LGA Package: Maumbirwo, Mabhenefiti, uye Gwaro rekugadzira PCB

1. Nhanganyaya: Nei LGA Package Ichikosha MuMagetsi Emazuva Ano

Kudiwa kwehuwandu hweI/O hwakakwira, kumhanya kwesignali nekukurumidza, uye kuvandudzwa kwehutongi hwekupisa kuri kuramba kuchikurudzira kuvandudzwa kwe semiconductor packaging. Mapakeji echinyakare akadai seQFP anotarisana nemiganho muhuwandu hwepini uye kusimba kwesignali pa frequency yakakwira, nepo ma package eBGA , kunyangwe achishanda zvakanaka, anounza matambudziko ane chekuita nekuongorora nekugadzirisa majoini e solder.

Pakeji yeLand Grid Array (LGA) inotarisa zvipingamupinyi izvi nenzira yakasiyana zvachose: mapadhi esimbi akatsetseka ari pasi pepakeji, achibvisa mapini anobuda kana mabhora ekusonesa. Dhizaini iyi inobvumira kubatana kuburikidza nekumanikidzwa kwesoketi kana kusungirirwa zvakananga kwePCB, zvichipa mainjiniya mukana wekushanda nesimba.

Chinyorwa chino chinoongorora chimiro chepakeji yeLGA, mabhenefiti, zvipingamupinyi, mhedzisiro yekugadzirwa kwePCB, uye mamiriro ekushandiswa.

2. Chii chinonzi LGA Package?

2.1 Tsanangudzo yeLGA Package

LGA inomirira Land Grid Array. Kusiyana nemapakeji ane leads dzakabuda kana mabhora e solder akabatanidzwa, LGA package ine ma pads esimbi akatsetseka (anowira) pamusoro wayo wepasi. Kubatana kwemagetsi kunoitika kuburikidza neimwe yenzira mbiri: kumanikidzwa kwemuchina kubva ku socket yeLGA ine ma contacts ane spring-loaded, kana kunamira zvakananga kuma PCB pads anoenderana. Kusavapo kwe bhora kana pin structures pachikamu chacho pachako kunoendesa kuoma kwekubatanidza kune socket kana board assembly.

2.2 Kusiyana Kwakaita LGA nePGA neBGA

Musiyano uripo pane chimiro chekubatanidza. Mapakeji ePin Grid Array (PGA) ane mapini akabatanidzwa kune chikamu chinoisa mumaburi emasoketi. Mapakeji eBall Grid Array (BGA) ane mabhora e solder anodzokera kuma PCB pads panguva yekuunganidza. Mapakeji eLGA anochinja paradigm iyi: zvivakwa zvese zvakasimudzwa zvine matinji zviripo pasocket kana kudivi rePCB, zvichisiya pasuru yacho ine ma flat pads chete. Musiyano uyu wezvivakwa unokanganisa nzira dzekuunganidza, maitiro ekutsiva, uye sarudzo dze thermal interface.

3. Maumbirwo eLGA Package uye Zvikamu

3.1 Mapedhi Ekubata Pazasi

Pasi pepakeji yeLGA pane mapedhi esimbi akawanda, anowanzo pedzwa ne nickel/gold (Ni/Au) plating kuti isaoxidation uye kuti ibatane zvakanaka. Mapedhi aya akarongwa mu grid pattern ine pitch values ​​iri pasi pe 1mm. Kusiyana nemapakeji eBGA uko mabhora e solder anozvigadzirisa panguva yekudzoreredza mvura, mapedhi eLGA anoda nzvimbo chaiyo yemakanika sezvo pasina nzira yekuzvidzora panguva yekuunganidza.

3.2 Substrate uye Zvinobatanidzwa zvemukati

Pamusoro pe contact array pane package substrate, yakavakwa ne organic laminate kana ceramic material zvichienderana nezvinodiwa pakushanda. Die iyi inonamira kune iyi substrate kuburikidza ne wire bonding kana flip-chip interconnect. LGA packages dzinoshanda zvakanyanya dzinowanzo shandisa flip-chip tekinoroji yenzira pfupi dzesignal uye hunhu hwemagetsi huri nani. Substrate iyi inotumira masaini kubva ku die kuenda kuma contact pads ekunze kuburikidza nezvikamu zvakawanda zvemukati.

3.3 Kugadzira Socket System

Mukushandiswa kwakavakirwa pasoketi, soketi yeLGA inoumba chikamu chakakosha chesystem. Macontacts ane spring-loaded mukati mesoketi anodzvanywa papakeji kana nzira yekuchengetedza ikashandisa mutoro. Iyi nzira inowanzo sanganisira load plate uye lever system inogovera simba zvakaenzana pakati pemacontacts ese. Hunhu hwesoketi hunosarudza zvakananga kuramba kwecontact, kuvimbika kwenguva refu, uye maoperating cycles epamusoro.

4. Mabhenefiti eLGA Package Technology

4.1 Kuwanda kweI/O kwepamusoro

Pasina mabhora ekusolder anotora nzvimbo yakatwasuka, mapakeji eLGA anowana mapad pitches akasimba uye nhamba yepamusoro yeI/O mukati metsoka dzakaenzana. Kuwanda uku kunoratidza kukosha kune ma processor emazuva ano uye maASIC anoda zviuru zvekubatanidza. Mainjiniya anogona kuita mashandiro akawanda munzvimbo dzakamanikana dzebhodhi uku achichengetedza kushanduka kwenzira yesignali.

4.2 Kubudirira Kwemagetsi

Maumbirwo eLGA package anoderedza kupinza kweparasitic nekubvisa kureba kwebhora kana pini kubva munzira yechiratidzo. Kubatana kupfupi kunoshandura kudzikira kwekusagadzikana kweimpedance uye kuvandudzwa kwekuvimbika kwechiratidzo pamafrequencies akakwira. Kune maapplication anoda kusvetuka kwakaderera uye kuchena kwemakona echiratidzo, mukana uyu wemagetsi unokanganisa zvakananga mashandiro esystem.

4.3 Mabhenefiti ekupisa uye emakanika

Mapakeji eLGA anobvumira kubatana kweheatsink zvakananga nechivharo chepakeji pasina zvivakwa zvepakati zvinokanganisa kutamiswa kwekupisa. Kubatana kwakavakirwa pasoketi kunogovera kushushikana kwemuchina zvakaenzana, zvichideredza kumanikidzwa kwenzvimbo kunokonzera kuneta kwemajoini e solder muBGA assemblies. Kugadziriswa uku kunovandudza kuvimbika kwenguva refu mumamiriro ekupisa.

4.4 Kugona Kutsiva Chikamu

Mapakeji eLGA akaiswa pasocket anogonesa kutsiviwa kwemachip pasina kushandiswa kwekusonera kana kubvisa machip. Kugona uku kunobatsira munzvimbo dzekugadzira, mapuratifomu eseva anoda kuvandudzwa kwemunda, uye masisitimu ekuyedza uko kuchinjana kwezvikamu kunoitika kakawanda. Maitiro ekutsiva asingaparadze anoderedza nguva yekugadzirisa uye anobvisa kukuvara kunokonzerwa nekuvandudzwa kwebhodhi.

5. Matambudziko nemiganhu yeLGA Packages

5.1 Zvinodiwa paKurongeka kweGungano

Mapakeji eLGA haana hunhu hwekuzvigadzirisa hunowanikwa mukusimba kwenzvimbo inosungirirwa muBGA. Kurongeka kwekuisa zvinhu kunoenderana zvachose nekunyatsorongeka kwemidziyo yekusarudza nekuisa uye kuiswa kwePCB pad. Zvinodiwa zvekubatana kwepakeji nebhodhi zvinova zvakaoma, sezvo nzvimbo dzisina kuenzana dzichikonzera kubatana kwakavhurika.

5.2 Mutengo weSocket uye Kuoma Kwayo

Masokisi emhando yepamusoro eLGA ane ma "spring contacts" akavimbika anomiririra kuwedzera kukuru kwemari yeBOM. Masokisi aya anogara muzvivakwa zvebhodhi kupfuura nhanho dzepakeji uye anowedzera matanho ekubatanidza. Kune mashandisirwo anodhura zvakanyanya kana magadzirirwo ane nzvimbo shoma, pamusoro pemasokisi unogona kupfuura mabhenefiti ekutsiva.

5.3 Matambudziko eSolder Akananga

Kana mapakeji eLGA akasungirirwa zvakananga kumaPCB pane kuiswa musoketi, hwindo rekuita basa rinodzikira zvakanyanya. Vhoriyamu yekunamira yesolder, dhizaini yekuvhura stencil, uye kudzora reflow profile zvinoda kushivirira kwakasimba kupfuura maitiro akafanana neBGA. Kuongorora kunovawo kwakaoma, sezvo X-ray mifananidzo yemajoini e flat pad isingapi ongororo yakakwana pane kubatana kwakaita sebhora.

5.4 Kusabatwa nehutachiona

Nzvimbo dzakati sandara dze LGA package dzinogona kubatwa neguruva, oxidation, uye kusvibiswa kwekubata. Kusiyana ne solder joints dzinoumba metallurgical bonds, pressure contacts dzinoda nzvimbo dzakachena kuti dzibatane dzisingapindi simba. Nzvimbo dzekuungana uye mamiriro ekuchengetera zvinoda kudzora kusvibiswa kwakasimba zvichienzaniswa nema packages anosungirirwa zvachose.

6. Zvaunofanira Kufunga Nezvekugadzira PCB uye Kugadzira Mapakeji eLGA

6.1 Zvinodiwa pakugadzira PCB Pad

Magadzirirwo emapedhi eLGA anoda kuti paki ienderane nehukuru hwechitarisiko. Kusarudzwa kwepedhi repamusoro kunokanganisa kuvimbika kwekubata, neENIG (Electroless Nickel Immersion Gold) iriyo sarudzo huru nekuda kwehunhu hwayo hwakati sandara, hunogoneka kutengeswa, uye hunodzivirira oxidation. Kubatana kwemapedhi pakati penzvimbo kunofanirwa kuramba kuri mukati memiganhu yakasimba kuti ive nechokwadi chekuti zvese zvinobata zvine simba pasi pekumanikidzwa kwesoketi.

6.2 Kudzora Maitiro Ekubatanidza

Kune mashandisirwo eLGA akasungirirwa, kuiswa kwepaste yesolder kunoda huwandu hwakafanana uye kuvharwa kwemapedhi ese. Ukobvu hwestencil uye geometry yekuvhura zvinokanganisa zvakananga kugadzirwa kwemajoini. Mapurofayiri ereflow anofanirwa kugamuchira huremu hwekupisa hwemapakeji eLGA uku achichengetedza mahwindo emvura ari pamusoro penguva yakakodzera. Kuongorora mushure mekudzoreredzwa kunonyanya kutevedzera masisitimu eX-ray, sezvo kuongorora kwekuona kusingakwanise kuongorora kubatana kwemapedhi akavanzwa.

6.3 Kuenzanisa neBGA Assembly

Kunyange hazvo BGA assembly ichibatsirwa ne solder ball self-alignment uye kugara zvakanaka kwemajoini, LGA assembly inonyanya kutsamira pakurongeka kwemuchina. BGA answering inogona kuongorora bhora richidonha uye chimiro charo kuburikidza neX-ray, nepo LGA joints dzichiratidza ma profiles akatsetseka asina kusiyanisa zvakanyanya. Misiyano iyi inoda nzira dzakagadziriswa dzekusimbisa maitiro uye zvinodiwa zvekuongorora zveLGA ​​implementations.

7. Mashandisirwo Akajairika eLGA Packages

Tekinoroji yepakeji yeLGA inonyanya kushandiswa mumapurogiramu anoda kushanda kwepamusoro uye kugona kusimudzira nharaunda.

• MaCPU nemaGPU emhando yepamusoro - Nzira dzekupisa dzinoshanda zvakanyanya uye dzinoshanda zvakanaka dzinotsigira mapuratifomu edesktop nemaseva anodyara simba rakawanda.

• Mapurosesa enzvimbo yedata - Mapakeji eLGA ane socket anogonesa kuvandudzwa kwemapurosesa uye kugadziridzwa kwehardware pasina kutsiva bhodhi rakazara.

• Mapurosesa enetwork uye maASIC ekutaurirana - Matambudziko mashoma eparasitic uye mashort interconnect anotsigira kusimba kwechiratidzo che multi-gigabit.

• Masisitimu ekudzora maindasitiri - Magadzirirwo eLGA akavakirwa pasocket anopa mukana wekuvandudza, kusimbisa, uye rutsigiro rwehupenyu hwese.

• Midziyo yekuedza otomatiki (ATE) - Kuchinjana kwezvikamu uye kugona kudzokorora kubata kunoita kuti kuyedza nekugadzirisa mabasa kuve nyore.

Kazhinji, mapakeji eLGA anodiwa mumasisitimu ane huwandu hwakawanda hweI/O, mashandiro emagetsi, uye kugona kushanda zvakanaka zvinoita kuti soketi neassembling zvive zvakaoma.

8. Maitiro ekusarudza mapakeji eLGA

Sarudzo dzeinjiniya maererano nekushandiswa kwepakeji yeLGA dzinofanira kuongorora zvinhu zvakati wandei.

• Zvinodiwa pakuverengwa kweI/O uye huwandu hwevanhu - Sarudza kana zvakanakira zveLGA ​​zvekubatanidza huwandu hwevanhu vakawanda zvichitsigira dhizaini yakawedzerwa uye kuoma kwekugadzira.

• Mafambiro ezviratidzo uye zvinangwa zvekuvimbika - Ongorora kana nzira pfupi dzekubatanidza dzichipa mabhenefiti ekuita anoyerwa padanho redata rakatarwa.

• Kutenderera kwehupenyu hwesystem uye nzira yekuvandudza - Ongorora kudiwa kwekutsiviwa kwemunda pakusarudza pakati pekushandisa LGA socketed uye direct-solder.

• Kugona kugadzira uye kushivirira - Simbisa kuti kunyatsogadzira PCB uye maitiro ekugadzira anogona kutsigira zvinodiwa neLGA.

• Kufunga nezvemutengo wese - Kuenzanisa mitengo yesoketi, kudzora kwakasimba kwemaitiro, uye mhedzisiro inogona kuitika pakubudirira uye kugona kushanda.

Kusarudzwa kwemapakeji eLGA chisarudzo chekuchinjana chinofanira kuenderana nezvinodiwa nemagetsi, zvemakanika, zvekugadzira, uye zvehupenyu hwese padanho rehurongwa.

9. Mhedziso: Kukosha kwePakeji yeLGA uye Miganhu yeKushandiswa

Tekinoroji yepakeji yeLGA inomiririra mhinduro yakanangwa yekushandiswa kwema semiconductor ane huwandu hwakawanda, ane mashandiro epamusoro apo zvinodiwa neI/O, kuvimbika kwemasaini, uye sarudzo dzekugadzira dhizaini yekufambisa masevhisi ezvikamu.

Magadzirirwo e flat-pad anopa mabhenefiti chaiwo mukushanda kwemagetsi uye kutonga kwekupisa ukuwo achigonesa kutsiva zvikamu zvisingaparadze mumagadzirirwo e socket. Zvisinei, mabhenefiti aya anouya nekuwedzera kwezvinodiwa zve assembly accuracy, mitengo yakakwira ye socket, uye mahwindo madiki e process ekushandisa direct-solder.

LGA haisi yepamusoro pane BGA kana mamwe marudzi emapakeji—asi, inoshandira zvinodiwa zveinjiniya apo hunhu hwayo hunoenderana nezvinangwa zvesystem. Kushandiswa zvakanaka kunoenderana nekuwiriranisa kugona kweLGA nezvinodiwa zvekushandisa, kugona kugadzira, uye zvinodiwa muhupenyu hwese.