KB-6164-laminaatti ja KB-6064-prepreg hallittuihin monikerrospinoamisiin

KB-6164 is the cured copper-clad laminate, while KB-6064 is the matching uncured prepreg used to bond multilayer PCB constructions. Highleap Electronics normally sources these materials as part of a finished PCB or PCBA order and converts them into a released stackup with controlled dielectric thickness, copper and inspection.

Laminate, Prepreg and Finished PCB Roles

A buyer who only specifies the laminate name leaves major decisions unresolved: glass style, resin content, pressed thickness, copper treatment, core distribution and final thickness. Highleap resolves these through a released stackup, not through purchasing substitution on the shop floor.

How to Interpret Official Properties

Kingboard lists KB-6164 as standard-Tg, lead-free-process compatible FR-4 with typical Tg 140°C, Td 330°C, total Z-axis expansion of 3.5% and CTI 175 V. These values identify the material class and are useful for comparison. They are not guaranteed finished-board specifications.

Test methods cannot be omitted

Tg varies by DSC, TMA or DMA. Dk and Df vary with test frequency, resin content and method. Procurement documents should preserve the method when a value matters, otherwise two apparently conflicting datasheets may simply use different measurements.

Material values, design values and measured results are different

• Material value: typical data published by Kingboard.
• Design value: construction-specific number used by the fabricator for stackup modeling.
• Mitattu tulos: data from a coupon or finished-board test.

Confusing these evidence levels is a common reason for impedance disputes.

Core, Prepreg, Copper and Pressed Thickness

Core thickness is not finished PCB thickness

The finished thickness equals the combined cores, pressed prepregs, copper and process tolerances. Copper density changes resin flow, so the same prepreg can press differently between a plane layer and a sparse signal layer.

Glass style and resin content affect fill and electrical behavior

Fine glass can support thin dielectrics, while heavier glass can provide more thickness and mechanical stability. Resin content determines how much flow is available to fill etched copper. The selected combination must satisfy thickness, resin fill, registration, drillability and impedance.

Copper foil must be stated correctly

Starting foil, finished copper and plated copper are different descriptions. For controlled impedance or fine lines, the copper treatment and profile may matter. The stackup should identify finished copper by layer and any approved copper-profile constraint.

For multilayer design context, use Highleap’s Piirilevyjen pinoamisopas. It explains why material availability and fabrication capability must be considered before layout is frozen.

Storage, Lot Control and Traceability

Prepreg is more sensitive to storage and shelf life than cured laminate. Temperature, humidity, packaging and exposure time can affect flow and cure. Highleap controls material receipt, lot identity and release according to current supplier guidance and internal process requirements.

Do not mix prepreg lots casually

Different lots can have normal variations in resin content and flow. For demanding thickness or impedance builds, the lot and construction should be controlled. Expired or improperly stored prepreg should not be used without an approved evaluation.

Traceability should match the product risk

A routine commercial board may need material identity and lot records. A regulated or high-reliability program may require certificates, storage records, stackup revision control and retained coupons. The RFQ should state the required documentation instead of assuming every order includes the same package.

Impedance and Finished-Board Qualification

Catalog Dk should not be copied directly into an impedance solver. The chosen core/prepreg, resin content, copper profile and press result determine the design value. Highleap can solve trace width and spacing after the construction is selected.

Where measured control is required, the fabrication drawing should state target impedance, tolerance, coupon geometry and reporting expectation. The controlled-impedance requirements guide provides a practical specification format.

Qualification should focus on the finished board

A material certificate proves identity, not finished-hole quality or impedance. Depending on the product, useful evidence may include pressed thickness, microsection, electrical test, impedance coupon, solderability and first-article assembly results.

Example construction logic for a six-layer board

A six-layer board might use two patterned KB-6164 cores separated by KB-6064 prepreg, with outer copper laminated around the subassembly. The final choice depends on target thickness, impedance, copper balance and drill geometry. If the design needs a 0.10 mm signal-to-plane spacing, the fabricator must confirm whether the selected glass style and resin content can press to that value across the actual copper pattern. A nominal catalog thickness is not a purchase guarantee.

Questions that should be answered before approving a stackup

• Are the listed core and prepreg styles currently available from an approved source?
• Is the pressed thickness based on the actual copper percentage or a generic table?
• Which Dk value was used for each controlled-impedance geometry?
• Does the prepreg provide enough resin to fill the copper topography?
• Are inner and outer copper values stated as finished copper?
• Will the same construction be used for repeat orders, or is an equivalent rule required?

How material shortages should be handled

If a requested core thickness is unavailable, the correct response is not an unrecorded substitute. Highleap should propose an alternate construction that preserves total thickness, impedance, copper, drill geometry and thermal class, then obtain approval before release. In some cases the trace width changes; in others, a different combination of prepregs changes resin content and press behavior. The commercial quotation should identify whether the price assumes a specific construction or allows an approved equivalent.

Deliverables for a material-based engineering order

Depending on project scope, the buyer may receive a preliminary stackup, final released construction, impedance table, material-lot record, microsection, electrical-test confirmation and certificate copy. These are finished-board deliverables. Raw laminate certificates alone do not show that the board was pressed, drilled and plated correctly.

Raw Material Versus Finished-PCB Sourcing

Highleap’s normal service is to supply a finished PCB or PCBA, not resell isolated sheets of laminate. This allows one manufacturing route to control material sourcing, stackup, lamination, drilling, plating, finish and inspection.

When raw-sheet sourcing creates risk

A buyer can source the correct part number but still select the wrong core thickness, copper form or prepreg. The receiving fabricator may also lack the released press recipe. Finished-board procurement places responsibility for construction feasibility with the PCB manufacturer.

Approved equivalents

An equivalent must match the material class, thermal behavior, CTI, construction availability, certificates and customer requirements. The phrase “or equivalent FR-4” is too broad for a controlled repeat product. If substitution is permitted, define the approval process.

How to evaluate a fabricator’s proposed stackup

The proposal should be internally consistent: the listed cores and prepregs must add to the target thickness, copper values must distinguish base and finished copper, impedance traces must fit the design rules, and resin content must be plausible for the copper pattern. A stackup that merely copies catalog thicknesses without stating pressed values is not production-ready.

Procurement should also check whether the material name appears in the fabrication notes and whether the drawing defines an equivalent policy. If the material is critical, the released construction should be part of the order package, not an informal email attachment that can be lost during repeat production.

KB-6164 Material FAQ

What is the difference between KB-6164 and KB-6064?

KB-6164 is the cured laminate/core. KB-6064 is the matching prepreg used to bond the multilayer board.

Can a catalog core thickness be used as the finished dielectric?

A core thickness may be close to its nominal value, but finished dielectric spacing must account for copper and process tolerances. Prepreg pressed thickness is even more dependent on construction.

Which Dk should be used for impedance?

Use a construction-specific design value agreed with the PCB manufacturer, then verify with a coupon if measurement is required.

Can KB-6064 be mixed with another laminate system?

Only through an approved hybrid qualification. Resin systems should not be mixed as an undocumented purchasing workaround.

Ensisijainen materiaaliviite: Kingboard KB-6164/KB-6064 technical information. Manufacturer figures are typical reference values; use the current datasheet and approved construction for production specifications.