Yepamusoro-Speed IS620i PCB Gungano & Kugadzira Masevhisi
Highleap Electronics inopa IS620i PCB gungano uye kugadzira uchishandisa Isola zvinhu, zvakagadzirirwa yakakwirira-kumhanya yedhijitari uye RF application.
Nyanzvi PCB Kugadzira Yepamusoro-Kumhanya Zvishandiso - Kusanganisira IS620i Zvishandiso
KuHighleap Electronics, tiri vagadziri vePCB vanoshanda zvizere uye vanogadzira zvinhu, tinokwanisa kubata zvinhu zvese zvema laminate zvinozivikanwa uye zvepamusoro—kubva paFR-4 yakajairwa kusvika kuIS620i, ma hydrocarbon-ceramic low-loss laminates, MEGTRON6, nezvimwewo.
Fekitori yedu yakagadzirirwa kuomarara, HDI, RF, uye multilayer PCB kugadzirwa, uye isu tinoshanda nevagadziri mumaindasitiri kuunza yavo yekumhanya-mhanya, yakaderera-kurasikirwa PCB dhizaini kuhupenyu nehusina kufananidzwa nemazvo.
IS620i, yakagadzirwa neIsola Group, chimwe chezvinhu zvakawanda zvatinotsigira. Iyi shanduko inomiririra yekutanga mukirasi yezvigadzirwa zvedhijitari yakavakirwa pamatekinoroji aripo, asi ichipa mabhenefiti akakosha enyika yanhasi yedhijitari. IS620i yakagadzirwa zvakasiyana-siyana kuitira kushandiswa kwepamusoro-soro kubva pa2 kusvika ku15 GHz, ichipa vagadziri uye vanogadzira zvigadzirwa nekushanduka-shanduka kwekugadzirwa kwedhijitari, vimbiso yekugovera, uye nyore kwekugadzirisa FR-4.
Madimikira Akakosha Pakungotarisa
- Glass Transition Temperature (Tg): 225 ° C
- Decomposition Temperature (Td): 364 ° C
- Dielectric Constant (Dk): 3.58
- Dissipation Factor (Df): 0.006
Mamiriro ehunyanzvi eIS620i Laminate
Iyi tafura inotevera inopa yakazara tekinoroji yakatarwa yeIS620i yakakwira-performance laminate uye prepreg zvinhu. Ese ma values anojairwa zvivakwa uye anopihwa einjiniya referensi zvinangwa.
Thermal Properties
| pfuma | Kukosha kwechimiro | Units | Test Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) neDSC | 225 | ° C | IPC-TM-650 2.4.25C |
| Decomposition Temperature (Td) neTGA @ 5% kuderedza uremu | 364 | ° C | IPC-TM-650 2.4.24.6 |
| Nguva yeDelaminate neTMA (Copper yakabviswa) - T260 | 60 | maminitsi | IPC-TM-650 2.4.24.1 |
| Nguva yeDelaminate neTMA (Copper yakabviswa) - T288 | > 20 | maminitsi | IPC-TM-650 2.4.24.1 |
| Z-Axis CTE – Pre-Tg | 55 | ppm / ° C. | IPC-TM-650 2.4.24C |
| Z-Axis CTE - Post-Tg | 230 | ppm / ° C. | IPC-TM-650 2.4.24C |
| Z-Axis CTE - 50 kusvika 260°C (Kuwedzera Kwese) | 2.8 | % | IPC-TM-650 2.4.24C |
| X/Y-Axis CTE Pre-Tg | 13 | ppm / ° C. | IPC-TM-650 2.4.24C |
| Kuchengetedza Kwemhepo | 0.35 | W / mK | ASTM E1952 |
| Thermal Stress 10 sec @ 288°C – Unetched | Pass | Pass Visual | IPC-TM-650 2.4.13.1 |
| Thermal Stress 10 sec @ 288°C – Yakaiswa | Pass | Pass Visual | IPC-TM-650 2.4.13.1 |
Zvigadzirwa Zvemagetsi
| pfuma | Kukosha kwechimiro | Units | Test Method |
|---|---|---|---|
| Dk, Mvumo @ 100 MHz | 3.59 | - | IPC-TM-650 2.5.5.3 |
| Dk, Mvumo @ 1 GHz | 3.58 | - | IPC-TM-650 2.5.5.9 Bereskin Stripline |
| Dk, Mvumo @ 2 GHz | 3.58 | - | Bereskin Stripline |
| Dk, Mvumo @ 5 GHz | 3.54 | - | Bereskin Stripline |
| Dk, Mvumo @ 10 GHz | 3.54 | - | Bereskin Stripline |
| Df, Kurasika Tangent @ 100 MHz | 0.0051 | - | IPC-TM-650 2.5.5.3 |
| Df, Loss Tangent @ 1 GHz | 0.0059 | - | IPC-TM-650 2.5.5.9 Bereskin Stripline |
| Df, Loss Tangent @ 2 GHz | 0.0060 | - | Bereskin Stripline |
| Df, Loss Tangent @ 5 GHz | 0.0066 | - | Bereskin Stripline |
| Df, Loss Tangent @ 10 GHz | 0.0071 | - | Bereskin Stripline |
| Volume Resistivity - Mushure mekudzivirira hunyoro | 8.9 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Volume Resistivity - Pakukwira tembiricha | 6.5 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity - Mushure mekudzivirira hunyoro | 2.21 × 10⁶ | MΩ | IPC-TM-650 2.5.17.1 |
| Surface Resistivity - Pane yakakwirira tembiricha | 4.4 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Dielectric Kuparara | > 50 | kV | IPC-TM-650 2.5.6B |
| Arc Resistance | 110 | Seconds | IPC-TM-650 2.5.1B |
| Simba reMagetsi (Laminate & laminated prepreg) | 55 (1400) | kV/mm (V/mil) | IPC-TM-650 2.5.6.2A |
| Comparative Tracking Index (CTI) | 2 (250-399) | Kirasi (Volts) | UL 746A ASTM D3638 |
Mechanical Properties
| pfuma | Kukosha kwechimiro | Units | Test Method |
|---|---|---|---|
| Simba rePeel - Yakaderera chimiro chemhangura foil (> 17 μm) | 1.14 (6.5) | N/mm (lb/inch) | IPC-TM-650 2.4.8C |
| Peel Strength - Yakajairwa mbiri mhangura mushure mekupisa kwekushushikana | 0.96 (5.5) | N/mm (lb/inch) | IPC-TM-650 2.4.8.2A |
| Peel Strength - Yakajairwa mbiri yemhangura mushure mekugadzirisa mhinduro | 0.90 (5.1) | N/mm (lb/inch) | IPC-TM-650 2.4.8.3 |
| Flexural Strength - Kureba kutungamira | 69.2 | muchinda | IPC-TM-650 2.4.4B |
| Flexural Strength – Cross direction | 62.4 | muchinda | IPC-TM-650 2.4.4B |
| Tensile Simba - Kureba kutungamira | 42.1 | muchinda | ASTM D3039 |
| Tensile Simba – Muchinjikwa | 39.7 | muchinda | ASTM D3039 |
| Young's Modulus - Kureba kutungamira | 3217 | muchinda | ASTM D790-15e2 |
| Young's Modulus – Cross direction | 3207 | muchinda | ASTM D790-15e2 |
| Poisson's Ratio - Kureba kutungamira | 0.166 | - | ASTM D3039 |
| Poisson's Ratio - Cross direction | 0.164 | - | ASTM D3039 |
Zvimwe Zvivakwa
| pfuma | Kukosha kwechimiro | Units | Test Method |
|---|---|---|---|
| Kunyorova Kusviba | 0.24 | % | IPC-TM-650 2.6.2.1A |
| Kupisa (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Max Operating Temperature | 130 | ° C | UL 796 |
Akakosha Technical Notes
Ese tekinoroji maitiro anoratidzwa pamusoro eIS620i laminates akajairwa zvivakwa zvakaburitswa neIsola Group uye zvinopihwa zvakaringana kunongedzera engineering. Kuita chaiko kunogona kusiyana zvichienderana neyako chaiyo PCB dhizaini, dhizaini dhizaini, kuburikidza nedhizaini, uye maitiro ekugadzira.
KuHighleap Electronics, isu tinoshandisa chete echokwadi IS620i laminates akacheneswa zvakananga kubva kuIsola-akatenderwa chiteshi, kuve nechokwadi chemhando uye kuteedzera mune yega dhizaini inomhanya.
Iyo data, kunyangwe ichitendwa kuti ndeyechokwadi uye yakavakirwa panzira dzekuongorora dzinoonekwa seyakavimbika, ndeyezvinangwa zveruzivo chete. Chero kutengeswa kwezvigadzirwa izvi kuchadzorwa nematemu nemamiriro echibvumirano chavanotengeswa nacho.
Sei Mainjiniya Vachisarudza IS620i Yepamusoro-Kumhanya, Yakaderera-Kurasikirwa PCB Projects
KuHighleap Electronics, tinokurudzira IS620i laminates ye-high-speed digital circuits, kunyanya kune madhizaini anoshanda mu2 kusvika 15 GHz frequency renji. Ichi chinyorwa chinomira kunze kwekuita kwayo kwepamusoro kwemagetsi, kugadzikana kwemafuta, uye kugadzirisa kuchinjika. IS620i inochengetedza kusarudzika kwechiratidzo chekuvimbika uye kushomeka kwechiratidzo kurasikirwa, zvichiita kuti ive sarudzo yakanaka kune zvikumbiro zvinoda kukurumidza-kumhanya, kwakaderera-kurasikirwa kwePCB mhinduro, dzakadai senharembozha, advanced computing, uye dijitari masisitimu.
Mabhenefiti Akakosha eIS620i
- Superior Electrical Performance: IS620i inopa dielectric constant ye 3.58 uye dissipation factor ye 0.006 pa 10 GHz, inochengetedza yakanakisa chiratidzo chekutendeseka uye kuderera kwechiratidzo kurasikirwa pamusoro pehuwandu hwehuwandu, hwakanakira kushandiswa kwepamusoro-kumhanya.
- Exceptional Thermal Kugadzikana: Iine tembiricha yegirazi yekuchinja (Tg) ye225 ° C uye tembiricha yekuora ye364 ° C, IS620i inoita zvakavimbika kunyange munzvimbo dzinopisa dzinopisa, ichiita kuti ive yakakodzera kune yakakwirira-simba remagetsi.
- Processing Flexibility: IS620i inopindirana neyakajairwa FR-4 maitiro ekugadzirisa, ayo anobatsira kuderedza mutengo wekugadzira uchichengetedza kushanda kwepamusoro. Yakakodzera kune ese madiki-batch prototypes uye yakakura-chiyero kugadzirwa, ichipa kuita kwakasiyana-siyana mukati mekugadzira maitiro.
- Kuzivikanwa kweIndasitiri uye Kutevedzera: IS620i ndeye UL yakasimbiswa (Nhamba yeFaira E41625) uye RoHS inowirirana, kuve nechokwadi kuti inosangana nezviyero zveindasitiri zvekuchengetedza uye kutevedza kwezvakatipoteredza. Inowanikwa mune ese ari maviri laminate uye prepreg mafomu, IS620i inopa kuchinjika kune yakaoma multilayer dhizaini.
Yakanaka Zvikumbiro zveIS620i
IS620i yakanakira zvakasiyana-siyana zvekushanda kwepamusoro-soro, kusanganisira high-speed digital circuits, telecommunication infrastructure, data center equipment, uye advanced computing systems. Iyo UV inovharira zvivakwa uye AOI fluorescence inopa mamwe mabhenefiti muotomatiki optical inspection (AOI), inovandudza kutonga kwemhando panguva yekugadzira. KuHighleap Electronics, tinopa yemahara stackup kubvunza kubatsira vatengi kusarudza akanakisa zvinhu zvekuita kwavo, mutengo, uye zvinodiwa zvekugadzira, kuve nechokwadi chemhinduro chaiyo yezvaunoda chaizvo.
IS620i PCB Kugadzirwa & Gungano Solutions
PaHighleap Electronics, tinopa zvinopfuura IS620i PCB kugadzira. Isu tiri shamwari yako yakazara-sevhisi kune ese PCB inodiwa, kubva 2-layer FR4 prototypes kusvika yepamusoro 60-layer HDI uye multilayer PCBs. Masevhisi edu akazara anofukidza zvese kubva kudhizaini uye kusarudzwa kwezvinhu kusvika kuturnkey yekugadzira uye kubatanidza, kuve nechokwadi chepamusoro-chiitwa mhinduro dzakagadzirirwa kune yako chaiyo purojekiti zvinodiwa.
Yedu IS620i PCB Kugona
- Precision Impedance Control: Kuwana ± 5% kurongeka kweakasiyana maviri maviri uye RF kutapurirana mitsara, kuve nechokwadi chakakwana chiratidzo chekuvimbika.
- Yepamusoro HDI Processing: Iine microvias, via-in-pad, uye kuburikidza neplugging yemhando yepamusoro-density dhizaini.
- Complex Multilayer Stackups: Inyanzvi mune zvakasanganiswa zvinhu (semuenzaniso, IS620i + FR4) yekuita zvinodhura.
- Premium Surface Inopedzisa: Kusanganisira ENIG, ENEPIG, goridhe rakaoma, uye OSP, kusangana nezvinodiwa zvekushandisa.
Yakazara Turnkey SMT Gungano uye Rigorous Hunhu Simbiso
Isu tinopa SMT assembly yakakwana yeBGA, QFN, 01005 components, uye RF shield placement. Kuedza kwedu kwakasimba kweQA kunosanganisira AOI, X-ray inspection, functional testing, uye flying probe testing kuti ive yakavimbika zvakanyanya. Mapurojekiti ese anoshandisa IS620i laminates chaiyo kubva kuIsola Group, inotsigirwa neIPC Class 2/3 standards. Kunyangwe uchida IS620i, hydrocarbon-ceramic low-loss laminate, kana FR-4 substrates, tine hunyanzvi uye zvivakwa zvekupa mhedzisiro yakanaka kune chero purojekiti.
Related Post
Ongorora zvimwe zvine chekuita neruzivo ruzivo.
Wana Quick Quote
Batira pamwe neHighleap Electronic yepurojekiti yako!
Wana Detailed Files
Siya email yako uye utore dhetabheti.