TLY-5 PCB Manufacturing & Assembly for Customer-Specified Material
Highleap Electronics manufactures finished PCBs and PCBAs for customer designs specifying Taconic TLY-5. We work from customer-approved material callouts, stack-ups, fabrication files, and assembly requirements.
Customer-Specified TLY-5 Review
Llamada de material
Confirm the exact material designation in the approved stack-up or fabrication drawing.
Construcción de tableros
Review dielectric build, copper configuration, layer sequence, and finished board thickness.
RF geometry
Check impedance targets, trace geometry, plated holes, vias, and edge interface details.
Assembly release
Align BOM, placement data, inspection, and customer-defined test requirements before production.
Manufacturing Review for Customer-Specified TLY-5 PCBs
When TLY-5 appears in an approved stack-up or fabrication drawing, it identifies one customer-specified laminate requirement within the complete board construction. Highleap reviews the released manufacturing package before production, including layer construction, copper configuration, impedance targets, drill and via requirements, finished thickness, surface finish, and inspection criteria.
TLY-5 manufacturing review before release
- Material construction review: Confirm the customer-approved dielectric construction, copper configuration, layer sequence, and finished thickness before tooling.
- RF geometry and impedance: Review trace widths, spacing, reference planes, controlled-impedance targets, and edge details against the released stack-up.
- Hole and via planning: Check plated holes, vias, aspect ratios, and any customer-specified fill or backdrill requirements for the approved design.
- Assembly interface: Review the BOM, placement data, soldering process, inspection plan, and customer-defined test instructions for the PCBA build.
Highleap fabrica la placa de circuito impreso (PCB) o el ensamblaje de placa de circuito impreso (PCBA) según el diseño aprobado. La selección de materiales, los límites de diseño y la cualificación siguen siendo responsabilidad del cliente en su proceso de ingeniería.
TLY-5 Technical Reference Data
The table below summarizes typical reference data for Taconic TLY-5, a Taconic laminate product. It is not a guaranteed specification or a substitute for the current manufacturer documentation approved for the project.
| Propiedad | Método de prueba | Unidad | Valor | Unidad | Valor |
|---|---|---|---|---|---|
| Dk a 10 GHz | IPC-650 2.5.5.5 | – | 2.20 | – | 2.20 |
| Df a 10 GHz | IPC-650 2.5.5.5 | – | 0.0009 | – | 0.0009 |
| Absorción de humedad | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Ruptura dieléctrica | IPC-650 2.5.6 | kV | > 45 | kV | > 45 |
| Resistencia dieléctrica | ASTM D149 | V/mil | 2,693 | V / mm | 106,023 |
| Resistividad de volumen (después de temperatura elevada) | IPC-650 2.5.17.1 | Mohms/cm | 10¹⁰ | Mohms/cm | 10¹⁰ |
| Resistividad volumétrica (después de la humedad) | IPC-650 2.5.17.1 | Mohms/cm | 10⁹ | Mohms/cm | 10⁹ |
| Resistividad superficial (después de temperatura elevada) | IPC-650 2.5.17.1 | mamás | 10⁸ | mamás | 10⁸ |
| Resistividad superficial (después de la humedad) | IPC-650 2.5.17.1 | mamás | 10⁸ | mamás | 10⁸ |
| Fuerza de flexión (MD) | IPC-650 2.4.4 | psi | 14,057 | N / mm² | 96.91 |
| Fuerza de flexión (CD) | IPC-650 2.4.4 | psi | 12,955 | N / mm² | 89.32 |
| Resistencia al pelado (1/2 oz. de cobre ED) | IPC-650 2.4.8 | libras/pulgadas | 11 | N / mm | 1.96 |
| Resistencia al desprendimiento (1 oz. de cobre CL1) | IPC-650 2.4.8 | libras/pulgadas | 16 | N / mm | 2.86 |
| Resistencia al desprendimiento (1 oz. de cobre C1) | IPC-650 2.4.8 | libras/pulgadas | 17 | N / mm | 3.04 |
| Resistencia al pelado (a temperatura elevada) | IPC-650 2.4.8 | libras/pulgadas | 13 | N / mm | 2.32 |
| Módulo de Young (DM) | ASTM D 3039 / IPC-650 2.4.19 | psi | 1.4 × 10⁶ | N / mm² | 9.65 × 10³ |
| Coeficiente de Poisson (MD) | ASTM D 3039 / IPC-650 2.4.19 | – | 0.21 | – | 0.21 |
| Conductividad Térmica | ASTM F 433 | W / m · K | 0.22 | W / m · K | 0.22 |
| Estabilidad dimensional (MD, 10 mil) | IPC-650 2.4.39 | milésimas de pulgada | -0.038 | mmm | -0.038 |
| Estabilidad dimensional (CD, 10 mil) | IPC-650 2.4.39 | milésimas de pulgada | -0.031 | mmm | -0.031 |
| Densidad (gravedad específica) | ASTM D 792 | g / cm³ | 2.19 | g / cm³ | 2.19 |
| CTE (X) (25–260 °C) | ASTM D 3386 (TMA) | ppm / ° C | 26 | ppm / ° C | 26 |
| CTE (Y) (25–260 °C) | ASTM D 3386 (TMA) | ppm / ° C | 26 | ppm / ° C | 26 |
| CTE (Z) (25–260 °C) | ASTM D 3386 (TMA) | ppm / ° C | 217 | ppm / ° C | 217 |
| Desgasificación de la NASA (% TML) | – | % | 0.01 | % | 0.01 |
| Desgasificación de la NASA (% CVCM) | – | % | 0.00 | % | 0.00 |
| Desgasificación de la NASA (% WVR) | – | % | 0.00 | % | 0.00 |
| Clasificación de inflamabilidad UL-94 | UL-94 | – | V-0 | – | V-0 |
Nota de referencia y fabricación:
- Los valores técnicos que aparecen en esta página son solo información de referencia. Para requisitos críticos de rendimiento, tolerancia, selección de materiales o cualificación, consulte directamente con Taconic y utilice la documentación vigente aprobada por el cliente.
- Highleap Electronics es una fábrica independiente de fabricación y ensamblaje de placas de circuito impreso (PCB). Fabricamos placas terminadas y conjuntos de placas de circuito impreso (PCBA); no fabricamos materiales laminados para PCB.
- El nombre Taconic se utiliza únicamente para identificar un producto laminado especificado por el cliente. Este uso no implica patrocinio, autorización, distribución, respaldo ni afiliación.
- La disponibilidad de materiales, la construcción y la ruta de suministro se confirman para cada proyecto antes de la producción.
Póngase en contacto con Highleap Electronics para hablar sobre la fabricación, el ensamblaje, el diseño para la fabricación (DFM), la validación de proveedores o para obtener un presupuesto para su proyecto de PCB especificado por el cliente.
Potential Applications for Customer-Specified TLY-5 PCBs
Fabricación de PCB de alta frecuencia
Customer designs specifying TLY-5 may be used in RF and microwave equipment where the approved design requires this material construction. Final suitability must be determined by the customer engineering and qualification process.
Communication and RF hardware
Highleap can manufacture customer-designed antenna, beamforming, RF front-end, and communication boards to approved files and material callouts.
Automotive and sensing electronics
We manufacture PCB and PCBA projects for customer-qualified control, radar, sensing, and interface applications according to the released production specification.
Microwave circuits and instrumentation
Fabrication planning can address customer-defined impedance, copper, drill, routing, and inspection requirements for RF circuit boards.
Aerospace, satellite, and specialist electronics
Highleap supports PCB fabrication and assembly where the customer supplies the approved construction, acceptance criteria, and required qualification path.
Reference Comparison Considerations for RF PCB Material Selection
Use this table only as a high-level comparison framework. It does not provide a material specification or guaranteed values. Confirm each material with its manufacturer and the customer-approved project documentation.
| Material | Dk a 10 GHz | Df a 10 GHz | Conductividad Térmica | Mejor caso de uso |
|---|---|---|---|---|
| Taconico TLY-5 | Refer to current Taconic documentation | Refer to current Taconic documentation | Refer to current Taconic documentation | Customer-approved RF design requirements |
| Alternative low-Dk PTFE laminate | Refer to its manufacturer | Refer to its manufacturer | Refer to its manufacturer | Customer engineering review required |
| Alternative high-frequency laminate | Refer to its manufacturer | Refer to its manufacturer | Refer to its manufacturer | Customer engineering review required |
| Estándar FR-4 | Dependiente del proyecto | Dependiente del proyecto | Dependiente del proyecto | Customer engineering review required |
TLY-5 PCB Fabrication and Assembly Workflow
Highleap turns customer-approved TLY-5 PCB designs into finished bare boards and PCB assemblies. Our work begins with the released production package and follows the agreed fabrication, assembly, inspection, and test requirements.
Project review before production
We review the approved stack-up, fabrication drawing, impedance requirements, copper construction, and material callout before tooling. Any sourcing or manufacturability question is returned for customer review before a change is made.
Controlled PCB fabrication
Production planning addresses the approved trace geometry, drilling, routing, via structures, surface finish, board thickness, dimensional tolerances, and agreed electrical or inspection requirements.
Assembly and test support
Cuando se requiere ensamblaje, Highleap puede coordinar el suministro de componentes, el ensamblaje SMT y de orificio pasante, el trabajo con BGA, AOI, rayos X cuando sea necesario, la programación y las pruebas funcionales especificadas por el cliente.
Póngase en contacto con Highleap Electronics para analizar sus requisitos aprobados de fabricación de PCB de RF o PCBA.
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