Kudiwa kweAI Server PCB muna 2026

Hardware yeAI server ndiyo simba guru rinochinja indasitiri yePCB muna 2026. Kuchinja uku hakusi kwekuwedzera - inhanho-nhanho yekuchinja kwehuwandu hwePCB, giredhi rezvinhu, huwandu hwezvikamu uye huwandu hwevatengesi. Sekureva kwaMorgan Stanley's Chivabvu 22, 2026 BOM disappointment ye NVIDIA's Vera Rubin VR200 NVL72 rack iri kuuya, kukosha kwehuwandu hwePCB pa rack kwakakwira ne233% chizvarwa-kubva-kubva pamadhora angangoita 35,100 paGB300 kusvika pamadhora angangoita 116,700 paVR200 . Mushumo mumwe chete unoratidza kukosha kwehuwandu hweMLCC kwakakwira ne182%, ABF substrate yakakwira ne82%, uye rack yakazara ASP pamadhora angangoita 7.8 miriyoni - kanenge kaviri pane rack yeGB300 iripo.

Gwaro iri rinotsanangura shanduko dzehunyanzvi uye zvinhu zviri mukati meRubin platform, ecosystem yemutengesi inoivaka, uye mhedzisiro yekupararira kwePCB zvinhu zvakagoverwa kune vamwe vese. Mamiriro emitengo ari muongororo yekuwedzera kwemitengo yePCB , hupfumi hwezvinhu zviri mugwaro remitengo yezvinhu zvakagadziriswa zvePCB , huwandu hwekupa muongororo yekushomeka kwezvinhu zvePCB , uye mhinduro dzekugadzira nekutenga mugwaro rekuderedza mitengo yePCB.

1. Nhamba yeMusoro: $35,100 → $116,700 paRaki imwe neimwe

Kuburitswa kweBOM kwaMorgan Stanley pasi peNVIDIA Vera Rubin VR200 NVL72 rack — kwakaburitswa nemuongorori Howard Kao musi wa22 Chivabvu, 2026 — kwakagadzira nhamba huru dzeAI server PCB economics muna 2026. Pakati pezvinhu zvese zviri pasi, kukosha kwePCB kwakawedzera zvakanyanya gore negore:

Zvakashandurwa kuita sematauriro e-per-square-meter, ma-multi-layer PCB emagetsi akajairika muna 2026 ari kushanda nemadhora mazana maviri nemana ($204) pa-square meter zvichienderana nedata reindasitiri kuburikidza neReuters, nepo mabhodhi e-AI server epamusoro-soro achisvika pamadhora zana nemazana mapfumbamwe nemakumi manomwe ($1,970) pa-square meter - pedyo ne10 × chiyero chakajairwa . Musiyano uripo ndewezvinhu: huwandu hwe-layer, CCL grade, copper-foil profile, glass cloth grade uye surface finish zvese zviri padanho repamusoro rezvikamu zvavo.

Nei zviri mukati meAI server PCB zviri kuwedzera ne233% kubva pachizvarwa kusvika pachizvarwa>

Nekuti Rubin inosanganisa mhedzisiro mbiri. Chekutanga, mhando dzePCB dziripo dziri kukura uye dzakaoma — Rubin's compute board inovandudza kubva pa22-layer HDI PCB paGB300 kuenda pa26-layer board, nehukuru hwezvinhu huchichinja kubva paM7 kuenda kuM8. Chechipiri, Rubin inoburitsa maPCB modules matsva asina kuwanikwa paGB300, anosanganisira Midplane PCB (18 units pa rack pa $1,500 imwe neimwe) uye ConnectX module PCB (72 units pa rack pa $270 imwe neimwe). Idzi mhando mbiri itsva chete dzinopa mari inosvika $46,400 mukuwedzera kukosha kwePCB pa rack pa.

2. Nei Rubin VR200 NVL72 Ichidhura $7.8 Million kubva kuODM

Ongororo yaMorgan Stanley inofungidzira kuti rack yakazara yeRubin VR200 NVL72 inosvika $7.8 miriyoni kubva kuODM , nemitengo yakakwira kuburikidza nenzira dzeOEM dzakadai seLenovo, Asustek, Giga-Byte naDell. Izvi zvakapetwa kaviri pane rack yeGB300 iripo iri pasi pe $4 miriyoni. Kuwedzera uku kwakavakirwa zvakanyanya muBOM yese:

• Memory ndiyo dhiraivha huru pane dzose. Mugove wendangariro wakabviswa kubva pa5-10% yeGB200 NVL72 BOM kuenda ku 25-30% yeVR200 BOMMutengo wekuchengetedza ndangariro wakakwira kubva pamadhora angangoita 370,000 (GB300) kusvika pamadhora angangoita 2 miriyoni (VR200) ​​- kuwedzera kwe435% nekuda kwehuwandu hweHBM hwakakwira pamwe nekuwedzera kwemusika wekuchengetedza ndangariro.
• Kukosha kwemadhora esilicon eGPU kwakakwira ne57% — kubva pamadhora angangoita mamiriyoni maviri nemakumi mashanu nemaviri emadhora kusvika pamadhora angangoita mamiriyoni matatu nemakumi mapfumbamwe nematanhatu emadhora pa rack imwe neimwe — asi GPU inogovera huwandu hweBOM yese akawira kubva painenge 65% kusvika painenge 51% nekuti ndangariro nezvimwe zvikamu zvakakura nekukurumidza.
• Zviri mukati mePCB zvakakwira ne233% kubva pamadhora angangoita 35,100 kusvika pamadhora angangoita 116,700 paraki imwe neimwe, zvichitevera kuverengwa kwepamusoro kwezvikamu, magiredhi epamusoro eCCL, uye maPCB modules matsva (Midplane, ConnectX) akaunzwa naRubin.
• Huwandu hweMLCC hwakawedzera ne182% kubva pamadhora angangoita $1,530 kusvika pamadhora angangoita $4,320 paraki imwe neimwe. Raki imwe chete yeVR200 ikozvino inoshandisa angangoita $1,530 Ma capacitor eceramic ane layer yakawanda 600,000, pamusoro pe30% pamusoro pehuwandu hweGB300.
• Kukosha kwe ABF substrate kwakawedzera ne82%, zvichiratidza nzvimbo yakakura inodiwa yeRubin GPUs uye kumanikidzwa kwakafanana kwemutengo kunokonzerwa neT-glass kunobata CCL.

3. Manera eCCL Grade: M6 → M7 → M8 → M9 Q-Glass → M10

Chikonzero chehunyanzvi chekukura kwemutengo weAI PCB ndechekukwira kwedanho reCCL. Danho rega rega rinochinja resin chemistry, copper-foil profile uye glass-cloth grade panguva imwe chete, zvichiwedzera mutengo wezvinhu pane kuwedzera pairi. Kufambira mberi kubva kuH100 / GB200 kusvika kuRubin Ultra kunotora maM-grade mashanu muzvizvarwa zvinenge zvitatu.

Kuwedzera kwemutengo wekuwedzera uku kwakaoma. Maererano nedata reindasitiri: M6 CCL inomhanya ne3-5× standard FR-4; M7 inomhanya ne6-9×; M8 inomhanya ne10-15×; M9 Q-glass inomhanya ne15-20× . Giredhi reM10 rechizvarwa chinotevera parizvino riri muqualification (Df <0.002) rinowedzera manera. Musi wa13 Kurume, 2026, nyanzvi Ming-Chi Kuo akasimbisa kuti NVIDIA yakabatana neWus Printed Circuit kuyedza M10 CCL kuti iwane 448G+, nemabhodhi ekuyedza achishandisa foil yemhangura yechizvarwa chinotevera HVLP5 nejira reQ-glass.

Chii chinonzi Q-glass uye nei ichikosha paAI->

Q-girazi ijira regirazi rakagadzirwa nefiber yequartz ine purity yakakwira (~99.99% SiO₂). Rine dielectric constant Dk inosvika 3.0 uye dissipation factor Df inosvika 0.0007 — zvese zviri pasi zvakanyanya pane NE-girazi neT-girazi. Pahuwandu hwedata hwe224G ne448G, bhajeti rese rekurasikirwa kwenzira yechiratidzo rakamanikana zvekuti kurasikirwa kwakasara kubva mukusafanana kwegirazi kunova chinhu chinotonga. Q-girazi inoderedza kurasikirwa uku nekuderedza bulk dielectric constant yekusimbisa pachayo. Vatengesi veQ-girazi vanotungamira ndiShin -Etsu, Asahi Kasei, Glotech, Feilihua, Taishan Fiberglass naHong Ho.

4. Kukwira kwemitengo yezvikamu: Kubva pa22 kusvika 26 kusvika 44 kusvika 78 zvikamu

Kufambira mberi kwehuwandu hwePCB layer yemabhodhi eNVIDIA AI compute kwakawedzera muzvizvarwa zvitatu zvapfuura:

• Bhodhi rekuverenga reH100: ~22 zvidimbu.
• Bhodhi rekuverenga reGB300: 22-34 zvidimbu zvichienderana nechimiro chayo.
• Bhodhi rekuverenga reRubin VR200: 26 akaturikidzana (sekureva kweMorgan Stanley teardown), yakagadziridzwa kubva paGB300's 22-layer HDI.
• Rubin VR200 PCB yepakati: kusvika 44 akaturikidzana kune purani yekubatanidza yepamusoro-soro iri muraki.
• Rubin LPX: zvishoma 52 zvikamu pagirazi reM9 Q.
• Rubin Ultra / Kyber: zvinofungidzirwa kuti zvingangoita 78+ zvidimbu.

Dura rega rega rinowedzerwa kuPCB rinowedzera mutengo wekugadzira ne20-30% nekuti dura rega rega rinowedzera CCL core, prepreg, lamination cycle, drilling, plating uye registration risk. Kupeta kaviri kubva pa22 kusvika ku44 layers kunoita kuti mutengo upfuure kaviri - kunoiwedzera nekuda kwehuwandu hwe lamination cycle, kuoma kwehole-aspect-ratio, uye kuunganidza kwe registration tolerance. Panosvika nguva iyo dhizaini inosvika 78 layers paQ-glass, nhanho yega yega yekugadzira inenge yasvika pamuganhu wezvinotsigira michina iripo.

5. Midplane PCB neConnectX Module — Mhando mbiri itsva dzePCB

Rubin anounza mhando mbiri dzePCB dzaisavapo paGB300, uye zvichienderana neMorgan Stanley's BOM debutdown, ivo vega vanopa mari inosvika $46,400 yePCB content worth pa rack :

• PCB yepakati. Mayunitsi gumi nemasere paraki pamutengo weyuniti inosvika $1,500. Midplane ndiyo PCB hombe inobatanidza mabhodhi ekuverenga mujira reNVLink rakabatana paraki yese yeNVL72. Kuverengwa kwema layer kunosvika makumi mana nemana neQ-glass dielectric, zvichida HVLP4 kana HVLP5 copper foil kuchengetedza 224G channel integrity kwenguva refu. Vagadziri veABF neBT substrate havagone kuita kuti mabhodhi ave makuru kudaro; iyi ndiyo nzvimbo yePCB.
• PCB yeConnectX module. Mayunitsi makumi manomwe nemaviri paraki pamutengo weyuniti inosvika $270. Module yega yega yeConnectX-8 inogarwa sekadhi remwanasikana kune bhodhi rekuverenga, ichipa maNIC enetwork yeraki. Iyo ConnectX PCB pachayo ibhodhi diki reHDI rakavakirwa paM7 kana M8 CCL ine HVLP foil uye tight impedance control.

Imwe neimwe yemhando itsva dzePCB idzi inoda giredhi repamusoro reCCL, profile ye copper foil yepamusoro, uye jira regirazi rakasarudzika - zvese zvakatoganhurirwa neChikamu 7 chiri pazasi. Mhedzisiro yacho ndeyekuti NVIDIA Rubin yakawedzera zvakanyanya kudiwa kwezvinhu zvidiki zvakafanana nevatengi ve5G base-station, automotive radar, uye high-end networking PCB.

PCB itsva yepakati inokwikwidzana sei nezvinhu zvakasiyana nedzimwe indasitiri->

Inokwikwidza zvakananga. Midplane inoshandisa jira reQ-glass rinowanikwa neNittobo, Shin-Etsu naAsahi Kasei rinodiwa nePCB dzechizvarwa chinotevera dze5G millimeter-wave. Foil yemhangura yeHVLP4/HVLP5 yakafanana neyaMitsui Kinzoku iyo mabhodhi eradar ne networking ane mwero wepamusoro anoda. M8/M9 CCL imwe cheteyo kubva kuDoosan, Panasonic, Resonac naShengyi. NVIDIA's Rubin allocation inotora simba repamusoro rezvinhu padanho rega rega.

6. Zvaunofanira Kufunga NezveKutsvaga PCB uye Kugadzira

Mapurogiramu eAI server anoda zvakanyanya kusimbaradza pakusimba kwemasaini, kuendeswa kwemagetsi, kunyoreswa kwema layer uye kudzora maitiro. Nzira chaiyo yekugadzira inoenderana ne stackup yakatenderwa, bhajeti rekurasikirwa nechiteshi, tafura ye impedance, kuburikidza nechimiro, kugoverwa kwemhangura, BGA pitch uye zvinodiwa zvekuongorora.

• Simbisa kuwanikwa kwelaminate isingadhuri zvakanyanya uye mitemo yekutsiva yakatenderwa usati waburitsa chigadzirwa.
• Ongorora zvinangwa zve controlled-impedance, zvinodiwa zve roughness uye nzira yekukuponi uchishandisa package yekugadzira.
• Ongorora lamination yakatevedzana, mavias akazadzwa, backdrilling uye kunyoreswa kwehuwandu hwakawanda panguva yeDFM.
• Gadzirisai kugadzirwa, kuwanikwa kwezvikamu, uye zvinodiwa pakugadzira kana bhodhi rapihwa sePCBA.

Highleap inogona kuongorora pasuru yekugadzira yePCB inokurumidza kugadzirwa isati yatengeswa, kusanganisira stackup, impedance data, mifananidzo uye tarisiro yekuyedza. Mapurojekiti ane zvinodiwa zvakakosha zvemaitiro anogona kuongororwa kune ese ari maviri ekugadzira ma prototype uye huwandu.

7. Maitiro eAI Demand anobvisa sei kugoverwa kwezvinhu kubva kune vamwe vese

Kupararira kwekuda kweAI kuburikidza neketani yekugovera zvinhu ndiyo nyaya huru yePCB yegore ra2026 kune vasiri veAI. Vatengi veHyperscale AI — vachivaka maRubin VR200 racks eOpenAI, Google, Microsoft, Amazon, Oracle, Meta, xAI nedzimwe nzvimbo huru dzedata — vakachengetedza huwandu hwakawanda hwesimba riripo kune vese vagadziri vezvinhu vanotungamira:

• Mitsui Kinzoku MicroThin copper foil — maodha e2026 anopfuura huwandu hwakaiswa pamugadziri anotungamira weHVLP foil yepamusoro.
• Girazi reNittobo T-girazi nejira reQ-girazi — maodha akadzokera kumashure muQ2 yegore rakatevera pamadhora angangoita $100/kg.
• Panasonic Megtron 6/7, Doosan CCL yepamusoro-soro, MGC/Resonac CCL — yakaendeswa kune zvinhu zvinogoverwa zvichienderana nekugoverwa.
• Topoint / Union Tool / Zhongwu micro-drills — kushandiswa kunopfuura 90%, zvinhu zviripo hazvikwanise kugutsa zvinodiwa.
• Kemikari yeAtotech / Uyemura plating — ENIG yepamusoro uye kugona kwe electroplating kwakagoverwa kumapurogiramu e AI server ane margin akakwirira.

Izvi zvinoreva kuti kunyangwe mutengi asiri weAI achida kubhadhara mitengo yakaenzana neye2024 yeCCL yepamusoro kana HVLP foil, zvinhu izvi hazviwanzo kuwanikwa nekuti vatengi veAI vakaisa maodha ekutanga anotora nzvimbo yekutanga. Ruzivo rweKorea Customs Service — mitengo yeCCL yekupinza zvinhu inosvika $20,728 patani munaKurume 2026, yakakwira ne74.5% gore rega rega, kekutanga pane $20,000/tani — chiratidzo chehuwandu hwekugoverwa uku.

8. Zviri Kuonekwa Nevatengi Vasiri VeAI Pari Zvino

Kune maindasitiri asingatenge maAI server PCB asi achishandisa zvinhu zvakafanana, mwaka wa2026 wakonzera kusagadzikana panguva yekushanda, mitengo uye kuwanikwa kwezvinhu:

• Zvishandiso zveTelecom ne networking OEMs. Nzvimbo dze5G base stations, switch uye ma routers zvinoenderana nePPE-based mid-loss CCL (Megtron 6 class) — zvinhu zvakafanana zvinoshandiswa nemhuri dzinoshandisa AI. Vazhinji vari kutarisana nenguva dzekutungamira kwemavhiki gumi nemana kusvika gumi nemasere uye kuwedzera kwemitengo ne20-40% pagiredhi rimwe chete ravakatenga muna 2024.
• Vanopa zvivakwa zve5G. Kuonekwa zvakananga kwePPE-resin kubva pachiitiko chekupa kwemvura chiri kumusoro. Mamwe magadzirirwo akagadziriswazve kwenguva pfupi kuita ma stackups akakora kana epamusoro kuti arambe achishanda zvakanaka nezvinhu zviripo.
• Zvigadzirwa zvemagetsi zvemotokari (kunyanya radar ye77 GHz). Ma PTFE / hydrocarbon laminates (laminate ine kurasikirwa kwakaderera/laminate ine kurasikirwa kwakaderera) akagoverwawo kuAI kune mapurogiramu e hyperscaler high-frequency. Kugadzirwa kweradar yemotokari ikozvino kunoenderana nemazinga akakodzera e laminate kana kugamuchira nguva refu yekutungamira.
• Kudzora maindasitiri, simba uye zvigadzirwa zvemagetsi zvevatengi. Standard FR-4 inotora zvinodiwa nevanhu vane premium grade; nguva yekutenga zvinhu kubva kumakambani aya yatora mavhiki maviri kusvika matatu kusvika mavhiki matanhatu kusvika masere. Kunyangwe vatengi vakanyatso dzivirirwa kubva pakusvibiswa nezvinhu zveAI vanoona mhedzisiro yekupararira kwechinhu ichi.
• RF / dziviriro yendege. Zvinhu zvemhando yepamusoro zvePTFE zvine kurasikirwa kushoma hazviratidzike zvakananga asi nguva dzekushandisa dzakareba sezvo michina yemhando yepamusoro ine kurasikirwa kushoma, Taconic neArlon vachipa simba kune mapurogiramu emhando yepamusoro ekuwedzera hunyanzvi.

Chii chingaitwe neOEM isiri yeAI muna 2026->

Mhinduro chaiyo inosanganisa mafambiro mana: (1) kukodzera giredhi rechipiri reCCL pabhodhi rega rega kuti mugadziri awane imwe nzira yekugovera; (2) kuwedzera fungidziro kusvika mavhiki 12-26 zvichienderera mberi kuitira kuti mugadziri agone kuwana CCL zvichienderana nezvaunoda; (3) ongorora magadzirirwo ekuti awedzere kutsanangurwa — M7 yakatarwa panosvika M6, HVLP foil yakatarwa panosvika LP, ENIG yakatarwa panosvika OSP; (4) shandisa ma hybrid stackups anodonhedza premium CCL pazvikamu zvisiri zvakakosha. Izvi zvakafukidzwa zvakadzama mugwaro rekudzikisa mitengo.

9. Mibvunzo Inowanzo bvunzwa Nezvekudiwa kweAI Server PCB

Kudiwa kweAI server kunokanganisa sei kugadzirwa kwePCB?

Kudiwa kwemabhodhi ane ma "high-layer-colted-impedance" kunogona kuita kuti ma "laminates" akasarudzwa asanyanya kurasikirwa, copper foil uye kugona kwawo kugadzira zvinhu zvakasiyana-siyana. Izvi zvinosiyana zvichienderana nezvinhu zvakatenderwa, kuoma kwe "stackup", huwandu uye zuva rekutumira rinodiwa.

Nderupi ruzivo runodiwa kuti utaure mashoko eAI server PCB nemazvo?

Ipai data reGerber kana ODB++, stackup, impedance table, dhizaini yekugadzira, drill data, finished cruise, surface finish, quantity, test requirements uye assembly files kana PCBA ichidikanwa. Data rakazara rinobvumira ongororo yeinjiniya usati waita sarudzo yezvinhu uye maitiro.

Mabhodhi akaomarara anomhanya zvikuru anogona kuvakwa mumhando yeprototype uye huwandu hwekugadzirwa here?

Ehe. Nzira yakakodzera yekushanda inosimbiswa panguva yekuongorora kweinjiniya. Zvivakwa zvakaoma zvinogona kuda kusimbiswa kwezvinhu, kutevedzana kwelamination, kudzorwa kweimpedance, kuburikidza nekurapwa, kuongororwa kwakakosha kana kuvaka kwepilot usati wagadzira volume.

Chikwata chekugadzira chingaderedza sei njodzi yekugovera PCB yepamusoro?

Taura sarudzo dzezvinhu zvakakodzera kana bhajeti yemagetsi ichibvumira, sunungura stackup nekukurumidza, tsanangura zvidzoreso zvekutsiva mudhirowa yekugadzira uye batanidza mugadziri usati wapedzisa nzira ine njodzi huru kana kuburikidza nechimiro.

Highleap inofanira kuongorora bhodhi reAI server riini?

Ongororo inonyanya kubatsira dhizaini isati yaburitswa kuti ishandiswe pamutengo, kunyanya kana bhodhi riine nzira dzinomhanya zvakanyanya, nzira dzakasimba dzekubuda muBGA, ma laminates akakosha, backdrilling, maficha eHDI kana zvinodiwa zvakasimba zvekutevedza.