BGA Packages

Vhura Kushanda uye Kuchengetedza Mutengo neHighleap's BGA Packages: Yakakwenenzverwa Kugadzira, Yakaderedzwa Mari Yekugadzira.

BGA PCB Solutions for Compact, High-Pin-Count Applications

BGA (Ball Grid Array) maPCB akakosha kumagetsi anoda saizi diki, kusimba kwepini, uye kuita kwakanakisa kwekupisa. Kusiyana nemapakeji echinyakare ane mativi anotungamira, zvikamu zveBGA zvinobatana kuburikidza nemabhora ekutengesa pasi peiyo chip-kuchengetedza nzvimbo uye kugadzirisa chiratidzo chekuvimbika.

Iyi marongerwo inogonesa:

Kuwanda kwezvikamu zvepamusoro pasina kuwedzera saizi yebhodhi
Kupisa kwakasimba kwemidziyo inomhanya zvakanyanya kana inoda simba
Kuvimbika kwemuchina wekutengesa kwakavandudzwa kuburikidza nekubatana kwakagadzikana kwemvura

Yakanakira mafoni, makomputa, marouters, uye mota dzemagetsi, BGA PCBs dzinotsigira kusimba kwenguva refu mumakompakiti dhizaini.

Highleap Electronics inoburitsa turnkey BGA PCB kugadzira uye kuungana kubva kune prototype kusvika mukugadzirwa kwakawanda. Isu tinoshandisa in-house X-ray inspection, reflow profiling, uye IPC-yakasimbiswa maitiro kuti tive nechokwadi chegoho repamusoro uye majoini akatsiga ekutengesa-kunyangwe pamabhodhi akaomarara akawanda.

Wagadzirira kuvaka neBGA? Taura nenyanzvi dzedu nhasi kuti ubvunze mahara kana quotation.

Highleap BGA - PCB Prototype iyo Nyore Nzira

TAURA NESU

Inowanzo Kushandiswa BGA Package Types?

BGA (Ball Grid Array) imhando yepakeji yakakurumbira inoshandiswa mumasekete akabatanidzwa (ICs) uye zvinhu zvemagetsi. Inopa nzira yakabatana uye yakavimbika yekuisa maICs pamabhodhi edunhu akadhindwa (PCBs). Heano mamwe anowanzo shandiswa BGA package mhando:

PBGA

PBGA (Plastiki Bhora Grid Array) inowanzoshandiswa BGA pasuru mhando. Inosanganisira substrate yepurasitiki ine grid array yemabhora ekutengesa pazasi, iyo inobatanidza IC kuPCB. PBGA mapakeji anopa zvakanaka kupisa uye magetsi kuita uye anowanikwa muhukuru hwakasiyana uye kuverenga kwebhora.

CBGA

CBGA (Ceramic Ball Grid Array) mapakeji anoshandisa ceramic substrate panzvimbo yepurasitiki. Ceramic inopa zvirinani kupisa conductivity uye kugadzikana kana ichienzaniswa nepurasitiki, ichiita CBGA yakakodzera kune yakakwira-inoshanda maapplication inoda inoshanda kupisa kupisa. CBGAs anowanzo shandiswa muma processors, mifananidzo machipisi, uye mamwe akakwira-simba maIC.

TBGA

TBGA (Thin Ball Grid Array) mapakeji akagadzirwa kuti ave nembiri yakatetepa kana ichienzaniswa neyekare BGA mapakeji. Iwo anoshandiswa mumashandisirwo ane nzvimbo shoma, senge laptops, mahwendefa, uye nharembozha. TBGA mapakeji anowanzo ane diki bhora mbichana uye akaderedzwa ukobvu kuti asangane nehukuru zvinomanikidza.

FBGA

FBGA (Yakanaka Bhora Grid Array) mapasuru ane bhora diki mbichana zvichienzaniswa neyakajairwa BGA mapakeji. Iwo anoshandiswa mumashandisirwo anoda yakakwirira pini density uye yakagadziridzwa magetsi ekushanda. FBGAs anowanzo kuwanikwa mundangariro modules, akadai DDR3 uye DDR4 modules.

uBGA

uBGA (Micro Ball Grid Array) mapakeji madiki madiki emhando dzeBGA mapakeji, akagadzirirwa zvidiki zvakanyanya mafomati zvinhu uye yakakwira pini densities. Iwo anoshandiswa mumakompakiti emagetsi emagetsi senge smartphones, zvinopfekeka, uye IoT zvishandiso. maBGA ane matinji ebhora madiki uye ari kunetsa kuunganidza nekugadzirisa zvakare nekuda kwehukuru hwawo.

CCGA

CCGA (Ceramic Column Grid Array) mapakeji anoratidza makoramu eceramic panzvimbo yemabhora ekutengesa ekubatanidza magetsi. Makoramu eceramic anopa kuvimbika kuri nani uye simba remuchina, ichiita maCCGAs akakodzera maapplication ane kuvhunduka kwakanyanya uye vibration zvinodiwa, senge mota uye aerospace zvemagetsi.

Iyi ingori mienzaniso mishoma yeinowanzo shandiswa BGA package mhando. Rudzi rwepakeji yakasarudzika yakasarudzwa kune imwe application zvinoenderana nezvinhu zvakaita senge saizi zvipingaidzo, zvinodikanwa zvekupisa, kuverenga kwepini, kushanda kwemagetsi, uye kufunga kwemitengo.

Zvakanakira zveBGA Package

Munzvimbo yemagetsi, BGA mapakeji anopa kugona kwenzvimbo, kugona kupisa, kugadzikana kwemagetsi kuita, uye yakagadziridzwa kugadzira, kuderedza mitengo. Highleap, inotungamira PCB & PCBA mugadziri, anoshandisa BGA zvakanakira zvemhando yepamusoro, zvinodhura mhinduro.Zvakanakira zveBGA Package ndezvizvi:

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Inoshanda PCB Space Utilization

BGA mapakeji anopa kushandiswa kwakanaka kwePCB nzvimbo. Nezvishoma zvikamu zvinosanganisirwa uye diki tsoka, ivo vanobatsira kuchengetedza nzvimbo pane tsika PCBs, zvakanyanya kusimudzira PCB nzvimbo kugona. Izvi zvinonyanya kukosha mune compact electronic devices.

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Enhanced Thermal Performance

BGA mapakeji anokunda mukupisa manejimendi. Kana iyo silicon chip yakaiswa pamusoro, yakawanda yekupisa inogona kunyatso kuendesa pasi kuburikidza nebhora grid array. Sezvineiwo, kana iyo silicon chip yakaiswa pazasi, kuseri kwefa kunosungirirwa kumusoro kwepakeji, ichigonesa kutonhora kunoshanda. Uku kupisa kwekushisa kunoderedza njodzi yekupisa uye kunowedzera kuvimbika kwezvikamu zvemagetsi.

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Kuvandudzwa Kwekuita Kwemagetsi

BGA mapakeji anopa kugadzikana kwemagetsi kushanda pamwero mukuru. Ivo vanoshaya mapini anopindika kana anogona kuputsika, kuderedza njodzi yemagetsi ekubatanidza nyaya. Uku kugadzikana kunovimbisa kuenderana uye kwakavimbika kushanda kwemasekete akabatanidzwa.

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Streamlined Soldering Process

BGA mapakeji anowanzo kuratidza akakura solder mabhora. Izvi zvinoita kuti yakakura-nzvimbo soldering iwedzere kudzoreka uye nyore panguva yekugadzira maitiro. Nekuda kweizvozvo, PCB yekugadzira yekumhanyisa inowedzera, uye goho rese rekugadzira rinovandudzwa. Uyezve, mabhora makuru ekutengesa anoita rework, kana zvichidikanwa, zvakanyanya kutwasuka.

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Yakaderedzwa Kukuvadza Kwekutungamira

BGA inotungamira inoumbwa neakasimba solder mabhora, ayo asinganyanye kukuvadza panguva yekubata, kuungana, kana kushandiswa kana ichienzaniswa neyechinyakare mapakeji ane isina kusimba inotungamira. Kugara uku kunobatsira pakugara kwenguva refu uye kusimba kwemidziyo yemagetsi.

Mukuwana izvi zvakanakira, kubatana nePCB vane ruzivo uye PCBA vagadziri kwakakosha. Highleap, ane mukurumbira PCB & PCBA mugadziri, anomira semubatsiri akavimbika mukuona mabhenefiti eBGA mapakeji. Unyanzvi hwedu mukugadzira uye magungano maitiro anovimbisa yakakwirira-yemhando uye inodhura-inoshanda mhinduro kune dzakasiyana siyana dzemagetsi zvikumbiro.

Sangana nemhando dzakasiyana dzezvido zveakadhindwa edunhu mabhodhi

Zvinhu Zvinokanganisa PCB BGA Gungano Hunhu?

Hunhu hwePCB BGA (Ball Grid Array) musangano unogona kukanganiswa nezvinhu zvakasiyana. Kuve nechokwadi chekutarisisa zvinhu izvi kwakakosha pakuwana gungano reBGA rinovimbika uye remhando yepamusoro.Nekuzvipira kweHighleap kune izvi zvinhu uye nekuitwa kwemaitiro akaomesesa ekugadzira, tinogara tichiendesa magungano eBGA emhando yepamusoro uye akavimbika. Maitiro edu ekushandira pamwe, anosanganisira vagadziri vePCB, nyanzvi dzemagungano, uye vashandi vekutonga kwemhando, inova nechokwadi chekutonga kwakanaka kwezvinhu izvi, zvichikonzera gungano reBGA rakabudirira remhando dzakasiyana dzekushandisa. Hezvino zvimwe zvakakosha zvinogona kukanganisa PCB BGA gungano mhando:

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Solder Paste Application

Iko kushandiswa kwe solder paste kwakakosha kuti uwane majoini akanaka ekutengesa. Zvinhu zvakadai sedhizaini yestencil, solder paste kuumbwa, uye printing process paramita (semuenzaniso, squeegee pressure, kumhanya, uye kurongeka) zvinogona kukanganisa solder paste deposition. Yakakodzera solder paste application inovimbisa huwandu hwakakwana hwe solder yekugadzira hukama hwakavimbika.

2

BGA Component Alignment:

Kurongeka kwakaringana kwechikamu cheBGA paPCB kwakakosha. Misalignment inogona kukonzera kushata solder kubatana kana zvikabudura pakati pepedyo solder mabhora. Kuongorora kwakakwana uye kutonga panguva yekuiswa kunobatsira kuve nechokwadi chekumisikidzwa kwechikamu cheBGA paPCB.

3

Solder Reflow Profile

Iyo solder reflow process inosanganisira kupisa iyo PCB kunyungudutsa solder paste uye kugadzira iyo solder yekubatanidza. Iyo reflow profiles inosanganisira ma paramita akadai preheat, soak, uye peak tembiricha, pamwe neiyo ramp-up uye ramp-pasi mitengo. Iyo yakanyatso optimized reflow profile inova nechokwadi chekunyorova uye kuyerera kweiyo solder paste, kudzivirira nyaya senge kusakwana solder volume, voids, kana solder bhora kudonha.

4

Thermal Kufunga

BGA mapakeji anogona kugadzira kupisa kwakanyanya panguva yekushanda. Thermal management yakakosha kudzivirira kuwanda kwekupisa, izvo zvinogona kukanganisa kuvimbika kwemajoini ekutengesa. Yakakodzera yekupisa dhizaini, kusanganisira kushandiswa kwemafuta ekupisa, masingi ekupisa, uye mitsetse yemhangura yakakwana yePCB, inobatsira kubvisa kupisa zvinobudirira uye inodzivirira kutadza kunokonzerwa ne thermally.

5

PCB Dhizaini Mafungiro

Iyo PCB dhizaini inoita basa rakakosha mumhando yegungano reBGA. Dhizaini zvinhu senge padhi dhizaini, kuburikidza nekuisa, uye solder mask dhizaini inobata iyo solder majoini kuumbwa uye kuvimbika. Saizi yakakodzera yepedhi, chimiro, uye nzvimbo yakakosha kuti ive nechokwadi chekunyorova kwakaringana uye kudzivirira bhiriji rekutengesa kana bhora rekutengesa zvisizvo.

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PCB Material Selection

Sarudzo yePCB zvinhu inogona kukanganisa BGA ungano mhando. Zvinhu zvakadai se coefficient of thermal expansion (CTE) yezvinhu zvePCB zvinofanirwa kuenderana nechikamu cheBGA uye maitiro egungano. Mismatched CTEs inogona kutungamirira mukupisa kunetseka uye solder joint kukundikana nekufamba kwenguva.

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Kuongorora uye Kuedzwa

Kunyatsoongorora uye kuyedza maitiro kwakakosha pakuona mhando yeBGA magungano. Matekiniki akadai sekuongorora kweX-ray, otomatiki optical inspection (AOI), uye kuyedza magetsi anobatsira kuona zvakakanganisika senge kusakwana kwevhoriyamu yesoda, kurongeka, zvikabudura, kana zvakavhurwa zvinongedzo. Kuongorora kwakakodzera uye maitiro ekuyedza anobatsira kuona nekugadzirisa chero nyaya chigadzirwa chekupedzisira chisati chaiswa.

Highleap BGA Kugona

Iyo yenguva dzose kugadzirwa kweBGA mufekitori yedu ndeiyi inotevera. Kana uine zvakakosha zvinodiwa, tapota taura nesu pa Highleap. Tine nyanzvi yehunyanzvi maitiro timu:

Iyo shoma dhayamita yeBGA pad ndeye 0.2MM (yemuenzaniso muganho unogona kuva 0.15MM).

Iyo shoma BGA kumutsara ndeye 3MIL (iyo prototype muganho inogona kuva 2.5MIL).

Iyo shoma chinhambwe kubva kuBGA solder pad edge kuenda kune solder pads mupendero wezvimwe zvikamu ndeye 0.15mm.

The shoma chinhambwe kubva pakati imwe BGA solder pad kusvika pakati imwe BGA solder padis 0.35mm.