ENEPIG VS ENIG: Kuongorora Misiyano

Kusarudzwa kwependi yepamusoro hakusi kungotsanangura chete - chinhu chinonyanya kukosha pakushanda kwePCB yako uye hupenyu hwayo. Nhasi uno kune vatambi vaviri vane mukurumbira muindasitiri iyi: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) ine simba uye inoshanda zvakasiyana-siyana uye yakavimbika, Electroless Nickel Immersion Gold ( ENIG ).

Chii chinonzi ENEPIG

Uku kupedzisa kwepamusoro ndeye multilayer coating ine electroless nickel, electroless palladium, uye yepamusoro denga rekunyudza goridhe. Iyo palladium layer inoshanda sechivharo kune nickel, kudzivirira ngura uye kuwedzera kusimba kwese kwekupedzisira.

Chii chinonzi ENIG

ENIG, kune rumwe rutivi, ivharo rine mativi maviri rinotangawo neelectroless nickel asi rinoteverwa zvakananga nejira regoridhe rakanyudzwa. Kupedzisa uku kunozivikanwa nekunaka kwayo solderability uye waya bondability.

ENEPIG VS ENIG: Kuenzanisa Kuongorora

1. Layer Composition

• ENEPIG: Kupedzisa uku kune mitsara mitatu: base nickel, palladium layer, nepamusoro pegoridhe. Iyo palladium inoshanda sechipinganidzo pakati penickel negoridhe layer.
• ENIG: ENIG inosanganisirawo zvidimbu zviviri pamusoro pemhangura substrate, asi nickel chete negoridhe. Iyo haina palladium layer iripo muENEPIG.

2. Corrosion Resistance uye Kuvimbika

• ENEPIG: Iyo palladium layer muENEPIG inopa imwe dziviriro kubva mukuora, kunyanya dema pad syndrome, chirema chakasangana mu ENIG kupera. Izvi zvinoita kuti ENEPIG iwedzere kuvimbika pakushandisa kwenguva refu.
• ENIG: Nepo ENIG ichipa kunaka kwekusagadzikana, inotapukirwa neblack pad syndrome nekuda kwekusangana kwakananga pakati penickel negoridhe layer.

3. Wire Bonding Kugona

• ENEPIG: ENEPIG inoshanda zvakasiyana-siyana, yakakodzera kune zvese zviri zviviri soldering uye wire bonding. Izvi zvinoita kuti ive yakanaka kune yakaoma uye yakakwirira-yakavimbika maapplication.
• ENIG: ENIG inowanzokodzera kushambadzira asi haikurudzirwe kusungirirwa kwewaya nekuda kweiyo goridhe layer inokwanisa brittleness.

4. Kufunga Kwemari

• ENEPIG: Kuwedzerwa kwepalladium layer muENEPIG kunogona kuita kuti idhure kupfuura ENIG. Nekudaro, kuvimbika kwayo kwakawedzerwa kunogona kururamisa mutengo mune yakakwirira-kuvimbika maapplication.
• ENIG: ENIG kazhinji isingadhure pane ENEPIG uye inodhura-inoshanda sarudzo yeyakajairwa PCB application.

5. Kushandisa Kukodzera

• ENEPIG: Yakanyanya kukodzera kune yakaoma, yakakwirira-density mabhodhi uko kuvimbika kwakakosha. Kuenderana kwayo nezvose zviri zviviri soldering uye waya bonding kunoita kuti ive inogoneka kune akasiyana emagetsi maapplication.
• ENIG: Yakanakira general PCB application uko gungano rinosanganisira chete soldering. Inoshandiswa zvakanyanya nekuda kweiyo yakanaka solderability uye flat surface.

Mainjiniya vanowanzo simbisa nyaya iyi pamwe chete nekugona kwePCBA assembly uye controlled impedance stackup pavanenge vachigadzirira PCB kana PCBA build yakavimbika.

ENEPIG VS ENIG: Kuita Sarudzo Yakarurama

Kusarudza pakati peENEPIG neENIG kunoenderana zvakanyanya nezvinodiwa zvePCB application yako. Kana iwe uchida kupedzisa kunopa kusarudzika kwewaya bonding masimba, corrosion resistance, uye kusimba kwepamusoro-kuvimbika maapplication, ENEPIG ndiyo nzira yekuenda. Nekudaro, kune zvakajairwa zvikumbiro apo mutengo uri chinhu chakakosha, uye kutengesa ndicho chinonyanya kunetseka, ENIG inopa imwe nzira inogoneka.

Rangarira, kupedzisa kwepamusoro hakungokwidziri kushanda kwePCB yako chete asiwo kunowedzera hupenyu hwayo, kuve nechokwadi chekuvimbika uye kushanda zvakanaka mumashandisirwo ako emagetsi.