HDI Via Dhizaini: Injiniya Microvia, Bofu Via, uye Kuvigwa Via yeHigh-Density Interconnect.

Nhanganyaya: Basa reVias muHDI PCB Dhizaini

Tekinoroji yeHigh-Density Interconnect (HDI) inogonesa michina yemagetsi inoshanda zvakanyanya nekupfupisa kureba kwetrace uye kuvandudza kusimba kwechiratidzo kuburikidza nekuchinja kwelayer kwakagadziriswa. Chinhu chikuru chedhizaini yeHDI PCB chiri mumagadzirirwo ayo epamusoro-soro - microvia, blind via, uye yakavigwa via - izvo zvinopa kubatana kwakanyatsojeka kwelayer mukati mechikamu chidiki.

Kusiyana neyakajairwa kuburikidza ne-buri vias, HDI kuburikidza nedhizaini inoshandisa yakasarudzika layer yekubatanidza kuti iwane yakakwirira routing density uye kushanda kwemagetsi. Sarudzo yemhando yemhando inokanganisa kugadzira kuoma, maitiro ekupisa, uye kuvimbika kwenguva refu. Ichi chinyorwa chinoongorora chimiro, magadzirirwo, uye kuvimbika kufunga kwechimwe nechimwe kuburikidza tekinoroji kutsigira ane ruzivo HDI dhizaini sarudzo.

Mhedziso yeVia Types muHDI Via Dhizaini

Microvia Mamiriro uye Zvishandiso

Ma microvia ndiwo anonyanya kukosha paHDI kuburikidza nedhizaini, akagadzirwa nekushandisa laser drilling ine dhayamita dzinosvika pakati pe75 ne150 μm. Anobatanidza ma layers ari pedyo (semuenzaniso, L1–L2 kana L2–L3), zvichiita kuti pave nekuchinjana kwepad-to-layer ukuwo achideredza nzvimbo yepasi.

Laser ablation inowana kurongeka kwenzvimbo mukati me20 μm, ichibvumira dense kuburikidza nearrays pasi peBGA uye zvimwe zvakanaka-pitch zvikamu. Nekudaro, stackup yekumisikidza inomisa inoshanda microvia kurongedza kune maviri kana matatu akaturikidzana nekuda kwechikamu chechiyero uye zvipingamupinyi zvelamination. Kuvimbika kunonyanya kuenderana nemhangura yekuzadza mhando, sezvo voids kana kusakwana plating kunogona kukonzera kukundikana pasi pekupisa bhasikoro kushushikana.

Bofu Via Configuration

Ma "blind vias" anobatanidza "outer layers" kune "internal layers" akasarudzwa pasina kupinda mu "full board" bhora, zvichichengetedza nzvimbo yekufambisa kune rimwe divi. Anobvumira mafambiro ezviratidzo kubva ku "inside-mounted components" kuenda ku "inside power" kana "ground planes" ukuwo achichengetedza dhizaini ye "compact board".

Nzira dzekugadzira dzinosanganisira kucheresa kwemakanika kwemadhayamita akakura (≈200 μm) uye kucheresa-kwakadzika kwelaser kucheresa jiometri (100–200 μm), kuchiteverwa nemhangura electroplating ye conductivity. Kunyoreswa chaiko uye kudzika kudzora panguva yelamination kwakakosha kudzivirira kubuda muzvikamu zvisingatarisirwe.

Kuvigwa Via Implementation

Ma "vias" akavigwa anobatanidza ma "inside layers" asina kuratidzwa pamusoro, anoumbwa panguva yekugadzira "core" kana "subassembly" isati yaiswa "lamination" yekupedzisira. Nzira iyi inochengetedza rusununguko rwakazara rwekutenderera pa "external layers" uye inokosha kune "complex HDI stackups" dzinopfuura ma "layers" masere.

Sezvo vias akavigwa akavharirwa mukati chimiro, kuongorora pashure lamination kunonetsa, zvinoda yakasimba muitiro kudzora panguva musimboti kugadzirwa. Kunyangwe mutengo wekugadzira uchiwedzera nekuwedzera lamination uye musimboti nhanho dzekuchera, yakavigwa vias inopa isingaenzaniswi dhizaini inochinjika kune yepamusoro, yepamusoro-inoshanda zvemagetsi.

Manufacturing Technologies muHDI Via Design

Laser Drilling vs Mechanical Drilling

Kuboora nelaser kwave nzira yakajairika yekugadzira microvia muHDI kuburikidza nekugadzira, uchishandisa masisitimu eUV kana CO2 laser kubvisa zvinhu zvepasi zvine simba rakadzorwa. Maitiro aya anosvitsa dhayamita yemaburi kusvika kuma micrometer makumi manomwe nemashanu nekutsungirira kwenzvimbo pasi pe15 micrometer, zvichipfuura kugona kwekuboora nekanika munzvimbo iyi.

Kudyidzana kwezvinhu kunosiyana zvakanyanya neresin chemistry. Yakajairwa FR-4 inobata UV wavelengths zvakanaka pa 355 nanometers, nepo yakakwirira-Tg polyimide zvinhu zvingada CO2 lasers inoshanda pa 10.6 micrometers wavelength kune yakakwana ablation maitiro.

Mechanical drilling inoramba iri nzira inofarirwa yebofu uye yekuvigwa vias ane madhayamita anopfuura 200 micrometer, uko throughput uye mutengo kufunga kunofadza zvechinyakare kuchera. Iyo drill bit geometry uye spindle kumhanya ma paramita anofanirwa kuvandudzwa kune yega yega musanganiswa kuti ideredze interlayer delamination panguva yekuchera.

Via Kuzadza uye Plating Techniques

Mhangura-yakazadzwa microvias inoburitsa yepamusoro-yezvino-yekutakura kugona uye yekupisa conductivity ichienzaniswa neyakajairwa yakapfava zvimiro, zvichiita kuti ive yakakosha pakugovera magetsi uye kupisa kuburikidza nekushandisa. Iyo electroplating process inoshandisa yakasarudzika chemistry ine organic additives inosimudzira pasi-kumusoro kuzadza kufambira mberi, kuderedza kuumbwa kusina mukati mukati mebhari.

Kiyi kuburikidza nekuzadza nzira muHDI kuburikidza nedhizaini inosanganisira:

• Mhangura yakazara-microvias -Yakazara mhangura electroplating inopa yakakura ikozvino kugona uye kupisa kwekuita kwemagetsi ekutumira maapplication.
• Resin-yakazara mapofu vias -Polymer fill material inogadzira planar surface inogonesa via-in-pad kuvaka uku ichideredza electroplating nguva.
• Yakazadzwa zvishoma -Yakajairika plating nehupamhi hunodzorwa inoshumira yakajairwa chiratidzo chekufambisa pasina yakawedzera mutengo wekuzadza.

Kuzadza kufanana kunokonzeresa kuvimbika kwenguva refu, sezvo mavhodhi akavharirwa anogadzira nzvimbo dzekushushikana dzinoparadzira mitswe panguva yekudziya kwemhepo. Mune akaturikidzana microvia masisitimu, imwe neimwe kuburikidza nenhanho inofanirwa kuzadzwa yakazara pamberi peinotevera laser yekudhiraivha oparesheni kuchengetedza kuvimbika kwechimiro mukati mechetani yekubatanidza.

Kudzora kwehunhu kuburikidza ne-cross-sectional ongororo inosimbisa kugovera ukobvu hweplating uye inoratidza hurema hunogona kuitika pamberi pegungano rekupedzisira.

Kuvimbika uye Kuita muHDI Via Dhizaini

Microvia Kuvimbika Zvinhu

Kukundikana kweMicrovia kunowanzoitika se "kutsemuka pamabvi," apo iyo kuburikidza nedhiramu inosangana nekubata pad. Izvi zvinokonzerwa nekupisa kwekuwedzera kusawirirana pakati pemhangura yekuisa uye substrate panguva yekushisa bhasikoro. Miyero yakadai seIPC-6012 Kirasi 3 uye IPC-6016 inoongorora HDI kuburikidza nekuvimbika kuburikidza ne500-1000 mitsetse iri pakati -40 ° C uye 125 ° C, nekuramba kushanduka kunogumira mukati me10%.

Via madziro mhangura ukobvu ndicho chinhu chinokosha kuramba kuneta kuputika. Iyo yakajairwa huwandu hwe20-25 μm inogonesa kusimba pasi pekunetseka kwekupisa, nepo kutetepa kukwirisa kunomhanyisa kutadza uye kuwandisa kwakawanda kunogona kukonzera kushushikana kwemukati panguva ye electroplating.

Akaturikidzana vs Staggered Microvia Configurations

Akaturikidzana mamicrovias anopa yakanyanya routing density asi tarisa thermomechanical kusagadzikana padivi peyakamira axis, ichideredza kuvimbika kwenguva refu. Madhizaini ekugadzira anowanzo dzikamisa stacking kune maviri akaturikidzana kuchengetedza kugadzikana.

Yakadzikama mamicrovias, akarongedzerwa neakachinjika offset, anogovera kushushikana zvakanyanya zvakaenzana uye anonatsiridza kudziya kwebhasikoro kuita, kunyangwe ichida zvishoma nzira dzekufamba. Vagadziri vanofanirwa kuenzanisa dhizaini yekubatanidza, kuratidzwa kwemafuta, uye hupenyu hwesevhisi kuti vasarudze iyo yakakwana kumisikidzwa.

HDI Via Madhizaini Madhizaini uye Zvakanakisa Maitiro

Aspect Ratio uye Geometric Constraints

Aspect ratio chinhu chakakosha chekuvimbika kwe microvia. Yakanakisa tsika inodzika nelaser-drilled microvias kune 1: 1 reshiyo-semuenzaniso, 100 μm kuburikidza nehupamhi hwe 100 μm dhayamita-kuona kuti yunifomu yeplating uye isina-isina kuzadza. Kupfuura reshiyo iyi kunowedzera njodzi yekusakwana kuvharwa kwemadziro epadivi uye kukanganiswa kwechimiro.

Mechanically drilled bofu vias anogona kusvika aspect ratios kusvika 6:1 pamwe zvakakodzera kuchera uye plating kudzora. Akaturikidzana mamicrovias anowanzo kuganhurirwa kune maviri akatevedzana akateedzana kuti aderedze akaunganidzwa kushivirira uye kushushikana kushushikana mukuvimbika-akakosha magadzirirwo.

Annular Mhete uye Via-mu-Pad Dhizaini

Mhete dzinoenderana dzinofanira kuenderana nekunyoreswa uye kubvumidzwa kwekuboorwa. Kubviswa kwe50–75 μm kubva pamupendero kuenda kumuganho wepad kwakajairika, nepo maitiro epamusoro anogona kuderedza izvi kusvika pa25 μm.

Via-mu-pad madhizaini anobvisa akaparadzana ekumhara mapedhi nekuisa akazadzwa uye akarongedzerwa vias akananga pasi pechikamu mapedhi, achiwedzera density yenzira asi achiwedzera mutengo wekugadzira uye kuoma.

Kuti uchengetedze kutendeseka kwechiratidzo, ndege dzereferenzi dzinofanirwa kuiswa padhuze kuburikidza neshanduko kudzikisa stubs uye kudzora impedance. Kuwedzera pasi padyo vias kunovimbisa kudzoka-nzira kuenderera uye inodzvanya kukanganiswa kwemagetsi.

Mutengo uye Manufacturability Zvinhu muHDI Via Dhizaini

Process Cost Vatyairi

Laser kuchera mutengo zviyero zvakananga nepfuti kuverenga uye chinzvimbo chechokwadi zvinodiwa, ine yakakwira-density microvia mapatani inokanganisa zvakanyanya pani yekugadzirisa nguva. Imwe neimwe yekuwedzera laser oparesheni inowedzera yakawedzera mutengo kuHDI kuburikidza nedhizaini, ichiita hungwaru kuburikidza nekuiswa kwehupfumi kwakakosha.

Matanho ekuzadza mhangura anowedzera electroplating kutenderera nguva zvakaenzanirana kuzadza kudzika uye ukobvu hunodiwa, ane zvimiro zvakazadzwa zvizere zvinoda kureba kwekugara kwetangi pane zvakajairwa plating mashandiro. Iyo yakajairika microvia yakazadzwa nemhangura inogona kuda maminetsi makumi matanhatu kusvika makumi mapfumbamwe enguva ye electroplating zvichienzaniswa nemaminitsi makumi maviri kusvika makumi matatu ekuputira zvakajairwa.

Layer stackup sequence inokanganisa zvakanyanya goho rekugadzira, sezvo yega yega kutenderera inoburitsa inogona kukanganisa kunyoresa kukanganisa uye njodzi yekubata zvinhu.

Dhizaini Yekugadzira Kugadziridza

Kuvigwa kuburikidza nezvivakwa kunoda akawanda lamination mashandiro ane epakati nhanho dzekuchera, kusanganisa mikana yekuremara uye kuwedzera maitiro kuomarara. Dhizaini yemisimboti yekugadzira muHDI kuburikidza nedhizaini dhizaini kudzikisira kuvigwa kuburikidza nekushandiswa kune yemukati maturu chete, kudzoreredza mabatiro ekubatanidza kune microvia uye bofu kuburikidza nezvivakwa zvinosvikika kuburikidza nekunze dhizaini kugadzirisa.

Mafungiro akakosha eDFM anosanganisira:

• Deredza kuburikidza nemhando dzakasiyana -Kushandisa mashoma kuburikidza nemhando padhizaini kunoderedza kuoma kwekugadzira uye kunatsiridza goho rinoenderana.
• Dzivisa zvisina kufanira kuvigwa vias - Chengetedza yakavigwa kuburikidza nezvimiro zvemamiriro ezvinhu pasina imwe nzira inosvikika.
• Gadzirisa kuburikidza nehukuru -Kudzikamisa kusiyanisa kwedhayamita kunoderedza kudhirowa kwechirongwa uye kuoma kwekushandisa.
• Funga nezvekushandiswa kwepaneru - Kuburikidza nekuisa mapatani kunofanirwa kukwidziridza laser yekuchera nzira kunyatsoshanda pane ese ekugadzira mapaneru.

Kudyidzana pakati peinjiniya yekugadzira uye kuronga kwekugadzira kunokwirisa kuburikidza nesarudzo kuenzanisa mashandiro emagetsi zvinoenderana nemutengo wekugadzira uye kufunga kwegoho.

Mhedziso: Injiniya Maonero paHDI Via Dhizaini

Inoshanda HDI kuburikidza nedhizaini zviyero routing density, manufacturability, uye kuvimbika kwenguva refu. Microvias inotsigira yakakwirira-density layer shanduko, bofu vias optimize siginecha routing kune dzemukati ndege, uye yakavigwa vias inogonesa yakaoma yemukati yekubatanidza pasina kukanganisa pamusoro penzvimbo. Kusarudza yakakodzera kuburikidza nemhando kunoda kuongorora magetsi, mechanic, uye mutengo wekutengesa-offs kuti uve nechokwadi chekushanda kwehurongwa.

Highleap Electronics Kugona:

• Precision laser drilling ye microvias pasi kusvika 75 μm ine inowirirana chiyero chekutonga
• Resin-yakazadzwa nebofu vias uye akaturikidzana microvia masisitimu ane yakasimbiswa plating kutendeseka
• Kuvigwa kuburikidza nekugadzira kuburikidza ne-multi-stage lamination uye advanced alignment systems
• Yakakwana kuvimbika kusimbiswa pane IPC-6012 Kirasi 3 uye IPC-6016 zviyero

Highleap Electronics inopa mhinduro dzakavimbika dzekubatanidza michina ine huwandu hwakawanda kuburikidza nemaitiro ekugadzira akadzorwa uye kuvimbisa mhando kwakasimba. Bata timu yedu yeinjiniya kuti mukurukure nezveHDI yakagadziriswa kuburikidza nemazano edhizaini yenyu inotevera diki kana yepamusoro.