WLCSP: Tsanangudzo yeTekinoroji yeKurongedza Chip-Scale yeWafer

Nhanganyaya kuWLCSP

Sezvo michina yemagetsi ichiramba ichiderera uku ichida kushanda kwepamusoro, tekinoroji yekurongedza yeIC yave chinhu chakakosha pakugadzira zvinhu zvitsva. WLCSP (Wafer-Level Chip-Scale Packaging) inomiririra kufambira mberi kukuru mukurongedza kwemasemiconductor, ichipa mhinduro diki inosangana nezvinodiwa zvemagetsi emazuva ano.

Maitiro aya ekurongedza anobvisa ma substrates echinyakare nema lead frames, zvichigonesa kubatana zvakananga ne chip-to-PCB. Muzvikamu zvinotevera, tinoongorora tsananguro, chimiro, maitiro ekugadzira, uye mashandisirwo anoshanda etekinoroji yeWLCSP.

Tsanangudzo yeWLCSP

Chii chinonzi WLCSP?

WLCSP inomirira Wafer-Level Chip-Scale Packaging. Kusiyana nenzira dzechinyakare dzekurongedza uko machipisi anotanga aiswa singular uye ozoiswa imwe neimwe, WLCSP inopedzisa matanho ese ekurongedza uku die richiramba riri pawafer. Saizi yekupedzisira yepakeji yakaenzana nesilicon die pachayo, zvichizadzisa chiyero chepakeji chechipi chekuti isapfuure 1.2 yakapetwa saizi yedie.

WLCSP vs. Kurongedza Kwechinyakare

Maitiro echinyakare ekurongedza akadai seBGA neQFN anoda substrate yepakati kana furemu yelead pakati pechip nePCB. WLCSP inobvisa zvidimbu izvi zvachose. Mhedzisiro yacho imhinduro chaiyo yechip-scale apo mabhora ekusolder anogadzirwa zvakananga pamusoro pewafer, uye kupatsanura kunoitika sedanho rekupedzisira. Maitiro aya anoshandura zvakanyanya paradigm yekurongedza kubva kuchip-then-package kuenda kupakeji-then-daice.

Maumbirwo uye Hunhu hweWLCSP

Maumbirwo Akajairika eWLCSP

WLCSP yakajairika ine silicon die ine redistribution layer (RDL) iyo inofambisa ma bond pad connections kune yuniform ball grid array. Solder bumps inoiswa zvakananga paRDL, zvichipa electrical ne mechanical interface kuPCB. Passivation kana protective layer inofukidza active circuitry. Hapana waya bonds, lead frames, kana packaging substrates dziripo mune iyi minimalist architecture.

Hunhu Hunokosha hweMaumbirwo

Fomu reWLCSP rinoita kuti pave ne "miniaturization" yakanaka uye huwandu hwakanyanya hwe "interconnect density". Ukobvu hwepakeji hunonyanya kutsanangurwa neukobvu hwewafer pamwe nekukwirira kwebhora re solder, izvo zvinowanzoita kuti pave nema "profiles" ari pasi pe 0.5mm. Kubatana kwakananga ne "die-to-board" kunogadzira nzira yemagetsi pfupi inogoneka, iyo inobatsira zvikuru kuma "high-frequency applications" anoda "parasitic inductance" shoma uye "capacitance".

Maitiro Ekugadzira eWLCSP

Kugadzirira Wafer uye Kuumbwa kweRDL

Kugadzirwa kweWLCSP kunotanga nemawafer akapedzwa kubva kumberi. Chidimbu chedielectric chinoiswa, chinoteverwa nekugadzirwa kwesimbi iyo inoburitsa nzvimbo dzekutanga dzebond pad kuenda kugridi yebhora yakajairika. Danho iri reRDL rakakosha pakugadzirisa madhizaini akasiyana-siyana edivha kuita footprint yepakiti yakaenzana yakakodzera SMT assembly.

Kuumbwa kweBundu reSolder

Metallization iri pasi pebump metallization (UBM) inoshandiswa kugadzirira nzvimbo dzekunamira solder. Mabhora ekusolder anoiswa kana kuti solder paste inoiswa panzvimbo yega yega yekubatanidza, yozoteverwa nekudzoreredzwa kwemvura kuti igadzire mabump akafanana. Kuyera kwebhora kunowanzova pakati pe0.3mm kusvika 0.5mm zvichienderana nehuwandu hweI/O uye zvinodiwa pakushandisa. Kuongororwa kwemhando yepamusoro kunoita kuti bump ienderane uye kuti ive yakagadzikana.

Kuedza uye Kuenzanisa

Kuongororwa kwemazinga ewafer kunoitwa kuti kuonekwe kuti wafer yacho inozivikanwa zvakanaka isati yagadzirwa. Wafer yacho inochekwa kuita zvikamu zveWLCSP uchishandisa blade kana laser cutting. Mudziyo wega wega wakaumbwa wakagadzirira kugadzirwa pabhodhi. Iyi nzira yekugadzirisa batch pamazinga ewafer inopa mabhenefiti makuru pamusoro penzira dzechinyakare dzekurongedza machipisi.

Mabhenefiti eWLCSP

Saizi uye Mashandiro Emagetsi

WLCSP inopa mukana mudiki kwazvo wekushandisa package, zvichiita kuti huwandu hwezvikamu huve pamusoro pemagadzirirwo ePCB . Kubviswa kwewaya dzemabond uye substrate layers kunoderedza zvakanyanya kusimba kwezvipembenene, inductance, uye capacitance. Hunhu uhwu hwemagetsi hunoita kuti WLCSP ive yakakodzera RF, manejimendi yesimba, uye mashandisirwo edhijitari anomhanya nekukurumidza uko kusimba kwechiratidzo kuri kukuru.

Kushanda Kwekupisa uye Kuungana

Kubatanidzwa kwedivha zvakananga kuPCB kunoita kuti pave nenzira inoshanda yekupisa kuti kupisa kuparare. Divha yesilicon inofambisa kupisa kuburikidza nemabhora e solder zvakananga kune maficha ekutonga kupisa kwebhodhi. WLCSP inoenderana zvizere nemaitiro akajairwa eSMT reflow, isingade michina yakasarudzika yekuunganidza. Kuenderana uku kunoita kuti zvive nyore kubatanidzwa mumitsetse yekugadzira iripo.

Zvipingamupinyi neMatambudziko eWLCSP

PCB Dhizaini Zvinodiwa

Kubudirira kwekushandiswa kweWLCSP kunoda dhizaini chaiyo yePCB uye kugadzirwa kwayo. Mabhora emuchina wekusolder ane pitch yakanaka anoda kutenderwa kwekunyoresa mapad akasimba uye kuiswa kwepaste inodzorwa. Kurongeka kwePCB trace pasi peWLCSP kunofanirwa kuenderana nemiganhu yekuisa. Mapoka ekugadzira anofanirwa kufunga nezvezvinhu izvi panguva yekutora nekugadzira marongero.

Kufunga Nezvemakanika uye Kuvimbika

Pasina chinhu chinovharira kana chinodzivirira, mapakeji eWLCSP anoratidza kusimba kushoma kwemuchina kana tichienzanisa nezvimwe zvinoshandiswa mukugadzira. Kusawirirana kweCTE pakati pesilicon neFR-4 substrates kunokonzera kushushikana pamajoini esolder panguva yekupisa. Kuongororwa kwekuvimbika kwebhodhi kwakakosha, kunyanya kune mashandisirwo ari kusangana nekushomeka kwemuchina kana kuputika kwekupisa kwakafara. Kuisa pasi pemuchina kunogona kudiwa kuti kuvimbika kuve kwakasimba.

Matambudziko eKuedza uye Kugadzirisazve

Kuongororwa kwemajoini eWLCSP mushure mekusangana kunoda X-ray imaging nekuda kwekubatana kwakavanzika kwesolder pasi pedhi. Kugadziriswazve kwezvikamu zveWLCSP zvakakundikana kunonetsa tekinoroji uye kune njodzi yekukuvara kwezvikamu zviri pedyo pazvikamu zvakakura. Zvinhu izvi zvinosimbisa kukosha kwekutonga kwakasimba kwemaitiro mukati meSMT assembly kuti uwane goho repamusoro rekutanga.

Zvikumbiro zveWLCSP

Mafoni Emagetsi uye Evatengi

WLCSP yave ndiyo package inofarirwa nemafoni nematablet uko dzimba dzebhodhi dziri pamutengo wepamusoro. MaIC ekutonga simba, maaudio codec, masensa, uye ma connectivity modules anowanzo shandisa iyi fomati. Iyo tete profile inotsigira dhizaini yemidziyo midiki uku ichichengetedza mashandiro emagetsi akanaka eRF uye ma mixed-signal functions.

Zvinopfeka uye IoT Zvishandiso

Tekinoroji inopfekwa uye maapplication eIoT anoshandisa WLCSP pakuita kuti zvinhu zvisanyanya kuomera. Matracker ekugwinya, mawachi, uye ma sensor node asina waya anobatsirwa ne compact form factor. Ma microcontroller ane simba shoma, ma MEMS sensors, uye ma transceiver asina waya muWLCSP anogonesa magadzirirwo ezvigadzirwa kare aisakwanisika nemhinduro dzemazuva ano dzekurongedza.

mhedziso

WLCSP inomiririra tekinoroji yakakura uye yakakosha yekurongedza yemagadzirirwo emagetsi ane nzvimbo shoma uye anoshanda zvakanyanya. Maitiro ayo ekugadzirisa ewafer-level anopa saizi chaiyo yechip-scale ine hunhu hwemagetsi hwepamusoro. Kunyange hazvo manejimendi ePCB ekunyatsorongeka uye kuvimbika achida kutarisirwa zvakanyanya, mabhenefiti eWLCSP—kutsika kushoma, kugona kwechiratidzo kwakanaka, uye kushanda zvakanaka kwekupisa—zvinoita kuti ive yakakosha kune zvigadzirwa zvemagetsi zvemazuva ano zvinotakurika. Sezvo miniaturization yemidziyo ichienderera mberi, WLCSP icharamba iri tekinoroji huru mukugadzirwa kwePCB kwepamusoro uye kugadzirwa kwezvigadzirwa zvemagetsi.