Yakavimbika HDI PCB Mugadziri | Kukurumidza Kuendesa, Complex Stackups, Global Supply
Wana High-Density Interconnect (HDI) PCBs anosvika 5+N+5 stackups. Kuvimbwa nemishonga, telecom, uye mhando dzemotokari. Kukurumidza kutendeuka: 5-15 mazuva.
HDI PCB Manufacturing Services
Unoda compact, yakakwirira-kumhanya, yakawanda-layer HDI PCBs yezvikumbiro zvakaoma? Highleap inyanzvi mutsika High-Density Interconnect (HDI) PCBs dzakagadzirirwa kusangana nezvinodiwa zvakanyanya. Kubva mapofu uye akavigwa vias kusvika ku microvias uye yega-layer interconnects, yedu yepamusoro yekugadzira maitiro inovimbisa kushanda kwepamusoro uye kuvimbika. Tora quote nhasi uye ukurumidze kutanga chigadzirwa chako nekucheka-kumucheto HDI tekinoroji.
Mhando dzeHDI PCB
HDI PCBs anowanikwa mumhando dzakasiyana siyana, heano mamwe marudzi akajairika eHDI PCBs:
1 + N + 1
Mune iyi stackup, "1" inomiririra core layer ine mhangura kumativi ese, uye "N" inoratidza huwandu hwemamwe maturu emhangura akawedzerwa pamusoro peiyo core layer.
Aya ma stackups akanyatsokodzera zvishandiso senge yepamusoro-yekupedzisira smartphones, mahwendefa, malaptop, uye mamwe epamberi emagetsi evatengi.
HDI PCB 1+N+1 kuvaka
2 + N + 2
Iine 2-N-2 stackup, kune maviri epakati akaturikidzana pakati peakawanda akawedzera mhangura akaturikidzana.
Aya ma stackups akanyatsokodzera yepamusoro-inoshanda komputa, nharembozha midziyo, zvekurapa, uye zvimwe zvepamberi zvemagetsi zvikumbiro.
3 + N + 3
Aya akaturikidzana anonyanya kukodzera mafoni emazuvano, mahwendefa, midziyo inopfekwa, midziyo yekukurumidzira yekutaurirana, uye zvimwe zvigadziriso zvemagetsi zvemakompakiti.
Nekudaro, inodawo chaiwo maitiro ekugadzira uye epamberi PCB ekugadzira hunyanzvi kuti ive nechokwadi akavimbika uye emhando yepamusoro mabhodhi.
HDI PCB - Yese Layer Kubatana
Yakaderedzwa kuburikidza neHDI PCB
Mune yakadzedzereka kuburikidza neHDI PCB, mamicrovias akazununguka pakati pezvikamu zvakasiyana, zvichipa kuchinjika kwakawanda uye nzvimbo yenzira yekufambisa uye yekubatanidza zvikamu.
Nekushandisa yakadzama vias, vagadziri vanogona kukwidziridza nzira dzechiratidzo uye kuderedza kurasikirwa kwechiratidzo, kuve nechokwadi chekuita kuri nani uye kuvimbika kwechigadzirwa chemagetsi.
Yakaturikidzwa kuburikidza neHDI PCB
Mune akaturikidzwa kuburikidza nedhizaini, mamicrovias akaturikidzana pamusoro peumwe neumwe kugadzira yakatwasuka yekubatanidza pakati peakasiyana akaturikidzana ePCB.
Iyo chaiyo HDI stack-up inoderedza mitengo yako!
HDI PCB mitengo inogona kudzikiswa kana yako stack-up yakanyatsorongwa kunze. Mainjiniya kuHighleap Electronic anogona kukubatsira zvakanaka prototype uye kugadzira ako akadhindwa edunhu mabhodhi.
Yedu HDI PCB Kugona Mukuita
Ona mienzaniso chaiyo yehunyanzvi hwedu hwekugadzira HDI PCB-kubva pamagetsi anopfekeka anopfeka kusvika kumabhodhi akaomarara enhare. Imwe neimwe purojekiti inosimbisa kugona kwedu mumicrovias, laser drilling, uye akaturikidzana kuburikidza nemadhizaini.
5 Nhanho HDI PCB
Rigid-Flex HDI PCB
Gobvu Mhangura HDI PCB
Gobvu Mhangura HDI PCB
Mixed-Pressure HDI PCB
HDI PCB ine Metal Half-Holes
Highleap Electronics HDI PCB Manufacturing Process
HDI Maitiro Anoyerera eMaviri-Sided uye Multilayer Mwanasikana Mabhodhi kana Bofu Via stack paAkavigwa Via
Iyo HDI (High-Density Interconnect) yekugadzira maitiro ese ari maviri-Maviri-Sided uye Multilayer Sub Boards inoteedzera yakadzama seti yematanho, kuve nechokwadi chepamusoro uye kuita kwechigadzirwa chekupedzisira. Sezvo isu tichifamba nematanho ekuita, zvakakosha paramita senge kuteedzera hupamhi, ukobvu hwemhangura, uye akasiyana-siyana ekuisa matanho anoita basa rakakosha mukuona yekupedzisira mhando yePCB. Pazasi pane kupatsanurwa kwematanho emaitiro ese ari maviri emhando mabhodhi uye akakosha kufunga kwePCB dhizaini.
Maviri-Sided Daughter Board process (POFV)
Tanga nesubstrate → Gadzirira kubika substrate wapedza kucheka → kupeta mhangura (8±1μm) → Dzvora maburi → Kubvisa → Copper plating → Negative plateing → Purogi yeresin → kupukuta → kupeta mhangura (15±3μm) → Kupura → Copper → Bhodhi → Chikamu → Copper 2. kupura 1 (Zvitanho zviviri zvepuranga kuti uwedzere ukobvu hwemhangura pamakomba akavigwa ne1μm) → Kupenya kusina kunaka kwemukati → Firimu rakaomarara remukati 15 → Kuongorora firimu rakaoma → Inner etching 1 → Inspection yeInner AOI → Brown oxidation.
Multilayer Mwanasikana Board Maitiro (POFV)
Tanga nesubstrate → Pre-bika substrate wapedza kucheka → Inner dry film → Inner etching → Inner AOI inspection → Brown oxidation → Kugadzika → Pre-bika 1 → Kugaya kumucheto → kuchera mhangura (8±1μm) → Dzvora maburi → Deburring → Deburring → Copper plating → Copper plating → Kupeta mhangura (15±3μm) → kupenya (Danho 2) → Kupura mhangura 1 → Kupura bhodhi → Kupura bhodhi 1 (Matanho maviri epuranga 15 (Matanho maviri epuranga kuti uwedzere kukora kwemhangura pamakomba akavigwa ne1μm) → Kupenya kwakashata kwemhangura → Firimu rakaoma remukati → Kuongorora → Kuongorora firimu remukati → Kuongorora kuongorora → Brown oxidation 1.
Iwo akatsanangurwa HDI maitiro eese maviri-Sided uye Multilayer Daughter Boards anovimbisa kuti mabhodhi anosangana nemhando yepamusoro yehutsi, kuita, uye kuvimbika. Iwo maparamita ekutsvagira hupamhi, nzvimbo, uye ukobvu hwemhangura akakosha pakuona kuti mabhodhi anosangana nezvinodiwa zvekumhanya-mhanya uye yakakwirira-frequency application. Matanho ekuita, anosanganisira plating, etching, uye kuongorora, shuwa kuti yega yega yakaumbwa uye yakabatana, ichipa kune yese kushanda uye kunaka kwechigadzirwa chekupedzisira.
Hapana Akaturikidzana Laser Bofu Vias Multilayer Daughter Board Maitiro ane Negative Plating + Resin Plugging (Isiri Kusangana nePP Kuzadza Mamiriro)
Tanga nesubstrate → Pre-bika the substrate wapedza kucheka → Inner dry film lamination → Inner etching → Inner AOI inspection → Brown oxidation → Lamination → Pre-bika 1 → Kugaya kumucheto → Kupeta mhangura (8±1μm) → Drill maburi → Deburring → Copper → Deburring → Copper Repuleti Kupenya → kupeta mhangura (sezvinodiwa) → kupenya (Danho 2) → Firimu rakaoma remukati 1 → Kuongorora firimu rakaoma → Kuonda kwemukati 1 → Kuongorora kwemukati kweAOI → Brown oxidation 1
Zvichienderana nekuyerera kuri pamusoro apa, zviri pachena kuti HDI PCB stack-up dhizaini inokanganisa zvakanyanya inotevera CAM engineering maitiro. Zvisarudzo zvakasiyana-siyana zvekugadzira uye nzira dzekugadzira zvinogona kukanganisa zvikuru kusikwa kweGerber mafaira, izvo zvinokosha pakugadzirwa kwePCB. Nekuda kweizvozvo, yakaoma HDI PCB stack-up dhizaini inowanzoda nguva yakawanda yeCAM kugadzirira uye inoda imwe mainjiniya QA. Kuchengetedza zvese nguva nemitengo, vagadziri vanofanirwa kubvunza nesu nekukurumidza kana tichishanda pane yakaoma HDI PCB stack-ups. Nekutora iyi proactive nzira, zvingangoitika zvinogona kutariswa nekugadziriswa nekukurumidza, zvichitungamira kune akagadziridzwa maitiro, kuderedzwa zvikanganiso, uye yakakosha yekuchengetedza zviwanikwa.
Laser Hole Layer process uye Circuit Production Kugona (Inner Layer)
Multilayer Daughter Board Pasina Kuvigwa Vias: Electroplating Hole Kuzadza
Lamination → Pre-bika the substrate → Edge milling → Dzvora maburi (board edge maburi) → Brown oxidation 1 → Kuchera nelaser → kurapwa kweplasma → Kucheneswa kwemakemikari → Kuongorora kwegomba → Kuputira mhangura 2 → Bhodhi plating 1 → Electroplating gomba rinodiwa → kuomesa gomba → kuomeswa kwemhangura → kuomeswa kwemhangura 2. Inner etching 2 → Inner AOI kuongorora 1 → Brown oxidation 2
Multilayer Mwanasikana Bhodhi isina Akaturikidzana Laser Bofu Vias Kushandisa Negative Plating + Resin Plugging (Kusasangana nePP Kuzadza Mamiriro)
Lamination → Pre-bika the substrate → Edge milling → Dzvora maburi (board edge maburi) → Brown oxidation 1 → Kuchera nelaser → Plasma kurapwa → Kuchenesa kemikari → Kuongorora kwegomba bofu → Kuchera → Copper plating 2 → Negative Polish plating → Kupura → Resin inodiwa (Danho 2) → Firimu rakaoma remukati 2 → Kuongorora firimu rakaoma → Kuisa mukati 2 → Kuongorora kwemukati kweAOI 1 → Kuokisisa kwebrown 2
Iyi nzira inovimbisa kusikwa kwakaringana kweakakwira-density yekubatanidza kune multilayer mwanasikana mabhodhi. Kune mabhodhi asina kuvigwa vias, nhanho senge laser drilling, kurapwa kweplasma, uye kuchenesa makemikari anoitwa kuti ave nechokwadi chechokwadi kuburikidza nekuumbwa. Mushure mekuongororwa kwegomba remapofu, kuputirwa kwemhangura, uye kuzadza gomba re electroplating, mhangura inotetepa kuti isangane nezvinodiwa.
Nokuti mapuranga pasina akaturikidzana Laser bofu vias, muitiro zvinosanganisira zvakaipa plating uye resin plugging, nechokwadi kuti vias akanyatsozadzwa. Iko kushandiswa kwelaser drilling uye anotevera matanho anovimbisa kuchena uye kwakaringana kuburikidza nekuumbwa. Maitiro acho anopera nekukwenenzverwa, kuonda kwemhangura, uye nekuongororazve kuti bhodhi rinosangana nemaitiro ekuita kwepamusoro-kumhanya uye yakakwirira-frequency application.
HDI PCB Motherboard (Outer Layer) Maitiro
Electroplating Gomba Kuzadza + Pateni Plating
Lamination → Pre-bika 1 → Kugaya kuEdge → Drivha maburi maburi → Brown oxidation → Kuchera nelaser → kurapwa kweplasma → Kucheneswa kwekemikari → Kuongorora gomba risingaoni → Kuputira nemhangura 1 → Kuzadza bhodhi 1 → Electroplating gomba rekuzadza → Kuonda kwemhangura → Kuonda kwemhangura → Kuonda kwemhangura → Kuonda kwemhangura
Pattern Plating
Lamination → Pre-bika 1 → Edge milling → Drivha maburi maburi → Brown oxidation → Kuchera nelaser → kurapwa kwePlasma → Kuchenesa kemikari → Kuongorora gomba rakapofumadzwa → Kuchera → Yakanaka photoresist process
Negative Plating + Resin Plugging + Pattern Plating
Lamination → Pre-bika 1 → Kugaya kuEdge → Drivha maburi maburi → Brown oxidation → Kuchera nelaser → kurapwa kwePlasma → Kuchenesa kemikari → Kuongorora gomba rakapofumadzwa → Kuboora resin → Kubvisa 1 → Copper plating 1 → Negative pluging → Copper → Resin thinning → Resin Polishing (15±3μm) → Kuchera → Yakanaka photoresist maitiro
Plating Hole + Resin Plugging + Pattern Plating
Lamination → Pre-bika 1 → Edge milling → Drivha maburi maburi → Brown oxidation → Kuchera nelaser → mushonga wePlasma → Kucheneswa kwemakemikari → Kuongorora gomba rakapofumadzwa → Kuchera resin → Kubvisa 1 → Kuputira mhangura 1 → Kupura bhodhi → Kuroverera gomba photoresist process
Maitiro Tsananguro uye Makiyi Paramita
Maitiro anotsanangurwa akagadzirirwa kugadzira emhando yepamusoro multilayer maseketi emabhodhi eamai, achitarisa nzira dzakadai se electroplating gomba kuzadza, pateni plating, uye resin plugging kuti uwane yakavimbika magetsi ekubatanidza. Yekuzadza gomba re electroplating, kunyatsoita mukuonda kwemhangura uye kuzadza gomba kunogonesa kutendeseka kwechiratidzo uye kuita mumhando yepamusoro-density dhizaini.
Nokuti zvakaipa plating uye resin plugging, muitiro kunosanganisira zvakawanda yepamusoro unyanzvi nechokwadi kuti vias akanyatsozadzwa uye pamusoro inoramba yakatsetseka nokuda muenzaniso plating. Iyo yakaderera yekuteedzera hupamhi uye yekuteedzera nzvimbo yakakosha yakakosha kune yakakwirira-kuita maapplication, kuve nechokwadi chekuti mamaboard inokwanisa kubata yakakwirira-kumhanya masaini uchichengetedza kuvimbika.
Highleap Electronics HDI PCB One-Stop Assembly Service
Highleap Electronics inopa yakazara HDI PCB (High-Density Interconnect) musangano sevhisi, ichipa isina musono, imwe-kumira mhinduro kune yako PCB inoda. Yedu HDI PCB musangano sevhisi inovhara zvese kubva pakugadzira uye prototyping kusvika kugadzira uye yekupedzisira kusangana, kuve nechokwadi chekuti zvigadzirwa zvako zvinounzwa nenguva, nekuita kwepamusoro uye nemazvo.
Yedu HDI PCB yekugadzira maitiro inokwirisa ichangoburwa mutekinoroji, ichitigonesa kugadzira yakanyanya kusimba edunhu mabhodhi ayo akakosha kune maapplication anoda madiki mafomu maficha, kukurumidza-kumhanya, uye yakakwirira-frequency kugona. Nesevhisi yedu-yekumira, tinobata zvese zvikamu zvehurongwa hwegungano, kusanganisira:
- Dhiza Rutsigiro: Chikwata chedu chinoshanda padhuze newe kuti uve nechokwadi chekuti dhizaini yako yeHDI PCB inosangana nezvose zvinoshanda uye zvekugadzira zviyero.
- Prototyping: Isu tinopa nekukurumidza-kutendeuka prototyping masevhisi, achikubvumidza kuti uedze dhizaini yako isati yazara-chiyero kugadzirwa.
- Manufacturing: Kubva pakudhirowa kwelaser uye microvia formation kusvika ku lamination uye copper plating, isu tinoshandisa yakanakisa maitiro muHDI PCB kugadzira kugadzira emhando yepamusoro mabhodhi.
- gungano: Isu tinounganidza yako HDI PCBs tichishandisa yazvino midziyo, kuve nechokwadi chekuti zvikamu zvakaiswa nemazvo, zvine hunyanzvi hwekusodha uye kuyedza kuti ive nechokwadi chekuita kwakavimbika.
- Kuedza uye Kuongorora: Matanho edu ekunyatso ongorora, anosanganisira AOI (Automated Optical Inspection) uye X-ray ongororo, tinoona kuti bhodhi rega rega rinozadzikisa zviyero zvemhando yepamusoro.
Nekupa imwe-yekumira mhinduro, Highleap Electronics inoderedza kudiwa kwevazhinji vatengesi, kuderedza nguva dzekutungamira uye kurerutsa zvinhu. Kunyangwe iwe uchida yakaderera-vhoriyamu prototypes kana yakakura-yakakura yekugadzira inomhanya, isu takazvipira kuendesa emhando yepamusoro HDI PCBs akagadzirirwa kune zvaunoda chaizvo. Chikwata chedu chakazvitsaurira chinova nechokwadi chekuti chirongwa chega chega chinobatwa nekutarisisa zvakanyanya kune ruzivo uye mhando, zvichiita kuti tive mudiwa akakodzera kune yako HDI PCB musangano zvinodiwa.
HDI PCB Manufacturing Capabilities
Isu tinopa huwandu hwakakwana hweHDI PCB kugadzira kugona, kuve nechokwadi chepamusoro uye kuvimbika kune akasiyana maapplication. Michina yedu yepamusoro inoita kuti tikwanise kuburitsa zvakasiyana-siyana HDI PCBs, kusanganisira Bofu Vias HDI PCBs, apo vias batanidza imwe rukoko kune imwe pasina kupfuura yose bhodhi; Kuvigwa Vias HDI PCBs, uko vias inobatanidza mukati mezvikamu asi isingasviki pamusoro; Microvia HDI PCBs, inoratidzira yakanaka vias for compact, high-density applications; uye Laser Drilled Holes, uko-ye-the-art laser drilling tekinoroji inoshandiswa kugadzira chaiyo microvias nemakomba, akanakira epamusoro-density dhizaini madhizaini ane kushivirira kwakasimba. Iyi tekinoroji inonyanya kunyatsokodzera zvikumbiro zvinoda nzvimbo shoma yebhodhi uye kushanda kwepamusoro.
HDI PCB Maitiro uye Mutsara Kugona
Yedu yekugadzira maitiro inotsigira akasiyana emhangura ukobvu, ichipa kuchinjika kune akasiyana dhizaini zvinodiwa. Tinobata makobvu emhangura kubva pa0.33 oz kusvika 1 oz, nehupamhi hwemhangura hwakapedzwa hwe25μm hwe0.5 oz mhangura uye 35μm ye1 oz mhangura. Rudzi urwu runotitendera kuti tisangane neakasiyana-siyana maitiro ekuita uku tichiona hunoenderana mhando mumhando dzakasiyana dzebhodhi.
Magadzirirwo edu ekugadzira anosanganisirawo upamhi hwemutsara, nekukwanisa kuwana upamhi hwemitsara yakatetepa se2.0 mil ye0.5 oz copper uye 2.5 mil ye1 oz copper. Aya mafaradhi akanaka akakosha pakugadzira madhizaini akanyanya compact anoda kunyatsojeka uye kugona, kunyanya mukumhanya-mhanya uye yakakwirira-frequency application.
Yepamberi HDI PCB Technologies
Isu tinoshandisa matekinoroji epamberi kuti tive nechokwadi chemhando yepamusoro uye mashandiro eHDI PCB edu:
- Back Drilling: Nzira inoshandiswa kubvisa chikamu chegomba rakaputirwa-kuburikidza negomba kubva kune mamwe akaturikidzana mukati, kuderedza kutendeseka kwezviratidzo uye kuve nechokwadi chekushanda kuri nani mumashandisirwo epamusoro-soro.
- Kudzora Kudzika Kuchera / Kugaya: Precision-inodzorwa kuchera inovimbisa kudzika kwegomba uye kurongeka, izvo zvakakosha kune akawanda-layer dhizaini.
- Akavigwa Capacitance: Nekubatanidza iyo yakaonda dielectric layer, isu tinosimudzira chiratidzo chekuvimbika nekugovera decoupling capacitance, tichigonesa kuita kwemasaini ekumhanya-mhanya.
- Hole Tolerances: Yedu yepamusoro-chaiyo yekuchera michina inotibvumira kuchengetedza kushivirira kwakasimba kwegomba uye nzvimbo dzegomba dzakaringana, zvakakosha kune yakavimbika interlayer kubatana uye kuburikidza-gomba insulation.
Neaya epamberi ekugadzira matekinoroji, tinogona kugadzira HDI PCBs inosangana nepamusoro indasitiri zviyero, kuve nechokwadi chekuvimbika, kuita, uye kugona kune ese maapplication.
Tanga Yako PCB Project!
Highleap, sevagadziri veHDI PCB vane ruzivo, vane ruzivo rwakakura mukugadzira HDI PCBs kune vatengi mumaindasitiri akasiyana akadai sekurapa, emotokari, uye zvemagetsi. Isu tine kugona kubata ese HDI PCB mapurojekiti nekurongeka kusingaenzaniswi uye yemhando yepamusoro, kuve nechokwadi chekuti tinozadzisa zvaunoda uye kugara mukati mebhajeti yako.
Kusarudzwa kwezvinhu zveHDI PCB
Kusarudza iyo chaiyo dielectric zvinhu kana resin yakakosha pakuita kweHDl. Zvinhu zvinotevera zvakakosha:
Decomposition Temperature (Td)
Iyo HDI PCB zvinhu zvinofanirwa kuve neTd iri pamusoro petembiricha yekushandiswa kwayo. Iwo tembiricha solder panguva HDI PCB gungano ari 250 ℃ kusvika 300 ℃ renji, saka ita nechokwadi kuti zvinhu Td yakakwirira kupfuura iri renji.
Dielectric Constant (Dk)
Kune maHDI PCB, zviri nani kushandisa zvinhu zve substrate zvine DK yakaderera. Kana DK yakaderera, kusimba kwechiratidzo uye kudzorwa kwe impedance kunowedzera, kunyanya pama frequency akakwira. Zvinhu zveDK yakaderera zvinoderedza kurasikirwa kwechiratidzo, kutaura kwecrosstalk, nezvimwe zvinetso zvemagetsi, zvichiita kuti zvive nechokwadi chekuti masaini edhijitari neRF anoshanda zvakanaka.
Glass Transition Temperature (Tg)
Pakugadzira HDI PCB, chinhu chine Tg yakakwira chinowanzo sarudzwa. FR4 ine Tg ye170°C kana kupfuura ndiyo inonyanya kushandiswa kumaPCB aya, sezvo ichipa hunhu hwakanaka hwekupisa uye hwemakanika.
Kurasika tangent
Iko kurasikirwa kwesimba kwechiratidzo sezvainopfuura nemutsetse wekutumira pane dielectric zvinhu.
Coefficient of Thermal Expansion (CTE)
Uku kungoerekana kwawedzera uye kudhonzwa kwedunhu kunogona kuve nemhedzisiro inoparadza pazvikamu, kunyanya hombe silicon chip mapakeji. Kunyanya kupisa kwebhasikoro kunoguma nekutadza kwemajoini ekutengesa nekuti dunhu rinowedzera nekukurumidza kupfuura iyo silicon chip yakatemerwa kushivirira. Uyezve, izvi zvinozoguma nemasimba ekugera anogadzira micro misodzi nekufamba kwenguva.
Zvakajairwa Zvishandiso zveHDI PCBs
Isu tine hesera yakakwana yemhando dzakasiyana dzeHDI PCB zvinhu uye kwenguva refu kubatana nevashambadziri vakanaka kuperekedza yako HDI PCB chirongwa.
Normal Speed uye Kurasikirwa
Zvakajairika kumhanya uye kurasikirwa zvinhu zvinonyanya kuenderana nedhijitari zvishandiso zvinogumira kune mashoma GHz. Muenzaniso wakakurumbira wechinhu chakadaro Isola 370HR.
Kumhanya Kwepakati uye Kurasika Kwepakati
Zvishandiso zvekumhanya zviri pakati nepakati zvinonyatso kuenderana nemashandisirwo anogumira ku10 Ghz asi kwete chero yakakwirira. Iyo Nelco N7000-2 muenzaniso wakakurumbira kubva muchikamu ichi chemidziyo.
High Speed, Low Loss
Izvi zvinhu zvine zvakanakira kuderera kwe dielectric kurasikirwa uye kushoma kwemagetsi ruzha. Izvi zvekushandisa zvakanyanya zvine Tg yeinoda kusvika 180 ° CA yakakurumbira muenzaniso wekumhanya, yakaderera kurasikirwa zvinhu ndeye Isola's I-Speed.
Yakanyanya Kumhanya, Yakanyanya Kuderera Kurasikirwa
Yakanyanya Kumhanya, Yakanyanya Kuderera Kurasa zvinhu zvinoenderana nemashandisirwo anokwira kusvika ku100 Ghz uye kumusoro. Iyo Isola Tachyon 100G chinhu chakakurumbira chiri chechikamu ichi.
HDI PCB Manufacturing Technology
Iyo yakaoma mukugadzira HDI PCB ndeye microvias, iyo inogadzirwa kuburikidza nesimbi uye matete waya.
Microvia kugadzira
Kugadzirwa kweMicrovia kwagara kuri nyaya huru yekugadzira HDI PCB. Pane nzira mbiri huru dzekuchera:
1.Mechanical drilling, iyo kune yakajairwa kuburikidza nekuchera gomba inogara iri sarudzo yakanakisa yekushanda kwayo kwakanyanya uye mutengo wakaderera. Nekuvandudzwa kwehunyanzvi hwekugadzira, kushandiswa kwayo mumicrovias kuri kuramba kuchikura.
2.Laser drilling, iyo ine marudzi maviri: photothermal ablation uye photochemical ablation. Iyo yekutanga inoreva nzira iyo iyo yekushandisa inodziya kunyunguduka uye kuputika kuburikidza neyakaumbwa kuburikidza negomba mushure mekunge iyo yakakwira-simba laser yanyungudika. Iyo yekupedzisira inoreva mhedzisiro yeakakwira-simba mafotoni uye lasers anopfuura 400nm munharaunda yeultraviolet.
Kuburikidza nesimbi
Dambudziko guru rekupfuura-gomba simbi nderekuti zvakaoma kuwana yunifomu plating. Kune yakadzika-gomba electroplating tekinoroji yemicrovias, kunze kwekushandiswa kweiyo electroplating mhinduro ine yakakwira dispersibility, mhinduro yeplating pachigadzirwa che electroplating inofanira kuvandudzwa nenguva. Izvi zvinogona kuitwa kuburikidza nechakasimba mechanicha inomutsa kana vibration, ultrasonic kubvongodza, uye kupfapfaidza kwakachinjika. Mukuwedzera, hunyoro hwemadziro ekuburikidza neburi hunofanira kuwedzerwa kusati kwaputirwa.
Pamusoro pekuvandudzwa kwemaitiro, HDIs 'kuburikidza-gomba simbi yesimbi yakaonawo kuvandudzwa kukuru kwetekinoroji: izvi zvinosanganisira makemikari ekuwedzera tekinoroji tekinoroji, yakananga electroplating tekinoroji, nezvimwe.
Dunhu redunhu
Kuzadzikiswa kwemitsara mitete kunosanganisira yechinyakare kutapurirana mifananidzo uye yakananga laser imaging. Chinyakare kutamisa mifananidzo kwakafanana nemaitiro ekugadzira mitsetse neyakajairwa kemikari etching.
Kune yakananga laser imaging, mufananidzo unoumbwa zvakananga pane photosensitive firimu nelaser. Iyo ultraviolet (UV) mwenje inoshandiswa pakushanda, kuitira kuti mvura inogadzirisa anticorrosion inogona kusangana nezvinodiwa zvekugadziriswa kwepamusoro uye kushanda nyore.CAD/CAM inogona kubatanidzwa zvakananga kupfupisa kutenderera kwekugadzira uye kuita kuti ive yakakodzera kune zvishoma uye zvakawanda zvekugadzirwa.
Sarudza Highleap seYako PCB Mugadziri
Unyanzvi Hwakazara
Isu tine ruzivo rwakapfuma mumhando dzose dzePCB kugadzira uye assembly.Kubva kune chikamu chekutenga kusvika kune chigadzirwa chekutakura, tinogona kupedzisa nhanho imwe neimwe nehupamhi hwepamusoro.
Yakasimba Supplier Network
Nemakore gumi echiitiko muindasitiri yePCB, Highleap ine network yevatengesi inotipa mukana wakavimbika wekuwana zvinhu zvemhando yepamusoro pamitengo yemakwikwi.
Yakaomarara Hunhu Kudzora
Pakuita kwega kwega, isu tinonyatso kudzora hunhu nekushandisa kwakasiyana bvunzo uye ongororo kuti ive nechokwadi chekuti PCBA yega yega inosvika pamhando yepamusoro.
Tora Quick Quote
Ziva kuti hunyanzvi hwedu hunogona kubatsira sei nePCB yako inotevera chirongwa.