I-HDI Isakhiwo Izindlela Ezinhle Kakhulu: Amathiphu Edizayini Abalulekile Amabhodi Esifunda e-HDI

Isingeniso kumabhodi we-HDI

Amabhodi e-HDI (High Density Interconnect) amabhodi esekethe anomthamo omkhulu wesekethe asebenzisa ubuchwepheshe be-micro blind kanye ne-cacble vias. Amabhodi e-HDI anezingqimba zangaphakathi nangaphandle zamasekhethi, futhi ngokusebenzisa izinqubo zokumba kanye ne-metalization, ukuxhumana phakathi kwezingqimba ezihlukene zamasekethe kufinyelelwa.

Amabhodi e-HDI ngokuvamile akhiqizwa kusetshenziswa indlela ye-lamination, futhi uma kunezingqimba eziningi, izinga lobuchwepheshe lebhodi liyaphakama. Amabhodi ajwayelekile e-HDI empeleni angama-laminate anezingqimba eyodwa, kuyilapho amabhodi e-HDI athuthukile esebenzisa ubuchwepheshe obufana ne-lamination enezingqimba ezimbili noma eziningi, kanye nobuchwepheshe be-PCB obuthuthukisiwe njenge-stacked vias, ukugcwalisa nge-electroplated, kanye nokubhoboza ngqo nge-laser.

Uma ukuminyana kwe-PCB kudlula izendlalelo eziyisishiyagalombili, ukuyikhiqiza kusetshenziswa i-HDI kungabiza kakhulu kunezinqubo zokucindezela zendabuko eziyinkimbinkimbi. Amabhodi e-HDI asiza ukusetshenziswa kobuchwepheshe bokuhlanganisa obuthuthukile, anikeza ukusebenza kukagesi okuphakeme nokunemba kwesignali kunama-PCB avamile. Ukwengeza, amabhodi e-HDI ahlinzeka ngokuthuthuka okungcono ezindaweni ezifana nokuphazanyiswa kwefrikhwensi yomsakazo, ukuphazamiseka kukagesi kagesi, ukukhishwa kwe-electrostatic, kanye nokushisa.

Njengoba imikhiqizo ye-elekthronikhi iqhubeka nokuya ekuxineni okuphezulu kanye nokunemba okuphezulu, igama elithi “high” alisho nje kuphela ukuthuthukisa ukusebenza komshini kodwa futhi nokunciphisa usayizi womshini. Ubuchwepheshe be- High Density Interconnect (HDI) buvumela ukwakheka kwemikhiqizo yokugcina ukuthi kube ncane kakhulu ngenkathi kuhlangatshezwana nezindinganiso eziphakeme zokusebenza kwe-elekthronikhi kanye nokusebenza kahle. Imikhiqizo eminingi ethandwayo ye-elekthronikhi namuhla, njengama-smartphone, amakhamera edijithali, ama-laptop, kanye ne-elekthronikhi yezimoto, isebenzisa amabhodi e-HDI. Ngokuthuthuka okuqhubekayo kwemikhiqizo ye-elekthronikhi kanye nesidingo semakethe, ukuthuthukiswa kwamabhodi e-HDI kulindeleke ukuthi kusheshe.

I-HDI Board Factory Ixoxa Ngemithetho Ejwayelekile Yokuhamba Nge-PCB

• Chaza kusengaphambili izindawo zedijithali, ze-analog, ne-DAA zomzila wesiginali ku-PCB.
• Hlukanisa izingxenye zedijithali neze-analog kanye nemikhondo yazo ehambisanayo ngangokunokwenzeka futhi uzibeke phakathi kwezindawo zazo ezilandelanayo zomzila.
• Gcina ukulandelelwa kwesignali yedijithali yesivinini esikhulu kukufushane ngangokunokwenzeka.
• Gcina imikhondo yesignali ye-analog ebucayi ibe mfushane ngangokunokwenzeka.
• Sabalalisa kahle amandla nomhlabathi.
• Gcina i-DGND, AGND, kanye nomhlaba wangempela uhlukene.
• Sebenzisa ukulandelelwa okubanzi kwezintambo zamandla nokulandela amasignali abalulekile.
• Izintambo zamandla nemigqa yaphansi kufanele zikhanye ngangokunokwenzeka, futhi imigqa yesignali akufanele yakhe amaluphu.
• Beka amasekhethi edijithali eduze kwamabhasi ahambisanayo/nezindawo zokusebenzelana ze-serial DTE, namasekhethi e-DAA eduze nezindawo zokusebenzelana zocingo.
• Kumadivayisi amancane ahlukahlukene, umzila we-symmetric uyadingeka, futhi kumaphedi e-SMT anezikhala eziseduze, imikhondo kufanele ixhunywe ngaphandle kwephedi hhayi phakathi ngokuqondile.
• Nikeza kuqala imigqa yesiginali yokhiye: amandla, amasiginali amancane e-analog, amasignali anesivinini esikhulu, amasignali wewashi, namasignali ahambisanayo, phakathi kokunye.
• Landela isimiso sokuhamba phambili kokuminyana komzila: Qala ukuzulazula usuka emishinini enokuxhumana okuyinkimbinkimbi kakhulu ebhodini nasezindaweni ezinezintambo eziminyene kakhulu.
• Gwema ama-engeli acijile nama-engeli angakwesokudla phakathi PCB design ukuvimbela izinkinga zemisebe engadingekile kanye nenqubo yokukhiqiza.
• Akufanele kube nezimbobo zokungena SMT amaphedi ukuvimbela ukulahleka kokunamathisela kwe-solder kanye nokukhubazeka kwengxenye ye-soldering. Imigqa yesignali ebalulekile ayivunyelwe ukuba idlule phakathi kwemilenze yokuphina.

I-PCB High-Frequency Circuit Routing

• Khetha inombolo yezendlalelo ze-PCB ngokuhlakanipha. Ukusebenzisa izendlalelo zamandla amaphakathi (ungqimba lwe-Vcc) nezingqimba zomhlabathi (i-Gnd layer) kungavikela futhi kunciphise ngempumelelo i-parasitic inductance namandla, kufinyeze ubude bomzila, futhi kunciphise ukuphazamiseka kwesignali.

• Indlela yomzila: Kumelwe ibe ngama-engeli angu-45°, hhayi ama-engeli angu-90°.

• Isikhombisi-ndlela somzila ophakathi: Kufanele sibe perpendicular kwenye. Uma ungqimba olungaphezulu luvundlile, ungqimba olungezansi kufanele lube mpo ukuze kuncishiswe ukuphazamiseka kwesignali.

• Grounding: Grounding signals ezibalulekile ukuze uthuthukise ngokuphawulekayo ikhono lazo lokunqanda ukuphazamiseka, futhi ugxilise amasignali amaningi aphazamisayo ukuze uwavimbele ukuthi angaphazamisi amanye amasignali.

• Ama-Decoupling capacitor: Engeza ama-decoupling capacitor kumatheminali okuphakela amandla ama-ICs.

• Ukuklinywa kwefrikhwensi ephezulu: Uma kunezizathu ezivamile ezifana nomhlabathi wedijithali nomhlabathi we-analog, engeza amadivaysi okuklinywa amafrikhwensi aphezulu phakathi kwawo, ngokuvamile usebenzisa ubuhlalu be-ferrite obunezimbobo zocingo phakathi nendawo.

• Ukugcwaliswa kwe-Copper: Ukwandisa indawo ephansi nakho kunganciphisa ukuphazamiseka kwesignali. (Ithusi elifile lidinga ukukhishwa ngesikhathi sokugcwaliswa kwethusi)

• Ubude bomzila: Lapho ubude bomzila bumfushane, bungcono, okunciphisa ukuphazamiseka. Nokho, akuwona wonke umzila odinga ukuba mfushane. Isibonelo, ukuzulazula kwe-DDR kudinga ubude obulinganayo bewashi, ikheli, nemigqa yedatha, ngakho-ke uzobona imikhondo yenyoka eyanwetshwa ngamabomu.

Umzila Wezingxenye Ezikhethekile

• Izingxenye ze-High-frequency: Gcina ukuxhumana phakathi kwezingxenye ze-high-frequency kufushane ngangokunokwenzeka ukuze unciphise imingcele esabalalisiwe kanye nokuphazanyiswa kukagesi okuhlangene; izingxenye ezibucayi ezijwayele ukuphazamiseka akufanele zibekwe eduze kakhulu komunye nomunye.
• Izingxenye ezinomehluko wamandla kagesi aphezulu: Khulisa ibanga phakathi kwezingxenye ezinomehluko wamandla kagesi aphezulu kanye nezixhumi zazo ukuze ugweme amasekhethi amafushane ngengozi kanye nokulimala kwengxenye. Ukuze uvimbele imisinga enwabuzelayo, ibanga eliphakathi kwemikhondo yethusi elinomehluko kagesi ongu-2000V kufanele libe likhulu kuno-2mm.
• Izingxenye ezisindayo: Izingxenye ezinzima kufanele zilungiswe kubakaki.
• Izingxenye ezizwelayo ngokushisa kanye ne-thermal: Izingxenye ezikhiqiza ukushisa kufanele zigcinwe kude nezingxenye ezizwelayo ngokushisa, futhi izingxenye ezikhiqiza ukushisa kufanele zisatshalaliswe ngokulinganayo.

Amapharamitha Abalulekile we-PCB Routing Design

• I-Copper trace (Ithrekhi) ububanzi: 0.3mm kumabhodi anohlangothi olulodwa, 0.2mm amabhodi anezinhlangothi ezimbili;
• Igebe elincane phakathi kwemikhondo yethusi: 0.3mm kumabhodi anohlangothi olulodwa, 0.2mm kumabhodi anezinhlangothi ezimbili;
• Ibanga eliphansi ukusuka emithonjeni yethusi ukuya onqenqemeni lwe-PCB: 1mm, ibanga elincane ukusuka ezingxenyeni ukuya onqenqemeni lwe-PCB: 5mm, ibanga elincane ukusuka kumaphedi e-solder ukuya onqenqemeni lwe-PCB: 4mm;
• Idayamitha yephedi ye-solder yezingxenye zokukhweza ezinezimbobo ezijwayelekile ziphindwe kabili kunobubanzi bangaphakathi bephedi ye-solder.
• Ama-electrolytic capacitor akufanele abekwe eduze kwezingxenye eziphehla ukushisa, njengezihluthulelo zamandla aphezulu, ama-transformer, ama-transistors anamandla amakhulu, izilawuli zamandla kagesi ezinamatheminali amathathu, namasinki okushisa. Ibanga phakathi kwama-electrolytic capacitor nalezi zingxenye kufanele libe likhulu kuno-10mm.
• Izikulufa akufanele zibe nemikhondo yethusi (ngaphandle kwephansi) noma izingxenye ezingaphakathi kweradiyasi engu-5mm ngaphandle.
• Kumiklamo ye-PCB yendawo enkulu (ngaphezu kuka-500m²), ukuvimbela ukugoba kwe-PCB ngesikhathi sokuphinda kufakwe i-solder, igebe elibanzi elingu-5mm kuya ku-10mm kufanele lishiywe phakathi kwe-PCB ngaphandle kokubeka izingxenye zokubeka imigoqo yokucindezela ukuvimbela ukugoba kwe-PCB.
• Sebenzisa umcibisholo ongenalutho ukuze ubonise isiqondiso se-reflow soldering ye-PCB ngayinye.
• Lapho uthutha umzila, isiqondiso sephakheji ye-DIP IC kufanele ihambisane nesiqondiso sokuphinda kufakwe i-solder, hhayi ukuhambisana, ukuze kugwenywe ibhuloho likathayela.
• Uma isikhombisi-ndlela somzila sishintsha sisuka kokuqondile siye esivundlile, kufanele singene nge-engeli engu-45°.
• Ububanzi bentambo yamandla akumele bube ngaphansi kuka-18mil; ububanzi bomugqa wesignali akufanele bube ngaphansi kuka-12mil; ububanzi bokufakwayo kwe-CPU nemigqa yokukhipha akufanele ibe ngaphansi kuka-10mil (noma u-8mil); futhi isikhala phakathi kwemigqa akufanele sibe ngaphansi kuka-10mil.
• Ubuningi bomzila webhodi kufanele bufanele. Uma umehluko wokuminyana mkhulu kakhulu, kufanele ugcwaliswe nge-foil yethusi enemeshi enegridi enkulu kuno-8mil (noma u-0.2mm).
• Ezindaweni ezingaphakathi kuka-1mm onqenqemeni lwe-PCB ezikhethelwe umzila futhi ngaphakathi kuka-1mm ezizungeze izimbobo ezigxunyekwayo, umzila awuvunyelwe.
• Izimpawu eziyisixwayiso kufanele ziphrintwe kusendlalelo sesikrini sikasilika eduze kwezingxenye ezifana namafuse, izimelaphi zefuse, ama-capacitor okuhlunga e-AC 220V, ama-transformer, njll.
• Ibanga phakathi kwemigqa ephilayo nephakathi nendawo ye-AC 220V amandla kagesi akufanele ibe ngaphansi kuka-3mm. Ibanga eliphakathi kwanoma iyiphi intambo kusekethe engu-220V kanye nezingxenye zamandla kagesi aphansi, amaphedi, nezinto zokulandela akumele zibe ngaphansi kuka-6mm, futhi umaki we-voltage ephezulu kufanele uphrintwe kuzo. I-low-voltage kanye ne-high-voltage kufanele ihlukaniswe ngamanethi ezintambo eziwugqinsi njengesixwayiso kubasebenzi bezokunakekelwa kwempilo ukuze bawaphathe ngokucophelela.

Lokhu okungenhla kuyisiqondiso esiphelele solwazi lwezintambo ze-PCB oluhlanganiswe yi-Highleap Electronic. Ngiyethemba ukuthi ungathola okuthile kukho! Xhumana nathi ukuze ufunde kabanzi ngezinqubo zokukhiqiza ze-PCB.