Demystifying BGA Soldering: Mazano uye Maitiro Akanakisisa

BGA PCB tekinoroji inopa akawanda mabhenefiti pamusoro pewaya ICs, zvichiita kuti ive sarudzo yakasarudzika yemagungano emazuva ano emagetsi. Aya mabhenefiti anosanganisira diki imba, yakakwirira kurongedza uye pini densities, yakagadziridzwa masaini ekufambisa zvivakwa, uye zvirinani kupisa kwekubatanidza kune redunhu bhodhi. Mafomu achangoburwa ezvikamu zveBGA, seVFBGA (Yakanaka Kwazvo BGA), inoratidzira zviuru zvakati wandei mapini ekubatanidza ane gomo risingasviki 0.5mm, zvichigonesa hukuru hwekubatanidza densities.

Munguva yekuungana kweBGA PCB zvikamu, nzira yekutengesa inoshandiswa, apo zvinhu zvakawanda zvinouya. Mhedzisiro yeichi chiitiko chinowanzo kupedzisa matte, zvichiratidza kuvimbika kwakanyanya pakati pebhora uye redunhu bhodhi, pamwe nekudzikama kwepamusoro-kwenguva refu kugadzikana, kurongeka kwemuviri webhora, conductivity, kutendeseka kwechiratidzo chemagetsi, uye kuramba kwekudzivirira. pini dzepedyo.

Kudyidzana pakati pezvimiro zvemuviri uye zvinokonzeresa zvemagetsi zvinhu zvakakosha mukunzwisisa maitiro eBGA PCB zvikamu. Iyo solder process inosanganisira kunyunguduka kwe solder mabhora ane solder paste, kugadzira kemikari inopindirana nepamusoro pebhodhi redunhu, kugadzira iyo intermetallic zone. Iyo yakafanana intermetallic zone iripo pakati pe chip nemuviri webhora, iyo inofanirwa kunge yakagadzikana pamillionhm level.

Pasinei nekunzwisisa kwe theoretical, mashandisirwo anoshanda anogona kutungamirira kune zvikanganiso, zvese zvakarongeka uye zvisina tsarukano, izvo zvinogona kukanganisa zvakanyanya magetsi paramita. Kunyangwe mubatanidzwa unooneka wakakwana we solder hauvimbisi kusununguka kubva mukukanganisa, sezvo nyaya dzakaonda kana mafuta solder majoini zvinogona kuitika, zvichikanganisa kubata kwemagetsi.

Iyo IPC-A-610E chiyero inoita basa rakakosha mukuongorora majoini ekutengesa eBGA PCB, ichitsanangura maitiro ekugamuchirwa emagungano emagetsi. Izvo zvakakosha kuti masisitimu ekugadzira ave nechokwadi chekuenderana neichi chiyero, sezvo zvimiro zvisina kugadzikana solder majoini anogona kupaza pasi pemechani kushushikana, zvichikonzera kurasikirwa kwemagetsi conductivity. Zvisinei, zvakakosha kuziva kuti zvikanganiso zvakawanda zvine chokuita nechimiro chemuviri wekutengesa zvinongova nemigumisiro yakakosha yemagetsi pahutano hwakanyanya.

BGA Storage Management

Tekinoroji yeBGA soldering nemidziyo zvakakosha, asi BGA Storage Management haifanirwe kuregeredzwa. Zvikamu zveBGA zvinhu zvinoteerera tembiricha yepamusoro uye zvinofanirwa kuchengetwa mumamiriro ekunze ekupisa uye akaoma nguva dzose. Tevere, ngatitarisei BGA Storage Management.

• Nzvimbo yekuchengetera: 20-25 ℃, humidity isingasviki 10% RH.
• Kubika mamiriro: tembiricha 125 ℃, hunyoro hunyoro ≤60% RH.
• Nzvimbo yemusangano: tembiricha yakatenderedza 25 ℃, humidity 55% RH.

J-STD-020 mwando senitivity level

BGA kubika nguva

Kudhinda Simbi Stencil Dhizaini

Yakakwana BGA soldering haiparadzaniswe kubva kuBGA Steel Stencil. Aya anotevera paramita anogona kutaurwa kune iyo BGA Steel Stencil:

1: Kushandisa electric polishing + laser simbi stencil mesh -- Kuvhura upamhi ndeye 0.1mm

2: Kushandisa electroformed simbi stencil mesh ——- Pitch = 0.35mm CSP, yakakwenenzverwa Mudhuri wegomba wakatsetseka pasina maburrs, uye solder paste ine yakanaka yekudhiza mhedzisiro Kuvhura kwakaringana, kutsetseka kwegomba madziro, kuzadzisa zvinodiwa zvekuvhura zve0402, 0201 zvikamu.

Kuvhura zvimiro zvereferenzi kune solder paste kudhinda matemplate:

Tarisa kune IPC yakajairwa kuita: IPC 7525: Simbi Stencil Dhizaini Mirayiridzo

Kutarisisa kweakajairwa kukanganisa zvikamu zveBGA soldering majoini

Heino tarisiro yakagadziridzwa yeakajairwa zvikanganiso zveBGA PCB soldering majoini, pamwe nerumwe ruzivo nezve nzira dzekuongorora uye matekinoroji:

Mhedziso yeMakakatanwa eChikanganiso cheBGA PCB Soldering Joints

1. Yakashata Lotkorpus:
   • Mechanical/Optical Kuonekwa: Chimiro chedenderedzwa chisina kunaka, nzvimbo isiriyo, pores (voids), nzvimbo isiriyo, kureba kwebhora rekutengesa, kushomeka kwekurongana.
   • Magetsi Kuonekwa: RBK (Kupikisa Pakati Pemabvi) haisati yachinja, RBK = ∞ (yakavhurika kubatana), pfupi pfupi pakati pemabhora.
   • Zvikonzero Zvingangoitika: BGA-Chip (Bhora), solder paste mhando, solder paste application, assembly offset, solder profile, pad design.
2. Kusasimba Pakati Pebhora uye Solder Paste ("Musoro muPillow"):
   • Mechanical/Optical Kuonekwa: Yakarurama spherical chimiro, kusvibiswa layer pakati pebhora uye solder paste, hapana mechanic inotakura mutoro.
   • Magetsi Kuonekwa: RIZ (Resistance In Zone) = ∞ (yakavhurika yekubatanidza), kuonana kwenguva pfupi kuburikidza nemutoro wemuchina.
   • Zvikonzero Zvingangoitika: BGA-Chip (Bhora), solder paste mhando, solder profile.
3. Kusasimba Pakati peSolder Joint uye Circuit Board ("Black Pad"):
   • Mechanical/Optical Kuonekwa: Yakarurama spherical chimiro, kusvibiswa layer pakati pebhora uye solder paste, makatsemuka munzvimbo yeintermetallic, yakasviba pad discoloration, yakaderera mehendi kusimba (kuparara).
   • Magetsi Kuonekwa: RIZ = ∞ (yakavhurika yekubatanidza), inotungamira kune mechaniki kushushikana kwekusangana kwenguva pfupi, RIZ mune yakajairika renji, yekubatanidza inoputika pasi pemutoro (yakavhurika solder joint).
   • Zvikonzero Zvingangoitika: PCB mhando, soldering mbiri.

Ruzivo Rwokuwedzera paNzira dzekuongorora:

• X-Ray Inspection (AXI): Inoshandiswa pakuongorora otomatiki yemagungano eBGA, inosangana nezvinodiwa sekuongorora kwakazara zvinoenderana neIPC-A-610E, mwero wearamu wenhema wakaderera, uye rutsigiro rweSPC.
• X-Ray Kuongorora neOptical Inspection (AXOI): Inosanganisa AXI neAOI mune imwe sisitimu, ichipa yakakwira-density BGA gungano rekuongorora kugona.
• Boundary Scan Method (IEEE1149.x): Nzira yakavimbika inoshanda isina adapta, inoshandiswa pakuona kusasimba kwemhosva uye kukanganisa mumagungano eBGA, kunyangwe kumagungano epamusoro-soro ane embedded conductor tracks.
• 3D AXI Systems: Shandisa tomosynthesis kuti uongorore zvakanaka, kusangana neIPC-A-610 maitiro ane chekuita neBGA solder joints.

Idzi nzira uye matekinoroji akakosha pakuita shuwa uye kuvimbika kweBGA PCB majoini ekutengesa, kunyanya munzvimbo dzemazuva ano dzekugadzira SMD.

Kuziva uye Kugadzirisa Zvakajairwa BGA Zvikanganiso

Ball Grid Array (BGA) zvikamu zvinopa zvakawanda zvakanaka, asi zvinouyawo nematambudziko chaiwo, kunyanya panguva yekugadzira. Kunzwisisa uye kugadzirisa zvakajairika BGA kukanganisa kwakakosha pakuona kuvimbika uye kuita kwemidziyo yemagetsi. Heano mamwe ezvakanyanya kukanganisa uye maitiro ekuzvideredza:

1. Kusarongeka: Izvi zvinoitika kana PCB neBGA zvisina kurongeka zvakanaka panguva yekudzokororwa kwemvura, zvichikonzera kubatana kusina kunaka. Kuti udzivise kusarongeka, shandisa michina nematekiniki akakodzera ekuisa BGA uye iva nechokwadi chekuti BGA yarongeka zvakanaka usati waisa solder.

2. Kureba Kusingachinji: Kusunga zvisina kunaka kunogona kukonzera kuti BGA igare pakona paPCB, zvichikanganisa kuchengetedzeka kwekubatana. Kuti ugadzirise izvi, shandisa paste yakakwana yekuisa uye ita shuwa kuti kupisa nekutonhodza kwakakodzera panguva yekudzoreredza mvura kuti uwane kukwirira kwakafanana kwekuisa.

3. Mabhora Asipo: Mabhora Asipo anogona kukonzera kuti nzvimbo dzakakosha dzekubatanidza dzisavepo pamusangano. Kuti izvi zvisaitike, iva nechokwadi chekuti maBGA abatwa zvakanaka uye achengetwa zvakanaka musati maungana uye tarisai kuti hamuna mabhora asina kuungana here musati mabatanidza.

4. Mapedhi Asina Kunyoroveswa: Paste yekusolder yakadzoserwa mvura inogona kusanyorovesa pad nemazvo, zvichiita kuti pasave nekukwana kwekubatanidza. Kuti izvi zvisaitike, iva nechokwadi chekuti maPCB akachena zvakanaka usati waisa paste uye shandisa paste yekusolder yakakodzera pakushandisa.

5. Mabhiriji: Kuisa paste yakawandisa pakati pemapureti kunogona kukonzera mabhiriji pakati penzvimbo dzekubatanidza, zvichikonzera mapfupi. Kuti udzivise mabhiriji, shandisa huwandu hwakakodzera hwepaste yakabatana uye iva nechokwadi chekuti stencil yakagadzirwa zvakanaka kuti paste igare.

6. Kudzoserwa Kwemvura Zvishoma: Kudzoserwa kwemvura zvisina kukwana kunogona kukonzera kusakwana kwekufukidza kwesolder pabhodhi. Kuti ugadzirise izvi, iva nechokwadi chekuti mapurofayiri ekudziya nekutonhodza akakodzera panguva yekudzoserwa kwemvura uye tarisa kuti hapana kuzara kwemvura mushure mekuzoserwa kwemvura.

7. Kuboorwa kwePopcorning: Kuboorwa kwePopcorning kunoitika kana mabhora akabatana panguva yekuboorwa, zvichikonzera mashorts. Kuti udzivise kuboorwa kwePopcorning, iva nechokwadi chekuti maBGA akachengetedzwa zvakanaka uye anoshandiswa zvakanaka uye shandisa ma profiles akakodzera ekuboorwa kwepombi.

8. Macircuit Akavhurika: Muchina unonyungudutsa usinganyorovese PCB pad unogona kukonzera macircuit akavhurika. Kuti udzivise macircuit akavhurika, iva nechokwadi chekuti une matekiniki akakodzera ekunyungudutsa uye tarisa kana paine matambudziko ekunyorovesa usati wagadzira.

9. Kusashanda: Kusashanda kunogona kuitika kana kuyerera kwesolder kwamira kusvika padhuze nekubatana, kunyanya muzvikamu zveBGA zvinopetwa. Kuti udzivise kusashanda, shandisa solder paste yakakodzera uye iva nechokwadi chekuti kupisa kwakaringana panguva yekudzoreredza.

Zvakanakira zveBGA Chips

Diki Size, Big Impact

BGA machipi, kana Ball Grid Array machipisi, imhinduro yeshanduko yakagadzirirwa kuwedzera kugona kwenzvimbo pamabhodhi edunhu, kunyanya mumidziyo midiki. Iyi dhizaini yekugadzira inobvisa kudiwa kweinotungamira inotungamira, pachinzvimbo kushandisa solder mabhora pahwaro hwepasuru yekubatanidza magetsi. Nekuda kweizvozvo, machipisi eBGA haango chengetedza nzvimbo chete asi zvakare anobvumira kune denser uye yakanyanya kuoma dunhu musanganiswa.

Compact Dhizaini yeSpace Optimization

Imwe yemabhenefiti akanyanya kukosha eBGA machipi ndeye compact size, iyo inogonesa kushandiswa kunoshanda kwebhodhi nzvimbo. Iyi ficha inonyanya kubatsira pakugadzira zvitete uye zvidiki zvigadzirwa zvemagetsi, uko nzvimbo iri pamubhadharo. Nekubvisa inotungamira inotungamira, BGA machipi anovhura nzira yeakapfava uye akakwenenzverwa madhizaini.

Precision Alignment yeKuvimbika

BGA machipisi akagadzirwa ane spherical solder majoini ayo anongoenderana nekurongedza. Iyi yekuzvigadzirisa-yega inogonesa kurongeka kana chip ichiiswa pabhodhi redunhu, ichiwedzera kuvimbika kweiyo chip. Iyi nzira yekuenzanisa inoderedza zvakanyanya njodzi yekukanganisa uye kusagadzikana panguva yekugadzira, zvichitungamira kune emhando yepamusoro zvigadzirwa.

Mutengo-Unobudirira Manufacturing

Magadzirirwo emachipisi eBGA anobatsira mukuwedzera kwegoho rekugadzira, zvichizopedzisira zvaderedza mari yekugadzira. Zvichienzaniswa nedzimwe mhando dzemachipisi, machipisi eBGA anopa mhinduro inodhura zvishoma nekuda kwekureruka uye kukwanisika kwekugadzirisa nekugadzirisa. Kubudirira kwemutengo uku kunoita kuti machipisi eBGA ave sarudzo inokwezva vagadziri vari kutsvaga kugadzirisa maitiro avo ekugadzira.

Inoshanda Rework uye Desoldering

BGA machipisi anoratidza akakura solder pads, ayo anofambisa basa reworking uye desoldering maitiro. Kungave uchishandisa bhati yekugezesa kana mhepo inopisa, mapedhi akakura anogadzirisa uye anotsiva nekukurumidza uye nyore. Izvi zvinoderedza nguva yekudzikira uye inoenderana nemitengo yekugadzirisa, zvichiita kuti BGA machipi ive sarudzo inoshanda yemidziyo yemagetsi inoda kugara ichigadziriswa.

Enhanced Conductivity for Improved Performance

Iyo diki saizi uye akawanda majoini eBGA machipi anokonzeresa conductivity yepamusoro kana ichienzaniswa nedzimwe mhando dzechip. Iyi yakawedzera conductivity inoderedza mukana wekukanganiswa kwechiratidzo, zvichiita kuti BGA machipi ave akakodzera kune yakakwirira-kumhanya uye yakakwirira-frequency maseketi. Iyo yepamusoro conductivity yeBGA machipisi inova nechokwadi chekushanda kwakakwana mukuda maapplication.

Inoshanda Thermal Management

BGA machipisi anokunda mukupararira kwekupisa, kunyatso gadzirisa kupisa kuchengetedza kuita kwakaringana. Dhizaini yeBGA machipi inosimudzira kupisa kutapurirana kunyatsoita, kuve nechokwadi chekuti chip inoramba ichitonhorera kunyangwe pasi pemitoro inorema. Pamusoro pezvo, machipisi eBGA anogona kushandiswa pamwe chete nekupisa-kubvisa zvinhu senge masingi ekupisa kana kupisa vias kuti vawedzere kusimudzira kugona kwavo kwekupisa.

Kazhinji, machipisi eBGA ane mabhenefiti akawanda anoita kuti ave sarudzo inofarirwa nevagadziri vanoda kuwedzera nzvimbo, kuvimbika, uye mashandiro mumidziyo yavo yemagetsi. Nekugadzirwa kwavo kudiki, kurongeka kwakaringana, kugadzirwa kusingadhuri, kugona kugadzirisa patsva zvinobudirira, kufambisa kwemhepo zvakanyanya, uye kutonga kwakanaka kwekupisa, machipisi eBGA mhinduro ine simba yemagetsi emazuva ano.

Kana chirongwa ichi chachinja kubva pakutsvagisa kuenda kuRFQ, ongorora dhizaini ye microvia neHDI uye simba re transformer PCB kuitira kuti zvinhu, maitiro, uye zvinodiwa pakuongorora zvirambe zvakaenzana.

Sei Sarudza Highleap Electronics kune Yako PCB&PCBA Inoda

Highleap Electronics ndiyo yako yekutanga sarudzo yePCB nePCBA kugadzira, nekuda kweruzivo rwedu rwakakura uye hunyanzvi. Nemakore eruzivo rweindasitiri, tinogara tichiendesa epamusoro-notch maPCB uye maPCBA magungano anosangana kana kudarika epamusoro-soro. Chikwata chedu chakazvitsaurira chevashandi chinovimbisa kugutsikana kwako nhanho dzese dzenzira, kubva kune prototype kusvika kugadzira.

State-of-the-Art Facilities uye Customization Sarudzo

Nzvimbo dzedu dzemazuva ano dzakashongedzerwa tekinoroji yekucheka-cheka, zvichitibvumira kuti tipe huwandu hwakawanda hwesarudzo dzekugadzirisa kuti tisangane nePCB yako yakasarudzika uye PCBA zvinodiwa. Kunyangwe iwe uchida diki prototype kumhanya kana yakakura-yakakura kugadzirwa, isu tinogona kugadzirisa masevhisi edu kuti aenderane nezvido zvako. Kuzvipira kwedu kusimbisiro yemhando inovimbisa kuti PCB yese nePCBA inosiya nzvimbo yedu ndeyemhando yepamusoro uye yakavimbika.

Competitive Pricing uye Mutengi Kugutsikana

Isu tinonzwisisa kukosha kwezvigadziriso zvinodhura paHighleap Electronics. Ndosaka tichipa mitengo yemakwikwi pasina kukanganisa pamhando yePCB dzedu nePCBA magungano. Kutarisa kwedu pakugutsikana kwevatengi kunotyaira zvese zvatinoita, kubva pakupa sevhisi yakasarudzika nerutsigiro kusvika pakuunza maPCB ako nePCBA magungano nenguva uye mukati mebhajeti. Sarudza Highleap Electronics yePCB yako nePCBA zvinodiwa uye uzvionere mutsauko.

mhedziso

Munguva yekuungana kweBGA PCB zvikamu, nzira yekutengesa inoshandiswa, uko zvinhu zvakawanda zvinotamba basa rakakosha. Mhedzisiro yeiyi maitiro anowanzo kupedzisa matte, zvichiratidza kuvimbika kwakanyanya pakati pebhora uye redunhu bhodhi, pamwe nekuvimbika kwechimiro, conductivity, kutendeseka kwechiratidzo chemagetsi, uye kushomeka kwekudzivirira kune vavakidzani mapini emuviri webhora. Pasinei nekunzwisisa kwe theoretical, mashandisirwo anoshanda anogona kutungamirira kune zvikanganiso, zvese zvakarongeka uye zvisina tsarukano, zvinokanganisa zvakanyanya magetsi paramita. Kunyangwe majoini anotaridzika akakwana haavimbise rusununguko kubva mukukanganisa, sezvo nyaya dzakaonda kana mafuta solder majoini zvichigona kuitika, zvichikanganisa kubata kwemagetsi.