Umhlahlandlela ophelele we-Hybrid Lamination: Ukulawula I-Warpage ku-High-Frequency kanye ne-FR-4 Materials

Ukushintshwa kwe-hybrid kwezinto ezisebenzisa imvamisa ephezulu, njenge-CORE (isb., i-hydrocarbon-ceramic low-loss laminate , i-RF-35A), kanye nezinto ezivamile ze-FR-4 sekuyinto ebalulekile ekukhiqizweni kwe-PCB (Printed Circuit Board). I-hybrid PCB laminate ihlanganisa izakhiwo zikagesi eziphakeme zama-high-frequency laminates kanye nokufinyeleleka kanye nokuqina komshini kwe-FR-4. Lokhu kwenza ama-hybrid laminate PCB abe yisisombululo esifanele sezinhlelo zokusebenza zesivinini esikhulu, i-RF, kanye ne-microwave lapho ukusebenza kahle kwezindleko kanye nokusebenza kufanele kulinganiswane. Ekwakhiweni kwebhodi le-hybrid Rogers kanye ne-FR-4 , uhlelo lokubopha, umjikelezo wokucindezela kanye nokulungiswa kwezendlalelo kufanele kubuyekezwe njenge-stackup ephelele ngaphambi kokukhiqiza.

Kodwa-ke, ukukhiqiza ama-PCB e-hybrid laminate aletha izinselelo ezinkulu ngenxa yomehluko wemvelo wezinto ezibonakalayo, njenge-coefficient of thermal expansion (CTE), i-dielectric constant (Dk), kanye nokuzinza kwe-thermal. Lokhu kungafani kuvame ukuholela ekucindezelekeni kwemishini phakathi nenqubo yokucwiliswa kwamanzi kanye nokuhamba ngebhayisikili okushisayo okulandelayo, okungaholela ku-warpage, delamination, noma ukwehluleka komshini. Izinkinga ezinjalo azigcini nje ngokubeka engcupheni ukwethembeka kwe-PCB kwesakhiwo nogesi kodwa futhi zinganciphisa umkhiqizo wokukhiqiza futhi zenyuse izindleko zokukhiqiza zizonke.

Lesi sihloko sinikeza isethi eningiliziwe yezincomo kanye nemikhuba emihle yokwenza ngcono izinqubo ze-laminate ze-PCB ezihlanganisiwe, kugxilwe ekulawuleni i-warpage nokuqinisekisa ukuthembeka. Ingxoxo ifaka amasu e-stackups ze-PCB ezihlanganisiwe ezinezingqimba ezine, ezivame ukuklanywa njenge-CORE (izinto ezibonakalayo ezivame kakhulu) + PP (prepreg) + CORE (FR-4), futhi ihlola ukuthi ukukhethwa okufanele kwezinto, ukulingana kwe-stackup, kanye nokulawula izinqubo kungathuthukisa kanjani imiphumela yokukhiqiza. Uma usebenzisa izendlalelo zokubopha ze-RO4460G2 kuma-stackups e-RF , umjikelezo wokucindezela, ukusatshalaliswa kwethusi kanye nesikhala se-dielectric esiqediwe kufanele kuvunyelwane nomenzi.

Izinselelo ku-Hybrid Lamination

Ukuhlanganiswa kwezinto ezisebenzisa imvamisa ephezulu, njenge-laminate ye-hydrocarbon-ceramic low-loss kanye ne-RF-35A, kanye ne-FR-4 kuma -lamination e -hybrid PCB kubalulekile ezinhlelweni zokusebenza ezidinga ukusebenza kwesivinini esikhulu kanye ne-RF. Kodwa-ke, izakhiwo zezinto ezihlukile zidala izinselele okumele zixazululwe ukuqinisekisa ama-PCB athembekile futhi akhiqizwayo. Enye yezinto eziyinhloko ukukhathazeka ukungalingani kokwandiswa kokushisa. Izinto ezisebenzisa imvamisa ephezulu zivame ukuba ne-coefficient ephansi yokwandiswa kokushisa (CTE) kune-FR-4. Lokhu kungafani kudala ukucindezeleka okukhulu komshini ngesikhathi sezinqubo ze-lamination kanye ne-thermal cycling, okungase kuholele ekuqhekekeni, ekuhlukaniseni, noma ngisho nasekuqhekekeni kwama-via nama-microvia. Ukukhetha izinto ngokucophelela kanye nokwenza ngcono i-stackup kubalulekile ekuxazululeni le nkinga.

Ukungafani Kokwandiswa Kokushisa Okushisayo

Enye yezinselelo ezibaluleke kakhulu ku-hybrid lamination ukungafani kwama-coefficients of thermal expansion (CTE) phakathi kwezinto ezisebenza ngamaza aphezulu kanye ne-FR-4. Izinto ezisetshenziswa yi-High-frequency ngokuvamile zibonisa amanani aphansi e-CTE uma kuqhathaniswa ne-FR-4, okudala ukucindezelwa komshini phakathi kokubili kwenqubo ye-lamination kanye nokuhamba ngebhayisikili okushisayo okulandelayo (isb, ngesikhathi sokugeleza kabusha kwe-solder). Lokhu kucindezeleka kungaholela ezindabeni ezinzima, ezifana ne-warpage ye-PCB yokugcina, i-delamination ezindaweni ezibonakalayo, kanye nokuqhekeka kwe-microvia. Lezi zinkinga zingafaka engozini ubuqotho bemishini kanye nokusebenza kukagesi kwe-PCB. Ukukhetha okubalulekile kanye nomklamo wokupakisha ngokucophelela kubalulekile ekwehliseni imithelela yokungafani kokwanda kokushisa.

Prepreg Selection and Symmetry

I-Prepregs (PP) idlala indima ebalulekile kuma-hybrid laminations, asebenza njengezingqimba zokunamathisela kanye ne-dielectric phakathi kwama-laminates. Kodwa-ke, ukukhetha okungalungile noma ukusetshenziswa okungalungile kwe-prepregs kungabangela ukungalingani okuphawulekayo kokucindezeleka, okuholela ku-warpage. Izitaki ze-prepreg ezingalingani zivame ukuholela ekugelezeni kwe-resin okungalingani ngesikhathi sokulaliswa, okwandisa ukucindezeleka nokuguqulwa kwemishini. Imiklamo ye-Symmetrical stackup iyanconywa ukuze kuqinisekiswe ukusatshalaliswa kwe-resin okufanayo kanye nebhalansi yokucindezeleka. Okuqukethwe kwe-resin okufanele kanye nokukhethwa kobukhulu be-prepreg nakho kubalulekile ukuze kugcinwe ukuzinza kwemishini kanye nokunciphisa ukuhlanekezela kwangaphakathi.

Ukucindezeleka Okuhlobene Nokuqeda Okuphezulu

Ukukhethwa kokuqedwa kwendawo kungaba nomthelela omkhulu ku-warpage nokuzinza kwemishini yama-PCB ayingxube. Izinqubo ezifana ne-tin spraying (HASL) zibandakanya amazinga okushisa aphezulu angakwazi ukwethula ukucindezeleka okushisayo okungeziwe ebhodini laminated. Lokhu kuyinkinga ikakhulukazi kuma-hybrid laminations, lapho ukungafani kwe-CTE phakathi kwezinto ezisebenza ngamaza aphezulu kanye ne-FR-4 kuwenza azwele kakhulu ekucindezelekeni okunjalo. Ngenxa yalokho, i-HASL ngokuvamile ayinconywa kumabhodi ayingxube. Esikhundleni salokho, kukhethwa okunye okuqedwayo okufana ne-ENIG (Electroless Nickel Immersion Gold) noma i-OSP (Organic Solderability Preservatives) njengoba kubeka ukucindezeleka okushisayo okuncane futhi kulungele kangcono izinhlelo zokusebenza ezixubile.

Ukuhlukahluka Kwempahla

Ukwehlukahluka kwezinto kungenye inselelo ebalulekile kuma-lamination ahlanganisiwe. Ngisho nangaphakathi kwesigaba sezinto ezifanayo, imikhiqizo ye-FR-4 evela kubakhiqizi abahlukene ingabonisa ukwehluka kwezakhiwo ezibalulekile, njengokuqukethwe kwe-resin, izinga lokushisa lokushintsha kwengilazi (Tg), kanye nokuzinza kokushisa. Lokhu kungahambisani kungaholela ekuhlukaniseni, ukwanda kwe-warpage, kanye nokwehla kobuqotho bemishini ku-PCB yokugcina. Ukusebenzisa izinto ze-FR-4 eziqinisekisiwe, njenge- Shengyi S1141 kanye ne-S1170, ezihlolwe ukuhambisana nezinto ezivame kakhulu, kuqinisekisa ukusebenza okuthembekile nokungaguquguquki kuma-lamination ahlanganisiwe.

Ama-Hybrid laminations wezinto ezisetshenziswayo ezinemvamisa ephezulu kanye ne-FR-4 ibhekana nezinselele ezimbalwa, okuhlanganisa ukungafani kokwanda kokushisa, ukukhethwa kwangaphambi kokulungiswa kanye nokulingana, ukucindezelwa okuhlobene nokuphela kwendawo, nokuhlukahluka kwempahla. Ukubhekana nalezi zinselele kudinga ukukhethwa kwempahla ngokucophelela, imiklamo eqinisekisiwe ye-prepreg, kanye nokulawulwa kwenqubo efanele ngesikhathi sokukhiqiza. Ngokulandela izinqubo ezingcono kakhulu nokwamukela imiklamo ethuthukisiwe, abakhiqizi bangakhiqiza ama-PCB ayingxube athembekile futhi asebenza kahle anama-warpage amancane kanye nokuqina kwesikhathi eside.

Izincomo ze-Hybrid Lamination Design

1. Ukukhetha Izinto

Ukukhetha impahla efanele kubalulekile ukuze kuncishiswe i-warpage kuma-hybrid laminations. Ngokusekelwe kokuhlangenwe nakho okungokoqobo nedatha ye-empirical, imihlahlandlela elandelayo iyanconywa:

• Kuma-Lamination angu-20mil angu-25FR + FR-4 : Faka esikhundleni i-25FR nge-laminate ephansi yokulahlekelwa yi-hydrocarbon-ceramic. I-laminate ephansi yokulahlekelwa yi-hydrocarbon-ceramic inikeza ukuhambisana okungcono kwemishini nokushisa ne-FR-4 futhi isebenza kahle kakhulu ekusetshenzisweni kwemvamisa ephezulu.

• Kuma-20mil i-laminate ye-hydrocarbon-ceramic ephansi yokulahlekelwa + i-FR-4 Laminations : Khetha izinto ze-FR-4 ezinobukhulu obungu-0.51mm, 0.36mm, noma 0.18mm. Phakathi kwalezi, i-0.51mm kanye ne-0.36mm ziyathandwa ngenxa yokuqina kwazo okuphezulu kwemishini kanye namazinga aphansi okuwa.

• Kuma-Lamination angu-20mil RF-35A + FR-4 : Sebenzisa izinto ze-FR-4 ezinobukhulu obungu-0.10mm, 0.18mm, noma 1.0mm. Lezi zinketho ziboniswe ukuthi zinciphisa ukungalingani kokucindezeleka ngempumelelo, zinciphisa i-warpage.

2. I-Symmetrical Prepreg Stackup Design kanye ne-Order-Specific Adjustments

I-Prepreg (PP) idlala indima ebalulekile ekulinganiseni ukucindezeleka kwemishini esakhiweni esine-laminated. Idizayini ye-prepreg engalingani ngokuvamile iholela ekusabalaliseni kwengcindezi okungalingani, okuholela ku-warpage ebalulekile kanye nokungazinzi kwemishini. Ukuze kuxazululwe le nkinga, imiklamo elandelayo ye-symmetrical prepreg stackup iyanconywa njengezinkombandlela zokuqinisekisa ukugeleza kwe-resin okuphelele kanye nebhalansi yengcindezi ngesikhathi sokulaliswa:

• 1080+2116+1080
• 3313+7628+3313
• 2116 × 2

Lokhu kulungiselelwa kusiza ukunciphisa ukungalingani kwangaphakathi kwengcindezi, ukunciphisa i-warpage, nokugcina ukuqina komshini kuwo wonke ama-hybrid laminations.

Kodwa-ke, kubalulekile ukuqaphela ukuthi i-oda elithile ngalinye lingadinga ukulungiswa okusekelwe kuhlu lwempahla yobunjiniyela, izidingo zokuthikamezeka, nenqubekelaphambili yokukhiqiza. Isibonelo, ama-oda abandakanya ukulawulwa kokuvimba angase adinge isitaki esengeziwe noma ukuguqulwa kwenqubo ukuze kuhlangatshezwane nezicaciso zikagesi ezinembile. Izincomo ezinikezwe lapha ziyiziphakamiso ezijwayelekile zama-hybrid laminations anezingqimba ezine futhi zingase zingambozi izidingo eziyingqayizivele zayo yonke imiklamo.

Ukuze uthole ukuhlaziya okuningiliziwe kwenqubo ethile kanye nezidingo zezinto ezibonakalayo ze-oda lakho, sikukhuthaza ukuthi uxhumane nethimba lethu. Onjiniyela bethu bazothuthukisa idizayini yesitaki futhi bacubungule imingcele ukuze ihambisane nezimo zangempela zokukhiqiza futhi baqinisekise umphumela ongcono kakhulu ongakhona we-PCB yakho.

3. Surface Qeda Izincomo

Ukufutha Ngethini (HASL) :

• • Ukufafaza amathini ngokuvamile akunconyiwe kumabhodi ayingxubevange ahlanganisa izinto ezinemvamisa ephezulu ne-FR-4 ngenxa yengcindezi yokushisa eyethulayo, okungaholela ekwandeni kwe-warpage.
  • Uma ukufafaza ngethini kungenakugwenywa, kuyamukeleka kuphela kuma-lamination e-hydrocarbon-ceramic low-loss + FR-4 hybrid. Izakhiwo zokushisa nezomshini ze-laminate ye-hydrocarbon-ceramic low-loss zenza imelane kakhulu nokucindezeleka okulethwa yilokhu kuqeda kobuso.

4. Ukusebenza Kwekhasi Lempi Okulindelekile

Ngokulandela imihlahlandlela engenhla, ukusebenza kwe-warpage okulindelekile kuma-hybrid laminations kungokulandelayo:

• Ukuze uthole i-laminate ye-hydrocarbon-ceramic ephansi yokulahlekelwa + i-FR-4 Hybrid Laminations: I-Warpage ingalawulwa ngaphakathi kwe-0.7%.
• Okwe-RF-35A + FR-4 Hybrid Laminations: I-Warpage ingagcinwa ngaphansi kwe-1.0%.

Le miphumela ithuthukisa kakhulu ukuzinza kwemishini futhi ihambisane namazinga omkhakha wokukhiqiza okuthembekile kwe-PCB.

5. Okugunyaziwe kwe-FR-4 Materials

Izinto ezithize kuphela ze-FR-4 ezihloliwe futhi zaqinisekiswa ama-hybrid laminations anezinto zokuvama okuphezulu. Izinto ezilandelayo ze-FR-4 ziyanconywa:

• S1141
• S1170

Zombili izinto zokwakha, ezikhiqizwe i-Shengyi Technology, zibonisa ukuhambisana okuhle kakhulu nezinto ezinemvamisa ephezulu, ziqinisekisa imiphumela enokwethenjelwa nge-warpage encishisiwe.

6. Izixazululo Ngokwezifiso Zezinye Izinto

Kuma-lamination e-hybrid afaka izinto ezivame kakhulu ngaphandle kwe-laminate ye-hydrocarbon-ceramic low-loss kanye ne-RF-35A, izincomo ezingenhla kungenzeka zingabi semthethweni kuwo wonke umuntu. Icala ngalinye kufanele lihlolwe ngokusekelwe ezicini ezithile zezinto ezihilelekile, njenge:

• I-Coefficient of Thermal Expansion (CTE)
• I-Glass Transition Temperature (Tg)
• I-Dielectric Constant (Dk)
• Okuqukethwe kwe-Resin

Abakhiqizi bayelulekwa ukuthi basebenzisane nabahlinzeki bezinto ezibonakalayo futhi benze izivivinyo eziphelele ukuze banqume umklamo olungile we-stackup kanye nenqubo yokuhlobisa yalezi zimo.

Ukucatshangelwa Kwenqubo Ye-Hybrid Lamination

1. Ukunciphisa Ukucindezeleka Kwangemva KokuLamination

Inqubo yokucwiliswa kwama-PCB ayingxubevange, ikakhulukazi lawo abandakanya izinto ezisebenza ngamaza aphezulu njenge-25FR ehlanganiswe ne-FR-4, idinga ukulawulwa okucophelelayo okushisayo nokwemishini ukuze kuvinjelwe i-warpage nokuqinisekisa ukwethembeka. Ukubhaka kwe-post-lamination kuyisinyathelo esibalulekile sokukhulula ukucindezeleka kwangaphakathi okukhiqizwa ngesikhathi senqubo yokuqothula. Kubalulekile ukuvumela ibhodi ukuthi lizinze endaweni elawulwayo eshisayo ngaphandle kokufaka ingcindezi eyengeziwe. Lokhu kugwema ukuguqulwa okuqhubekayo futhi kuvumela uhlelo lwe-resin ukuthi lwelaphe ngokugcwele, okunciphisa kakhulu ukucindezeleka kwemishini esele. Ukushisisa okufanayo nokupholisa okushisayo okuhamba kancane phakathi nalesi sigaba kusiza ukugcina ukuqina kohlangothi lwebhodi kanye nebhalansi yesakhiwo, ikakhulukazi uma lisebenzisana nezinto ezinamakhoefiyenti ahlukene okunweba okushisayo, njengama-laminates anemvamisa ephezulu kanye ne-FR-4.

2. Ukuhlola Kokugcina Ukulungisa Ukubhaka

Ezimeni lapho i-warpage itholwa ngesikhathi sokuhlolwa kokugcina, ukubhaka okulungisayo kungalungisa kabusha ibhodi futhi kubuyisele ukucaba. Ukubhaka ibhodi le-hybrid ku-150 ° C amahora angu-2 ngaphandle kokufaka ingcindezi kuvumela izendlalelo ze-laminate ukuthi ziphumule futhi zisabalalise kabusha izingcindezi ngokulinganayo. Phakathi nalokhu kuchayeka kokushisa okulawulwayo, i-laminate resin ithambisa kancane, yenza kube lula ukukhululeka kwengcindezi phakathi kwezingqimba. Ukuze uvimbele ukubola okuphinde kwenzeke, ukupholisa ngokushesha nokufanayo kubalulekile. Ukubeka ibhodi endaweni yemabula ukuze kuphole kuqinisekisa inkundla eyisicaba futhi ezinzile, okuvumela i-laminate ukuthi iqine ngokulinganayo kuyilapho igcina ukucaba kwayo okulungisiwe. Lesi sinyathelo sibaluleke kakhulu kuma-stackups ahlanganisiwe, njengoba ukupholisa okungalingani kungabhebhethekisa i-warpage ngenxa yezakhiwo zezinto ezibonakalayo phakathi kwe-high-frequency core kanye ne-FR-4.

3. Ukuqinisekisa Ukuzinza Kwe-Dimensional Nokuthembeka Kwesikhathi Eside

Kokubili izinqubo zokubhaka zangemuva kokulahlwa kanye nokulungisa zidlala indima ebalulekile ekuqinisekiseni ukwethembeka nokunemba kwama-PCB ayingxubevange. Ngokulandela lezi zinqubo, abakhiqizi bangafinyelela ukukhululeka kwengcindezi okulawulwayo, bathuthukise ukuzinza kobukhulu, futhi bavimbele ukwehluleka noma ukwehluleka komshini phakathi nezigaba zokuhlangana ezilandelayo. Lokhu kuthuthukiswa kobuchwepheshe kubaluleke kakhulu ezinhlelweni zokusebenza ezifuna ukusebenza kwemvamisa ephezulu, njengoba kuqinisekisa ukuthi isitaki esiyingxubevange sigcina ubuqotho baso bokusebenza nogesi kuwo wonke umjikelezo wokuphila womkhiqizo.

Ukuthola I-Optimul Hybrid Lamination: Izinzuzo Eziyinhloko kanye Nemikhuba Eqinisekisiwe Yemboni

Ngokusebenzisa ukukhethwa kwezinto ezingenhla, idizayini yesitaki, nezincomo zokulawula inqubo, abakhiqizi be-PCB bangazuza izinzuzo ezilandelayo:

1. I-Warpage Encishisiwe: Amabhodi e-hybrid ane-laminate ye-hydrocarbon-ceramic ephansi yokulahlekelwa + FR-4 angafinyelela amazinga e-warpage ngaphakathi kuka-0.7%, kuyilapho amabhodi e-RF-35A + FR-4 engagcina i-warpage ingaphansi kuka-1.0%. Lawa mazinga angaphakathi kwezindinganiso zemboni futhi aqinisekisa ukusebenza okuthembekile.
2. Ukuthembela Okuthuthukile: Ukunciphisa i-warpage kunciphisa ingozi yokwehluleka kwemishini, njengokuhlukanisa noma ukuqhekeka, ngesikhathi sokuhlanganisa nokusebenza.
3. Ukusebenza Kagesi Okuthuthukisiwe: Ukuqinisekisa ukucaba nokuzinza kwemishini kugcina ubuqotho bezimpawu zemvamisa ephezulu, okuholela ekusebenzeni okungcono kagesi.
4. Isivuno Esiphakeme: Ukuncipha kwe-warpage kuholela kumabhodi ambalwa anqatshiwe, ukuthuthukisa isivuno sokukhiqiza nokunciphisa izindleko.
5. Ukuhambisana Kwezinto: Ukusebenzisa okugunyaziwe Izinto ze-FR-4 kanye nemiklamo ye-stackup ye-symmetrical iqinisekisa ukuhambisana phakathi kwezinto ze-high-frequency kanye ne-FR-4 evamile.

Lezi ziqondiso zenzelwe ukubhekana nezinselele ezithile ze-hybrid lamination futhi zisekelwe ekuhlangenwe nakho okubanzi kwemboni nokuqinisekiswa. Kunoma imiphi imibuzo eyengeziwe noma izidingo zangokwezifiso, abakhiqizi bakhuthazwa ukuthi basebenzisane nabaphakeli bezinto ezibonakalayo nabakhi be-PCB ukuze bakhe izixazululo ezilungiselelwe izidingo zabo ezithile.