Kudzivirira Kuyera Kwemuviri wePCB uye Kudzora Kubvisa Hunhu Hwako

Mabhodhi eDunhu Rakadhindwa ( PCBs ) ndiwo musimboti wezvishandiso zvemagetsi zvemazuva ano, uye kuvimbika kwawo kwakakosha pakushanda zvakanaka kwemasisitimu akaomarara. Zvikanganiso zviviri zvikuru zvinogona kukanganisa kusimba kwePCB ndeyekuyeresa uye kuchenesa. Zvese zviri zviviri mhando dzekuora kwelaminate, asi zvakasiyana pakuoma uye zvikonzero. Kunzwisisa nekudzivirira matambudziko aya kwakakosha pakuona kuti maPCB anogara kwenguva refu uye akavimbika, kunyanya munzvimbo dzine kushushikana kwakanyanya senge mudenga, mota, uye maindasitiri ekurapa.

Chii chinonzi PCB Measling?

Measling inoreva kutaridzika kwemavara machena kana "gwirikwiti" mukati mefiberglass-yakasimbiswa laminate yePCB. Aya mavara anowanzo diki, anogara munzvimbo dze delamination mukati me resin matrix, uko magirazi mafirita akapatsanurwa kubva ku resin, achigadzira voids. Nepo kucheka kusingawanzo kukonzeresa kutadza kwemagetsi nekukurumidza, kunonetesa chimiro chelaminate uye zvinogona kutungamira kune zvakakomba nyaya senge delamination kana bhodhi rikawedzera kushushikana.

Zvinokonzera Measling

Measling inoitika nekuda kwekusanganiswa kwekupisa uye mechanical stress. Zvikonzero zvinowanzoitika zvinosanganisira:

• Kupisa Kwemhepo : Munguva yekusonera kana mamwe maitiro ekupisa kwakanyanya, kuchinja kwekushisa nekukurumidza kunogona kukonzera kuti resin ikurumidze kupwanyika kupfuura shinda dzegirazi, zvichikonzera kupatsanurwa uye kuumbwa kwegwirikwiti.

• Kunyudzwa kweMwando : Fiberglass inongori hygroscopic, zvichireva kuti inogona kunyudzwa hunyoro kubva munharaunda. Kana PCB ikasangana nekupisa kwakanyanya, hunyoro uhwu hunoshanduka kuita utsi, zvichigadzira kumanikidzwa mukati me laminate kunomanikidza shinda kuti dziparadzane ne resin.

• Kuisa Lamination Isina Kunaka : Nzira dzisina kukwana dzekuisa lamination panguva yekugadzira PCB, dzakadai sekushomeka kwakakwana kana kusashanda zvakanaka, zvinogona kusiya maburi kana maburi emhepo mukati me laminate. Maburi aya anogona kukura kana paine kushushikana, zvichikonzera kukura kwechirwere chegwirikwiti.

Impact yeMeasling paPCB Performance

Nepo measling inonyanya kukanganisa chizoro pakutanga, inoratidza kupera simba kweiyo laminate chimiro. Kana ikasiiwa isina kugadziriswa, mesling inogona kukwira kuita matambudziko akakura eku delamination, kunyanya mukushushikana kwakanyanya. Muzvikamu zvakakosha zvakadai seaerospace kana zvechiuto zvemagetsi, uko kuvimbika kunonyanya kukosha, kunyange zviduku zviduku zvemesling zvinogona kutungamirira mukurambwa panguva yekuongorora kwehutano hwehupi, sezvo aya mavara machena anowanzoonekwa seanotangira kuderera kwakanyanya.

Delamination yePCBs

Delamination inoreva kupatsanurwa kwezvikamu mukati mePCB laminate. Inyaya yakanyanya kuoma kana ichienzaniswa nemesling uye inogona kukonzera kutadza kwemagetsi nekukurumidza uye nenjodzi. Delamination inoitika kana chisungo chiri pakati pemhangura nedielectric (kazhinji FR4 kana polyimide) kana pakati pezvikamu zvedielectric zvinhu pachazvo zvinoputsika. Uku kupatsanurwa kunogona kukonzera akavhurika maseketi, mapfupi, kana kubviswa kwakazara kwenzira dzechiratidzo.

Peji rino ndiro gwara rekudzivirira kupararira kwemeasling nekubvisa masero emudumbu. Kana bhodhi ratoratidza zviratidzo, shandisa ongororo yekukundikana kwekupararira kwemeasling nekubvisa masero emudumbu ; kuti uwane zvinyorwa zvekuongorora uye kudzora kudzokorora, ongorora maitiro eHighleap ePCB quality assurance.

Zvakajairwa Zvinokonzera PCB Delamination

Zvinhu zvakati wandei zvinokonzeresa delamination yePCBs, kusanganisira:

• Thermal Cycling: Kudzokororwa kuratidzwa kune yakakwirira uye yakaderera tembiricha inoita kuti zvinhu zviri mukati mePCB zviwedzere uye zvibvumirane pamitengo yakasiyana. Kana iyo thermal coefficient yekuwedzera (TCE) pakati pemhangura uye dielectric zvinhu zvisingaenderani, izvo zvinokonzeresa kusagadzikana zvinogona kutungamirira mukuparadzaniswa kwezvikamu.
• Unyoro Mumusungo: Munguva yePCB yekugadzira maitiro, mwando unogona kubatwa mune laminate. Kana bhodhi richinge rakafumurwa nekupisa kwakanyanya panguva ye soldering kana kuyerera, mwando uhwu unopfava uye unowedzera, zvichikonzera mablistering uye kupatsanurwa kwe layer.
• Isiri Yakafanira Lamination process: Maitiro asina kunaka ekuchera, akadai sekusakwana kupisa, kudzvanywa, kana kurapa nguva, zvinogona kutungamirira kune isina kusimba kubatana pakati pematanho. Voids, mahomwe emhepo, uye kunamatira zvisina kuenzana zvinogona kupedzisira zvatungamira kune delamination pasi pekushushikana.
• Chemical Exposure: MaPCB anoshandiswa munzvimbo dzeindasitiri kana akafumurwa kumakemikari ane hutsinye panguva yekugadzira ari panjodzi yekuparara kwemakemikari ezvekunamatira zvinhu. Uku kushatisa kunoderedza chisungo pakati pemhangura uye dielectric, zvichiita kuti pave nekuparadzaniswa kwepakati nekufamba kwenguva.

Mhedzisiro yePCB Delamination

Migumisiro ye delamination inowanzokurumidza uye inotyisa. Kamwe delamination yaitika, kurongeka kwebhodhi kunokanganiswa, zvichitungamira kune akati wandei akakosha nyaya:

• Open Circuits: Delamination inogona kuita kuti mitsetse yemhangura ibude kubva kune dielectric, zvichikonzera matunhu akavhurika anodzivirira bhodhi kushanda zvakanaka.
• Mapfupi Circuits: Mune multilayer PCBs, delamination inogona kukonzera akasiyana akaturikidzana emhangura kuti asangane, zvichitungamira kune mapfupi maseketi uye zvinogona kukuvadzwa kune zvakabatana zvikamu.
• Kuwedzera Kupikisa uye Kuora Kwechiratidzo: Kunyangwe kana kupatsanurwa kwakazara kusati kwaitika, delamination yakasarudzika inogona kuwedzera kupokana munzira dzechiratidzo, zvichitungamira mukuderedzwa kwechiratidzo, kurasikirwa kwechiratidzo chekutendeseka, uye kuita kwakashata kwese.

Kuti uwane ongororo yakakwana yekugadzira, shandisa chinyorwa chino pamwe chete nekugadzirwa kwe LED aruminiyamu PCB uye kugadzirwa kwe PCB dze laminate dzakanyanya kurasikirwa zvakanyanya paunenge uchitarisa zvinodiwa pa stackup, kuunganidza, kana bvunzo.

Delamination vs. Measling

Nepo measling uye delamination ari ese ari maviri mafomu ekutadza kwePCB laminate, anosiyana zvakanyanya maererano nekuomarara kwawo, zvikonzero, uye mhedzisiro:

• Measling inyaya yakapusa, yekutanga-danho, kazhinji inoratidzika sediki diki chena mumasumbu efiberglass. Inoratidza kushaya simba mukati me laminate asi haisi pakarepo kukonzera kukanganisa kwemagetsi. Nekudaro, kana ikasiiwa isina kugadziriswa, meya inogona kupedzisira yakonzera delamination.
• Delamination, kune rumwe rutivi, kukanganisa kwakanyanya kwechimiro umo zvikamu zvePCB laminate zvakaparadzana. Izvi zvinogona kutungamirira kukukasira uye njodzi kukundikana kwemagetsi, kusanganisira akavhurika maseketi uye mapfupi maseketi. Delamination inoda kutariswa nekukurumidza uye kugadziriswa, sezvo inogona kukanganisa kushanda kwese kwebhodhi.

Kudzivirirwa kwePCB Measling uye Delamination

Zvese kugaya uye delamination zvinodzivirirwa kuburikidza nekungwarira kusarudzwa kwezvinhu, maitiro ekugadzira, uye kutonga kwemhando. Mamwe emazano akakosha ekudzivirira nyaya idzi anosanganisira:

1. Kusarudzwa Kwezvinhu: Kushandisa emhando yepamusoro laminates ane akakodzera kupisa kwekuwedzera coefficients kunogona kuderedza njodzi yeku delamination. Laminates ane mwero wakaderera kunyura hunyoro akakoshawo mukudzivirira zvese kugaya uye delamination.
2. Yakakodzera Lamination Techniques: Kuve nechokwadi chekudziya kwakaringana, kudzvanywa, uye nguva yekurapa panguva yelamination process yakakosha pakugadzira zvisungo zvakasimba pakati pePCB layer. Yakakwana lamination pressure inoderedza njodzi yevoids kana mahomwe emhepo, ayo anogona gare gare kuwedzera uye kutungamirira ku delamination.
3. Kudzora Unyoro: MaPCB anofanirwa kuchengetwa munzvimbo dzakaderera-munyoro, uye kufanobika mabhodhi kusati kwatengeswa kunogona kubatsira kubvisa hunyoro hwakavharirwa, kuderedza njodzi yekudonha panguva yekupisa bhasikoro.
4. Thermal Stress Management: Kushandisa zvinobudirira zvinogadzirisa zvigadziriso zvekupisa, senge thermal vias kana kupisa sinks, zvinogona kuderedza kushushikana kwekupisa paPCBs, kuderedza njodzi yeese measling uye delamination.
5. Kuedza uye Kudzora Kwemhando: Kuyedzwa kwakasimba, kunosanganisira kuchovha bhasikoro, humidity bvunzo, uye mechanic stress bvunzo, inofanira kunge iri chikamu chePCB kugadzira maitiro kuona chero kushaya simba mulaminate bhodhi risati raunganidzwa.

mhedziso

PCB mesling uye delamination inomiririra matambudziko akakomba mukugadzira nekushandiswa kwePCB, kunyanya mukuvimbika kwepamusoro-soro maapplication uko kunyangwe hurema hudiki hunogona kukonzera kutadza kukuru. Kunzwisisa zvinokonzeresa, mhedzisiro, uye kudzivirira kwenyaya idzi kwakakosha pakuchengetedza kuvimbika kwenguva refu kwePCBs. Nekunyatso gadzirisa zvinhu, maitiro ekugadzira, uye maitiro ekuyedza, vagadziri vanogona kudzikisa njodzi yekukanganisa uku uye kuona kuti maPCB avo anoita zvakavimbika pasi pemamiriro anodikanwa.

Kune mabhizinesi anotarisa kuve nechokwadi chemhando yepamusoro uye kuvimbika mumaPCB avo, kushanda nevagadziri vane ruzivo vanonzwisisa kuomarara kwe delamination yePCB uye maitiro ekudzivirira kwakakosha. Nekudyara mune zvemhando yepamusoro maitiro uye zvigadzirwa, makambani anogona kudzivirira kutadza kunodhura uye kuona kuti masystem avo emagetsi anoita zvakanaka kwemakore anotevera.