Kugadzira PCB dzeMicrovia dzakaiswa Stacked
Highleap inogadzira maPCB eHDI ane ma microvia akaunganidzwa muChina. Unyanzvi hwedu hunosanganisira ma microvia akacherwa nelaser, copper-filled interconnects, sequential build-up uye multilayer PCB yakagadzirwa. Mubvunzo chaiwo wekuti chain yese ye via-kwete microvia yega yega ine geometry, copper interfaces uye humbowo hunodiwa nechigadzirwa chako.
Tinoshanda nechikwata cheOEM chekugadzira nekutenga zvinhu pakugadzira BGA, HDI inodziviswa munzvimbo uye kuchinjisa kugadzirwa. Tiunzireiwo hurongwa hwekurongedza zvinhu, kunyangwe zvisati zvaoma: tinogona kukurukura kana kuvaka kwakamira kwakakodzera, uko kurongeka kwakarongeka, uye kuti ndeapi matanho ekuchengetedza anofanirwa kutorwa mukugadzirwa.
Watova nemepu ye layer stack ne microvia here? Tumira dhizaini yako yeHDI kuti ionekwe sekotesheni yeinjiniya.
Chisarudzo Chekutanga Ndechekuti MaVias Anofanira Kuiswa Mumatanda
Microvia yakakamurwa isarudzo yekuvaka ine mhedzisiro yekugadzira. Inofanira kugadzirisa dambudziko rekuti routing inogoneka here kana kuti connection-density, pane kuti ionekwe sechinhu chinogara chiripo pabhodhi rega rega reHDI.
Ma microvia elaser anotevedzana ane chinzvimbo chakafanana cheXY pakati pezvikamu zve dielectric zvakaunganidzwa. Danho rega rega idzva rinowira pasi pechisungo chiri pasi, kazhinji chinoda chimiro chakagadzirwa, chakazadzwa nemhangura uye chakavharirwa chinokwanisa kutsigira microvia inotevera. Kurongeka uku kunogona kuchengetedza nzira dzekufambisa pasi pemidziyo inopinza. Inogadzirawo mamwe ma interfaces emhangura-ku-mhangura anofanirwa kutariswa panguva yekugadziriswa kwemaitiro.
Kukurukurirana kweHighleap nezveinjiniya kunotanga nekubatana kwefeni nelayer: pitch yechikamu, pad field, trace/space limits, reference planes, dielectric thickness, copper weights uye permission via locations. Kana kuchinja gadziriro kuchichinja return paths kana impedance, shanduko iyoyo ndeye review yemagetsi yemutengi.
Ona zvinhu zvedu zvine chekuita nekugadzirwa kweHDI PCB uye dhizaini yeHDI stack-up kuti uwane sarudzo dzakakura dzekuvaka. Peji rino rinonyanya kutarisa pakugadzira macheni ema microvia akaunganidzwa kuti agone kugadzirwa uye kutsigirwa kuburikidza nekugadziriswa.
Chikamu Chakaoma Ndiyo Interface Yakavanzika Yemhangura
Ma microvia akaunganidzwa anowanzoonekwa senzira iri nyore yekuwana waya dzakasimba. Kune zvigadzirwa zvinogara kwenguva refu uye zvinoshanda zvakanyanya, nyaya inonyanya kukosha ndeyekuenderana kwekubatana pakati pekuzadza kwemhangura kweimwe nhanho nepedhi kana chivharo chinotsigira chinotevera. Kuzadzwa kwenzvimbo, kuzadzwa kusina kukwana, kubatana kusina kunaka kwesimbi, kusvibiswa kana kusiyana kwekugadzirisa zvinogona kukonzera kusasimba kwekubatana kwakavanzika.
Izvi hazvisi zvekupikisa ma microvia ese akaunganidzwa. Inyaya inozivikanwa yekukodzera. Muna 2019, IPC yakayambira pachena kuti mamwe ma microvia akakundikana aingoonekwa chete mushure mekugamuchirwa kwebhodhi risina chinhu—panguva yekudzokororwa kwemvura, kuongororwa kwekumanikidzwa kwemuchina kana kushandiswa mumunda—uye yakaratidza njodzi yekusasimba kwenzvimbo dzekubatanidza target-pad-to-copper-fill. Yakanyeverawo kuti kuongororwa kwe microsection chete kunogona kusabata zvikanganiso zvese zvakavanzwa.
Zvinorevei kune odha yekutenga yekugadzira: taura kugamuchirwa kwakavakirwa pakushanda uye kuyedzwa kunomiririra kuvaka uko njodzi yechigadzirwa inoda. Mufananidzo wakanaka wechikamu chakasiyana uye bvunzo yekuenderera mberi kwekupisa kwekamuri ipfungwa dzinobatsira, asi hapana kana imwe yacho inofanira kubatwa sehumbowo hwakakwana hwekuvimbika kwenguva refu kwe microvia.
Chirevo cheindasitiri: Yambiro yekuvimbika kweIPC's microvia , Kurume 2019, uye bepa jena reIPC-WP-023 rakataurwa.
Chimiro cheTarget-pad
Kubatana kusina kusimba kana kuti copper interface isina kunaka zvinogona kuvhurika kana paine thermal expansion. Tsanangura nzira yekuyedza inonyatsoenderana ne stacked-chain failure mode.
Zadza mhando
Mavanga, misono, madonhwe akawandisa kana kuzadza mhangura zvisina kukwana zvinogona kukanganisa nhanho inotevera yakacherwa nelaser. Simbisai kuvakwa kwekuzadza mhangura nekuvhara usati waburitsa CAM.
Kunyoresa uye geometry
Ukobvu hweDielectric, laser taper, saizi ye target-pad uye margin yekunyoresa zvinoshanda pamwe chete. Nominal via dhayamita chete haitsananguri hwindo rekugadzira.
Kune mapurogiramu akavimbika zvikuru, kurukurai nezvemakuponi ekushandisa via-chain, kuratidzwa kwemvura zvakare, kutarisa kwekudzivirira panguva yekumanikidzwa kwekupisa, zvinodiwa zve microsection uye zvinodiwa nevatengi. Shandisai gadziridzo yakakodzera yeIPC yenyu yechibvumirano kana OEM. Yambiro yeIPC kana mhedzisiro imwe chete yekuedza inoita kuti chivakwa chega chega chakaiswa mumatanda chive chisina kuchengetedzeka—kana chivakwa chega chega chakaedzwa chive chakakodzera pasi rose.
Maitiro eHighleap Anoongorora Stack Yekugadzira
Kugadzira maPCB e microvia akaunganidzwa inzira inodzokororwa yekuwedzera. Mutengo wayo uye kuoma kwayo kunobva pakugadzirira nhanho yega yega kutsigira inotevera—kwete kungoshandisa chibooreso chidiki. Nzira chaiyo yekushanda inoenderana nesystem ye laminate uye nzira yefekitori inokodzera; inotevera ndiyo nzira yatinoenderana nevatengi pakuongorora kweinjiniya.
- Bvisa tsananguro yepakati nepakati pezvikamuNyora pasi pepakati, dielectric yega yega yakavakwa, huremu hwemhangura, ukobvu hwakapedzwa, nzvimbo dzakavigwa uye nzvimbo dzakaunganidzwa. Isa nhamba yechikamu chisina kujeka kune imwe neimwe microvia start uye target.
- Sira mhangura yacho woiisa pachena.Vakai jira rinotevera re dielectric; dhonzai chibooreso ne laser kune target pad pasi pemamiriro ekunyoresa akakodzera uye kudzika kwakakodzera. Kugadzirwa kwe target-pad kunokanganisa kunaka kwe interfacial inotevera.
- Gadzira simbi, zadza uye gadzirira nzvimbo yekumharaTaura nezvekuzadza mhangura nemagetsi uye chivharo apo microvia inotevera inofanira kuwira zvakananga pamusoro. Dzora hunhu hweplating, kuvharika kwayo, kurongeka kwayo uye kugadzirira pamusoro pemhangura kunotevera.
- Dzokorora chete mazinga akarongwa akatenderwaKutenderera kwega kwega kwekuwedzera kwekuvaka kunowedzera kubata, kuratidzwa kwelamination uye interface yekudzora. Kuchinja kwehurefu hwe stack kana switch kuenda kuma staggered vias kunofanirwa kutorwa sekugadzirisa dhizaini.
- Ongorora cheni, wobva waronga kuti ionekwe seiOngorora zvinodiwa pakugadzira zvinhu zvakaburitswa uye humbowo hwekuti zvinhu zvakakodzera. Kana via-in-pad iri pasi peBGA, gadzirisa nzvimbo yapera wobva waisa chiedza chekunze pamwe chete nechikwata chePCBA.
Zvatinoda kuona mupakeji yekugadzira
Tafura chaiyo yekushandisa zvinosanganisira L1–L2, L2–L3 nedzimwe nhanho dzakasiyana; chiratidzo chekuboorera chinoti "yakaiswa kuburikidza" chinosiya zvakawanda zvisingatsanangurike. Ratidza kana cheni yacho ichiwira paburi rakavigwa, padhi rinopinda neburi kana chimwe chinhu chemhangura. Isa zviyero zvekubata-pedhi, ukobvu hwe dielectric, kukwirira kweburi, zvinodiwa zvekuzadza/kuvhara uye mamiriro ekushandisa via-in-pad.
Mabasa akabudiswa neHighleap anosanganisira HDI yakacherwa nelaser, mavias akafukidzwa nemaziso/akavigwa, lamination yakatevedzana uye zvivakwa zvakazadzwa nemhangura. Tinosimbisa kuti ndeapi masanganiswa anogoneka pakurongeka kwelayer chaiyo yemutengi, zvinhu uye huwandu; hatiburitse resipi imwe chete yekugadzira yakagadzirwa nevanhu vese ye stacked stack-up yega yega.
Kukodzera Mutengesi weStacked-Microvia: Kumbira Humbowo, Kwete Zvipikiso
Huwandu hwepamusoro hwema layer emutengesi weHDI haukuudze kana maitiro ayo ekugadzira akazara nemhangura anoenderana nekuvakwa kwako. Kune vatariri vekutenga nechikwata chemhando yeOEM, humbowo hunobatsira hunoratidza kuti chakagadzirwa neketani chaiyo, laminate uye kuratidzwa kwebvunzo.
| Mubvunzo wekuti munhu akwanise kuzadzisa zvinodiwa | Uchapupu hunoratidza kubvumirana nemugadziri |
|---|---|
| Kureba kwemurwi chaiwo kunogadzirwa here? | Dhirowa yekuvaka yakatenderwa, kuburikidza nemepu yezvikamu zviviri uye kurongeka kwelamination kwakaongororwa |
| Ko chitarisiko chemhangura chinodzorwa sei? | Chimiro chakatsanangurwa chekuzadza mhangura/chivharo, kugadzirira chinangwa uye zvinodiwa zvekugamuchira zvinhu zvakasiyana-siyana |
| Muenzaniso unomiririra unopona here kana munhu akaungana? | Mamiriro ekuyedza kudzokororwa/kupisa, makuponi anomiririra, kutarisa kuramba kwakatarwa, kupasa/kukundikana miganhu |
| Fekitori ichadzivirira sei kukanganiswa kwekugadzirisa? | Kuunganidzwa kwezvinhu kwakarongwa, runyorwa rwezvinhu, ruzivo rwekuchera, mvumo yeECO uye zvinodiwa zvekunyora zvinyorwa zvekugadzira |
| Ko loti yekutanga yemuchina wekuongorora inogona kutsigira kuburitswa kwevhoriyamu here? | Mhedzisiro yenyaya yekutanga, mishumo yebvunzo yakabvumiranwa, maitiro asina kuenderana uye zvinodiwa zvekuchinja kwevhoriyamu |
Tinokurudzira kukiya chinangwa chekugamuchira padanho reRFQ. Muenzaniso wechikamu chidiki unosimbisa mamiriro ari panzvimbo yemuenzaniso iyoyo; hauchinjiki nekuyedzwa kwekuvimbika kunoenderana nekushanda. Saizvozvowo, bvunzo yemagetsi patembiricha yemukamuri inogona kupotsa kushaya simba kunoonekwa pasi pekumanikidzwa kwekupisa. Musanganiswa wakakodzera unoenderana nenjodzi yekushandisa uye zvinodiwa nemutengi.
Highleap inogona kuronga kugadzirwa kwePCB yepamusoro nePCB assembly uye component sourcing kana chirongwa chimwe chete chichida SMT, BGA placement, test uye functional examination. Kugadzirwa/kusanganiswa kwekutanga kunokosha kunyanya kana zvivakwa zvakarongwa zviri mukati meBGA fine-pitch.
Kubva paHDI Stack-Up Yakarongwa Kuenda paQuote Ine Revo
Chiratidzo che stacked-microvia chinofanira kutsanangura kuti bhodhi richagadzirwa sei: huwandu hwematanho ekuvaka, mazinga akazadzwa nemhangura, hukama hwakavigwa, sisitimu yezvinhu, kuwanda kwepaneru, kuongororwa uye kuvimbika. Mabhodhi maviri ane chimiro chakafanana uye nhamba yezvikamu anogona kuva nenzira dzakasiyana dzemaitiro uye njodzi.
Tinoshanda nemapoka einjiniya epasi rose nekutsvaga zvinhu, kusanganisira mapurogiramu eOEM ekuEurope neIsrael, anoda mubatsiri weChina wekugadzira PCB. Kune aya mapoka, mvumo yevatengesi inowanzosanganisira magwaro einjiniya, kurongeka kwekugadzirwa, zvinhu uye magwaro eRoHS/REACH kana zvichibvira, mitemo yekuvanzika, uye chibvumirano pamusoro pehuwandu hwekutumira nekuongorora. Mashoko iwayo anofanira kugadziriswa pamwe chete nekotesheni yehunyanzvi, kwete mushure mekubvumidzwa kwemuenzaniso.
Tumira mapoka aya mana eruzivo
- Kuvakwa: Pakeji yeGerber kana ODB++, muunganidzwa wakazara, dielectric/copper callouts uye dhizaini yekugadzira.
- Kuburikidza necheni: mafaira ekuboorera, ma microvia layer pairs, urefu hwe stack, capture pads, zvinodiwa pakuzadza/kuvhara, nzvimbo dzakavigwa uye surface finish.
- Acceptance: IPC/kirasi yevatengi inotarisirwa, zvinodiwa zve microsection kana via-chain coupon, assembly reflow profile uye chero chirongwa chekufanirwa.
- Commercial: huwandu hwemuenzaniso/mutyairi/vhoriyamu, purogiramu inodiwa, kwainoenda, zvimwe zvinhu zvakatenderwa uye kana PCBA ichibatanidzwa.
Kana kuunganidzwa kwemidziyo kwacho kuri kwekutanga, nyora pasi zvirambidzo zvako zvemagetsi, zvemakanika uye zvekuvimbika zvisingachinjiki. Mhinduro dzedu dzeinjiniya dzinogona kubatsira kuona kana kurongeka kwemidziyo yekutanga kuchifanira kuchengetedzwa kana kugadziriswazve usati watanga kurongeka kwemidziyo.
Dhizaini ye microvia yakarongwa yakagadzirira kuongororwa here?
Tumirai chivakwa chenyu che layer uye tichakurukura nezvekuvakwa kunogadzirwa uye RFQ scope.
Sei uchida chirongwa cheStacked Microvia PCB?
Highleap Electronics ikambani yekugadzira PCB nePCBA iri kuChina, ine HDI laser drilling inotsanangurwa pachena, copper-filled stacked through processes, multilayer lamination uye integrated electronics assembly options. Isu takakodzera zvikwata zvinoda kukurukura nezvesarudzo dze routing-density uye njodzi yekugadzira nevatengesi veinjiniya—kwete kutenga general board inotsanangurwa chete nehuwandu hwe layer.
Chinangwa chacho dhizaini inogona kufambira mberi kubva pakuongorora kweinjiniya kuenda pakugadzirwa kwakatenderwa uye kunodzokororwa. Izvi zvinoda kubvumirana pane chimiro chaicho che stacked geometry, zvinhu zvakakodzera uye kutevedzana kwemaitiro, uye humbowo hwekuvimbika hunoenderana nenjodzi yechigadzirwa. Goverana muunganidzwa wako we stack-up uye kumbira hurukuro yekugadzira neHighleap.
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- Gerber, ODB++, kana .pcb, spec.
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Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.