Masevhisi eFine Pitch SMT Assembly eHigh-Density Circuit Boards
Zviri mukati
- Chii Chinonzi Fine Pitch SMT Assembly?
- Kugadzirwa kwePCB Kunokanganisa Sei Kubudirira Kwekugadzira Fine-Pit?
- Stencil neSolder Paste zvinorongwa sei?
- Zvikamu Zvidiki Zvinotorwa Sei Uye Zvinobatwa Sei?
- Kuiswa uye Kudzokororwa Kwezve Zvakaonekwa Sei?
- Ndekupi Kuongorora Kunodiwa Pakugadzwa kwePCB Yakagadzirwa Nesimbi?
- Mutengo weKugadzira SMT Fine Pitch, Nguva Yekutungamira uye Kugadzirisazve
- Kumbira Mutengo weFine Pitch SMT Assembly
- Mibvunzo yeFine-Pitch SMT Assembly
Masevhisi ekubatanidza SMT anodiwa kana nzvimbo yepad, saizi yezvikamu kana huwandu hwebhodhi husina mhedzisiro yakawanda. Dambudziko rinogona kubva kuQFP, BGA, QFN, CSP, LGA, mapassive madiki, maconnector akapatsanurwa kana musanganiswa wemapakeji ane zvinodiwa zvakasiyana zve solder-volume uye thermal.
Highleap Electronics inoongorora kuunganidzwa kweSMT kwakawanda padanho reprojekiti. Kugona kwayo hakugone kusimbiswa kubva panhamba imwe chete; paki chaiyo, patani yenyika, mask yekusolder, kuburikidza nechimiro, ukobvu hwebhodhi, rutsigiro rwepaneru, zvikamu zviri pedyo uye zvinodiwa zvekuongorora zvese zvinokanganisa nzira. Highleap inogona kutsigira prototype, NPI, pilot uye kudzokorora kugadzirwa mushure mekuongorora mafaira nerondedzero yemapakeji.
Kuti muwane mutengo, tumirai mafaira ePCB, BOM nehuwandu. Zivai zvikamu zvakakosha zvepitch fine-pitch kana pasi-term kana zvichizivikanwa. Kana mutengi asingazive pitch yepakeji, Highleap inogona kuongorora data reBOM nebhodhi pane kuda pfupiso yakadzama yepakeji musati mabvunza.
1. Chii Chinonzi Fine Pitch SMT Assembly?
Izwi rekuti fine pitch PCB assembly rinotsanangura zvinopfuura lead spacing. Bhodhi rinogona kunge rakaoma nekuda kwe 0201 kana ma passives madiki, narrow-pitch gull-wing packages, fine-pitch BGA, QFN thermal pads, dense component spacing kana ma thin/irregular boards. Highleap inoongorora musanganiswa wepakeji yese kuburikidza neSMT PCB assembly review.
| mamiriro | Nei ichideredza mhedzisiro yemaitiro | Ongororo yekutarisa |
|---|---|---|
| Zvishomanana zvepasita | Huremu hushoma uye mapedhi madiki anowedzera kuiswa uye kunzwa kwekusvetukira. | Maitiro emadziro, kuburitswa kwestencil, kuiswa kwayo uye njodzi yekutemwa nematombo. |
| QFP yakanaka kwazvo | Mitsetse iri pedyo inowedzera njodzi yekukwira kwebhiriji uye kukwira kwemitengo. | Maitiro enzvimbo, vhoriyamu yekunamira, kurongeka uye kuonekwa kweAOI. |
| BGA/CSP | Majoini e solder akavanzwa uye kurongedza/kurongedza bhodhi kunokosha. | Fanout, kuburikidza nedhizaini, hunyoro, kuyererazve kwemvura uye X-ray plan. |
| QFN/LGA | Pedhi hombe yekupisa uye majoini akavanzika anoda paste yakaenzana. | Maitiro ekuvhura, kuvhura, kurongeka uye kuongorora. |
| Mapakeji akasanganiswa akawandisa | Stencil imwe chete neprofile zvinofanira kutsigira zvakasiyana-siyana zvekuisa uye zvinodiwa pakupisa. | Stencil yematanho, kugadzirisa aperture, kutevedzana kwemifananidzo uye hwindo reprofile. |
Saka mugadziri weSMT assembly anofanira kusimbisa kugona kwayo mushure mekuongorora faira uye kwete kutengesa pitch shoma sehumbowo hwekuti dhizaini yega yega yakakodzera.
2. Kugadzirwa kwePCB Kunokanganisa Sei Kubudirira Kwekugadzira Fine-Pitch?
Magadzirirwo evhu, tsananguro yesolder-mask, kugadzirwa kwe-via-in-pad, kupedzisa kwepedhi, fiducials uye rutsigiro rwepaneru zvinokanganisa zvakananga kudhinda, kuisa uye kuongorora. Highleap inotarisa PCB yakaburitswa ichienzanisa nepakeji chaiyo yezvikamu uye inoona matambudziko anogona kugadzira mabhiriji, kusakwana kwesolder, zvikamu zvinoyangarara, kusashanda zvakanaka kana kusarongeka zvakanaka.
- Tarisa saizi yepedhi uye nzvimbo pakati pepakeji yakasarudzwa.
- Ongorora mawebhu e solder-mask uye mhangura yakavhurika yakakomberedza zvinhu zvakanaka.
- Simbisa kuburikidza nekuzadza mupad kana kuvhara uko kurasikirwa kwesolder kuri njodzi.
- Tarisa mafiducial epasi rose neemunharaunda kuti aone kana michina yacho yakabatana.
- Ongorora kucheneswa kwemucheto webhodhi, njanji dzepaneru uye rutsigiro pasi penzvimbo dzakamanikana.
- Tsvaga zvinhu zvikuru zvemhangura kana zvekupisa zvinochinja maitiro ekudzoreredza kwemvura.
Mutengi anogona kushandisa ongororo yePCB DFM yemahara asati agadzira. Highleap inofanira kudzorera runyorwa rwematambudziko akatarisana nepakeji yakakanganiswa uye sarudzo inokurudzirwa; munhu anotenga haafanire kunzwisisa mutemo wese wekugadzira zvinhu zvakanaka asati atumira RFQ.
3. Stencil neSolder Paste zvinorongwa sei?
Kubudirira kwe "fine-pitch" kunotanga ne "solder deposit" yakagadzikana. Kudzikiswa kwe "uniform aperture" imwe chete kungasakodzera ma "passive" madiki, "fine leads" uye "QFN thermal pads" makuru pabhodhi rimwe chete. Highleap inofunga nezve "stencil thickness", "aperture geometry", "area ratio", "step features", "paste type", "board support" uye "cleaning frequency".
| Zvinodiwa pasuru | Maitiro ekugadzira stencil anogona kushandiswa | Chinangwa chekudzora |
|---|---|---|
| Zvishomanana zvepasita | Saizi yakakodzera yeburi uye chimiro chayo uye kuburitswa kwakasimba. | Dzivisa kushomeka kwezvinonamirwa, kuchekwa kwematombo uye kusanganiswa kwepaste. |
| Vatungamiriri vakanaka | Kuderedzwa kwevhu rakavhurika kana geometry kwakadzorwa. | Deredza mabhiriji uku uchiramba uchinyorovesa. |
| QFN thermal pad | Mahwindo kana nzvimbo dzakapatsanurwa. | Dzora vhoriyamu yekusonesa, kuyerera uye kugoverwa kwechinhu chisina chinhu. |
| Zvinodiwa zvekuisa mari muzvikamu zvakasiyana | Dhizaini yestencil kana aperture iri panzvimbo imwe chete. | Ipai mavhoriyamu akasiyana epaste pabhodhi rimwe chete. |
| Kudiwa kukuru kwekudzokorora | SPI uye nguva yakatarwa yekuchenesa/kuongorora. | Tarisa kuti mvura yadonha sei usati waisa mvura yacho wozoidzosazve. |
Highleap inogona kuongorora sarudzo dzeSMT stencil uye gwara rekuvhura stencil kuti ionekwe musanganiswa chaiwo wepakeji. Tekinoroji yakakosha yestencil inofanira kutaurwa sezvinodiwa papurojekiti, kwete kuwedzerwa mushure mekunge odha yaiswa.
4. Zvikamu Zvidiki Zvinotorwa Sei Uye Zvinobatwa Sei?
Kuzivikanwa kwechikamu, kurongedza, mamiriro ehunyoro uye kuratidzwa kwezvikafu zvinogona kukosha sekururama kwenzvimbo yacho. Tepi yakachekwa, matireyi, machubhu uye mareels asina kukwana zvinofanirwa kupa huwandu hwakakwana uye kureba kwemutongi kuti zvigadzirwe zvakanaka. Midziyo inodzivirira hunyoro inoda kuchengetwa kwakarongwa, kuteverwa kwehuwandu hwezvinhu uye kubikwa chete kana zvakakodzera.
Simbisa nhamba yechikamu chemugadziri, pasuru uye kugadzirisa usati watenga.
Ronga mareli, matireyi kana machubhu uchifunga nezvekugadzirisa uye kukwegura.
Nzvimbo yekuchengetera zvinhu uye nzvimbo yekuchengetera zvinhu pasi kuti ionekwe nemapakeji anonyatsonzwisisika.
Tsanangura mamiriro ekugamuchira, kuverenga, kukwegura kwakanyanya uye mutoro wekutsiva.
Highleap inogona kusanganisa chivakwa nechikamu chinotsvagwa kuti pave nePCBA dzakapinza . Mutengo wacho unofanira kuratidza zvikamu chaizvo, dzimwe nzira dzakarongwa uye huwandu hwepakeji kana kuti kuratidzwa kweodha shoma. Izvi zvinodzivirira kuvimbika kwehurongwa nekuisa zvinhu.
5. Kuiswa uye Kudzokororwa Kwezve Zvakaonekwa Sei?
Purogiramu yekuisa zvinhu inofanira kugadzirwa kubva padata rinodzorwa uye kusimbiswa zvichienderana nekutarisa zvikamu, package, feeder uye fiducials dzebhodhi. Zvivakwa zve "fine-pitch" zvinobatsirwa nekutarisa kwekutanga kwepaneru huwandu hwakazara husati hwaburitswa. Kudzokazve kwechinhu kunoda nzira yekupisa yebhodhi inoremekedza zvinodiwa zvekunamira, miganhu yezvikamu uye huwandu hwekupisa hwechikamu.
- Simbisa data repakati nepakati repakeji rakaburitswa.
- Tarisa zvizere feeder uye component identity usati waisa.
- Ongorora zvinhu zvakakosha pabhodhi rekutanga.
- Gadzira kana kusimbisa chimiro chekudzokorora kwedata pabhodhi/paneru yemumiriri.
- Ongorora zvabuda mukusungirirwa kwesimbi uye humbowo hwakavanzwa usati waburitsa zvese.
Highleap inogona kushandisa reflow soldering process control kuti ienzanise zvikamu zvidiki nemapakeji makuru. Kupisa kwakanyanya chete hakugadzirise kunyorova kusina kunaka kana warpage; nguva, ramp, soak, atmosphere uye board support zvese zvinokanganisa mhedzisiro.
6. Ndekupi Kuongorora Kunodiwa Pakugadzika PCB Yakagadzirwa Nesimbi?
Hapana nzira imwe chete yekuongorora inoona zvikanganiso zvese zviri papitch. Kuongorora solder paste kunogona kuyera deposit isati yaiswa. AOI inotarisa nzvimbo inoonekwa yezvikamu, polarity uye mamiriro esolder. X-ray inotsigira BGA, QFN nedzimwe nzvimbo dzakavanzwa. Kuedza kwemagetsi kana kushanda kunosimbisa maitiro ecircuit.
| nzira | Yakanakisisa pakuona | Muganho wakakosha |
|---|---|---|
| SPI | Namatira vhoriyamu, nzvimbo, kukwirira uye shift yekudhinda. | Hazviratidzi kunaka kwekupedzisira kwekubatana. |
| AOIs | Kuiswa kunooneka, polarity, mabhiriji uye mafillets anosonerwa. | Havakwanise kuona majoini akavanzwa zvizere. |
| X-ray | Mabhiriji akavanzika, kuvhurika, mapatani asina chinhu uye zviratidzo zvekuenderana. | Kududzirwa uye kugamuchirwa zvinofanira kutsanangurwa. |
| Bvunzo yemagetsi/inoshanda | Kuvhura, mapfupi uye maitiro ezvigadzirwa mukati mekuvharwa kwebvunzo. | Zvingasaziva chikonzero chaicho. |
| Maikorosikopu/ongororo nemaoko | Ruzivo rwehunyanzvi hwemuchina uye hunyanzvi hwekugadzira. | Mushandisi anovimba uye anononoka pakuvhara kwakafara. |
Highleap inogona kusanganisa kuyerwa kwe fine-pitch solder paste , kuongororwa kweAOI kwePCBA neX-ray zvichienderana nengozi yepakeji. Chirevo chinofanira kuratidza kana kuongorora kuri kutorwa sesampuli, kutanga kana kuti kufukidza zvizere.
7. Mutengo weFine Pitch SMT Assembly, Nguva Yekutungamira uye Kugadzirisa Patsva
Mutengo wekunyora zvakanaka unokanganiswa netekinoroji yestencil, kurongedza zvikamu, nguva yekugadzirisa, rutsigiro rwebhodhi, kuongororwa kwekutanga, kuongororwa uye njodzi inotarisirwa yekugadzirisa. Huwandu hushoma hune mutengo wakawanda wekugadzirisa payuniti, nepo maodha ekudzokorora achibatsirwa nemapurogiramu akachengetwa uye zvinhu zvakagadzikana. Mukuungana kwezvikamu zvepedyo , dhizaini yestencil, kururama kwekuisa uye mukana wekuongorora zvinofanirwa kufungwa pamwe chete pane kutsanangurwa sezvinangwa zvakasiyana zvemaitiro.
Miganhu yekugadzirisa patsva inofanira kubvumwa usati waita dambudziko. Mutsetse wepitch fine-pitch unogona kugadziriswa munharaunda; BGA kana QFN inotsiva inoda michina inodziya inodzorwa, mamiriro echikamu uye kuongororwa. Highleap inogona kuongorora zvinodiwa pakugadzirisa patsva kweBGA uye kusarudza kana unit ichifanira kugadziriswa, kurambwa kana kudzoserwa kuti ishandiswe nevatengi.
Mafaira akazara, zvikamu zviripo zvinoenderana nemuchina uye hurongwa hwekuongorora hwakabvumiranwa.
Mapepa ekunyorera akakosha, mapakeji mashoma, kuyedzwa kwemaitiro, bvunzo isina kukwana kana kushandurwa kwemafaira kwakadzokororwa.
Dhizaini yakagadzikana, stencil/mapurogiramu anogona kushandiswazve uye purogiramu yebatch inofanotaurwa.
Vatengi vanofanira kukumbira mitengo yekutanga neyakadzokororwa yekutenga zvakasiyana. Izvi zvinoratidza kuti ndedzipi muripo weinjiniya nemidziyo usingadzokorori uye zvinodzivirira kuti mutengo wekugadzira weprototype usakanganiswa nemutengo wemuchina wekugadzira wemangwana.
8. Kumbira Mutengo weFine Pitch SMT Assembly
Tumira mafaira ePCB, BOM nehuwandu. Highleap inogona kuona mapakeji emhando yepamusoro kubva padata, saka mutengi wekutenga haafanire kugadzirira matrix yepakeji. Wedzera chero X-ray inodiwa, bvunzo inoshanda kana mwero wekushanda kwevatengi kana uchitozivikanwa.
Mhinduro yacho inofanira kusimbisa musanganiswa wepakeji yakaongororwa, fungidziro dzekutsvaga, zano restencil, kuongororwa kwechinyorwa chekutanga, kufukidzwa kwekuongorora, nguva yekutanga uye chero maturusi akakosha. Kugona kunoramba kuri pasi peongororo yepurojekiti, kunyanya kune pitch isina kujairika, kuvakwa kwebhodhi kana kusanganiswa kwepakeji.
Tumira purojekiti iyi kuburikidza nepeji rePCB assembly quote . Highleap inogona kudoma prototype, NPI uye huwandu hwekugadzirwa hunodzokororwa pasi penzira imwe chete yeSMT inodzorwa.
Highleap inogona kudzorera pfupiso yenjodzi inotarisa paseji ine chirevo, ichingoratidza chete zvinhu zvinokanganisa kugona, maturusi akakosha, kuongorora kana purogiramu. Izvi zvinopa mhinduro yakajeka kune anotenga pasina ruzivo rwehunyanzvi.
9. Mibvunzo yeFine-Pitch SMT Assembly
Highleap inogona kusimbisa kugona kwebhora rakanaka kubva kuBOM chete here?
BOM inoona mhuri dzemapakeji, asi kugona kwekupedzisira kunoenderanawo nemapatani epasi pePCB, chifukidziro chesolder, rutsigiro rwepaneru uye mukana wekutarisa. Tumira mafaira ebhodhi neBOM pamwe chete kuti zviongororwe zvakavimbika.
Bhodhi rega rega rinopidirwa zvakanaka rinoda kuongororwa neX-ray here?
Kwete. X-ray inonyanya kukosha pamapakeji akavharika akadai seBGA, QFN neLGA. Fine-pitch QFP uye small passives zvinogona kuongororwa zvinobudirira neSPI, AOI uye microscope review, zvichienderana nenjodzi nehuwandu.
Tepi yakachekwa inopihwa nevatengi inogona kushandiswa here?
Kazhinji hongu, asi huwandu, kureba kwemuchina, mamiriro ekurongedza uye zera remuchina zvinofanirwa kutsigira gadziriro yemuchina. Highleap ichaona kana kurongedzazve, zvimwe zvikamu kana imwe nzira yekugovera inodiwa.
Ko nitrogen reflow inosungirwa here kuti SMT iite zvakanaka?
Hazvisi zvega zvega. Mhepo inosiyana-siyana pakati pezvinodiwa pakunamira, kupedzisa, package, profile uye joint. Highleap inosimbisa kana mamiriro ekugadzirisazve akakosha achidikanwa mushure mekuongorora bhodhi chairo.
Ko sevhisi yekubatanidza SMT ye0201 inoshandisa maitiro akafanana neaya eSMT akajairwa here?
Sevhisi yekubatanidza SMT ye0201 inoshandisa kuyerera kwakafanana kwekudhindwa-kuiswa-kudzorerwa, asi geometry yemapedhi, kuburitswa kwestencil, kurongedza zvikamu, kugadzika kwefeeder, kuongororwa kwenzvimbo uye kuongororwa zvinoda kudzorwa kwakasimba. Kugona kunosimbiswa kubva pabhodhi rese, kwete saizi isingashande chete.
Kuungana kweBGA kwakapfava kunogona kubatanidzwa nemasevhisi eQFN CSP ekuungana here?
Ehe. Kubatanidza BGA zvakanaka uye QFN CSP zvinogona kurongwa pabhodhi rimwe chete, asi mastencil deposits, kuburikidza nemaumbirwo, hunyoro hwekubata, warpage uye mibvunzo yeX-ray zvinogona kusiyana zvichienderana nepakeji. Highleap inogadzira nzira imwe chete ine zvidzoriso zvinoenderana nepakeji.
Chii chinoita kuti kuungana kwePCB kuome?
Kuungana kwePCB ine zvikamu zvidiki, huremu hushoma uye nzvimbo shoma, saka kusiyana kwekudhinda, kuratidzwa kwefeeder, rutsigiro rwebhodhi uye kukanganisa kwekuisa zvinhu kunowedzera kukosha. SPI neongororo yekutanga zvinogona kushandiswa zvichienderana nenjodzi.
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Nzira yekuwana sei quote yePCBs
Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.