IT-968 PCB Laminate Yekumhanya Kwakanyanya

Ongorora IT-968 SE PCB laminates epamusoro-kumhanya, yakakwirira-frequency kushandiswa. Highleap inopa kugadzirwa, kuungana, uye dhizaini rutsigiro rwe multilayer IT-968 inovaka.

 

 

IT-968 High-Speed ​​PCB

IT-968 High-Speed ​​PCB Laminate yeAdvanced Electronic Designs

IT-968 ndeyepamusoro-inoshanda PCB substrate yakagadzirwa neTEQ. Iyo inoratidzira yakakwira girazi tembiricha yekuchinja (Tg), yakanyanya kugadzikana yekupisa, uye yakanyanya-yakaderera kurasikirwa maitiro. Ichi chinyorwa chakagadziridzwa chepamusoro-frequency uye high-speed digital applications, kusanganisira 5G zvivakwa, data center servers, mota radar, nezvimwe.

KuHighleap Electronics, tinopa mabasa ekugadzira nekubatanidza maPCB akazara tichishandisa ma laminates eIT-968, tichitsigira zvese prototyping uye kugadzirwa kwehuwandu nevimbiso yakasimba yemhando.

Chaizvoizvo Zvishandiso:

  • 5G isina waya base zviteshi uye millimeter-wave modules
  • High-speed backplanes, routers, uye switch
  • Mota radar uye ADAS masisitimu
  • AI komputa, kukwidziridza network, uye RF kumberi-kuguma modules

Tarisa kune iyo tekinoroji yakatarwa pazasi kuti uongorore kugona kweIT-968 kune yako inotevera purojekiti.

ITEQ Laminate/ Prepreg : IT-968TC SE/IT-968BS SE

pfuma Ukobvu <0.50 mm [0.0197 mu] Hukobvu ≥ 0.50 mm [0.0197 mukati] Units
(Metric / Chirungu)
Test Method
(IPC-TM-650 kana kucherechedzwa)
Typical Spec Typical Spec
Simba rePeel – Yakaderera/Zvakanyanya-Yakaderera‑Profile Cu (>17 µm) 0.44–0.61 (2.5–3.5) 0.44 (2.50) 0.44–0.61 (2.5–3.5) 0.44 (2.50) N/mm (lb/in) 2.4.8 / 2.4.8.2
Simba rePeel – Yakajairwa Mbiri (1 oz) 0.88–1.23 (5.0–7.0) 0.70 (4.00) 0.88–1.23 (5.0–7.0) 0.70 (4.00) N/mm (lb/in) 2.4.8.3
Volume Resistivity - C-96/35/90 > 1010 106 - - MΩ·cm 2.5.17.1
Volume Resistivity - Mushure mekudzivirira hunyoro - - > 1010 104 MΩ·cm 2.5.17.1
Vhoriyamu Resistivity - Panguva yakakwira tembiricha E-24/125 > 1010 103 > 1010 103 MΩ·cm 2.5.17.1
Surface Resistivity - C-96/35/90 > 109 104 - - MΩ 2.5.17.1
Surface Resistivity - Mushure mekudzivirira hunyoro - - > 109 104 MΩ 2.5.17.1
Surface Resistivity - Panguva yakakwira tembiricha E-24/125 > 109 103 > 109 103 MΩ 2.5.17.1
Moisture Absorption, yakanyanya - - 0.12 0.5 % 2.6.2.1
Dielectric Kuputsa, zvishoma - - > 50 40 kV 2.5.6
Mvumo (Dk) 1 GHz 3.44 AABUS 3.44 AABUS - 2.5.5.9
Mvumo (Dk) 2 GHz 3.44 - 3.44 - - 2.5.5.13
Mvumo (Dk) 5 GHz 3.35 - 3.35 - - 2.5.5.13
Mvumo (Dk) 10 GHz 3.34 - 3.34 - - 2.5.5.13
Kurasika Tangent (Df) 1 GHz 0.0027 AABUS 0.0031 AABUS - 2.5.5.9
Kurasika Tangent (Df) 2 GHz 0.0030 - 0.0030 - - 2.5.5.13
Kurasika Tangent (Df) 5 GHz 0.0035 - 0.0035 - - 2.5.5.13
Kurasika Tangent (Df) 10 GHz 0.0038 - 0.0038 - - 2.5.5.13
Flexural Strength - Kureba kutungamira - - 444 (64 380) 415 (60 190) N/mm² (psi) 2.4.4
Flexural Strength – Cross direction - - 415 (60 175) 345 (50 040) N/mm² (psi) 2.4.4
Arc Resistance, shoma > 60 60 > 60 60 s 2.5.1
Thermal Stress 288 °C 10 s - Zvisina kuvharwa Pass Pass Visual Pass Pass Visual Rating 2.4.13.1
Thermal Stress 288 °C 10 s - Yakaiswa Pass Pass Visual Pass Pass Visual Rating 2.4.13.1
Magetsi Simba, shoma > 30 30 - - kV / mm 2.5.6.2
Kupisa V‑0 V‑0 V‑0 V‑0 Rating UL 94
Glass Transition Temperature (TMA) - - 175 170 min ° C 2.4.24
Decomposition Temperature (5% wt kurasikirwa) - - 400 340 min ° C 2.4.24.6
X/Y Axis CTE (40–125 °C) - - 12-14 - ppm / ° C. 2.4.24
Z-Axis CTE - Alpha 1 - - 45 60 max ppm / ° C. 2.4.24
Z-Axis CTE - Alpha 2 - - 260 300 max ppm / ° C. 2.4.24
Z-Axis Kuwedzera 50–260 °C - - 2.3 3.5 max % 2.4.24
Thermal Resistance T260 - - > 60 30 min ini 2.4.24.1
Thermal Resistance T288 - - > 60 15 min ini 2.4.24.1
CAF Resistance - - Pass AABUS Pasa / Kukundikana 2.6.25

CHERECHEDZA

  • Iyo data iri pamusoro uye nhungamiro yekugadzira inopihwa vagadziri uye PCB vagadziri sereferensi. Nepo ruzivo rwuchitenda kuve rwakaringana, hunhu chaihwo hunogona kusiyana zvichienderana nenzira dzekuyedza uye mamiriro ekugadzira. Mamiriro ekupedzisira echigadzirwa anofanirwa kusimbiswa maererano nechibvumirano neITEQ. ITEQ inochengetedza kodzero yekuvandudza data pasina chiziviso chekutanga kuti ive nechokwadi chekuti ruzivo rwazvino rwunowanikwa kune vashandisi.
  • Highleap Electronics inyanzvi PCB inogadzira uye muunganidzi inopa yakazara-maitiro masevhisi kubva kuprototyping kusvika kuhuwandu hwekugadzira. Isu tinoshanda neyakasiyana-siyana yemhando yepamusoro-inoshanda zvinhu - zvinosanganisira asi isina kuganhurirwa kuIT-968 SE - uye tinotsigira akaomarara akaturikidzana epamusoro-kumhanya uye RF zvikumbiro.
  • Kana iwe uchida kubvunza nezve dhizaini, rubatsiro rwekusarudza zvinhu, kana akagadziridzwa stack-up mazano uchishandisa IT-968 SE kana mamwe ma substrates, timu yedu yeinjiniya yakagadzirira kubatsira. Bata nesu kuti utange chirongwa chako nhasi.

Kugadzira Kuenderana & Injiniya Kugona

Highleap Electronics ine ruzivo rwakakura rwekugadzira yakakwira-layer-count, yakakwirira-kumhanya, uye RF PCBs vachishandisa IT-968 SE laminates. Isu tinonzwisisa zvizere maitiro ekuchera, manejimendi ekudhirowa, uye chiratidzo chekuvimbika zvinodiwa zvinoenderana neiyi yepamusoro yakaderera-Dk, yekupedzisira-yakaderera Df zvinhu.

Zvivako zvedu zvakashongedzerwa kubata zvivakwa zvakaomarara uku uchiona kuvimbika kwekupisa uye kuita kwemagetsi kunodiwa kune IT-968-yakavakirwa madhizaini. Kunyangwe iwe uri kushanda pane yakakwirira-kumhanya networking hardware, backplanes, line makadhi, kana wireless/RF modules, mitsara yedu yekugadzira inogadziridzwa kuenderana, iko kurongeka, uye throughput.

  • Inotsigira multilayer PCB stackups kubva 2 kusvika 60 akaturikidzana
  • Yepamberi HDI kugona nebofu / kuvigwa kuburikidza nezvimiro
  • Impedance-inodzorwa nzira neDk simulation uye munda wesolver verification
  • Surface inopedza: ENIG, ENEPIG, kunyudza sirivha, nezvimwe
  • Kuongorora kwakazara: 100% E-bvunzo, X-ray yemukati machira, microsection kuongororwa
  • Yakasimbiswa kune IPC Kirasi 2 kana 3 maitiro ekugadzira

Pamusoro pekugadzira, timu yedu yeinjiniya inopa yakazara dhizaini tsigiro - inosanganisira stackup kuronga, kupisa modhi, kuongorora kutsiva zvinhu, uye CAM optimization - kukubatsira iwe kuderedza mutengo uye njodzi pasina kukanganisa kunaka.

Kune mapurojekiti anoda IT-968 SE kana anofananidzwa nepamusoro-anoita laminates, taura nesu kuti tikurukure zvipingamupinyi zvekugadzira, nguva yekuchinja, uye zvinangwa zvekuvimbika. Mhinduro dzedu dzinovimbwa neOEMs mune telecom, kudzivirira, uye yakakwirira-kuita komputa.

Turnkey-PCB-Assembly-Fekitori

Kumbira Quote kana Injiniya Tsigiro

Kugadzira yakakwira-kumhanya dhijitari kana RF application inoda IT-968 laminate kuita? Highleap Electronics yakagadzirira kukubatsira kushandura madhizaini ako kuita maPCB akavimbika, akagadzirira kugadzira - nekukurumidza uye zvinokwanisika.

Chikwata chedu chinoshanda mukugadzira IT-968-yakavakirwa PCB, uye isu tinopa:

  • Yemahara DFM (Design for Manufacturability) inotarisa uye yakagadziridzwa stack-up wongororo yeIT-968 high-speed PCBs.
  • Injiniya rutsigiro rwekusarudza zvinhu uye dielectric simulation
  • Kukurumidza prototyping uye yakazara-chikero kugadzirwa uchishandisa IT-968 laminate yeRF maapplication
  • One-stop mhinduro: SMT stencil, programming, uye turnkey PCB gungano

Unoda kukurumidza kutungamira nguva, zvirinani kudzora mutengo, kana kutungamira pakushandisa IT-968 yeakawanda PCB inovaka? Mainjiniya edu ari pano kuti akupe nzwisiso uye mazano anoenderana nebasa rako.

Kumbira mutengo wekukosha ipapo ipapo kana kuronga ongororo yehunyanzvi nhasi.

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