Mugadziri wePCB wezvikamu makumi maviri nemana muChina
Ehe—Highleap Electronics inogadzira maPCB ane zvidimbu makumi maviri nemana. Rudzi rwedu rwekugadzira mabhodhi akaomarara rwakaburitswa rwunosvika zvidimbu makumi matanhatu. Kune maOEM, mainjiniya nenyanzvi dzekutenga, tinopa nzira yakabatana kubva pakuunganidza zvidimbu makumi maviri nemana uye kuongorora kweDFM kuburikidza nekugadzira, kuongorora uye kuunganidza maPCB nenzira yesarudzo.
Kunyangwe purojekiti yenyu iri yebhodhi re network rinomhanya zvakanyanya, puratifomu ye compute kana server, industrial controller kana high-density instrumentation PCB, timu yedu inogona kuongorora zvinodiwa chaizvo zvekuvaka—kwete kungova nehuwandu hwe layer. Tinoshanda nevatengi vekunze kwenyika, kusanganisira mainjiniya nevatengi muEurope neIsrael, vanoda mubatsiri wekugadzira ma PCB wekuChina ane hunyanzvi uye ane kutaurirana kwakajeka kwehunyanzvi.
Tumirai data reGerber kana ODB++, muunganidzwa wenyu wezvinhu uye huwandu hwezvinhu zvakatarwa. Kana kuvaka kwacho kusiri kwekupedzisira, tumirai muunganidzwa wakarongwa uye mutiudzei kuti ndezvipi zvinodiwa zvemagetsi kana zvemakanika zvakagadziriswa.
Izvi zviri pamusoro apa inyanzvi dzekugadzira zvinhu zvakaburitswa, kwete vimbiso yekuti muganho wese unogona kubatanidzwa padhizaini imwe chete ine zvidimbu makumi maviri nemana. Kugona kwekupedzisira, kushivirira uye kutumirwa zvinosimbiswa zvichienderana nedata rako rekugadzira.
Highleap inogona kugadzira PCB yako ine 24-Layer here? Ehe.
Highleap ikambani inogadzira maPCB uye inogadzira maelectronics muChina. PCB yakasimba ine 24-layer iri mukati mehunyanzvi hwedu hwakataurwa pachena. Tinotsigira kuongororwa kwemaprototype, kuiswa kwechigadzirwa chitsva uye huwandu hwakarongwa hwekugadzirwa, nenzira inodiwa inotsanangurwa nedhizaini.
Hatibati mabhodhi ese ane 24-layer seanochinjika. Kuvakwa kwemuchina wekugadzira maburi, dhizaini ye112G-class signal-integrity yakaderera uye bhodhi rine ma "sequential-lamination cycles" akawanda hazvina njodzi kana mutengo wakafanana. Basa redu rekutanga nderekugadzirisa misiyano iyoyo tisati tatenga odha uye kuburitswa kwezvigadzirwa.
Titumirei data package iripo ine 24-layer kuti titengese, kana kuti tibatanidzei apo stack-up ichiripo kuti tiongorore mashandiro ayo. Kana dhizaini ichida HDI, backdrilling, via-in-pad kana hybrid high-frequency materials, tsvagai maficha iwayo padanho reRFQ.
Kugona Kugadzira PCB Yezvikamu 24: Nhamba Dzinodiwa Nevatengi
Nhamba idzi dzakatorwa kubva patafura yeHighleap yakasimba yePCB . Dzinotsanangura chikuva chekugadzira; hadzisi vimbiso yekubatanidza zvese zvine 24-layer stack-up. Upamhi hwemutsara hunogona kugoneka, gomba rakapedzwa, chiyero cheaspect, ukobvu hwebhodhi uye kushivirira kweimpedance zvinofanirwa kuongororwa pamwe chete.
| Parameter | Kugona kwakabudiswa kweHighleap | Zvekutaura paRFQ yako ine 24-layer |
|---|---|---|
| Kuverengwa kwezvikamu zvebhodhi rakaomarara | Kusvikira ku60 layer | Kurongeka kwemasafu makumi maviri nemana, kugadziriswa kwemasafu, ukobvu hwese hwakapedzwa |
| Nzvimbo & nzvimbo shoma yemukati/yekunze | 2/2 mil (inenge 50/50 µm) | Maitiro akakosha ekugadzira zvinhu zvakasiyana-siyana uye huremu hwemhangura |
| Minimum mechanical drill | 0.15 mm (kukosha kwechibooreso chakaburitswa) | Gomba rakaputirwa rakapedzwa, saizi yekuboorera, kushivirira, kuburikidza neaspect ratio |
| Minimum laser drill | 0.075 mm (kukosha kwechibooreso chakaburitswa) | Mapairi e microvia layer, saizi yemapedhi, kurongedza uye kuzadza |
| Chiyero chekuboorera kwemuchina | Kusvikira ku 20: 1 | Hukama hwekukora kubva paburi kuenda paburi uye zvinodiwa pabhareri rakaputirwa |
| Hukuru hwakasimba hwePCB ukobvu | 0.2-8.0 mm | Ukobvu hwemachira makumi maviri nemana uye kushivirira kunobvumirwa |
| Kudzora impedance | Huwandu hwakaburitswa: ±5 Ω pa ≤50 Ω, kana ±7% pamusoro pe50 Ω | Zvinangwa zvine magumo ega / musiyano, mareferensi ezvikamu, nzira yekukuponi |
| Kupera kwepamusoro kunowanikwa | Inosanganisira ENIG, ENEPIG, sirivha yekunyudza, tin yekunyudza, OSP nezvimwe | Sarudzo yekupedzisa, ukobvu, kugona kusundirwa uye zvinodiwa kuti zvigare kwenguva refu |
Kugona kwedu kukuru kwePCB ine ruzha rwakawanda kunosanganisira kuvaka zvinhu zvinorasikirwa zvishoma uye zvinosanganiswa, nepo kugadzirwa kweHDI PCB kuchitsigira zvinodiwa zvakaoma zvekubatanidza. Kune Rogers, Isola, Megtron kana mamwe ma laminates akatarwa, giredhi chaiyo, ukobvu, foil yemhangura uye nzvimbo yemasheya zvinofanirwa kusimbiswa pane kungofungidzira.
Kudzora Kweinjiniya Kunosarudza Kana Kuvaka Kwemachira 24 Kuchibudirira
Vatengi vane ruzivo vanotonzwisisa chinangwa chePCB ine layer yakawanda. Sarudzo yekutenga inobva pakuti mugadziri anogona here kuchengetedza chivakwa chemagetsi nechamakanika chakatenderwa muchinhu chekutanga uye munzvimbo dzekugadzira dzinodzokororwa. Aya ndiwo macheki makuru atinokurukura tisati taburitsa chigadzirwa.
01 · Kuunganidzwa kwesimbi, kuyerera kweresin uye lamination
Tinoongorora kurongeka kwema-layer makumi maviri nemana, macores/prepregs, kugoverwa kwemhangura, ukobvu hwakapedzwa uye zvinhu zvinotarisa kunyoresa. Symmetry uye copper balance zvine basa, asi ndizvo zvinoitawo zvinhu zvakati wandei uye lamination cycles. Chero kutsiva kwe dielectric kana laminate kunokurudzirwa kunofanirwa kuongororwa zvichienderana nezvinodiwa nemagetsi zvedhizaini isati yatenderwa.
02 · Kudzora kudzorwa uye kurasikirwa kwechiratidzo
Ipa zvinangwa zve impedance uye kushivirira nekirasi ye layer/net, mapping ye reference-plane, zvinodiwa pakurasikirwa kwe laminate uye chero zvinodiwa zve insertion-loss. Tinogona kukurukura nezve nzvimbo ye coupon uye chiyero chekuyera, copper roughness uye trace-geometry compensation. Kune high-speed serial interfaces, via-transition design uye residual stub targets zvinofanirwa kujekeswa.
03 · Kuburikidza nezvivakwa uye backdrilling
Maitiro ekuboorera anotungamira mukukohwa uye mutengo. Kuburikidza nemaburi, ma-vias akavharirwa, ma-microvia e-laser, ma-via-in-pad akaiswa pamusoro uye ma-backdrills akadzama anodzorwa zvinoda matanho akasiyana ekuita. Taura matanho ekutanga/kumisa, saizi dzemaburi akapedzwa, zvinodiwa zvekuzadza/kuvhara, hurefu hwestub hunobvumidzwa uye nzvimbo dzekuboorera kusvika kumhangura. Ma-microvia akaunganidzwa akaomeswa anofanirwa kusimbiswa zvichienderana nehurongwa hwekuvaka hwakarongwa.
04 · Kurongeka kwezvikamu uye kunyoreswa kwemhangura
Mhete dze annular dzakakosha, ma antipads eplane, mapatani ekubuda zvakanaka uye nzvimbo dzekubuda kwe drill zvinoda kuongororwa kwakarongeka. Muganho wekuboorera kubva kumhangura kuenda ku lamination uye plating wakakosha kupfuura CAD clearance yakatarwa yoga. Tinoratidza musanganiswa une njodzi huru tisati taburitsa maturusi.
05 · Kuedzwa kwekugadzira uye humbowo hwekugamuchirwa
Highleap inonyora AOI nekuongorora kwemagetsi muruzivo rwekambani yayo. Zvichienderana nekirasi yechigadzirwa chakabvumiranwa uye zvinodiwa pakutenga, hurongwa hwekuongorora hunogona kusanganisira ma coupons e impedance, microsections, plating checks uye mamwe mishumo. Taura mwero wekugamuchirwa uye magwaro anodiwa paRFQ—kwete mushure mekunge batch yatumirwa.
06 · Kudzora nekugadzirisa uye kudzokorora maodha
Pakeji yakagadzirira kugadzirwa inobatanidza dhizaini yekugadzira, kurongedza, Gerber/ODB++ layers, ma drill maps, zvinhu zvakatenderwa, impdance data uye purchase-order revision. Kana ECO ikachinja laminate, drill kana layer geometry, quotation itsva uye process route zvinofanira kureva pakeji yakagadziriswa.
Pamagadzirirwo anoshandisa via filling and plating , taura chitarisiko chakavharwa uye chakatsetseka panodiwa neBGA assembly. Kana magadzirirwo ako achiri kupedzwa, kugovera magadzirirwo aunoda uye mepu yekudhirowa nekukurumidza kunogona kudzivirira kudzokororwa kwekugadzira kunodhura.
Mapurogiramu ePCB ane 24-Layer Atakarongerwa Kuongorora
Mabasa edu e multilayer, high-frequency uye assembly akakosha kune masisitimu akaomarara uko huwandu hwe routing uye kutonga kwemagetsi zvinodiwa pakutenga. Mienzaniso yezvikamu zvemapurojekiti ekukurukura nemainjiniya edu inosanganisira:
Chikamu chechigadzirwa hachitsivi ongororo yedhizaini. Isu tinofunga kuti bhodhi racho rinogona kugadzirwa zvakanaka , kusanganisira kuvimbika uye zvinodiwa kuti rigamuchirwe, pane kutaura kuti kushandiswa kwese kwe24-layer kwagara kuripo.
Mubatsiri weChina wekugadzira maPCB ane 24-Layer kuEurope neIsrael
Masangano einjiniya muGermany, France, UK, Netherlands, nyika dzeNordic neIsrael anowanzo kuve nezvinodiwa zvinoda magwaro, magwaro uye kutonga shanduko. Highleap inoshandira mapurojekiti epasi rose ePCB nePCBA uye inopa nzira yekugadzira muChina kune zvikwata zvinoda hunyanzvi hwakadzama, kutsvaga makambani emakwikwi uye hukama hwakarongeka hwevatengesi.
Kune maOEM ekuEurope neIsrael, zvikonzero zvinoshanda zvekuongorora Highleap ndeizvi:
- Kukurukurirana kweinjiniya zvakananga: Kugona kuunganidzwa kwezvinhu, ma-via asina kujairika, impedance, zvinhu uye mibvunzo yeDFM zvinogona kukurukurwa usati watanga kushandisa maturusi.
- Imwe nzira yemutengesi: kugadzira bhodhi risina chinhu rine nhurikidzwa makumi maviri nemana uye, kana zvichidikanwa, kuronga kutenga zvikamu uye Kuungana kweSMT / gomba rinopinda pasi pechirongwa chakabvumiranwa.
- Zvitupa zvinoenderana nemagwaro: taura nezvekirasi yekugamuchirwa kweIPC, zvinyorwa zvemaitiro/bvunzo, kuzivisa zvinhu, zvinodiwa pakutevedza uye chero zvikamu zvemhando yemutengi muPO.
- Kujeka kwekutengeserana: enzanisa huwandu hwezvigadzirwa, hwekutanga uye hwekugadzira zvichienzaniswa nemidziyo yekushandisa, zvinhu, chiyero chekuyedza, nguva yekutakura zvinhu uye mutengo wepasi rose—pane kuenzanisa mutengo weyuniti isina chinhu chete.
- Kurongeka kwekutumira kunze kwenyika: bvumiranai nezvekwainofanira kutumirwa, mitemo yekutumira uye mapepa anodiwa musati matumira. Kune EU supply chains, taurai humbowo hweRoHS/REACH hunodiwa uye zvinhu chaizvo zvinoshanda.
Nhoroondo yekambani yeHighleap inoratidza pachena zvitupa zvekutarisira mhando zvinosanganisira ISO 9001, ISO 13485 uye IATF 16949. Mapoka ehunyanzvi anotengesa zvinhu anofanira kukumbira makopi echitupa chazvino, kushanda kwacho uye nzvimbo/nzvimbo yakakodzera sechikamu chekubvumidzwa kwemutengesi. Hatipe runyorwa rwezvitupa semvumo yega yega yechigadzirwa chega chega kana mutemo wekutonga.
Kuongorora mutengesi anobva kuIsrael kana kuEurope?
Tiudzei nyika yenyu, kwamunoda kuenda, kirasi yekugamuchirwa, incoterm yaunoda, chirongwa chepurogiramu chiripo uye kana kuvanzika kwedata rekugadzira kuchida NDA isati yatumirwa mafaira. Tinogona kugadzirisa zvinodiwa izvi panguva yeRFQ uye ongororo yebhizinesi.
Kurukura zvinodiwa nePCB yako ine 24-layer neHighleap →Kugadzira PCB ine 24-Layer uye Kugadzira PCB kubva kuOne Manufacturing Partner
Bhodhi risina chinhu rine nhurikidzwa makumi maviri nemana inongova danho rimwe chete rechigadzirwa. Highleap inopawo zvinhu zvitsva, SMT, kubatanidza zvinhu kuburikidza neburi, sarudzo dzekuongorora dzine chekuita neBGA, gadziriro dzekuedza dzemagetsi/kushanda, coating ye conformal uye masevhisi ekugadzira zvinhu. Kubatanidza kugadzira nekugadzirisa zvinhu kunobatsira mainjiniya nekutenga kuti vagadzirise magadzirirwo ebhodhi, zvinodiwa kuburikidza nepad, panelization, kuwanikwa kwezvinhu uye mukana wekuyedza usati watanga kuvaka.
Kugadzirwa kwePCB isina chinhu ine nhurikidzwa makumi maviri nemana
- Ongororo yezvinhu uye zvinhu zvakaunganidzwa
- Kuboorera, HDI uye impedance zvinoita kuti zvikwanisike
- Kugadzira, kuongorora uye kuyedza magetsi
- Mhando yemuenzaniso, muongorori uye vhoriyamu RFQs
Bhodhi rine nhurikidzwa makumi maviri nemana + chirongwa chePCBA
- BOM / ongororo yakatenderwa neimwe nzira
- Kuronga kweSMT nekuronga kwekubatanidza maburi
- Kuongorora gungano uye bvunzo dzekushanda dzakabvumiranwa
- Purogiramu imwe chete yakarongeka yekugadzira kusvika pakuungana
Kugona kwekubatanidza uye nzira dzekuongorora zvinoenderana nerudzi rwepakeji, saizi yebhodhi, zvikamu zvakasarudzwa uye zvirevo zvebvunzo zvakabvumiranwa.
Kumbira Kotesheni yePCB Yakakomba ine Zvikamu 24, Kwete Kufungidzira Kwemutengo Wakajairika
Zvinhu zviviri zvikuru zvinokonzera kusava nechokwadi kwemitengo ndeyekusakwana kwekuunganidza zvinhu uye maitiro akasarudzika asina kujeka. RFQ yehunyanzvi inogonesa mugadziri kutora mashoko akakodzera uye nzira chaiyo yekugadzirisa zvinhu—uye inobvumira timu yako yekutsvaga vatengesi kuenzanisa vatengesi nehunyanzvi hwakaenzana.
| Tumira padanho reRFQ | Sei zvichichinja mutengo, njodzi kana nguva yekutungamirira |
|---|---|
| Gerber / ODB++ / IPC-2581, NC drill, dhizaini yekugadzira, kugadzirisa | Geometry, chimiro cheboore, zvirambidzo zvekugadzira uye kugadziriswa kwakadzorwa |
| Kuvaka kwakazara kwezvikamu makumi maviri nemana kana kuti kwakarongwa | Purani yepurani ... |
| Kusapindirana kwezvinangwa, kushivirira, zvinodiwa pakuwanda/kurasikirwa, manotsi ekukuponi | Sarudzo yezvinhu, muripo wejometri, nzira yekusimbisa uye mutengo |
| Kuburikidza nemepu: kuburikidza, bofu, kuvigwa, VIPPO, backdrill | Kuboora, kuisa maplatifomu, kuisa maplatifomu akatevedzana, kuzadza uye kuoma kwekuyedza |
| Ukobvu hwakapedzwa, chidimbu, kupedzisa, kirasi yekugamuchira, mishumo yebvunzo | Kushivirira kugadzirwa, chiyero chekuongorora uye zvisungo zvekugamuchira |
| Mhando yemuenzaniso / pilot / huwandu hwekugadzirwa, zuva rakanangwa, kwainoenda | Kugadzira maturusi, kuisa panel, kugovera zvinhu, kuronga nguva uye kuronga kutakura zvinhu |
| Kana zvabatanidzwa: BOM, CPL, dhizaini yemusangano uye chirongwa chekuyedza | Kuwanikwa kwechikamu, kukodzera kwemaitiro uye mutengo wakakwana wePCBA |
Chii chinosarudza mutengo wePCB wezvikamu makumi maviri nemana? Zviyero zvebhodhi uye goho papaneru, sisitimu yezvinhu, ukobvu hwemhangura, chiyero cheburi, matanho ekutevera-lamination, impedance inodzorwa, backdrilling, surface finish, test coverage, saizi yeodha uye zvinodiwa pakutumira. Mabhodhi maviri ane zvikamu makumi maviri nemana anogona kuva nemitengo yakasiyana zvikuru. "Mutengo pabhodhi rezvikamu makumi maviri nemana" pasina data rekuvaka haisi chiyero chekutenga chakavimbika.
Chii chinoona nguva yekuiswa kwelaminate? Kuoma kwekugadzira, kucherwa kwelaminate uye kuoma kwekugadzira, mutoro wekugadzira, zvinodiwa pakukodzera/kuyedza uye hurongwa hwekutumira. Tinotaura nezvekuvakwa kwacho tichienzanisa nepakeji chaiyo yefaira; hapana vimbiso yekutumira yakatarwa inoshanda kune dhizaini yega yega ine 24-layer.
Kubva kuRFQ kusvika kuRepeatable Production
- Tumira ruzivo rwakoIsa mafaira ekugadzira, zvinodiwa pakurongedza, huwandu, nguva uye mhando.
- Ongororo yeinjiniyaGadzirisa mibvunzo yeDFM, kubatanidza zvinhu nemidziyo, chiyero chekuongorora nepfungwa.
- Bvumidza kuvakwa kwachoSimbisa zvirevo, mutengo, purogiramu uye kugadziriswa kwekugadzirwa usati waburitswa.
- Gadzira & tumiraGadzira uye ongorora uchishandisa pasuru yakabvumiranwa; ronga kuungana kana zvichidikanwa.
Mugadziri wePCB ane 24-Layer: Mibvunzo Inowanzo bvunzwa Nezvekutenga
Ko Highleap inonyatsogadzira maPCB ane 24-layer here?
Ehe. Highleap inoburitsa kugona kwakasimba kwezvikamu zvakawanda kusvika kuzvikamu makumi matanhatu, zvinosanganisira kuvaka kwezvikamu makumi maviri nemana. Kubvumidzwa kwedhizaini chaiyo kunoenderana nehurongwa hwacho, zvinhu, ukobvu hwacho, mavhiya uye kushivirira kunodiwa.
Unogona here kutsigira controlled impedance, HDI uye backdrilling paPCB ine 24-layer?
Maitiro aya anowanikwa muHighleap's high-speed, rigid-PCB uye HDI service services. Ipai tafura ye impedance, drill map, backdrill target uye zvinodiwa zve laminate kuitira kuti timu yeinjiniya igone kusimbisa kuvakwa kwakabatana.
Ko Highleap inogona kutsigira prototype kutanga yozopedzisira yagadzirwa here?
Highleap inopa mapurojekiti emhando yepamusoro uye ekugadzira. Nzvimbo yekuongorora inogona kutsanangurwa kuti igadziriswe, kugadziriswa uye kusimbiswa kwehuwandu hwezvinhu zvisati zvaendeswa kune yakagamuchirwa kugadziriswa kwehuwandu. Huwandu, kuwanikwa kwezvinhu uye chiyero chekuongorora zvinokanganisa purogiramu.
Chikwata chenyu chinogona kugadzirisa PCB pamwe nekugadzirwa kwebhodhi rine nhurikidzwa makumi maviri nemana here?
Ehe. Highleap inopa kugadzirwa kwebhodhi risina chinhu pamwe nemabasa ekubatanidza maPCB nekuwana zvikamu. Isawo BOM, mafaira ekuisa uye chirongwa chekuyedza kana uchida mutengo wePCBA wakabatana.
Tinogona kutsvaga kubva kuHighleap kuti tiite basa rekuEurope kana kuIsrael here?
Highleap inoshanda nevatengi vekune dzimwe nyika. Taura kwaunoda kuenda uye magwaro ako, mhando, zvinodiwa zvekupinza zvinhu uye nguva yekutumira muRFQ. Magwaro chaiwo ekutumira zvinhu kunze kwenyika uye mitemo yekutumira zvinhu zvinofanirwa kusimbiswa paodha.
Ko kana mapuranga edu e24-layer achiri kugadzirwa?
Tumira chivakwa che layer chakarongwa, ukobvu hwacho hwakapedzwa, zvinangwa zve impedance, zvinodiwa nezvinhu uye kuburikidza nekuchinja. Maka zvinodiwa zvisingachinji uchienzaniswa nesarudzo dzekugadzira. Ongororo yeinjiniya inogona kuona shanduko dzinoda mvumo yemagetsi usati waburitsa dhizaini.
varumbidzwa Posts
Kugadzira PCB neFirmware Programming
Highleap Electronics inopa PCB assembly ne firmware...
Kugadzira PCB Yemhando Yakanaka Yepamusoro Yekushandisa Nzira Dzakawanda
Maitiro ekuwana mutengo wePCBs Ngatiite ongororo yeDFM/DFA ye...
Kugadzira PCB dzeMicrovia dzakaiswa Stacked
Maitiro ekuwana mutengo wePCBs Ngatiite ongororo yeDFM/DFA ye...
Kugadzira PCB Yakadzama Yekudhirowa
Maitiro ekuwana mutengo wePCBs Ngatiite ongororo yeDFM/DFA ye...
Nzira yekuwana sei quote yePCBs
Ngatimhanyei DFM/DFA ongororo yenyu todzokera kwamuri nereport. Unogona kurodha mafaera ako zvakachengeteka kuburikidza newebhusaiti yedu. Isu tinoda ruzivo rwunotevera kuti tikupe iwe quote:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Pamusoro pekugadzira PCB, isu tinopa huwandu hwakakwana hwemagetsi masevhisi, anosanganisira PCB dhizaini, PCBA, uye turnkey mhinduro. Kunyangwe iwe uchida rubatsiro neprototyping, dhizaini yekusimbisa, kutsvagisa chikamu, kana kugadzirwa kwakawanda, isu tinopa yekupedzisira-kusvika-kumagumo rutsigiro kuti uve nechokwadi chekubudirira kweprojekiti yako.
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.