Firimu reKapton Polyimide rekugadzira PCB inochinjika
Kapton HN, FN, uye HPP-ST magiredhi efirimu epolyimide echitatu anogona kutsanangurwa kuti ashandiswe nemagadzirirwo ePCB anochinjika uye akaomarara. Highleap Electronics inopa mabasa ekugadzira nekubatanidza maPCB zvichienderana nezvinhu zvakatsanangurwa nevatengi, zvinhu zvakaunganidzwa, uye zvinodiwa pakugadzira.
Firimu reKapton Polyimide muZvishandiso zvePCB Zvinochinjika
Kapton chigadzirwa chepolyimide film kubva kuDuPont, chine mamakisi akadai seHN, FN, uye HPP-ST anowanikwa kune zvinodiwa zvakasiyana zvehunyanzvi. Mumagadzirirwo ecircuit anochinjika, mafirimu epolyimide anogona kutsanangurwa kana panodiwa kuvakwa kwe dielectric yakatetepa, kuchinjika kwemuchina, kuputira magetsi, kana kudzivirira tembiricha.
Firimu reKapton® rinogona kutariswa mumhando dzakasiyana dzemagadzirirwo ePCB anochinjika uye akaomarara, kusanganisira magungano emagetsi akaganhurirwa, macircuits emagetsi akawanda, ma sensor interconnects, ma industrial electronics, ma automotive electronics, nezvimwe zvinoshandiswa zvine zvinodiwa zvemakanika kana zvekudzivirira.
Zvakajairika zvekufunga nezvekugadzira PCB zvinosanganisira:
- Kuvakwa kwedunhu rinochinjika uye rakaomarara
- Dielectric uye huwandu hwese hwePCB
- Zvinodiwa zvenzvimbo yekukombama uye zvemakanika
- Zvinodiwa zvekudzivirira magetsi uye zviratidzo
- Kubatanidzwa nemidziyo yekufukidza, mitsipa, nezvimwe zvinhu zvePCB
Highleap Electronics inogadzira nekubatanidza maPCB zvichienderana nezvinhu zvinodiwa nevatengi uye zvinodiwa pakugadzira. Kapton® inongotaurwa sezita rezvinhu zvevamwe chete.
Kapton® FCCL Technical Specifications
Tafura 1. Zvinhu Zvenyama zveKapton® Rudzi rwe100 HN Firimu, 25µm (1 mil)
| Physical Properties | Typical Value pa | Test Method | |
|---|---|---|---|
| 23 ° C (73 ° F) | 200 ° C (392 ° F) | ||
| Ultimate Tensile Simba, MPa (psi) | 231 (33,500) | 138 (20,000) | ASTM D-882-91, Nzira A |
| Goho Point pa3%, MPa (psi) | 69 (10,000) | 41 (6,000) | ASTM D-882 |
| Stress Kugadzira 5% Elongation, MPa (psi) | 90 (13,000) | 62 (9,000) | ASTM D-882 |
| Ultimate Elongation, % | 72 | 83 | ASTM D-882 |
| Tensile Modulus, GPa (psi) | 2.76 (400,000) | 2.0 (290,000) | ASTM D-882 |
| Impact Simba, N•cm (ft•lb) | 78 (0.58) | - | DuPont Pneumatic Impact Test |
| Kupeta Endurance (MIT), kutenderera | 285,000 | - | ASTM D-2176 |
| Kusimba Kwemisodzi—Kuparadzira (Elmendorf), N (lbf) | 0.07 (0.02) | - | ASTM D-1922 |
| Kusimba Kwemisodzi—Yekutanga (Makuva), N (lbf) | 7.2 (1.6) | - | ASTM D-1004 |
| Density, g/cc kana g/mL | 1.42 | - | ASTM D-1505 |
| Coefficient of Friction-Kinetic | 0.48 | - | ASTM D-1894 |
| Coefficient of Friction-Static | 0.63 | - | ASTM D-1894 |
| Refractive Index (Na D Line) | 1.70 | - | ASTM D-542 |
| Ratio yaPoisson | 0.34 | - | Avg. Matatu Samples Akareba |
| Low Temperature Flex Hupenyu | Pass | - | IPC TM 650, Nzira 2.6.18 |
Tafura 2. Thermal Properties yeKapton® Type 100 HN Firimu, 25 µm (1 mil)
| Thermal Property | Kukosha kwechimiro | Mamiriro Emuedzo | Test Method |
|---|---|---|---|
| Melting Point | hapana | hapana | ASTM E-794 (1989) |
| Thermal Coefficient of Linear Kuwedzera | 20 ppm/°C (11 ppm/°F) | -14 kusvika 38 ° C (7 kusvika 100 ° F) | ASTM D-696 |
| Coefficient of Thermal Conductivity, W/m•K (cal/sec-cm-°C) | 0.20 (4.8 × 10⁻⁴) | 296 K (23°C) | ASTM D5470 |
| Chaicho Kupisa, J/g•K (cal/g•°C) | 1.09 (0.261) | - | Kusiyana Calorimetry |
| Kupisa | 94V-0 | - | UL-94 (2-8-85) |
| Kuderera,% | 0.17 1.25 |
30 min pa150°C 120 min pa400°C |
IPC TM 650, Nzira 2.2.4A ASTM D-5214 |
| Kupisa Sealability | Kwete Kupisa Kuvharika | - | - |
| Kuderedza Oxygen Index,% | 37 | - | ASTM D-2863 |
| Solder Float | Pass | - | IPC TM 650, Nzira 2.4.13A |
| Chiutsi Generation | DM = <1 | - | NBS Smoke Chamber NFPA-258 |
| Glass Transition Temperature (Tg) | Kuchinja kwechipiri kunoitika muKapton® pakati pe360°C (680°F) ne410°C (770°F) uye inofungidzirwa kuti ndiyo tembiricha yegirazi. Maitiro ekuyera akasiyana anoburitsa mhedzisiro dzakasiyana mukati meiyo tembiricha iri pamusoro. |
||
Tafura 3. Muviri uye Thermal Properties yeKapton® Rudzi rweHPP-ST Firimu
| pfuma | Yakajairika Kukosha kweFirimu Kukora | Test Method | |||
|---|---|---|---|---|---|
| 25 µm | 50 µm | 75 µm | 125 µm | ||
| Ultimate Tensile Simba, MPa (psi) | 231 (33,500) | 234 (34,000) | 231 (33,500) | 231 (33,500) | ASTM D-882 |
| Ultimate Elongation, % | 72 | 82 | 82 | 82 | ASTM D-882 |
| Kusimba Kwemisodzi (Elmendorf), N | 0.07 | 0.21 | 0.38 | 0.58 | ASTM D-1922 |
| Kusimba Kwemisodzi (Makuva), N | 7.2 | 16.3 | 26.3 | 46.9 | ASTM D-1004 |
| Kupeta Endurance (MIT), × 10³ | 285 | 55 | 6 | 5 | ASTM D-2176 |
| Density, g/cc | 1.42 | 1.42 | 1.42 | 1.42 | ASTM D-1505 |
| Kupisa | 94V-0 | 94V-0 | 94V-0 | 94V-0 | UL-94 |
| Shrinkage (150°C, 30 min),% | 0.03 | 0.03 | 0.03 | 0.03 | IPC TM 650 |
| Kuderedza Oxygen Index,% | 37 | 43 | 46 | 45 | ASTM D-2863 |
Tafura 4. Zvinhu Zvenyama zveKapton® Rudzi rweFN Firimu
| pfuma | Yakajairika Kukosha Kwemhando Yefirimu | ||
|---|---|---|---|
| 120FN616 | 150FN019 | 250FN029 | |
| Ultimate Tensile Simba, MPa (psi) 23°C / 200°C |
207 (30,000) / 121 (17,500) | 162 (23,500) / 89 (13,000) | 200 (29,000) / 115 (17,000) |
| Goho Point pa3%, MPa (psi) 23°C / 200°C |
61 (9000) / 42 (6000) | 49 (7000) / 43 (6000) | 58 (8500) / 36 (5000) |
| Stress pa5% Elongation, MPa (psi) 23°C / 200°C |
79 (11,500) / 53 (8000) | 65 (9,500) / 41 (6000) | 76 (11,000) / 48 (7000) |
| Ultimate Elongation, % 23°C / 200°C |
75 / 80 | 70 / 75 | 85 / 110 |
| Tensile Modulus, GPa (psi) 23°C / 200°C |
2.48 (360,000) / 1.62 (235,000) | 2.28 (330,000) / 1.14 (165,000) | 2.62 (380,000) / 1.38 (200,000) |
| Impact Simba pa23°C, N•cm (ft•lb) | 78 (0.58) | 68.6 (0.51) | 156.8 (1.16) |
| Kusimba Kwemisodzi—Kuparadzira (Elmendorf), N (lbf) | 0.08 (0.02) | 0.47 (0.11) | 0.57 (0.13) |
| Kusimba Kwemisodzi—Yekutanga (Makuva), N (lbf) | 11.8 (2.6) | 11.5 (2.6) | 17.8 (4.0) |
| Polyimide, wt% | 80 | 57 | 73 |
| FEP, wt% | 20 | 43 | 27 |
| Density, g/cc kana g/mL | 1.53 | 1.67 | 1.57 |
Cherechedza: Hunhu hwehunyanzvi hwakaratidzwa pamusoro apa hwakapihwa senzira yekutarisa mainjiniya chete uye hahuna vimbiso yehunhu hwezvinhu. Kune hunhu hwezvinhu hwakasimbiswa, zvivakwa zviripo, kushivirira, uye ruzivo rwekutevedzera mitemo, ndapota tarisa magwaro ehunyanzvi emugadziri wezvinhu aripo iye zvino. Kapton® chigadzirwa cheDuPont chechitatu; Highleap Electronics haigadziri firimu reKapton® polyimide kana kuburitsa hunhu hwayo.
Highleap Electronics inopa mabasa ekugadzira maPCB uye kugadzira maPCB emagadzirirwo evatengi anotsanangura firimu reKapton® polyimide kana zvimwe zvinhu zvinotenderwa zvedunhu rinochinjika. Tinoongorora kuunganidzwa kwemidziyo inotenderwa nevatengi, kusarudzwa kwezvinhu, zvinodiwa pakugadzira, uye magwaro ekugadzira tisati tagadzira. Kuwanikwa kwezvinhu uye kuvakwa kwePCB kwekupedzisira zvinosimbiswa zvichienderana neprojekiti yega yega.
Kapton®-Yakavakirwa PCB Manufacturing Matanho
KuHighleap Electronics, tinopa yakakwana yekugadzira uye masevhisi egungano akagadzirirwa kuKapton®-based flexible PCBs. Chikwata chedu cheinjiniya chinonzwisisa zvinodikanwa zvekugadzirisa zve polyimide zvinhu uye inotsigira ese ari pasi- uye akakwira-vhoriyamu mapurojekiti.
- Rubatsiro rwezvinhu: Kapton® HN, HPP-ST, uye FN mafirimu kubva pa25µm kusvika 125µm
- Maitiro anoenderana: laser drilling, coverlay lamination, dynamic bending zones
- Precision kugadzirwa: Yakachena mukamuri etching, yakanaka-mutsara kufungidzira, uye SMT-yakagadzirira kupedzisa
- Zvishandiso-zvakananga stack-ups: Rigid-flex musanganiswa, multilayer PI lamination
- Zvitemo: IPC Kirasi 2/3 inoenderana nekugadzira nharaunda
Ingave yeaerospace-giredhi insulation kana compact FPC dhizaini, nzvimbo yedu inovimbisa kurongeka kwedimensional, yakaderera kubuda, uye yakagadzikana kushanda kwemagetsi.
Tora Mutengo weMapurojekiti eFlexible PCB Anotsanangura Kapton Film
Kana dhizaini yako yePCB inochinjika kana kuti rigid-flex PCB ichitaura nezveKapton polyimide film, Highleap Electronics inogona kuongorora zvinodiwa zvePCB nekugadzira zvichibva pane zvawakatendera, kurongeka, kuunganidzwa kwezvinhu, uye magwaro ekugadzira.
Semugadziri wePCB uye mupi webasa rePCB assembly, basa redu rinotarisa pabhodhi redunhu rakapedzwa uye PCBA pane kugadzira firimu repolyimide pacharo.
- Ongororo yeDFM yemagadzirirwo ePCB anochinjika uye akaomarara
- Ongororo yePCB yakavakirwa pazvinhu zvakatarwa nevatengi
- Kugadzirwa kwePCB inochinjika uye vhoriyamu
- Kufukidza, kusimbisa, kuboora, kuputira, uye maitiro ekufambisa
- Kuungana kweSMT/THT, kutsvaga zvikamu, kuongorora, uye kuyedza
Kuwanikwa kwezvinhu uye kuvakwa kwePCB kwekupedzisira zvinosimbiswa zvichienderana nezvinodiwa zvepurojekiti yega yega isati yagadzirwa.
📩 Taura nesu kuti tikumbire mutengo wePCB kana ongororo yeinjiniya. Ndapota tumirai mafaira enyu eGerber, miunganidzwa, BOM, mifananidzo, uye zvinodiwa pakugadzira kuti zviongororwe.
Kapton® chigadzirwa cheDuPont chinobva kune vamwe vanhu. Zita racho rinongotaurwa chete kuti rione zvinodiwa nevatengi. Highleap Electronics ikambani yakazvimiririra inogadzira PCB uye inopa PCB assembly uye haigadziri Kapton® polyimide film.