MEGTRON-6
Chii chinonzi MEGTRON-6?
Material Overview
- Mugadziri: Panasonic Industry
- Zvigadzirwa Zvakatevedzana: MEGTRON6
- MaModheru eLaminate: R-5775(N), R-5775(K), R-5775(G)
- Rudzi rweChinhu: Multilayer PCB Laminate
- Yakagadzirirwa Kutumira Chiratidzo Chekurasikirwa Kushoma
- Inoshandiswa muMagadzirirwo ePCB Anomhanya Nekukurumidza & Akanyanya Kuwanda
Hunhu Hune Chekuita nePCB
- Kurasikirwa Kwekutapurirana Kwakaderera Kwakanyanya
- Kupisa Kwakanyanya Kwekupisa
- Kurasikirwa KwemaDielectric Akaderera Kwezviratidzo Zvinomhanya Zvikuru
- Yakakodzera Zvivakwa zveHigh-Density Multilayer
- Inotsigira Magadzirirwo ePCB Anodzora-Impedance
- Zvinhu Zvakawanda Zvakavakwa neGiredhi
Nzvimbo Dzekushandisa
- Nzvimbo dzekubatana pamwe chete neICT
- Masevha & Makomputa Anoshanda Nepamusoro
- Masisitimu Ekutaurirana Asina Waya & RF
- Zvishandiso zveBase-Station & Antenna
- Zvishandiso zvekuyera nekuyedza
- Masisitimu eMotokari & Epamusoro eElektroniki
MEGTRON-6 General Properties
| chinhu | Test method | Condition | chikwata | MEGTRON 6 R-5775(N) | MEGTRON 6 R-5775(K) | MEGTRON 6 R-5775(G) | ||
|---|---|---|---|---|---|---|---|---|
| Low Dk Girazi Mucheka | Normal Girazi Mucheka | |||||||
| Glass Transition Temp (Tg) | DSC | A | °C | 185 | 185 | |||
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 45 | 45 | ||
| α2 | 260 | 260 | ||||||
| T288 (nemhangura) | IPC-TM-650 2.4.24.1 | A | ini | >120 | >120 | |||
| Dielectric Constant (Dk) | 13GHz | Yakaenzana-mhando Circular Disk Resonator | C-24/23/50 | - | 3.34 | 3.62 | ||
| Dissipation Factor (Df) | 0.0037 | 0.0046 | ||||||
| Peel Strength* | 1oz (35μm) | IPC-TM-650 2.4.8 | A | kN/m | 0.8 | 0.8 | ||
taura pfungwa
- Peel Simba *: H-VLP Mhangura
- Sample ukobvu :29.5 mil = 0.750 mm (Core Type 30)
- Iyo data iri patafura iri pamusoro haina kuvimbiswa kukosha.
- Zvinhu zveMEGTRON6 zvinogadzirwa nePanasonic Industry. Kuti uwane ruzivo rwechizvino-zvino nezvezvinhu izvi, zvivakwa zviripo, uye magwaro ehunyanzvi, ndapota tarisai mugadziri wezvinhu izvi kana nzira dzazvo dzakabvumidzwa.
R-5775(N) Tsanangudzo
| Properties | Units | Test Method | Condition | Kukosha kwechimiro | |
|---|---|---|---|---|---|
| Thermal Properties | |||||
| Glass Transition Temperature (Tg) | ° C | DSC | Sezvakagamuchirwa | 185 | |
| DMA | 210 | ||||
| Thermal Decomposition Temperature (Td) | ° C | TGA | 410 | ||
| Nguva yeKubvisa Chidimbu (T288) | Pasina Cu | ini | IPC-TM-650 2.4.24.1 | > 120 | |
| With Cu | > 120 | ||||
| CTE: α1 | X-Akabatana | ppm / ° C. | IPC-TM-650 2.4.24 | <Tg | 14-16 |
| Y-Akabatana | 14-16 | ||||
| Z-Akabatana | 45 | ||||
| CTE: α2 | Z-Akabatana | >Tg | 260 | ||
| Zvigadzirwa Zvemagetsi | |||||
| Kusagadzikana kweVolume | MΩ·cm | IPC-TM-650 2.5.17.1 | C-96/35/90 | 1 × 109 | |
| Kumusoro Kugadziriswa | MΩ | 1 × 108 | |||
| Dielectric Constant (Dk) | @ 1 GHz | - | IPC-TM-650 2.5.5.9 | C-24/23/50 | 3.40 |
| @ 13 GHz | Resonator yeDiski Yakatenderera Yemhando Yakaringana | 3.34 | |||
| Dissipation Factor (Df) | @ 1 GHz | IPC-TM-650 2.5.5.9 | 0.002 | ||
| @ 13 GHz | Resonator yeDiski Yakatenderera Yemhando Yakaringana | 0.0037 | |||
| Proper Properties | |||||
| Kubvisa Mvura | % | IPC-TM-650 2.6.2.1 | D-24/23 | 0.14 | |
| Peel Simba | 1 oz (H-VLP) | kN/m | IPC-TM-650 2.4.8 | Sezvakagamuchirwa | 0.8 |
| Kupisa | Rating | UL | C-48/23/50 | 94V-0 | |
Hurukuro
- Ukobvu hwemuenzaniso wereferensi: 29.5 mil (0.750 mm), Core Type 30.
- Makoshero akanyorwa pamusoro apa idata rekutarisa uye anogona kusiyana zvichienderana negiredhi rezvinhu, kuvakwa, uye mamiriro ebvunzo. Tarisa magwaro emugadziri azvino kuti uwane zvirevo zvemazuva ano.
R-5775 tsanangudzo
| Properties | Units | Test Method | Condition | Kukosha kwechimiro | |
|---|---|---|---|---|---|
| Thermal Properties | |||||
| Glass Transition Temperature (Tg) | ° C | DSC | Sezvakagamuchirwa | 185 | |
| DMA | 210 | ||||
| Thermal Decomposition Temperature (Td) | ° C | TGA | 410 | ||
| Nguva yeKubvisa Chidimbu (T288) | Pasina Cu | ini | IPC-TM-650 2.4.24.1 | > 120 | |
| With Cu | > 120 | ||||
| CTE: α1 | X-Akabatana | ppm / ° C. | IPC-TM-650 2.4.24 | <Tg | 14-16 |
| Y-Akabatana | 14-16 | ||||
| Z-Akabatana | 45 | ||||
| CTE: α2 | Z-Akabatana | >Tg | 260 | ||
| Zvigadzirwa Zvemagetsi | |||||
| Kusagadzikana kweVolume | MΩ·cm | IPC-TM-650 2.5.17.1 | C-96/35/90 | 1 × 109 | |
| Kumusoro Kugadziriswa | MΩ | 1 × 108 | |||
| Dielectric Constant (Dk) | @ 1 GHz | - | IPC-TM-650 2.5.5.9 | C-24/23/50 | 3.71 |
| @ 10 GHz | IPC-TM-650 2.5.5.5 | 3.61 | |||
| Dissipation Factor (Df) | @ 1 GHz | IPC-TM-650 2.5.5.9 | 0.002 | ||
| @ 10 GHz | IPC-TM-650 2.5.5.5 | 0.004 | |||
| Proper Properties | |||||
| Kubvisa Mvura | % | IPC-TM-650 2.6.2.1 | D-24/23 | 0.14 | |
| Peel Simba | 1 oz (H-VLP) | kN/m | IPC-TM-650 2.4.8 | Sezvakagamuchirwa | 0.8 |
| Kupisa | Rating | UL | C-48/23/50 | 94V-0 | |
Hurukuro
- Ukobvu hwemuenzaniso wereferensi: 29.5 mil (0.750 mm), Core Type 30.
- MEGTRON6 R-5775 / R-5670 ndiwo mazita ezvigadzirwa zvePanasonic Industry. Hunhu hwezvinhu zviripo pari zvino, zvivakwa zviripo, uye magwaro ehunyanzvi zvinofanirwa kusimbiswa nemugadziri wezvigadzirwa.
- Highleap Electronics inopa mabasa ekugadzira maPCB uye kugadzira maPCB. Kuti muwane ongororo yepurojekiti yePCB kana kuti muwane mutengo, ndapota. taura nesu.
Kugadzira PCB Yekukurumidza Kwemapurojekiti eMEGTRON6
Kune mapurojekiti ePCB ane ma multilayer anomhanya zvikuru anosanganisira MEGTRON6, Highleap Electronics inotarisa pakushandura dhizaini yemagetsi yakatenderwa kuita maitiro ekugadzira nekubatanidza maPCB anodzorwa. Zvinodiwa zve stack-up, impedance, kuburikidza nezvivakwa, kuvaka kwemhangura, data rekuboorera, uye magwaro ekubatanidza zvinoongororwa pamwe chete zvisati zvagadzirwa.
Basa redu rekugadzira rinofukidza ruzivo rwebhodhi rune chekuita nekugadzirwa kwePCB nekukurumidza, kusanganisira kunyoreswa kwe multilayer, controlled impedance, HDI structures, surface finish, panelization, test, uye shanduko kubva pakugadzirwa kwebhodhi risina chinhu kuenda kuPCBA yekupedzisira.
- Kugadzirwa kwePCB ine ma PCB akawanda-anomhanya uye asina kurasikirwa zvakanyanya
- Zvinodiwa zvekudzivirira kudzorwa uye musiyano
- HDI, microvia, blind-via, uye built-via structures
- Kuisa lamination yakawanda, kuboora, kuisa plating, uye kupedzisa pamusoro
- Kuungana, kuongororwa, uye kuyedzwa kunoshanda kweSMT/THT
Highleap Electronics inopa mabasa ekugadzira maPCB uye kugadzira maPCB kumapurojekiti ane chekuita nezvinhu zveMEGTRON6 R-5775 / R-5670, kubva pakugadzirwa kwema prototypes kusvika pakugadzirwa kwehuwandu.
Titumirei mafaira enyu eGerber, zvinhu zvakaunganidzwa, BOM, uye zvinodiwa pakugadzira zvinhu kuti muongorore kugadzirwa uye mukotesheni.
