Zvinhu zveAI Server PCB: Laminates Dzisina Kurasikirwa, Stack-Up, Thermal uye PCBA Guide

Kusarudza zvinhu zvePCB zveAI server hazvina kufanana nekusarudza laminate yeFR-4 yakajairika. Hardware yeAI server inosanganisa nzira dzeSerDes dzinomhanya zvakanyanya, GPU kana accelerator power delivery, high layer count, dense BGA routing, heavy copper planes, strict impedance control uye longtime thermal reliability mune imwe board system. Kana zvinhu zvePCB zvisiri izvo zvikasarudzwa, dambudziko rinogona kuoneka sekurasikirwa kweinsertion, closed eye diagrams, unstead impedance, high tembiricha high, through fatigue, CAF risk, warpage, assembly defects kana kunonoka kugadzirwa nekuti laminate inodiwa haipo.

Gwaro iri rakanyorerwa mainjiniya, makambani matsva ehardware, mapoka ekutenga uye maneja ezvigadzirwa ari kutsvaga mhinduro dzinoshanda kumibvunzo yakaita sekuti: Ndeapi machira ePCB andinofanira kushandisa pabhodhi reAI server? FR-4 yakakwana here? Ndirini pandinofanira kuda Megtron, Tachyon, Astra, laminate yakasarudzika yakaderera kana imwe laminate yakaderera? Drk, Df, copper roughness uye glass weave zvinokanganisa sei 112G kana 224G channels? Chii chandinofanira kubvunza mugadziri wePCB ndisati ndaomesa stack-up?

Highleap Electronics ifekitari yekugadzira maPCB uye kugadzira maPCB. Kune mapurojekiti eAI server, GPU, accelerator, networking uye high-performance computing, nzira chaiyo haisi yekusarudza zita rechinhu chakasiyana. Chinhu chinofanira kuongororwa pamwe chete nekumhanya kwesignal, kureba kwechiteshi, kuwanda kwelayer, impedance structure, copper weight, via structure, lamination process, soldering profile uye component package requirements.

Zvinodiwa Kugadzirisa Zvinhu zveAI Server PCB

Maseva eAI anoisa zvinhu zvePCB zvinonetsa zvisingawanzoitiki nekuti bhodhi harisi chete chinhu chinotakura zvinhu chete. Iro chikamu chechiteshi chemagetsi, network yekuendesa simba, nzira yekupisa uye chimiro chekuvimbika. Chinhu chacho chinokanganisa zvakananga kurasikirwa kwechiratidzo, kugadzikana kweimpedance, kutsveyama kwenguva, kuwedzera kwekupisa, kugara kwesoldering uye goho rekupedzisira rekugadzira.

PCB yemazuva ano yeindasitiri inogona kusarudzwa zvakanyanya neTg, huremu hwemhangura, ukobvu hwebhodhi uye mutengo. PCB yeAI server inoda kuongororwa kwakadzama. Zvinhu izvi zvinofanirwa kutsigira kutaurirana kwedhijitari nekukurumidza pakati peGPU, CPU, zvishandiso zvekurangarira, retimers, switches, NICs, backplanes, storage controllers uye power modules. Bhodhi rinogona kunge riine akawanda ma layers, multiple lamination cycles, blind and bidden vias, back-drilling, very dense BGA escape routing uye hombe current paths.

Chinhu chinonyanya kukosha ndechekuti zvinhu zvePCB zveAI server zvinoenderana nebasa rebhodhi. GPU baseboard, accelerator card, switch board, backplane, storage controller uye power distribution board hazvidi nguva dzose laminate yakafanana. Kushandisa zvinhu zvakaderera zvakanyanya-kurasikirwa kwese kwese kunogona kuwedzera mutengo zvisina kufanira. Kushandisa standard FR-4 pama layers akakosha ekumhanya kwakanyanya kunogona kukonzera kutadza kwemagetsi. Chirongwa chakanaka chezvinhu chinoparadzanisa ma layers akakosha kubva kuma layers asiri akakosha uye chinovaka stack-up inogutsa zvese zvinodiwa zveinjiniya nezvekugadzira.

Zvinodiwa Zvekushandisa zveMabhodhi Akasiyana eAI Server

Sevha yeAI ine mhando dzakasiyana dzePCB. Bhodhi rega rega rine chiyero chakasiyana chekuvimbika kwechiratidzo, kutumirwa kwesimba, mutoro wekupisa uye kunzwisisika kwemutengo. Usati wasarudza laminate, sarudza rudzi rwebhodhi uye ma interfaces aro.

Ndosaka kutsvaga "AI server PCB materials" kusingapindurwe nezita rimwe chete rezvinhu. Mhinduro chaiyo inotanga nemepu yechiratidzo. Ndeapi ma layer ane 112G kana 224G differential pairs? Ndeapi ma traces mapfupi zvakakwana kuti akwanise kushandisa zvinhu zvakachipa? Ndeapi ma layer ari simba kana control yekumhanya kwakaderera? Ndeapi ma layer anoda huremu hwakawanda hwemhangura? Ndeapi maBGA anoda HDI? Mugadziri wePCB anofanira kuongorora mibvunzo iyi asati akurudzira stack-up.

Maitiro Ekusarudza Laminates Dzisina Kurasikirwa Kwakawanda dzeAI Server PCBs

Zvinhu zvinonyanya kutsvakwa zveAI server PCBs ndiDk naDf.Dk , kana kuti dielectric constant, inokanganisa impedance nekunonoka kwekupararira.Df, kana dissipation factor, inokanganisa kurasikirwa kwe dielectric. Pama frequency akakwira, mutsauko mudiki muDf unogona kuva mutsauko mukuru mukurasikirwa kwechiteshi, kunyanya kana kureba kwetrace kuri kure kana kana chiteshi chiine ma connectors, vias, mapakeji uye retimers.

Kune hardware yeAI server, sarudzo ye laminate inofanira kunge yakavakirwa pabhajeti rese rechiteshi, kwete chete pamutengo wedatasheet. Chinhu chine Df yakaderera chinowanzopa kurasikirwa kuri nani, asi mhedzisiro yebhodhi rapera inoenderanawo nekuoma kwemhangura, ukobvu hwe dielectric, weave yegirazi, trace geometry, kuburikidza nekuchinja, back-drilling, connector quality uye manufacturing tolerance.

Mhuri dzePCB dzinoshandiswa zvinomhanya zvakanyanya dzinoshandiswa mumasevha, networking uye mapurojekiti eHPC dzinosanganisira Panasonic MEGTRON series, Isola Tachyon neI-Tera series, Isola Astra MT77, zvinhu zvemhando yepamusoro zve laminate low-loss high-frequency, AGC materials nedzimwe nzira dzeCCL dzakanyatsokodzera low-loss. Zvisinei, mazita ezvinhu haafanirwe kutorwa seanotsiva otomatiki. Kunyangwe kana zvinhu zviviri zvine Df values ​​dzakafanana, zvinogona kusiyana muDk, copper foil option, resin flow, thickness availability, CTE, lamination behavior, peel strength uye long-term supply.
Kana dhizaini yeseva ikatsanangura MEGTRON M, Kugadzira MEGTRON M multilayer inofanira kuongororwa nechivakwa chakatenderwa kwete nechinyorwa chezvinhu zvemhuri.

Foiri yemhangura, Machira egirazi, Sisitimu yeResin uye Dhizaini yeStack-Up

Kune zvinhu zveAI server PCB, laminate ingori chikamu chimwe chete che equation yekushanda. Foil yemhangura, jira regirazi uye resin system zvakakoshawo. Kukundikana kwakawanda kwekuvimbika kwemasaini kunoitika nekuti timu yekugadzira inoongorora Drk naDf asi inofuratira roughness ye conductor, glass weave skew kana maitiro e hybrid stack-up.

1. Foiri yemhangura: nei HVLP ichikosha

Pama frequency akawanda eGHz, magetsi echiratidzo anoyerera pedyo nepamusoro pemuchina wekufambisa. Mhangura isina kusimba inowedzera nzira inoshanda yemagetsi uye inowedzera kurasikirwa kwemuchina wekufambisa. Ndokusaka ma PCB eAI server anomhanya zvakanyanya achiwanzoda mhangura isina kusimba, mhangura yeVLP, mhangura yeHVLP kana sarudzo dzakafanana dzemhangura yakatsetseka. Kune nzira refu dze112G kana 224G, kuomarara kwemhangura kunogona kukonzera kurasikirwa kukuru kwekuisa.

Paunenge uchiongorora foil yemhangura, tarisa:

• Kana chinhu chacho chichishandisa mhangura yakajairwa, RTF, VLP, HVLP kana mhangura yeHVLP3.
• Kukosha kwekuomarara kunoshandiswa mumuenzaniso wekuvimbika kwechiratidzo.
• Kana sarudzo ye copper foil iripo ye laminate ukobvu hunodiwa uye huremu hwe copper.
• Kana foil yakasarudzwa ichiramba yakasimba zvakakwana mushure mekugadzirwa nekubatanidzwa.
• Kana mugadziri wePCB achigona kudzora kuchekwa kwemitsara midiki inodiwa uye kushivirira kweimpedance.

2. Jira regirazi: kugadzikana kwe skew uye impedance

Kuruka kwegirazi kunogadzira shanduko ye dielectric yemuno nekuti chiratidzo chinogona kupfuura nepamusoro pemagirazi nenzvimbo dzine resin yakawanda. Pakumhanya kwakaderera izvi zvinogona kugamuchirwa. Pakukwira kwedata reAI server, kunyanya pamiviri yakareba, kusvetuka kwegirazi kunogona kuderedza nguva uye kuvhurika kwemaziso.

Magadzirirwo emasevhisi eAI anowanzo shandisa magirazi akapararira, magirazi eDk akaderera kana magirazi akarukwa mativi mana kuti vagadzire nzvimbo yakafanana ye dielectric. Kuronga ma differential pairi pakona diki, kushandisa ma prepreg styles akakodzera uye kuchengetedza ma pair geometry akafanana kunogonawo kubatsira kuderedza skew. Sarudzo idzi dzinofanira kukurukurwa panguva yekugadzira magadzirirwo panzvimbo pePCB yapera.

3. Sisitimu yeResin: maitiro ekupisa uye ekugadzirisa

Sisitimu yeresin inokanganisa Df, Tg, Td, kunyudzwa kwemvura, kuramba kweCAF, kuyerera kweresin uye kunaka kwelamination. Kune maPCB eAI server, resin inofanira kurarama nekupiswa kwakawanda: PCB lamination, solder mask curing, surface finish processing, reflow soldering uye kushanda kwenguva refu munzvimbo yeserver ine tembiricha yakakwira.

Mibvunzo inokosha ine chekuita ne resin inosanganisira:

• Chinhu ichi chinoenderana here nemaitiro akawanda ekugadzira lamination?
• Zvinhu zvacho zvine tembiricha yakakodzera yeTg uye kuora kwechinhu here pakugadzira puratifomu?
• Ine mwando mudiki here kuti ideredze njodzi yekuyerera kwemvura uye kuvimbika kwayo?
• Inodzivirira CAF here pakuvaka kwakasimba kwemagetsi ane simba guru kana kuti nzvimbo dzakatsetseka?
• Ko prepreg inogona kupa resin yakakwana inoyerera yakakomberedza mhangura inorema uye zvikamu zvakaoma zvemukati here?

4. Kuunganidzwa kwemhando dzakasiyana-siyana: kushanda pasina mari inodiwa

Mabhodhi mazhinji eAI server anoshandisa ma "hybrid stack-ups". Ma "critical high-speed layers" anoshandisa zvinhu zvinorasikirwa zvishoma kana kuti zvinorasikirwa zvishoma, nepo ma "low-speed" kana "power/control layers" achishandisa zvinhu zvinodhura zvishoma zvine "high-Tg" kana "low-loss" zvine "FR-4". Nzira iyi inogona kuderedza mutengo, asi inofanira kugadzirwa nokungwarira.

Kuvaka kwehybrid kunoita kuti pave nemimwe mibvunzo yekugadzira:

• Zvinhu izvi zvine CTE values ​​inoenderana here?
• Ko press cycle ichashanda here kune ese macores uye prepregs ari mu stack-up?
• Kuyerera kweresin kuchakwana here kumativi ose ane mhangura yakawanda?
• Ko bhodhi richaramba rakati sandara here mushure mekuiswa kwelamination uye kuyererazve?
• Mugadziri anogona here kuchengetedza kunyoreswa uye kushivirira impedance mukati mekuvaka kwakazara?

Kuunganidza zvinhu zvakasiyana-siyana hakufanirwe kutorwa senzira iri nyore yekuderedza mari. Inofanira kuedzeswa, kuverengwa uye kuongororwa nemugadziri wePCB usati waburitswa.

Matambudziko ekupisa, kuunza magetsi uye kuvimbika

Mabhodhi eAI server ane simba rakawanda kwazvo. MaGPU, ma accelerator, ma switch ekumhanya, zvishandiso zvekurangarira, maVRM uye ma optical kana ma networking modules zvinogona kugadzira nzvimbo dzinopisa dzemuno. Kusarudzwa kwezvinhu zvePCB kunokanganisa mashandiro ebhodhi pakubata kupisa nemagetsi, kunyangwe nzira huru yekutonhodza iri heat sink, cold plate kana liquid cooling system.

Kuendeswa kwemagetsi uye kuronga mhangura

Kuendeswa kwesimba remagetsi emagetsi akawanda kunoda mapuraneti emhangura asingapindi simba zvakanyanya, kungwarira nekugadzira uye kupatsanura zvakakwana. Kune mabhodhi eAI accelerator neGPU, kuronga mhangura hakusi kwekungoenderana nehukuru hwemabhodhi chete. Kunokanganisawo ukobvu hwebhodhi, kuenzana kwelamination, kuboora, kuputira, kufanana kwekucheka, warpage uye kushanda kwesoldering.

Zvinhu zvakakosha zvekufunga nezvazvo pakutumira magetsi zvinosanganisira:

• Huremu hwemhangura hwemukati uye kugoverwa kwemhangura.
• Kudonha kwevoltage uye kuramba kweDC kwenzira dzemagetsi.
• Kukwira kwekupisa kwakakomberedza maVRM, mapini emagetsi eGPU uye zvinobatanidza zvine simba remagetsi.
• Kuburikidza nekuverenga, kuburikidza nehukuru, ukobvu hweplating uye maitiro ekugovana magetsi.
• Kana zvikamu zvemhangura zvinorema zvichikonzera nzara ye resin kana kuti lamination voids.

Z-axis CTE uye kuvimbika kwepurasitiki kuburikidza negomba

MaPCB eAI server ane layer count yakawanda anogona kukanganiswa nekuneta nekuti bharero remhangura rakaputirwa nelaminate rinokura nematanho akasiyana panguva yekupisa. Zvinhu zvine Z-axis CTE yakaderera uye inodzorwa zvinobatsira kuderedza kushushikana pamaburi akaputirwa nepakati uye mavias. Izvi zvakakosha zvikuru kune ma backplanes akakora, midplanes, switch boards uye accelerator boards dzinoona kupisa nekutonhodza kakawanda panguva yekushanda.

Zvivharo zvekupisa, mari dzemhangura uye nzira dzekupisa dzemunharaunda

Mamwe mabhodhi eAI server anoda kupisa kuburikidza ne arrays, nzvimbo dzemhangura dzinorema, mari dzemhangura, zvinhu zvinoiswa musimbi kana zvinhu zvinopararira mukupisa zviri munzvimbo imwe chete. Zvivakwa izvi zvinofanirwa kurongwa nemaitiro ekugadzira zvinhu uye lamination. Mari yemhangura kana nzvimbo yemhangura inorema inogona kubatsira kubvisa kupisa, asi inogonawo kukonzera kusawirirana kweCTE, kusawirirana kwe soldering kana matambudziko e flatness kana isina kugadzirwa kuti igone kugadzirwa.

Kunyudzwa kwehunyoro uye kuvimbika kwekuyerera kwemvura

Kunyudzwa kwemvura shoma kwakakosha pakushandisa maPCB eAI server akavimbika zvikuru. Kunyorova mukati me laminate kunogona kuwedzera njodzi yekubvisa ganda, kuyera, kusviba kana zvimwe zvinetso zvekupisa panguva yekusvira. Izvi zvinonyanya kukosha kana bhodhi rakakora, rakakora, rakagadzirwa nezvinhu zvakasanganiswa kana kuti rakaungana neBGA hombe uye zvikamu zvekupisa zvakanyanya.

Kufunga Nezvekugadzira uye Kugadzira PCB

Chinhu chinotaridzika zvakanaka mudhatabhesi chinogona kuramba chisina kugadzirwa kana zvakaoma kugadzira kana kuunganidza. Zvinhu zvePCB zveAI server zvinofanirwa kuongororwa pamwe chete nemaitiro ese ekugadzira: kuboora, desmear, plating, imaging, etching, lamination, back-drilling, surface finish, solder mask, routing, electrical testing uye final PCB assembly.

Njodzi dzekugadzira PCB

Njodzi dzekugadzira PCB

Nekuti Highleap Electronics inopa zvese kugadzirwa kwePCB uye kuunganidzwa kwePCB, ongororo yezvinhu inofanirawo kusanganisira maitiro ePCBA. Bhodhi reAI server rakakora rine maBGA makuru, mhangura inorema, zvinobatanidza thermal mass yakawanda uye zvikamu zvinokurumidza zvakanyanya zvinogona kuda chimiro chekudzokorora chakagadzirwa uye kudzora warpage nekungwarira.

• BGA warpege: Mapakeji makuru eGPU, CPU, FPGA kana switch anoda bhodhi rakatsetseka uye kudzora kudzokororwa kwemvura kwakasimba.
• Kusawirirana kwehuwandu hwekupisa: Nzvimbo dzakakura dzemhangura uye zvinobatanidza zvikuru zvinogona kukonzera kupisa kusina kuenzana panguva yekusonera.
• Kudzora hunyoro: Kubika, kuchengeta uye kubata zvinogona kudiwa kuti zvive zvakavimbika zvakanyanya kana kuti zvisanyanya kunyorova.
• Utsanana: Mabhodhi ane huwandu hwakawanda hwezvinhu anogona kuda kudzora kusvibiswa kweionic zvakanyanya kuderedza kubuda kwemvura uye njodzi dzine chekuita neCAF.
• Inspection: Kuongorora X-ray kwakakosha paBGA, kuburikidza ne-in-pad uye majoini e solder akavanzwa.
• Kuganhurirwa kwekugadzirisazve basa: Kugadzirisazve maBGA makuru pamabhodhi eAI server akakosha kunofanira kurongwa nokungwarira nekuti kupisa kakawanda kunogona kuomesa laminate.

Njodzi dzeKugovera, Kudzora Mutengo uye Kuronga Kwechipiri

Zvinhu zvePCB zveAI server zvinowanzova zvakaoma kuwana kupfuura ma laminates akajairwa. CCL inoshanda zvakanyanya, specialty prepreg, HVLP copper foil uye magirazi chaiwo anogona kunge aine nguva yakareba ye lead, huwandu hushoma hweodha kana miganhu yekugovera. Dhizaini inoenderana nechinhu chimwe chete chisingawanzoonekwi chisina chinotsiva chakabvumidzwa inogona kunonotsa purogiramu yakazara yehardware.

Nzira yakachengeteka ndeyekugadzira hurongwa hwezvinhu panguva yekugadzira, kwete mushure mekunge mafaira eGerber apera. Hurongwa uhwu hunofanira kusanganisira zvinhu zvinofarirwa, imwe nzira inotenderwa, ongororo yekuwanikwa kwezvinhu, kuenzanisa mitengo uye kusimbiswa kwemagetsi.

Kuzivikanwa kwechinhu chechipiri hazvirevi kungotsiva chimwe chigadzirwa nechimwe. Zvinoreva kusimbisa kuti chinhu chinotsiva chinogona kusangana nezvinodiwa zvemagetsi, zvekupisa, zvemakanika uye zvekugadzira zvakafanana. Kune maPCB eAI server, kunyangwe misiyano midiki muhukobvu hwe dielectric, Dr, Df, copper roughness kana maitiro e resin inogona kuchinja mhedzisiro yekupedzisira.

Zvekutumira Highleap Electronics kuti Uongorore Zvinhu

Kuti tikurudzire zvinhu zvePCB zveAI server, Highleap Electronics inoda zvinopfuura bhodhi kana faira reGerber. Kana ongororo yezvinhu ikangotanga, zvinova nyore kuderedza mutengo, kuvandudza goho uye kudzivirira kugadzira patsva.

Kuti muwane ongororo inokurumidza uye inobatsira, ndapota tumirai ruzivo runotevera:

• Basa rebhodhi: GPU board, accelerator card, switch PCB, backplane, motherboard, NIC, storage controller kana power board.
• Mwero wedata rakatarwa: Kugadzirwa kwePCIe, kumhanya kweEthernet, mwero weSerDes, chinodiwa che112G/224G kana imwe interface inomhanyisa zvakanyanya.
• Kuverengwa kwezvikamu zvinofungidzirwa uye ukobvu hwebhodhi: Isa chero zvikamu zve impedance zvinodiwa uye ndege dzemagetsi.
• Zvinhu zvinofarirwa: Kana dhizaini yako yatove iine Megtron, Tachyon, Astra, specialty low-loss laminate, AGC, Shengyi kana imwe laminate, ipa nhamba chaiyo yechikamu kana iripo.
• Tafura yekudzivirira inodzorwa: Impedance ine magumo rimwe chete uye yakasiyana, kushivirira, mareferensi ezvikamu uye trace geometry kana zvatotsanangurwa.
• Kuunganidza zvinhu zvakaunganidzwa kana kuti zvekutanga: Ukobvu hwepakati/prepreg, huremu hwemhangura uye basa rekuisa jira rinomhanya zvakanyanya.
• Tsanangudzo dzeBGA: Kukwira kwebhora, huwandu hwebhora, saizi yepakeji, zvinodiwa kuburikidza ne-in-pad uye zvipingamupinyi zvenzira dzekutiza.
• Simba rinodikanwa: Matanho emagetsi ane simba guru, huremu hwemhangura, nzvimbo dzinopisa, simba remagetsi rinobatanidza magetsi uye kudonha kwemagetsi.
• Ruzivo rwekuungana: BOM, faira rekuisa, mapakeji makuru eBGA, mapedhi ekupisa, kunzwisiswa kwekuyerera kwemvura uye zvinodiwa pakuongorora.
• Chirongwa chekugadzira: Huwandu hwemuenzaniso, kuvaka kwekutanga, kufanotaura kwekugadzirwa kwezvinhu zvakawanda uye zuva rekutumira zvinhu.

Mibvunzo Inowanzo bvunzwa Nezvezvinhu zveAI Server PCB

Ndeipi PCB yakanakisa yekushandisa mabhodhi eAI server?

Hapana chinhu chimwe chete chakanakisa chebhodhi rega rega reAI server. Mabhodhi eGPU, mabhodhi ekumhanyisa, mabhodhi ekuchinjana, mabhodhi ekumashure, maNIC uye mabhodhi emagetsi ane zvinodiwa zvakasiyana. Ma layers akakosha anomhanya zvakanyanya anowanzoda ma laminates ane kurasikirwa kwakaderera, kurasikirwa kwakaderera zvakanyanya kana kurasikirwa kwakaderera zvakanyanya ane mhangura yakatsetseka. Zvikamu zvekudzora zvemagetsi kana zvekukurumidza kwakaderera zvinogona kushandisa zvinhu zve high-Tg kana zvakagadziriswa zveFR-4 kana zvinodiwa zvemagetsi nekupisa zvichibvumira.

Ko maPCB eAI server anogona kushandisa standard FR-4 here?

Standard FR-4 inogona kugamuchirwa kune vanodzora vanomhanya zvishoma, vane simba riri nyore kana kuti vasina kukosha, asi kazhinji haikodzeri nzira refu dzeSerDes dzinomhanya zvakanyanya mumasisitimu eAI server. Kune 112G, 224G kana dzimwe nzira dzakafanana dzinomhanya zvakanyanya, dhizaini yacho inowanzoda laminate inorasikirwa zvishoma, mhangura yakapfava uye kugadzikana kuri nani kweDk.

Sei Drk naDf zvichikosha kune zvinhu zveAI server PCB?

Dk inokanganisa impedance uye kunonoka kwekupararira kwemasaini. Df inokanganisa kurasikirwa kwe dielectric. MuAI server PCBs, nzira dzinomhanya zvakanyanya dzinoshanda pama frequency apo kurasikirwa kwe dielectric uye kurasikirwa kwe conductor kunogona kuderedza margin yesignali. Dk yakagadzikana uye Df yakaderera inobatsira kuchengetedza impedance inodzorwa uye kuderedza kurasikirwa kwe insertion.

Ndeipi foil yemhangura inofanira kushandiswa kumaPCB eAI server anomhanya kwazvo?

MaPCB eAI server anomhanya zvakanyanya anowanzo shandisa VLP, HVLP kana mamwe mafoil emhangura asina kunyatsogadzirwa kuti aderedze kurasikirwa kwemuchina. Kana mhangura yakapfava, kurasikirwa kwemuchina wepamusoro-soro kunowanzova kwakaderera. Foil chaiyo inofanira kusarudzwa pamwe chete ne laminate, kumhanya kwechiratidzo, kureba kwetrace uye maitiro ekugadzira.

Chii chinonzi girazi weave skew uye nei ichikosha?

Kutsveyama kwegirazi kunoitika kana maronda maviri ari mu differential pair akasangana nemamiriro akasiyana e dielectric nekuda kwechimiro chegirazi rakarukwa mu laminate. Pahuwandu hwe data rakawanda, izvi zvinogona kukonzera kusawirirana kwenguva uye kuderedza mukana wekuona. Girazi rakapararira, girazi reDk rakaderera, maitiro akakodzera ekugadzirira uye nzira yekufambisa zvinhu zvinogona kubatsira kuderedza njodzi iyi.

Ko ma "hybrid stack-up" akakodzera here maAI server PCB?

Ehe, kuunganidzwa kwemahybrid kunowanzoitika kana dhizaini ichida kuenzana nekushanda nekukurumidza uye mutengo. Chinhu chikuru ndechekuisa zvinhu zvisinganyanyi kurasikirwa chete pazvinodiwa uye kushandisa zvinhu zvisingadhuri zvakanyanya kune dzimwe nzvimbo. Zvisinei, zvinhu zvehybrid zvinofanirwa kunge zvine maitiro anoenderana elamination, CTE uye mahwindo ekugadzira.

Ndezvipi zvinhu zvinofanira kuongororwa kunze kwaDk naDf?

Zvinhu zvakakosha zvinosanganisira Tg, Td, T288, Z-axis CTE, kunyudzwa kwemvura, kuramba CAF, simba remaganda, huwandu hwe resin, kushata kwe copper foil, kuwanikwa kwe prepreg uye kuenderana ne multiple lamination cycles. Zvinhu izvi zvinokanganisa kugadzirwa, kuvimbika kwe assembly uye kushanda kwenguva refu.

Kusarudzwa kwezvinhu kunofanira kukurukurwa nekukurumidza sei nemugadziri wePCB?

Kusarudzwa kwezvinhu kunofanira kukurukurwa usati waisa marongero ekupedzisira pese pazvinogoneka. Kune maPCB eAI server, zvinhu zvinokanganisa upamhi hwetrace, spacing, impedance, layer thickness, via structure, back-drilling uye cost. Kana zvinhu zvikachinjwa mushure mekuisa marongero, stack-up uye signal integrity zvingada kuverengerwa patsva.

Ndeapi mafaira anodiwa kuti uwane mashoko eAI server PCB?

Kuti muwane mashoko ekuwedzera uye kuongorora mainjiniya, tumirai mafaira eGerber kana ODB++, kurongedza, zvinodiwa zveimpedance, zvinodiwa nezvinhu, mafaira ekuboorera, ukobvu hwebhodhi, huremu hwemhangura, kupedzisa kwenzvimbo, BOM, faira rekutora nekuisa uye zvinodiwa pakuunganidza. Kana dhizaini isiri yekupedzisira, ruzivo rwekutanga rwekurongedza nekumhanya kweinterface ruchiri kubatsira.

Ko Highleap Electronics inogona kubatsira pakugadzira PCB uye kugadzira PCB here?

Ehe. Highleap Electronics inotsigira kugadzirwa kwePCB uye kuunganidzwa kwePCB. Kune mapurojekiti eAI server nemakomputa anoshanda zvakanyanya, kuongorora kugadzirwa nekuunganidzwa pamwe chete kunobatsira kuderedza njodzi dzine chekuita nekusarudzwa kwezvinhu, warpage yebhodhi, BGA soldering, thermal mass, kuongorora uye goho rekugadzira.