Kusarudza Yakanakisa PCB Substrate Yekuwedzeredzwa Kuita

Munyika inogara ichishanduka yekugadzirwa kwemagetsi, kusarudzwa kweiyo chaiyo Yakadhindwa Circuit Board (PCB) substrate zvinhu kwakakosha zvakanyanya. Inotamba basa rakakosha mukutsanangura zvakakosha hunhu uye kuita kwePCBs. Kuti uvandudze mashandiro uye kugona kwemabhodhi ako edunhu, kugadzirisa iyo substrate zvinhu ndiyo yekutanga uye yakakosha nhanho. Mumakore achangopfuura, akawanda ekugadzira substrate zvinhu akabuda, achienderana nehunyanzvi matekinoroji uye maitiro emusika.

Mamiriro emusika akadhindwa wedunhu bhodhi musika akaona shanduko yakadzama yekutarisa, shanduko kubva kune yechinyakare zvigadzirwa zvehardware sedesktop PC kuenda kunzvimbo yekutaurirana isina waya, maseva, uye nharembozha. Midziyo yekufambisa nharembozha, inoenzanisirwa nemafoni efoni, yakafambisa tekinoroji yePCB kusvika pakuwana dhizaini yakakwira, huremu hwakadzikiswa, uye mabasa mazhinji. Izvo zvakakosha kuti uzive kuti kuita kwePCB kwakabatana zvisingaite nekusarudzwa kweiyo yakakodzera substrate zvinhu. Saka nekudaro, kusarudzwa kwezvinhu zve substrate kunoita basa rakakosha mukugadzira mhando uye kuvimbika kweese maPCB uye ekupedzisira-zvigadzirwa izvo zvakagadzirirwa kushandira.

Kusangana nezvinodiwa zveHigh Density uye Fine Lines

• Copper Foil Zvinodiwa

  Kutsvaga kwepamusoro density uye mitsetse yakatsetseka, kunyanya kana iri High-Density Interconnect PCBs (HDI PCBs), inoda kutariswa chaiko. Makumi gumi apfuura, maHDI PCB aitsanangurwa seane upamhi hwemitsara (L) uye kupatsanurwa kwemitsara (S) ye0.1mm kana pasi, zvichienderana ne IPC zviyero. Nhasi, zviyero izvi zvakaderera zvakanyanya, neL uye S tsika dzinosvika pasi se60μm uye, mumamiriro ezvinhu epamusoro, kunyange 40μm.

  Sechinyakare, mapatani edunhu akaumbwa kuburikidza nekufungidzira uye etching maitiro, kuwana hushoma L uye S kukosha kwe30μm uchishandisa yakaonda yemhangura foil substrates ine ukobvu kubva pa9μm kusvika 12μm. Nekudaro, nekuda kwezvinetso zvine chekuita neyakaonda yemhangura foil Copper Clad Laminate (CCL), vazhinji vagadziri vePCB zvino vanosarudza etching-minus-copper-foil nzira, uko ukobvu hwemhangura hwemhangura hunowedzerwa kusvika 18μm. Pasinei nekushandiswa kwayo, iyi nzira haina kukurudzirwa sezvo inosanganisira akawanda akaomarara maitiro, matambudziko mukudzora ukobvu, uye kuwedzera mitengo. Nekuda kweizvozvo, iyo yekupedzisira-yakatetepa yemhangura foil ine ukobvu hwemhangura kubva pa3μm kusvika 5μm inoonekwa seimwe yepamusoro.

• Yakaderera Roughness Copper Foil

  Kuwana yakaderera roughness pamusoro copper foil pamusoro zvinokosha. Izvi zvinofambisa hukama hwakavandudzwa pakati pemhangura foil uye substrate zvinhu, kuve nechokwadi chekusimba kwepeel yemakondakita. Kuti uwane mibairo yakakwana, zvakakosha kudzikisa kushata kwepamusoro kwefoiri yemhangura kusvika pasi pe3μm, kana kutodzika se1.5μm.

• Insulating Dielectric Laminates

  Yakakwirira-Density Interconnect PCBs inovimba zvakanyanya neKuvaka Up Maitiro. Nepo Resin Coated Copper (RCC) uye prepreg epoxy girazi jira rakasanganiswa nemhangura foil lamination zvagara zvichishandiswa kutenderera zvakanaka, nzira dziri kusimukira dzakadai seSemi-Additive process (SAP) uye Modified Semi-Additive process (MSPA) dziri kuwana mukurumbira. Idzi nzira dzinosanganisira insulating dielectric film lamination nekemikari yemhangura plating kugadzira ndege dzemhangura dzinoitisa, zvichiita kuti kugadzirwa kwemaseketi akanaka.

  Sarudzo yezvinhu zve dielectric zvinosunga laminating inokosha. Inofanira kunge iine mashandiro anodiwa e dielectric, hunhu hwe insulation, kuramba kupisa, uye hunhu hwe bonding hunoenderana neHDI PCB technology.

Kuzadzikisa Zvinodiwa zveHigh Frequency uye High Speed

Kufambira mberi kubva pakushandisa tekinoroji yekutaurirana ine waya kuenda pakushandisa waya uye kuchinja kubva pakushandisa nzira dzekutumira data dzine frequency shoma, dzinomhanya zvishoma kuenda pakushandisa nzira dzekutumira data dzine frequency yakawanda, dzinomhanya zvakanyanya zvinoratidza kukura kukuru. Kuchinja kubva pakushandisa tekinoroji ye4G kuenda ku5G mumafoni kunoratidza kudiwa kwekutumira data nekukurumidza uye kuwedzera kugona kwedata.

Kuti usangane nezvinodiwa zve-high-frequency uye high-speed transmission, kusarudzwa kwezvinhu zvepamusoro zvakakosha. Chekutanga kutariswa ndeye dielectric inogara (Dk) uye dielectric kurasikirwa (Df) yeiyo substrate zvinhu. Substrate zvinhu zvine Dk pazasi 4 uye Df pazasi 0.010 zvinoiswa sepakati Dk/Df laminate board. Nokuda kwekuita kwepamusoro, pasi Dk/Df laminate board ane Dk pazasi 3.7 uye Df pazasi 0.005 anosarudzwa.

Mhando dzakasiyana-siyana dzezvinhu zve substrate dziripo dzemabhodhi ecircuit ane mafrequency akawanda, kusanganisira fluorine-series resin (semuenzaniso, PTFE), PPO kana PPE resin, uye modified epoxy resin. PTFE , inozivikanwa nehunyanzvi hwayo hwe dielectric, yakakodzera zvigadzirwa zvinoshanda pamafrequency e5GHz kana kupfuura. Kusiyana neizvi, modified epoxy FR-4 kana PPO substrates dzakakodzera mafrequency anotangira pa1GHz kusvika pa10GHz.

Sarudzo pakati peiyi yakakwirira-frequency substrate zvinhu inosanganisira kutengeserana pakati pemutengo, dielectric zvivakwa, kunyura kwemvura, uye frequency maitiro. Fluorine-series resin inopa yakasarudzika dielectric kuita asi nemutengo wepamusoro. Kune rimwe divi, epoxy resin inodhura-inoshanda asi inononoka mukuita dielectric.

Mumamiriro ezvinhu apo zvigadzirwa zvinoshanda pamafrequency anopfuura 10GHz, fluorine-series resin inova chinhu chesarudzo. Izvo zvakakosha kuti uzive kuti PTFE substrates inogona kunge iine pasi pasi semutengo wakakwira, kusasimba kusimba, uye yakakwirira kupisa kwekuwedzera coefficients. Kugadzirisa matambudziko aya, inorganic zvinhu zvakaita sesilicon dioxide zvinogona kushandiswa semafirita kana jira regirazi rinogona kuwedzerwa kusimbisa substrate rigidity uye kuderedza kuwedzera kwemafuta.

Yakasarudzika Insulating Resins uye Surface Roughness yeMhangura

Kupfuura kusarudzwa kweiyo substrate zvinhu, zvimwe zvinhu zvinouya mumutambo wepamusoro-frequency chiratidzo chekufambisa. Iko kushata kwepamusoro kwemhangura kunokanganisa zvakanyanya kurasikirwa kwekutapurirana kwechiratidzo nekuda kweiyo Skin Effect phenomenon. Iyo Ganda Mhedzisiro inoitika apo electromagnetic induction pane yakakwirira frequency inomanikidza ikozvino kuti itarise pamusoro peiyo conductor, zvichikonzera kuwedzera kurasikirwa kwechiratidzo.

Kuti uderedze kurasikirwa kwechiratidzo, copper conductor surface roughness inofanira kudzorwa. Panguva imwecheteyo, kushata kwepamusoro kunotungamira mukurasikirwa kwechiratidzo. Naizvozvo, kushata kwemhangura kunofanirwa kuchengetwa kwakadzikira sezvinobvira, zviri pasi pe1μm, kunyanya kumasaini pamusoro pe10GHz. Copper foil ine ultra-low roughness (0.04μm) inobatsira zvikuru. Yakafanira oxidation kurapwa uye anonamira resin masisitimu akakosha kuti uwane iyo inodiwa pamusoro roughness.

Kugadzirisa High Heat Resistance uye Dissipation Zvinodiwa

Sezvo michina yemagetsi ichiva midiki uye ichiwedzera kuva nesimba, inogadzira kupisa kwakawanda. Kutarisira kupisa kwakanaka kwakakosha kuti mudziyo ushande zvakanaka. MaPCB eMetal Core ( MCPCBs ) kana maPCB eInsulated Metal Substrate (IMS) anopa hunhu hwakanaka hwekuparadza kupisa.

Aluminium chinhu chinodhura-chinoshanda uye chinopisa chinopisa chinowanzo shandiswa muMCPCBs. Inopa yakanakisa kupisa kupisa uye kugona kuburitsa. Chinokosha chekushanda kwekushisa kwekushisa chiri mukuvimbisa kunamatira kwakasimba pakati pesimbi yesimbi uye ndege yedunhu.

Kusarudza Substrate Zvishandiso zveSpecialized PCBs

Iko kunogara kuchiwedzera kushandiswa kwemaPCB akaomarara uye anochinjika/akaomarara maPCB munzvimbo dzakasiyana siyana anounza zvitsva zvinodiwa maererano nenhamba uye kuita. Mhando dzakasiyana dze substrates dziri kubuda kuti dziite izvi zvinodiwa.

Mafirimu ePolyimide, anowanikwa mumhando dzakasiyana-siyana sepachena, chena, nhema, uye yero, anopa kupisa kwakanyanya kupikisa uye kuderera kwekuwedzera kwemafuta ekuwedzera. Zvishandiso izvi zvinoenderana nezvinodiwa zvakasiyana zvemaapplication.

Mylar substrates, inozivikanwa nekudhura-inoshanda, inotaridza hunhu hwakadai seyepamusoro elasticity, dimensional kugadzikana, mhando yepamusoro, photonic coupling, uye kuramba kwezvakatipoteredza, zvichivaita sarudzo dzakasiyana-siyana dzezvinodiwa zvakasiyana.

High-speed, high-frequency signal transmission yakakosha kune flexible PCBs (Flex PCBs). Iyo dielectric inogara uye dielectric kurasikirwa kweiyo flex substrate zvinhu zvinofanirwa kunyatsotariswa. Polyimide uye kufambira mberi kwepolyimide substrates, pamwe chete ne substrates ine inorganic additives, inogona kugadzirwa kuti ienderane nezvinodiwa zvakananga, zvakadai seyakaderera Dk / Df nokuda kwekufambisa kwepamusoro-kumhanya kana magetsi emagetsi ekushandiswa nemhepo huru.

Vimba neHighleap Electronic yeNyanzvi Yekusarudzwa Kwezvinhu uye PCB Manufacturing

Kusarudza iyo yakakodzera substrate zvinhu zvePCB yako isarudzo yakakosha, uye inoda kunzwisisa kwakadzama kweakasiyana hunhu hunobatanidzwa. Kana iwe ukazviwana uchifambisa kuoma kwe substrate material terminology uye maitiro ekuita, pane inodhura-inoshanda mhinduro iripo yekukubatsira iwe kuita sarudzo dzine ruzivo.

Highleap Electronic, inotungamira pasi rose inopa isina bhodhi yekugadzira, PCB gungano, uye chikamu chekutsvaga masevhisi, inogadzirisa kugadzirisa yakakwana PCB mhinduro dzakagadzirirwa kune zvakasarudzika zvinodiwa nepurojekiti yako, bhajeti, uye tarisiro yekuita. Mainjiniya edu ane ruzivo anofunga zvinhu zvakaita senzvimbo yekushandisa, mashandiro, uye bhajeti yako kuti ikutungamirire kuburikidza neiyo substrate yekusarudza zvinhu.

Neanopfuura makore gumi echiitiko uye rekodhi yekuzadzisa zvakabudirira mazana ezviuru zvePCB mapurojekiti, Highleap Electronic mubatsiri wako waunovimba naye mukusarudza iyo yakakwana substrate zvinhu uye kugadzira yakakwirira-inoshanda PCB inosangana nekupfuura zvaunotarisira.

Kune maPCB ane masubstrate eFR4 akajairwa, unogona kuwana mutengo wepaindaneti ipapo ipapo kuburikidza newebhusaiti yedu. Kana purojekiti yako ichida zvinhu zve substrate zvakanongedzerwa zvakaita seFlex PCBs , maPCB e laminate ane kurasikirwa kwakaderera , kana maPCB ane Aluminum , tinokukurudzira kuti utibate zvakananga kuti uwane mutengo wakagadzirwa. Iva nechokwadi chekuti, Highleap Electronic ichakubatsira kusarudza zvinhu zve substrate zvakakodzera purojekiti yako uye kuendesa maPCB anoshanda zvakanaka.