TLX-8
Chii chinonzi TLX-8?
Material Overview
- Mugadziri weParizvino: AGC
- Chigadzirwa: TLX-8
- Rudzi rwezvinhu: Fiberglass-Yakasimbiswa PTFE
- Zvakajairika Dr: 2.55 ± 0.04
- Zvakajairika Df: 0.0018
- Kushandiswa Kwakanyanya: RF & Microwave PCBs
Features
- Yakaderera Dielectric Kurasikirwa
- Dielectric Constant Inodzorwa
- Low Moisture Absorption
- Magadzirirwo Akasimbiswa neFiberglass
- Sarudzo Dzakawanda Dzekukora
- Sarudzo dzakasiyana dzeCopper Cladding
Benefits
- Yakaderera uye Yakagadzikana Dk
- Yakanakisa Mechanical & Thermal Properties
- Dimensionally Stable
- Low Moisture Absorption
- Low DF
- UL 94 V-0 Rating
- Kune Yakaderera Layer Count Microwave Dhizaini
Applications
- MaAntena eRF & Microwave
- Radar Systems
- Midziyo Yekutaurirana Nefoni
- Midziyo Yekuyedza Microwave
- RF Mafirita
- Vasanganisi & Vashanduri veFrequency
- Zvinoparadzanisa Simba, Zvinopatsanura & Zvinosanganisa
- Zvikamu zveRF & Microwave Passive
TLX-8 General Properties
| Properties | Nzira dzeKwayedza | chikwata | ukoshi | chikwata | ukoshi |
|---|---|---|---|---|---|
|
DK @ 10 GHz |
IPC-650 2.5.5.3 |
|
2.55 |
|
2.55 |
|
Df @ 1.9 GHz |
IPC-650 2.5.5.5.1 |
|
0.0012 |
|
0.0012 |
|
Df @ 10 GHz |
IPC-650 2.5.5.5.1 |
|
0.0017 |
|
0.0017 |
|
Dielectric Kuparara |
IPC-650 2.5.6 |
kV |
> 45 |
kV |
> 45 |
|
Kunyorova Kusviba |
IPC-650 2.6.2.1 |
% |
0.02 |
% |
0.02 |
|
Flexural Strength (MD) |
ASTM D 709 |
psi |
28,900 |
N / mm² |
|
|
Flexural Strength (CD) |
ASTM D 709 |
psi |
20,600 |
N / mm² |
|
|
Tensile Simba (MD) |
ASTM D 902 |
psi |
35,600 |
N / mm² |
|
|
Kusimba Simba (CD) |
ASTM D 902 |
psi |
27,500 |
N / mm² |
|
|
Elongation paBreak (MD) |
ASTM D 902 |
% |
3.94 |
% |
3.94 |
|
Elongation panguva yeBreak (CD) |
ASTM D 902 |
% |
3.92 |
% |
3.92 |
|
Young's Modulus (MD) |
ASTM D 902 |
kpsi |
980 |
N / mm² |
|
|
Mudiki's Modulus (CD) |
ASTM D 902 |
kpsi |
1,200 |
N / mm² |
|
|
Young's Modulus (MD) |
ASTM D 3039 |
kpsi |
1,630 |
N / mm² |
|
|
Ratio yaPoisson |
ASTM D 3039 |
|
0.135 |
N / mm |
|
|
Peel Simba (1 oz.ed) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
15 |
N / mm |
|
|
Simba rePeel (1 oz.RTF) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
17 |
N / mm |
|
|
Peel Stength (½ oz.ed) |
IPC-650 2.4.8.3 (Yakakwira Temp.) |
Ibs./linear inch |
14 |
N / mm |
|
|
Peel Stength (½ oz.ed) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
11 |
N / mm |
|
|
Simba rePeel (1 oz. |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
13 |
N / mm |
2.1 |
|
Dimensional Kugadzikana (MD) |
IPC-650 2.4.39 Sec.5.5 (After Bake.) |
mils/in. |
0.06 |
mm/M |
|
|
Dimensional Kugadzikana (CD) |
IPC-650 2.4.39 Sec.5.4 (After Bake.) |
mils/in. |
0.08 |
mm/M |
|
|
Dimensional Kugadzikana (MD) |
IPC-650 2.4.39 Sec.5.5 (Thermal Stress.) |
mils/in. |
0.09 |
mm/M |
|
|
Dimensional Kugadzikana (CD) |
IPC-650 2.4.39 Sec.5.5 (Thermal Stress.) |
mils/in. |
0.1 |
mm/M |
|
|
Kumusoro Kugadziriswa |
IPC-650 2.5.17.1 Sec.5.2.1 (Yakakwidzwa Temp.) |
Mohm |
6.605 x 10⁸ |
Mohm |
6.605 x 10⁸ |
|
Kumusoro Kugadziriswa |
IPC-650 2.5.17.1 Sec.5.2.1 (Humidity Cond.) |
Mohm |
3.550 x 10⁶ |
Mohm |
3.550 x 10⁶ |
|
Kusagadzikana kweVolume |
IPC-650 2.5.17.1 Sec.5.2.1 (Yakakwidzwa Temp.) |
Mohm/cm |
1.110 x 10¹⁰ |
Mohm/cm |
1.110 x 10¹⁰ |
|
Kusagadzikana kweVolume |
IPC-650 2.5.17.1 Sec.5.2.1 (Humidity Cond.) |
Mohm/cm |
1.046 x 10¹⁰ |
Mohm/cm |
1.046 x 10¹⁰ |
|
Kuchengetedza Kwemhepo |
ASTM F433/ASTM 1530-06 |
W/M*K |
0.19 |
W/M*K |
0.19 |
|
CTE (X axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
21 |
ppm/℃ |
21 |
|
CTE (Y axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
23 |
ppm/℃ |
23 |
|
CTE (Z axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
215 |
ppm/℃ |
215 |
|
Density (Specific Gravity) |
ASTM D 792 |
g / cm³ |
2.25 |
g / cm³ |
2.25 |
|
Td (2% Kuderedza uremu) |
IPC-650 2.4.24.6 (TGA) |
℃ |
535 |
℃ |
|
|
Td (5% Kuderedza uremu) |
IPC-650 2.4.24.6 (TGA) |
℃ |
553 |
℃ |
|
|
Flammability Rating |
UL-94 |
|
V-0 |
|
V-0 |
Hurukuro
- Makoshero akanyorwa pamusoro apa idata rezvinhu zvakajairika uye anogona kusiyana zvichienderana nekukora kwelaminate, kuvakwa kwemhangura, mamiriro ekugadzirisa, uye nzira dzekuedza.
- TLX-8 chikamu cheRF/microwave laminate portfolio yeAGC. Kuti uwane zvirevo zviripo, ukobvu huripo, sarudzo dzekuvhara mhangura, uye ruzivo rwekufanirwa, tarisa magwaro ehunyanzvi azvino kubva kuAGC.
- Ruzivo rwuri papeji rino rwunopihwa kuti rushandiswe pakugadzira zvinhu zveinjiniya uye harufanirwe kushandiswa sezvinodiwa zvePCB kana gadziriro yemagetsi.
TLX-8 Inobatsira Rini paRF kana Microwave PCB?
TLX-8 ingakosha kuongororwa kana RF kana microwave PCB ichida laminate yakavakirwa paPTFE ine kurasikirwa kwakaderera kwe dielectric, hunhu hwe dielectric hunodzorwa, uye fiberglass reinforcement. Sarudzo yacho inofanira kunge yakavakirwa pazvinodiwa zvedunhu rese kwete pazita rezvinhu chete.
Kune vagadziri vePCB, TLX-8 inonyanya kukosha kana maitiro ekutumira, kurasikirwa kwekuisa, kugadzikana kweimpedance, uye RF geometry zvine simba guru padunhu rakapedzwa. Mapurojekiti akajairika anogona kusanganisira network dzeantenna, radar electronics, RF filters, microwave passive circuits, michina yekutaurirana, uye hardware yekuyedza kana yekuyera.
- Nzira dzeRF uye microwave: Yakakodzera magadzirirwo apo kurasikirwa kwe dielectric kuri chikamu chakakosha chekuverenga mutsetse wekutumira.
- MaAntena nemaRadar circuits: Inogona kutariswa kune zvivakwa zvine frequency yakakwira uko trace geometry, ukobvu hwe dielectric, copper profile, uye grounding zvinoda kunyatsotsanangurwa.
- Mafirita uye network dzeRF dzisingashande: Inobatsira kumaseketi anoenderana nehukuru hwetambo dzemagetsi dzinodzokororwa uye maitiro e dielectric anodzokororwa.
- Mabhodhi eRF ane nhamba yakaderera kusvika pakati nepakati: TLX-8 inogona kuongororwa nezvemaPCB emu microwave asingade magadzirirwo akafanana neaya emadhijitari ekumashure akaomarara ane layer-count.
- Magadzirirwo ekudzivirira-kudzorwa: Iyo laminate inogona kuiswa mumaPCB stack-ups uko zvinangwa zve impedance zvinotsanangurwa pamwe chete nehukobvu hwemhangura uye nzvimbo ye dielectric.
- Zvivakwa zvePCB zveHybrid: Mune mamwe mapurojekiti, PTFE RF layer inogona kusanganiswa nezvimwe zvinhu zvePCB zvinotenderwa kana zvinodiwa nemagetsi, zvemakanika, uye zvemutengo zvichitsigira kuunganidzwa kwehybrid.
TLX-8 haisiyo laminate chaiyo yega yega PCB ine mafrequency akawanda. Mafrequency ekushanda, chinangwa chekuisa-kurasikirwa, ukobvu hwebhodhi, huwandu hwema layer, RF topology, zvinodiwa pakupisa, kuoma kwekugadzirwa, mamiriro ekubatanidza, uye kuwanikwa kwezvinhu zvinofanirwa kufungwa nezvazvo usati waburitsa PCB yekupedzisira.
Pamapurojekiti ekugadzira maPCB eTLX-8 uye ekugadzira maPCB, Highleap Electronics inoshanda kubva pane zvakatenderwa, stack-up, Gerber data, zvinodiwa zve impedance, mifananidzo yemakanika, uye mafaira ekugadzira kuti igadzire dhizaini inoenderana nePCB.
Tumira purojekiti yako yeTLX-8 PCB kuti iongororwe uye iongororwe mutengo wekugadzira