In-yakadzama Overview yePCB Laminate Kuvaka

PCBs ndiwo musana wemagetsi emazuva ano, achipa chikuva chezvikamu zvakasiyana kuti zvibatane uye zvishande zvisina musono. Pakati pePCB yega yega pane chimiro chakaomesesa chezvikamu zvakabatana, chimwe nechimwe chichishanda chakanangana nekuita basa uye kuvimbika kwebhodhi. Pakati pezvinhu zvakakosha izvo PCB Laminate Construction, madhayagiramu akaturikidzana anoita basa rakakosha pakutsanangura kuvakwa kwebhodhi. uye zvinhu zvemagetsi. Kunzwisisa izvi PCB Laminate Kuvaka kwakakosha kune PCB vagadziri uye vagadziri kuti vagadzire anoshanda uye emhando yepamusoro edunhu mabhodhi.

Iwo musimboti wePrinted Circuit Board (PCB) iri muchimiro chayo chakaomarara icho chinosanganisira akati wandei akabatana nePrepregs uye Core zvinhu.

Prepreg, inowanzonzi machira eB-stage resin-impregnated, chinhu chakapfava zvishoma chakagadzirwa neresin yakanyikwa mumafirimu matete. Inoshanda mabasa maviri mukugadzira maPCB ane layer yakawanda : inoshanda senamira yekubatanidza mapatani emukati ekufambisa uye inopa insulation ye interlayer. Munguva yekumonera, epoxy resin yaPrepreg inonyungudutsa, inoyerera, uye inosimba, ichibatanidza zvinobudirira ma circuit layer uku ichigadzira chipingamupinyi chakavimbika chekudzivirira pakati pawo.

Zvinhu zvepakati, kune rumwe rutivi, zvinoumba chinhu chikuru chePCB—bhodhi rakasimba rine ukobvu hwakati uye foil yemhangura yakanamirwa kumativi ese. PCB yakajairika ine layer yakawanda inogadzirwa kuburikidza ne lamination yezvikamu zvepakati nePrepregs zvinochinjana. Zvikamu zvePrepreg, izvo zvinoumba zvatinodaidza kuti "wet-out" kana kuti impregnation, zvinogona kubatanidza zvikamu zvakawanda zvepakati pamwe chete, uye pasinei nekuva neukobvu hwekutanga, zvinosangana nekuderera panguva yekudzvanya. Pakuvaka kushoma, kugadzirwa kwemhangura kuburikidza nebhodhi reHVLP kunofanirwa kutsanangurwa pamwe chete nezvikamu zve dielectric nekuti conductor roughness inokanganisawo modhi ye channel.

Kazhinji, ekunze maviri dielectric akaturikidzana e multilayer PCB inpregnation layers, yakafukidzwa neakaparadzana mhangura foil layers anoshanda seyekunze conductive ndege. Iwo akakora makudo emhando dzekunze nemukati memhangura foils anowanzo kuuya mumhando 0.5OZ, 1OZ, uye 2OZ (ine 1OZ inosvika 35um kana 1.4mil). Mushure mekugadzirisa, iyo yekunze yemhangura foil layer inowanzo wedzera muhukobvu neinoda kusvika 1 OZ, ukuwo ukobvu hwekupedzisira hwemukati memhangura foil inoramba iri padyo neukoshi hwepakutanga asi inogona kudzikira zvishoma nekuda kwekucheka.

Chikamu chekunze chePCB ine layer yakawanda chine soldermask , inozivikanwa nevanhu vazhinji se "Green Oil," kunyangwe ichigonawo kuva yeyero kana mamwe mavara. Ukobvu hwesoldermask hausi nyore kuona, hwakakora munzvimbo dzisina mhangura kana tichienzanisa nedzine mhangura, asi kubuda kwemhangura kuchiri kuonekwa kana ukaongorora PCB pamusoro pechinhu.

PCB Parameters uye Zvishandiso

Misiyano muPCB paramita iripo pakati pevagadziri vakasiyana, zvichida kutaurirana nePCB fekitori mainjiniya kuti vawane yavo chaiyo data, kunyanya kutarisa dielectric inogara uye soldermask ukobvu, izvo zvinogona kusiyana kubva kune mumwe mugadziri kuenda kune mumwe.

Foiri yeCopper Foiri yekunze. Ukobvu hwefoiri yecopper foiri yekunze hunowanikwa hunosanganisira 12um, 18um, uye 35um. Mushure mekugadzirisa, izvi zvinowanzoita kuti pave nehukobvu hwekupedzisira hwe44um, 50um, uye 67um, hunenge hwakaenzana nehuremu hwecopper hwe1 OZ, 1.5 OZ, uye 2 OZ zvichiteerana. Cherechedza kuti kana uchishandisa software yekuverenga impedance yekudzora, hapana sarudzo yehukobvu hwecopper hwe0.5 OZ kune ekunze.

Zvinhu Zvikuru Chinhu chinowanzoshandiswa chepakati iS1141A, inova chinhu chakajairika cheFR-4, chakaputirwa nemhangura mativi maviri, chine zvirevo zvinosarudzwa zvinogona kusimbiswa zvakananga nemugadziri.

Prepreg Prepregs inouya nehukuru hwakasiyana-siyana hwepakutanga hwakaita se7628 (0.185mm/7.4mil), 2116 (0.105mm/4.2mil), 1080 (0.075mm/3mil), uye 3313 (0.095mm/4mil). Kana yadzvanywa, hukobvu hunowanzo derera ne10-15um (0.5-1mil), saka hukobvu hushoma hwe dielectric layer mu stackup design haufanirwe kunge huri pasi pe3mil. Layer imwe chete ye impregnation inogona kushandisa kusvika kuPrepregs nhatu, uko pasina kana imwe yetatu inogona kuva nehukobvu hwakafanana; Prepreg imwe chete inogona kushandiswa, kunyange vamwe vagadziri vachida hukobvu huviri. Kana hukobvu hwePrepreg husina kukwana, copper foil kumativi ese epakati inogona kuchekwa yozobatanidzwazve nePrepregs, zvichiita kuti layer ye impregnation ive yakakora. Chimiro che dielectric chePrepregs chinosiyana nekukora kwadzo, uye tafura inotevera inoratidza ukobvu hwemamodheru akasiyana uye zvimiro zve dielectric zvinoenderana nazvo:

Iyo dielectric nguva dzose ye laminate board zvinoenderana neiyo resin zvinhu zvinoshandiswa; FR4 mabhodhi anowanzo ratidza dielectric inoramba iripo ye4.2 kusvika 4.7, iyo inoderera nekuwedzera frequency.

Chigadziko cheSoldermask Ukobvu hwechigadziko chesoldermask pamusoro pefoil yemhangura, inonongedzwa seC2, hunenge 8-10um. Ukobvu hwechigadziko chesoldermask munzvimbo dzisina mhangura, C1, hunosiyana zvichienderana neukobvu hwemhangura hwepamusoro, hunenge 13-15um yemhangura ine ukobvu hwe45um uye 17-18um yemhangura ine ukobvu hwe70um. Pakuverenga neSI9000, ukobvu hwesoldermask hwe0.5OZ hwakakwana.

Chikamu cheConductor Nekuda kwekuchekwa, chikamu checonductor hachina rectangular asi trapezoidal. Semuenzaniso, muchikamu chepamusoro, kana ukobvu hwefoil yemhangura huri 1OZ, chikamu chepamusoro chetrapezoid chipfupi ne1MIL pane chikamu chezasi. Saka, kana upamhi hwemutsetse wakagadzirwa huri W=5MIL, upamhi hwepamusoro hunenge huri 4MIL uye upamhi hwezasi hunenge 5MIL. Musiyano uripo pakati pezvikamu zvepamusoro nepazasi une chekuita nehukobvu hwemhangura, sezvakaratidzwa mutafura iri pazasi mumamiriro akasiyana:

Kuverenga kweImpedance. Kuverenga kweImpedance kwakajairika kunoshandisa mamodheru anotevera:

• Microstrip Line Model
• Stripline Model

Mune iyo microstrip modhi, mamwe magadzirirwo aripo, kusanganisira isina kushandiswa modhi isina kupfeka. Iyo dielectric constants Er1 uye Er2 mumuenzaniso wakaratidzwa zvinoenderana neiyo chaiyo prepreg modhi inoshandiswa; makiyi modhi akanyorwa kare uye akadzama paramita anofanirwa kuwanikwa zvakananga kubva kumugadziri wePCB.

Kana chirongwa ichi chachinja kubva pakutsvagisa kuenda kuRFQ, ongorora kusarudzwa kwePCB laminate uye kuunganidzwa kweBGA kwakanyatsogadzirwa kuitira kuti zvinhu, maitiro, uye zvinodiwa pakuongorora zvirambe zvakaenzana.

Kazhinji, kunzwisisa chimiro chakaomarara uye zvinhu zvePrinted Circuit Board (PCB) kwakakosha pakugadzira nekugadzira zvishandiso zvemagetsi zvemhando yepamusoro. Zvinhu zvePrepreg neCore zvinoita basa rakakosha mukubatanidza uye kupa insulation, nepo copper foils uye solder masks zvichibatsira mukufambisa nekudzivirira PCB.

Misiyano muPCB paramita uye zvinhu pakati pevagadziri zvinoratidzira kukosha kwekutaurirana uye kuwana chaiyo data yepurojekiti yega yega. Stack-up diagrams inoshanda sematurusi akakosha, ichipa purani yekuvakwa kwePCB uye zvivakwa zvemagetsi.

Nekunzwisisa zvinhu zvakakosha zvemadhizaini, vagadziri vanogona kuona kutendeseka uye kuvimbika kwePCB magadzirirwo avo, zvinozotungamira kune zvirinani-kuita uye zvakanyanya kusimba zvemagetsi zvishandiso.