MEGTRON-4

Chii chinonzi MEGTRON-4?

MEGTRON-4, yePanasonic MEGTRON yakatevedzana laminate, inopa yepamusoro yekupisa uye yemagetsi kuita kwepamusoro-kuguma PCBs, zvichiita kuti ive yakanakira yekumhanyisa-kumhanya uye yakakura-vhoriyamu data kufambisa mumashandisirwo akaita sevhavha uye marouters.

Material Overview

  • Mugadziri: Panasonic Industry
  • Zvigadzirwa Zvakatevedzana: MEGTRON4
  • Laminate: R-5725
  • Kugadzirira pamuviri: R-5620
  • Kazhinji Dr @ 1 GHz: 3.83
  • Df yakajairika @ 1 GHz: 0.005

unhu

  • Yakanakisa Mechanical Simba
  • Enhanced Thermal Resistance & Kugadzikana
  • Superior Thermal & Electrical Performance
  • Inokodzera Multilayer PCBs & High Conductor Density
  • Yakaderera Dielectric Constant & Dissipation Factor (Yakakwira-Speed ​​Inokwanisa)

Applications

  • kanyanga
  • Supercomputer
  • Kuyera Chimbo
  • ICT Infrastructure Equipment

MEGTRON-4 General Properties

Properties Units Test Method Condition Kukosha kwechimiro
Thermal Properties
Glass Transition Temperature (Tg) ° C DSC Sezvakagamuchirwa 176
TMA 170
DMA 210
Thermal Decomposition Temperature (Td) ° C TGA 360
Nguva yeKubvisa Chidimbu (T288) Pasina Cu ini IPC-TM-650 2.4.24.1 - > 120
With Cu 30
CTE α1 X-Akabatana ppm / ° C. IPC-TM-650 2.4.24 <Tg 12-14
Y-Akabatana 13-15
Z-Akabatana 35
CTE α2 Z-Akabatana >Tg 265
Zvigadzirwa Zvemagetsi
Kusagadzikana kweVolume MΩ·cm IPC-TM-650 2.5.17.1 C-96/35/90 1 × 109
Kumusoro Kugadziriswa MΩ 1 × 108
Dielectric Constant (Dk) - IPC-TM-650 2.5.5.9 C-24/23/50, 1 GHz 3.83
Dissipation Factor (Df) - IPC-TM-650 2.5.5.9 C-24/23/50, 1 GHz 0.005
Proper Properties
Kubvisa Mvura % IPC-TM-650 2.6.2.1 D-24/23 0.14
Peel Simba 1 oz Cu kN/m IPC-TM-650 2.4.8 Sezvakagamuchirwa 1.2
Kupisa Rating UL C-48/23/50 94V-0

Hurukuro

  1. Makoshero anoratidzwa pamusoro apa anopiwa senzira yekutarisa mainjiniya ePCB uye haafanirwe kutariswa semagadzirirwo akavimbiswa emaPCB apera.
  2. Ruzivo rwakanyorwa rwunoenderana nemuenzaniso we32 mil (0.8 mm) une chivakwa che #3313 × 8-ply.
  3. MEGTRON4, R-5725, uye R-5620 ndiwo mazita ePanasonic Industry. Magadzirirwo ezvishandiso zviripo iye zvino uye zvivakwa zviripo zvinofanirwa kusimbiswa uchishandisa magwaro ehunyanzvi emugadziri azvino.
  4. Highleap Electronics inopa mabasa ekugadzira maPCB uye kugadzira maPCB. Kana muine mibvunzo nezvekugadzirwa kwePCB, ndapota bvunzai nezvemaPCB. taura nesu.

Material Storage

  • R-5725 laminate uye R-5620 prepreg yakafanana neyedu yakajairika FR-4 zvinhu.
  • Laminate inofanira kuchengetwa yakatsetseka munzvimbo inotonhorera yakaoma. Dzivisa kukotama kana kukwenya pasi laminate.
  • Kana zvichiita chengetedza laminate mumudziyo wekutanga.
  • Prepreg inofanira kuchengetwa yakadzikama munzvimbo inotonhorera uye yakaoma, ine 73°C (23°C) kana pasi uye 50% RH kana pasi.

Laminate Surface Kugadzirira

  • Yenguva dzose Shiny Copper inogona kucheneswa uchishandisa indasitiri yakajairwa kemikari yakachena kana michina yakachena.
  • Reverse Kubata Mhangura inofanirwa kucheneswa uchishandisa indasitiri yakajairwa kemikari yakachena.

Inner Layer Bond Treatment

  • Dema kana Brown Oxide inogona kushandiswa.
  • Alternative Oxide Kurapa uchishandisa Peroxide/Sulfuric etch tekinoroji inogona kushandiswa zvakare.

Drying

  • Dry akapedza zvemukati akaturikidzana zvachose kubvisa chero hunyoro hwakanyura kana hunyoro hwepamusoro.
  • Kubika zvakakangwa pa300℉ (150℃) kwemaawa 1-2 ndiko kunosarudzwa. Pakugadzira oxide inoshandiswa pakutakura zvinhu, mimwe michina inogona kunge iine kugona kwakakwana kwekuomesa. Zvisinei, kubika zvakakangwa kunokurudzirwa.
Turnkey-PCB-Assembly-Fekitori

Kubva paHigh-Speed ​​Stack-Up kusvika kuFinished PCBA

Kune mapurojekiti ePCB ane layer yakawanda anosanganisira MEGTRON4, Highleap Electronics inotarisa pakushandura dhizaini yemagetsi yakatenderwa kuita dhizaini inoshanda uye kuvaka kwekubatanidza. Ongororo yekugadzira inobatanidza kuvaka kwe stack-up, zvinodiwa zve impedance, kuburikidza ne architecture, copper features, uye assembly interfaces kuitira kuti bhodhi risina chinhu nePCBA yekupedzisira zvitevedzere zvakafanana kugadzirwa.

Ongororo yeChimiro cheChiratidzo

Matrace ane controlled-impedance traces, differential pairs, reference planes, dielectric spacing, uye layer transitions zvinoongororwa pamwe chete nePCB stack-up yakatenderwa. Izvi zvinobatsira kuona maparamita ekugadzira anodiwa pakugadzira bhodhi rine layer yakawanda nekukurumidza.

Kurongeka kweKuvakwa kweMatanda Akawanda

Kunyoreswa kwezvikamu, kuboora, maburi akaiswa maburi, kutevedzana kwelamination, kugoverwa kwemhangura, uye ukobvu hwebhodhi hwakapedzwa zvinobatanidzwa zvichienderana nekugadzirwa kwePCB uye magwaro ekugadzira.

Kuendeswa Kwekugadzira-Kugadzira-Kugadzira

Kupera kwepamusoro, fomati yemapaneru, nzvimbo dzezvikamu, zvinodiwa pakusonesa, nzvimbo dzekuongorora, uye zvinodiwa pakuyedza zvinoongororwa PCBA isati yagadzirwa kuitira kuti zvinodiwa pakugadzira PCB nekugadzira zvirambe zvakaenzana.

Highleap Electronics inopa kugadzirwa kwePCB dzakawanda, kugadzirwa kweimpedance inodzorwa, kuunganidza SMT/THT, kuongorora, uye kuyedza kubva pakugadzira ma prototype kuburikidza nekugadzira huwandu. Kune mapurojekiti ane chekuita neMEGTRON4 R-5725 / R-5620, zvinodiwa zvezvinhu zvinosanganisirwa mugwaro rePCB rakatenderwa usati wagadzira.

Titumirei mafaira enyu eGerber, stack-up, uye BOM kuti muongorore uye mukotesheni yekugadzira PCB.