Yepamusoro-Kushanda Inochinjika PCB Material - DuPont™ Pyralux® AP
Ongorora DuPont™ Pyralux® AP, yepamusoro-tier inonamira polyimide laminate yakanakira inoshanduka uye yakaoma-inochinjika PCB kugadzira. Inotsigirwa neHighleap Electronics.
DuPont™ Pyralux® AP Flexible Laminate
Pyralux® AP ipurasitiki yemhangura inochinjika, inoshanda zvakanyanya, yakagadzirwa nepolyimide, yakagadzirirwa macircuits anochinjika akawanda uye maPCB anochinjika . Pyralux® AP haina jira rinonamira uye kugadzikana kwakanaka kwekupisa uye mativi, saka inosangana nezvinodiwa zvemagetsi zvinovimbika zvakanyanya.
- Yakanakisa dimensional uye thermal kugadzikana pasi pemamiriro akanyanya
- Yakanakira multilayer flex uye rigid-flex PCB application
- UL 94V-0 yakasimbiswa uye IPC 4204/11 inoenderana
- Yakasiyana-siyana yemhangura uye dielectric ukobvu musanganiswa unowanikwa
Ichi chinyorwa chinoshandiswa zvakanyanya mumagetsi emotokari, midziyo yekurapa, aerospace masisitimu, uye 5G yekutaurirana michina.
Pyralux®
AP Chigadzirwa Zvipiriso
| Chigadzirwa Code | Dielectric Kukora (mil) | Hukobvu hwemhangura (oz/ft²) |
|---|---|---|
| AP 7163E | 1.0 | 0.25 |
| AP 7164E | 1.0 | 0.33 |
| AP 8515R | 1.0 | 0.5 |
| AP 9111R | 1.0 | 1.0 |
| AP 7156E | 2.0 | 0.25 |
| AP 7125E | 2.0 | 0.33 |
| AP 8515E | 1.0 | 0.5 |
| AP 8525R | 2.0 | 0.5 |
| AP 9121R | 2.0 | 1.0 |
| AP 9222R | 2.0 | 2.0 |
| AP 8535R | 3.0 | 0.5 |
| AP 9131R | 3.0 | 1.0 |
| AP 9232R | 3.0 | 2.0 |
| AP 8545R | 4.0 | 0.5 |
| AP 9141R | 4.0 | 1.0 |
| AP 9242R | 4.0 | 2.0 |
| Laminate Property | IPC TM-650 (* kana zvimwe) | AP-9111 1 miriyoni dielectric |
AP-9121 2 miriyoni dielectric |
AP-9131–9161 3-6 mil dielectric |
|---|---|---|---|---|
| Kunamatira kuCu (Peel Simba) Sezvakagadzirwa, N/mm (lb/in) Mushure mekutengesa, N/mm (lb/in) |
Method 2.4.9 | 1.6 (9) | >1.8 (10) | >1.8 (10) |
| 1.6 (9) | >1.8 (10) | >1.8 (10) | ||
| Solder Yayangarara pa288°C (550°F) | Method 2.4.13 | Pass | Pass | Pass |
| Dimensional Kugadzikana Nzira B,% Nzira C,% |
Method 2.2.4 | -.04 kusvika -.08 -.05 kusvika -.08 |
-.04 kusvika -.08 -.04 kusvika -.07 |
-.03 kusvika -.06 -.03 kusvika -.06 |
| Dielectric Thickness Tolerance,% | Method 4.6.2 | ± 10 | ± 10 | ± 10 |
| UL Flammability Rating | *UL-94 | V-0 | V-0 | V-0 |
| Dielectric Constant*, 1 MHz | Method 2.5.5.3 | 3.4 | 3.4 | 3.4 |
| Dissipation Factor*, 1 MHz | Method 2.5.5.3 | 0.003 | 0.002 | 0.002 |
| Dielectric Simba, kV/mil | Method 2.5.6.1 | 6-7 | 6-7 | 6-7 |
| Vhoriyamu Resistivity, ohm-cm | Method 2.5.17.1 | E16 | E17 | E17 |
| Surface Resistance, ohms | Method 2.5.17.1 | >E16 | >E16 | >E16 |
| Unyoro uye Insulation Res., ohms | Method 2.6.3.2 | E11 | E11 | E11 |
| Kunyura munyoro,% | Method 2.6.2 | 0.8 | 0.8 | 0.8 |
| Kusimba Simba, MPa (kpsi) | Method 2.4.19 | >345 (>50) | >345 (>50) | >345 (>50) |
| Kubatanidzwa,% | Method 2.4.19 | > 50 | > 50 | > 50 |
| Inititation kubvarura Simba, g | Method 2.4.16 | 700-1000 | 900-1200 | 900-1200 |
| Kuparadzirwa Kwemisodzi Simba, g | Method 2.4.17.1 | > 10 | > 20 | > 20 |
| Chemical Resistance, min. % | Method 2.3.2 | Kupfuura, >95% | Kupfuura, >95% | Kupfuura, >95% |
| Solderability | *IPC-S-804, M. 1 | Pass | Pass | Pass |
| Flexural Endurance, min. cycles | Method 2.4.3 | 6000 | 6000 | 6000 |
| Girazi Shanduko (Tg), °C | - | 220 | 220 | 220 |
| Modulus, kpsi | - | 700 | 700 | 700 |
| MuNdege CTE (ppm/°C) T | - | 25 | 25 | 25 |
| MuNdege CTE (ppm/°C) T>Tg | - | 40 (zvichida) | 40 (zvichida) | 40 (zvichida) |
- Pyralux® AP chigadzirwa cheDuPont.
- Hunhu hwehunyanzvi hunopihwa chete senzira yekutarisa mainjiniya. Ndapota tarisai magwaro emugadziri wezvinhu kuti muwane zvirevo zvakasimbiswa.
- Highleap Electronics ikambani yakazvimiririra inogadzira maPCB uye inopa masevhisi ekugadzira maPCB uye haisi iyo kambani inogadzira maPCB ePyralux® AP.
Mabhenefiti Akakosha & Mashandisirwo ePyralux® AP
Pyralux® AP inopa indasitiri-inotungamira mashandiro evagadziri uye vagadziri vePCB inoshanduka. Inopa anowirirana emagetsi zvivakwa uye yepamusoro yekupisa kuvimbika kune yakakosha maapplication.
Kubatsira Kwakakosha:
- Yakaderera Coefficient yeThermal Kuwedzera (CTE) - yakanakira rigid-flex multilayers
- High adhesion pakati pemhangura uye polyimide kune yakasimba redunhu kutendeseka
- Yakanakisa dielectric ukobvu kudzora kune inodzorwa impedance dhizaini
- Kuita kwakagadzikana munzvimbo dzakaoma: hunyoro hwepamusoro, bhasikoro rinopisa, uye kuratidzwa kwemakemikari
Mavhuro Okushanda:
- Midziyo yekuongorora yekurapa (semuenzaniso, masisitimu ekufungidzira, zvinopfekwa)
- Dziviriro uye aerospace zvemagetsi (satellite masisitimu, avionics)
- High-speed telecommunication systems uye 5G antennas
- Zvemotokari ECUs, masensa, uye mu-cabin emagetsi ekudzora
Kugadzira PCB Inochinjika Nemutengi Anotsanangura Pyralux® AP
Highleap Electronics inopa mabasa ekugadzira nekugadzira maPCB anochinjika uye maPCB akasimba zvichienderana nemifananidzo yevatengi, zvinodiwa pakuunganidza zvinhu, uye zvinhu zvakatemwa zve laminate. Mapurojekiti anotaura nezvePyralux® AP anogona kuongororwa kuti aone kana zvinhu zviripo uye zvinodiwa pakugadzira zvinhu zvisati zvagadzirwa.
Kugona Kugadzira PCB Kuchinjika
- Kugadzirwa kwePCB inochinjika ine jira rimwe chete uye ine jira rakawanda
- Kugadzirwa kwePCB kwakasimba uye kwakawanda-kwakatsetseka
- Kuboorera neLaser uye nekanika
- Kugadziriswa kweCoverlay uye lamination
- Kugadziriswa kwePCB inodzorwa
- SMT, THT kuunganidza, kuongorora, uye kuyedza
Pyralux® AP inozivikanwa papeji rino sePCB inosarudzwa nemutengi chete. Highleap Electronics ikambani yakazvimiririra inogadzira PCB uye inopa masevhisi ekugadzira.
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