Kugadzira PCB yeChina I-Tera MT40 - Kurasikirwa Kwekukurumidza & Kuderera
Highleap Electronics inopa kugadzirwa nekugadzwa kwePCB yeI-Tera MT40 inoshanduka nekukurumidza. Isu tinovaka mabhodhi ane magwaro akawanda ane chitupa, akarasika zvishoma, uye anomhanya nekukurumidza uye anotumirwa pasi rose kubva kuChina.
Kugadzira PCB yeI-Tera MT40 yeHigh-Speed Digital uye RF Designs
I-Tera MT40 imhuri yePCB laminate uye zvinhu zve prepreg zvishoma kubva kuIsola zvekugadzira madhizaini edhijitari anomhanya nekukurumidza uye RF/microwave circuit. Highleap Electronics inopa masevhisi ekugadzira maPCB anomhanya-mhanya uye maPCB assembly kumapurojekiti anotsanangura I-Tera MT40 mu multilayer, controlled-impedance, uye mamwe magadzirirwo ebhodhi anonzwa zviratidzo.
Mukugadzirwa kwePCB yeI-Tera MT40, hunhu hwezvinhu zvinoumba chikamu chimwe chete chekugadzirwa kwemagetsi. Stack-up geometry, ukobvu hwemhangura, dielectric spacing, trace dimensions, reference planes, via transitions, uye copper-foil hunhu zvinogona kukanganisa PCB yapera. Highleap inoongorora zvinodiwa izvi zvebhodhi sechikamu chedata rekugadzira risati ragadzirwa.
- Puratifomu yezvinhu zvinorasikirwa zvishoma zvemaPCB edhijitari anomhanya zvakanyanya uye RF/microwave
- Sarudzo dzeLaminate nekugadzirira maPCB akawanda
- Inoshanda kune magadzirirwo ePCB ane impedance inodzorwa uye magadzirirwo ePCB ane frequency yakakwira
- Rutsigiro rwekuvaka kwePCB dzakawanda, HDI, hybrid, uye dzakaoma
Kune mapurojekiti ekugadzira maPCB eI-Tera MT40, Highleap Electronics inogona kushanda kubva pamafaira ako eGerber akaburitswa, stack-up, impedance zvinodiwa, drill data, uye magwaro ekuunganidza kuronga kugadzirwa kwePCB uye kugadzirwa kwePCBA. Hunhu hwezvinhu zviripo uye zvivakwa zviripo zvinofanirwa kusimbiswa zvichienderana nemagwaro ehunyanzvi eIsola asati stack-up yekupedzisira yaburitswa.
I-Tera® MT40 - Mamiriro Ekuita
| pfuma | Typical Value | Units | Test Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) neDSC | 200 | ° C | 2.4.25C |
| Glass Transition Temperature (Tg) neTMA | 205 | ° C | 2.4.24C |
| Decomposition Temperature (Td) neTGA @ 5 % kuderedza uremu | 360 | ° C | 2.4.24.6 |
| Nguva yeDelaminate neTMA (Copper yakabviswa) - A. T260 | > 60 | maminitsi | 2.4.24.1 |
| Nguva yeDelaminate neTMA (Copper yakabviswa) - B. T288 | > 60 | maminitsi | |
| Z-Axis CTE - A. Pre-Tg | 55 | ppm / ° C. | 2.4.24C |
| Z-Axis CTE - B. Post-Tg | 290 | ppm / ° C. | |
| Z-Axis CTE - C. 50–260 °C (Kuwedzera Kwese) | 2.8 | % | |
| X/Y-Axis CTE — Pre-Tg | 12 | ppm / ° C. | |
| Kuchengetedza Kwemhepo | 0.61 | W/m·K | ASTM E1952 |
| Thermal Stress 10s @ 288 °C (550.4 °F) - A. Unetched | Pass | zvekuona nemeso | 2.4.13.1 |
| Thermal Stress 10s @ 288 °C (550.4 °F) - B. Etched | Pass | zvekuona nemeso | |
| Dk, Mvumo — @ 2 / 5 / 10 GHz | 3.45 | - | 2.5.5.5 |
| Df, Loss Tangent — @ 2 / 5 / 10 GHz | 0.0031 | - | Bereskin Stripline |
| Vhoriyamu Resistivity C-96/35/90 | 1.33 × 107 | MΩ·cm | 2.5.17.1 |
| Surface Resistivity C-96/35/90 | 1.33 × 105 | MΩ | 2.5.17.1 |
| Dielectric Kuparara | 45.4 | kV | 2.5.6B |
| Arc Resistance | 139 | Seconds | 2.5.1B |
| Simba reMagetsi (Laminate & laminated prepreg) | 45 (1133) | kV/mm (V/mil) | 2.5.6.2A |
| Comparative Tracking Index (CTI) | 3 | Kirasi (Volts) | UL 746A / ASTM D3638 |
| Peel Simba - 1 oz EDC foil | 1.0 (5.7) | N/mm (lb/in) | 2.4.8C |
| Flexural Strength – A. Length direction | 71.0 | muchinda | 2.4.4B |
| Flexural Strength – B. Muchinjikwa | 58.0 | muchinda | |
| Kusimba Simba – A. Kureba kwakananga | 39.0 | muchinda | ASTM D3039 |
| Kukoira Simba – B. Muchinjikwa | 35.0 | muchinda | |
| Young's Modulus – A. Length direction | 3060 | muchinda | ASTM D790-15e2 |
| Young's Modulus – B. Muchinjikwa | 2784 | muchinda | |
| Poisson's Ratio – A. Length direction | 0.234 | - | ASTM D3039 |
| Poisson's Ratio – B. Muchinjikwa gwara | 0.222 | - | |
| Kunyorova Kusviba | 0.1 | % | 2.6.2.1A |
| Kupisa (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Relative Thermal Index (RTI) | 130 | ° C | UL 796 |
Cherechedza:
Yese tekinoroji data iri pamusoro akajairwa kukosha kwakavakirwa pane yepamutemo I-Tera® MT40 dhetabheti uye akajairwa bvunzo nzira (semuenzaniso IPC-TM-650, ASTM). Mhedzisiro chaiyo inogona kusiyana zvichienderana nekugadziriswa kwakasiyana semhando yemhangura, layer count, uye stackup dhizaini. Nemagadzirirwo akakosha, ndapota taura neHighleap Electronics yerutsigiro rweinjiniya uye kusimbisa stackup.
China-Yakavakirwa I-Tera® MT40 PCB Kugadzira - Inofambiswa ne Multi-Material Nyanzvi
KuHighleap Electronics, tinonyanya kugadzira nekusanganisa maPCB nekukurumidza tichishandisa zvinhu zvakasiyana-siyana zvinotungamira muindasitiri — zvinosanganisira I-Tera® MT40, maRF laminates asina kurasikirwa zvakanyanya, uye ma laminates ane kumhanya kwakanyanya. Zvinhu zvedu zvakawanda zviri mukati medu zvinotibvumira kusangana nezvinodiwa zvakasiyana-siyana zvekugadzira uye zvekushandisa pamutengo wepamusoro mumafoni, mundege, uye mumabasa ekuchengetedza data.
Nemakore emaoko-pane ruzivo muI-Tera MT40 PCB yekugadzira, isu tinopa akazara akagadziridzwa stackups, impedance control, uye multilayer zvivakwa zvinosangana nezvinodiwa zve25-56 Gbps interconnects, PCIe Gen 4/5, uye 100G/400G chiratidzo chekufambisa. Ese maPCB anogadzirwa mune yedu IPC Kirasi 2/3 yakasimbiswa nzvimbo muChina ine yakasimba yemhando yekudzora uye nekukurumidza kuburitsa mitsetse.
- 100% chaiyo Isola I-Tera® MT40 laminate sourcing
- Hybrid stackup rutsigiro (I-Tera MT40 + FR4, kana vamwe)
- Yepamberi yekugadzira: HDI, microvias, backdrilling
- Kuedzwa kwakazara kwemagetsi, impedance kusimbiswa, AOI & X-ray
- Rapid prototyping (mazuva 5-7) uye sarudzo dzekutumira pasi rose
Kunyangwe iwe uchida I-Tera MT40 PCBs kana mamwe akakwira-kumhanya PCB substrates, Highleap inopa imwe-stop kugadzira uye turnkey gungano kuti ikurumidze nguva yako yekutengesa. Chikwata chedu chinogona zvakare kukubatsira iwe kuenzanisa zvivakwa zvezvinhu kana kuvaka zvakatenderedza yako I-Tera MT40 dheteti zvinyorwa zveakanakisa kuita-mutengo wemutambo.
Yakavimbika I-Tera® MT40 PCB Mutengesi ane Kurumidza Kutendeuka uye Yakazara QA Tsigiro.
Highleap Electronics inopa kukurumidza-kutendeuka I-Tera MT40 PCB yekugadzira uye kuungana ine yakazara mukati-yemhando yekutonga. Kunyangwe iwe uri prototyping yakakwira-kumhanya siginecha layer kana kuvaka vhoriyamu RF module, isu tinosanganisa fekitori-yakananga kugadzirwa nechiratidzo chekuvimbika hunyanzvi kuti ive nechokwadi chekuita, kuwirirana, uye panguva-yekuburitsa.
Sefekitari yakasimirirwa yepamusoro-soro yePCB, tinotsigira akajairwa uye mahybrid MT40 stackups, anopa impedance-inodzorwa nzira, uye inosanganisira yakazara QA kuyedzwa - kutiita mudiwa akavimbika kune mainjiniya nemaOEM pasi rese.
- Yemahara DFM + stack-up wongororo nevane ruzivo RF/Signal mainjiniya
- 3-7 zuva rekukurumidza-kutendeuka kugadzirwa kweyakajairwa I-Tera MT40 inovaka
- AOI, X-ray, impedance bvunzo, bvunzo dzemagetsi zvese zvinosanganisirwa
- Factory certifications: RoHS, UL, ISO9001, IATF16949
- Global logistics tsigiro + yemuno mainjiniya rubatsiro
Tibate kuti ukumbire mutengo, kugamuchira mienzaniso yezvinhu, kana kuwana mazano ehunyanzvi nezve MT40 PCB layout yako, RF design, kana multilayer stackup. Tinotsigirawo mamwe maPCB laminates akasiyana-siyana anoderedza kurasikirwa kwakanyanya kunze kweI-Tera MT40, kusanganisira RF yakaderera kurasikirwa uye mhuri dzelaminate dzinomhanya zvakanyanya.