PCB Packaging - Highleap Electronic

BGA vs. QFN: Musiyano Mukuru Mukusarudza IC Package

Mufananidzo 1. BGA vs. QFNINhanganyaya: Nei BGA vs. QFN Zvichikosha Mukugadzirwa kwemagetsi kwemazuva ano, kusarudzwa kwepakeji yeIC kunokanganisa zvakananga kugadzirwa kwePCB, mashandiro emagetsi, uye mutengo wezvose zvigadzirwa. Pakati pematekinoroji ekuisa pamusoro, BGA (Ball Grid Array) uye QFN (Quad...

Pakeji yeFlip-Chip: Magadzirirwo, Maitiro, uye Kufunga Nezveinjiniya

Mufananidzo 1. Flip-Chip Package PCB1. Chii Chinonzi Flip-Chip Package? Flip-chip package itekinoroji yekubatanidza machira e semiconductor apo semiconductor die inosungirirwa yakatarisa pasi, ine active surface yakatarisana ne substrate. Kusiyana ne wire bonding, iyo inotungamira...

WLCSP: Tsanangudzo yeTekinoroji yeKurongedza Chip-Scale yeWafer

Mufananidzo 1. WLCSPNhanganyaya kuWLCSP Sezvo michina yemagetsi ichiramba ichiderera uku ichida kushanda kwepamusoro, tekinoroji yekurongedza yeIC yave chinhu chakakosha chinogonesa hunyanzvi. WLCSP (Wafer-Level Chip-Scale Packaging) inomiririra kufambira mberi kukuru mu...

LGA Package: Maumbirwo, Mabhenefiti, uye Gwaro rekugadzira PCB

Mufananidzo 1. LGA Package1. Nhanganyaya: Nei LGA Package Ichikosha Mumagetsi Emazuva Ano Kudiwa kweI/O yakawanda, kumhanya kwesignali nekukurumidza, uye kuvandudzwa kwehutongi hwekupisa kuri kuramba kuchikurudzira hunyanzvi hwekurongedza kwema semiconductor. Mapakeji echinyakare akadai seQFP anotarisana...

Pakeji yeCSP: Gwaro rehunyanzvi reKurongedza Chip Scale

Mufananidzo 1. Chip Scale Package1. Nhanganyaya: Nei CSP Ichikosha Mumagetsi Emazuva Ano Magetsi emagetsi, zvinopfekwa, uye nharembozha zvinoramba zvichiderera uku zvichida mashandiro akawanda. Maitiro aya anoita kuti IC packaging iende kuI/O density yakakwira mukati me...

BGA vs. LGA: Musiyano Mukuru muTekinoroji yePakeji yePCB Assembly

Mufananidzo 1. BGA vs. LGA1. Nhanganyaya: Sei Uchienzanisa Mapakeji eBGA neLGA BGA neLGA dzinomiririra mafomati maviri epamusoro ekurongedza epamusoro mumagetsi ane density yakakura. Ose anobvisa ma leads akafumurwa, zvichiita kuti pitch ive yakanaka uye kuwedzera kwehuwandu hweI/O kwakakosha kune maseva,...

BGA Package: Maumbirwo, Mhando, Dhizaini & Gwaro reKugadzira

Mufananidzo 1. Mapakeji eBGA1. Nhanganyaya: Chii chinonzi BGA Package uye Nei Ichikosha? Pakeji yeBGA (Ball Grid Array) ifomati yekurongedza yeIC inoshandisa mabhora akasiyana-siyana ekusolder pasi pechikamu chekubatanidza magetsi nemechanical kuPCB. Kusiyana...

Pakeji yeSOP: Maumbirwo, Zvimwe, uye Kufunga Nezvekugadzirwa kwePCB

Mufananidzo 1. SOP Package1. Nhanganyaya: Chii chinonzi SOP Package? SOP package (Small Outline Package) ipakeji yeIC inosungirirwa pamusoro yakagadzirirwa kugadzirwa otomatiki yePCB. Yakagadzirwa panguva yekuchinja kubva paburi kuenda kune tekinoroji yeSMT, ine rectangular yakatsetseka...

Chii chinonzi QFN Package? Gwaro Rakazara reQuad Flat No-Lead IC Packaging

Mufananidzo 1. QFN Package1. Nhanganyaya kuQFN Package Technology Kurongedza kwakabatana kwedunhu (IC) kunoshanda senzvimbo yakakosha pakati pemadhiri e semiconductor nemabhodhi edunhu akadhindwa. Kurongedza kwakanaka kunovimbisa kubatana kwemagetsi kwakavimbika, kupisa kunoshanda zvakanaka...

Mapakeji eQFN vs. QFP: Kuenzanisa Kwakazara kwePCB Design

Mufananidzo 1. Mapakeji eQFN vs. QFP1. Nhanganyaya Kurongedza kweIC kunoshanda senzvimbo yakakosha pakati pemadhiri e semiconductor nemabhodhi ecircuit akadhindwa, zvichikanganisa zvakananga mashandiro emagetsi, manejimendi yekupisa, uye kushanda zvakanaka kwekugadzira. Pakati pekuiswa pamusoro pe...