Pakeji yeCSP: Gwaro rehunyanzvi reKurongedza Chip Scale
Mufananidzo 1. Chip Scale Package
1. Nhanganyaya: Nei CSP Ichikosha Mumagetsi Emazuva Ano
Zvishandiso zvemagetsi zvevatengi, zvinopfekwa, uye nharembozha zviri kuramba zvichiderera uku zvichida mashandiro akawanda. Maitiro aya anoita kuti IC packaging iwedzere I/O density mukati mezvishoma. Mapakeji echinyakare akadai seQFP neTQFP , anodziviswa nema peripheral lead frames, anonetsekana kusangana nezvinodiwa izvi. Kuwanda kwepakeji yavo kunoramba kuri kukuru, ichidya zvivakwa zvinokosha zvePCB.
Pakeji yeCSP yakabuda semhinduro yakakosha inobatanidza die isina chinhu uye kurongedza kwakajairika. Inopa zvinhu zvakaita sechimiro chakakura uku ichichengetedza kugadzirwa, kuyedzwa, uye kuvimbika zvinodiwa munzvimbo dzekugadzira.
2. Chii chinonzi CSP Package?
2.1 Tsananguro Yakajairika
Pakeji yeCSP inotsanangurwa zvakanyanya nehukuru hwayo nesilicon die. Chiyero chinogamuchirwa neindasitiri chinoti saizi yepakeji yeCSP haifanirwe kudarika 1.2 nguva yenzvimbo yedie. Tsanangudzo iyi yejometri inosiyanisa CSP nemapakeji makuru echinyakare, zvisinei netekinoroji yekubatanidza yemukati inoshandiswa.
2.2 Maonero eUinjiniya
Kubva pamaonero einjiniya, CSP package inopa fomati inogoneka kutengeswa, inogona kuyedzwa, uye yakagadzirira kugadzirwa uku ichideredza chirango chetsoka pane silicon isina chinhu. Inogonesa maitiro akajairwa eSMT assembly pasina kuda manejimendi akasarudzika ayo anodikwa ne bare die mounting.
2.3 Kujekeswa kweMuganhu
Pakeji yeCSP ine chinzvimbo chakasiyana muhurongwa hwekurongedza. Yakasiyana nedhayi isina chinhu, isina dziviriro uye inoda kubatanidzwa kwakasarudzika. Yakasiyanawo nemapakeji eBGA akajairwa anogona kunge akakura kakawanda kupfuura dhayi yavo. CSP inomiririra kupatsanurwa kwehukuru, kwete chimiro chimwe chete chekurongedza.
Mufananidzo 2. CSP Package Sideview
3. Hunhu Hukuru hweCSP Packages
3.1 Chimiro Chidiki Chetsoka
Chinhu chinonyanya kukosha pane chero CSP package ndechekuti ine saizi shoma. Nekureba kwepakeji kwava kusvika padiye pachayo, CSP inogonesa huwandu hwakawanda hwezvikamu paPCB layouts . Izvi zvinokosha kana nzvimbo yebhodhi yakaganhurirwa nezvinodiwa zvechimiro chechigadzirwa.
3.2 Kubatana Kwemagetsi Mapfupi
Mapakeji eCSP ane nzira pfupi dzemasaini pakati pekufa nePCB. Kureba kwekubatanidza kwakaderedzwa kunoderedza kupinza kwehutachiona uye kuramba, zvichivandudza kusimba kwechiratidzo chekushandisa nekukurumidza uye kuderedza kurasikirwa kwesimba mumidziyo inoshandiswa nemabhatiri.
3.3 Kuvandudza Thermal Performance
Maumbirwo akamanikana emapakeji eCSP anogadzira nzira dzakatwasuka dzekupisa kubva padhiri kuenda kune rimwe bhodhi. Pasina mafuremu akakura e lead kana substrates hombe dzinoshanda sezvipingamupinyi zvekupisa, kushanda zvakanaka kwekupisa kunovandudzika kana tichienzanisa nemapakeji ekare e lead.
3.4 Kuwanda kweI/O kwakanyanya
Mapakeji mazhinji eCSP anoshandisa nzvimbo dzinobatana pane ma peripheral leads. Kurongeka uku—kunowanzo kuve mabhora anosonerwa kana mabumps akapararira pasi pepakeji—kunobvumira nhamba yepamusoro yeI/O mukati mechikamu chakaganhurirwa chinotsanangura tekinoroji yeCSP.
4. Mhando Dzakajairika dzeCSP Packages
CSP ipuratifomu yekupatsanura inosanganisira nzira dzakawanda dzekushandisa. Mhando huru dzinosiyana munzira dzadzo dzekubatanidza uye nzira dzekugadzira.
4.1 Chisungo cheWaya CSP
Chisungo chewaya CSP chinoshandisa chisungo chewaya chegoridhe kana chemhangura chekare kubatanidza ma die pads kune substrate diki. Nzira iyi inopa mari shoma yekugadzira uye inoshandisa zvivakwa zvekugadzira zvakagara zviripo. Zvisinei, chisungo chewaya CSP chinotarisana nemiganho muhuwandu hweI/O uye mashandiro epamusoro-soro nekuda kweinductance yewaya.
4.2 Flip-Chip CSP (FC-CSP)
FC-CSP inoshandura nzira yekuisa ma "die orientation", ichibatanidza ma "active-side bumps" zvakananga ku "substrate". Iyi nzira ye "flip-chip" inobvisa waya dzinoita kuti pave nekushanda kwakanaka kwemagetsi nekupisa. Mapakeji eFC-CSP anofarirwa kune ma "processors" anoshanda zvakanyanya uye ma "RF applications" uko kusimba kwechiratidzo kuri kukuru.
4.3 CSP yeWafer-Level (WLCSP)
WLCSP inopedzisa matanho ese ekurongedza padanho rewafer isati yaiswa singing. Pakeji inobuda inenge iri die pachayo ine zvikamu zvekugovera patsva uye mabhora ekusonesa akaiswa. WLCSP inowana saizi diki yeCSP package asi inoda mitemo yakasimba yekugadzira PCB uye kudzora maitiro ekugadzira.
Zvakakosha kunzwisisa kuti WLCSP chikamu chidiki cheCSP—haasi ese mapakeji eCSP ane mwero wewafer, kunyange hazvo ese WLCSP achinzi CSP netsanangudzo.
Mufananidzo 3. Flip Chip CSP
5. CSP vs Dzimwe Mhando dzeIC Package
Kunzwisisa kuti CSP inobatana sei nedzimwe mhuri dzemapakeji kunobatsira kujekesa zvinodiwa pakusarudza mashandisirwo chaiwo.
5.1 CSP vs BGA
CSP inotsanangura chikamu chehukuru; BGA inotsanangura chimiro chechimiro. Ball grid array package inokodzera seCSP chete kana zviyero zvayo zvasangana nechiyero che1.2× die size. MaBGA makuru ane substrates dzakakura anowira kunze kweCSP classification kunyangwe aine maitiro akafanana ekubatanidza.
5.2 CSP vs QFN
Mapakeji eQFN anoshandisa ma peripheral pads akamanikana kusvika kumucheto wepakeji. Izvi zvinoderedza I/O scaling uye zvinoda mapakeji makuru kuti pave nehuwandu hwakawanda hwema pin. Mapakeji eCSP ane area-array interconnects anopa I/O density scaling yepamusoro uye footprints diki kuti pave nekushanda kwakaenzana.
5.3 CSP vs WLCSP
Kuenzanisa uku kunogadzirisa pfungwa isiriyo yakajairika. WLCSP inomiririra nzira imwe chete yekugadzira mukati mechikamu chakakura cheCSP. Mamwe marudzi eCSP—kusanganisira waya yekubatanidza uye flip-chip variants—anoshandisa kuvaka kwakavakirwa pasubstrate kwakapedzwa mushure mekuchekwa kwewafer. CSP inosanganisira nzira idzi dzese; WLCSP inonyanya kuve subset yewafer-level.
6. Zvaunofanira Kufunga Nezvekugadzira uye Kugadzira Mapakeji eCSP
6.1 Dhizaini yePCB Pad
Mapakeji eCSP anoda mapedhi chaiwo ane magadzirirwo akasimba. Maburi emasiki anosungirirwa, saizi yemapedhi, uye magadzirirwo e-via-in-pad anofanirwa kuenderana nezvinodiwa zvepakeji yeCSP. Mapedhi asina kusungirirwa emasiki anoiswa (NSMD) anowanzo tsanangurwa kuti awedzere kuvimbika kwemajoini emasiki.
6.2 Matambudziko Ekugadzirisa Zvisungo
Mabhora anonyungudika zvakanaka ari pamapakeji eCSP anoda ma profiles ekudzoreredza mvura zvakanaka. Kusapisa kwakakwana kunokonzera kunyorova kusina kukwana; tembiricha yakawandisa inogona kukuvara. Kugadzikana kwevhoriyamu yekuisa pani kunova kwakakosha sezvo saizi dzemabhora dzichiderera, zvichiita kuti dhizaini yestencil uye parameters dzekudhinda zvive zvakakosha pakugadzirisa.
6.3 Miganhu Yekuongorora
Kuongorora nemaziso hakugone kusimbisa majoini emuchina akavanzwa pasi pemapakeji eCSP. Kuongorora neX-ray kunodiwa kuti pave nechokwadi chemhando yekugadzirwa. Masisitimu eX-ray anoshandiswa otomatiki anofanira kugadzirisa majoini ega ega uye kuona zvikanganiso zvakaita semaburi, mabhiriji, uye mamiriro emusoro-mu-pillow.
6.4 Zvinonetsa Kuvimbika
Mapakeji eCSP ane zvinhu zvakakosha zvekuvimbika zvinosanganisira kushushikana kwekupisa, kushanda kwekuyedza kudonha, uye kudyidzana kwepakeji nePCB flatness. Kubatana kwakananga kubva kune imwe kuenda kune imwe zvinoreva kuti coefficient yekuwedzera kwekupisa inotumirwa zvakananga kumajoini esolder pane mumapakeji ane mafuremu e lead anoenderana.
7. Mashandisirwo Akajairika eCSP Packages
Kusarudzwa kwezvishandiso zvemapakeji eCSP kunobva pahunhu hwazvo hwehunyanzvi kwete kubva muzvikamu zveindasitiri zvakajairika.
7.1 Midziyo Inofamba Neinopfekwa
Zvipingamupinyi zvehukuru mumafoni, mawachi, uye mahedhifoni zvinoita kuti mapakeji eCSP ave akakosha. Kusanyanya kukosha kwechinhu chimwe chete kunoreva zvigadzirwa zvidiki kana kuwedzera mashandiro mukati mehukuru hwakatarwa. Kushanda nesimba shoma kunobatsira nekudzikira kwekurasikirwa kweinternet.
7.2 Memory neProcessors Zvinomhanya Zvikuru
Zvinodiwa zvekuchengetedza masaini muDDR memory, maapplication processors, uye high-speed interfaces zvinotsigira CSP implementations. Short interconnects dzinoderedza kuora kwemasaini, zvichiita kuti data riwedzere pasina kukanganisa nguva.
7.3 Magetsi Emagetsi Anoshandiswa Nevatengi Asina Nzvimbo Yakawanda
Zvigadzirwa zvine nzvimbo yePCB yakaganhurirwa zvakanyanya—senge masensa eIoT, maimplants ekurapa, uye makamera madiki—zvinoshandisa mapakeji eCSP kuti zviite basa rinodiwa. Kuwanda kweI/O kunogonesa michina yakaoma mukati mebhajeti rehukuru hwakaomesesa.
8. Zvakanakira uye Zvisina Kukosha zveCSP Packages
8.1 Zvakanakira
Mapakeji eCSP anopa mabhenefiti anoyerwa mukuderedza saizi, mashandiro emagetsi, uye huwandu hwekubatanidza. Chimiro chidiki chinoita kuti chigadzirwa chive chidiki. Nzira pfupi dzemasaini dzinovandudza maitiro ehuwandu hwepamusoro. Nzvimbo dzekubatanidza dzinotsigira huwandu hweI/O hwakakwira kupfuura dzimwe nzira dzeperipheral-lead dzine saizi yakafanana.
8.2 Nokuremara
Kushandiswa kweCSP kunosanganisira kuchinjana kwemainjiniya. Kugadzira kunoda kudzora maitiro kwakasimba uye michina yekuongorora yakanyanya kunaka. Kugadzirisa patsva kunova kwakaoma kana kusashanda kune mamwe marudzi eCSP. Kugadzirwa kwePCB kunofanirwa kutsigira zvinhu zvakapfava. Kugadzirisa mutengo wese wesystem—kwete mutengo wezvikamu chete—ndiko kunosarudza kana CSP ichipa kukosha kwese.
9. Mhedziso: Kunzwisisa Tekinoroji yeCSP Package Zvakakodzera
Pfungwa nhatu huru dzinopfupikisa kunzwisisa kwakakodzera kwehunyanzvi hwemapakeji eCSP.
Chekutanga, CSP inonyanya kurongwa zvichienderana nehukuru. Chiyero che1.2× die area chinotsanangura chikamu, kwete tekinoroji chaiyo yekubatanidza kana maitiro ekugadzira.
Chechipiri, mhando dzakasiyana dzemapakeji dzinowira pasi peCSP amburera. Wire bond, flip-chip, uye wafer-level implementations imwe neimwe inokodzera seCSP kana ikasangana nehukuru hwayo, pasinei nekusiyana kukuru mukuvaka uye mashandiro.
Chechitatu, kusarudzwa kweCSP kunofanirwa kubva mukuongorora kweinjiniya yesystem-level. Sarudzo yacho inosanganisira kugona kwePCB, kukura kwemaitiro ekugadzira, zvinodiwa zvekuvimbika, uye mutengo wese wekuva muridzi - kwete kungofungidzira kuti kurongedza kudiki ndiko kwakanyanya kunaka.
Kunzwisisa musiyano uyu kunogonesa kusarudzwa kwakakodzera kwepakeji yeCSP zvichibva pane zvinodiwa chaizvo pakushandisa pane fungidziro dzakajairika nezve tekinoroji yekurongedza.
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Ngatimhanyei DFM/DFA ongororo yenyu todzokera kwamuri nereport. Unogona kurodha mafaera ako zvakachengeteka kuburikidza newebhusaiti yedu. Isu tinoda ruzivo rwunotevera kuti tikupe iwe quote:
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- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Pamusoro pekugadzira PCB, isu tinopa huwandu hwakakwana hwemagetsi masevhisi, anosanganisira PCB dhizaini, PCBA, uye turnkey mhinduro. Kunyangwe iwe uchida rubatsiro neprototyping, dhizaini yekusimbisa, kutsvagisa chikamu, kana kugadzirwa kwakawanda, isu tinopa yekupedzisira-kusvika-kumagumo rutsigiro kuti uve nechokwadi chekubudirira kweprojekiti yako.
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.
