Kugadzira uye Kugadzira PCB yeCopper Foil yeHVLP

Kana PCB iine zviratidzo zvinokurumidza kutevedzana, mhangura haisisiri danda rekufambisa magetsi chete. Nzvimbo yayo yepamusoro inogona kuva chikamu chekuverenga kurasikirwa kwechiteshi. HVLP copper foil inoshandiswa mumagadzirirwo ayo mhangura yakaderera inodiwa kudzora mupiro wekurasikirwa kwemuchina wekufambisa magetsi wePCB yapera.

Zvisinei, kutsanangura HVLP foil hakuiti kuti PCB ive bhodhi rinoshanda zvakanaka. Foil inofanira kushanda ne laminate yakasarudzwa, prepreg, stackup, trace geometry, kuburikidza nechimiro, impedance targets, uye maitiro ekugadzira. Nechikonzero ichocho, HVLP PCB inofanira kubatwa sekuvaka kwakakwana kwete sekutenga copper-foil.

Highleap Electronics inogadzira maPCB uye inopa PCB assembly. Isu hatigadziri HVLP copper foil pachayo. Asi, tinogadzira bhodhi rakapedzwa zvichienderana nefoil, laminate, stackup, uye zvinodiwa nemagetsi zvinotenderwa nemutengi, uye assembly inowanikwa kana PCBA yakazara ichidikanwa.

Chii chinonzi HVLP Copper Foil muPCB?

HVLP zvinoreva Hyper Very Low Profile . Mukugadzirwa kwePCB, inotsanangura copper foil yakagadzirwa ne low surface profile. Chikonzero chekushandisa copper-profile yakanyanya inyaya yemagetsi: pama frequency akakwira, conductor roughness inogona kuwedzera nzira inoshanda ichiteverwa ne high-frequency current uye inokonzera kurasikirwa kweconductor.

Kubatsira kwacho kunoenderana nekushandiswa. Kubatanidza kupfupi, kusingakurumidzi kungave kusina chikonzero chekushandisa mhangura yepamusoro-soro, nepo nzira refu yekubatanidza inomhanya ichigona kuva nebhajeti shoma yekuisa-kurasikirwa. Saka foil chaiyo inobva pazvinodiwa nemagetsi zvedhizaini kwete kubva pashoko rekuti "HVLP" chete.

Hapana imwe chete yakagadzirwa "HVLP PCB" pasi rose. Kunyangwe pakati pezvigadzirwa zvemhangura zvisina chimiro chakanaka, chimiro chaicho chepamusoro uye magadzirirwo azvo zvinogona kusiyana. Kana dhizaini yekumhanya-mhanya yatove yakatevedzerwa neprofile yemhangura chaiyo, magwaro ekugadzira akaburitswa anofanira kuratidza chinodiwa ichocho pane kusiya chakavhurika kuti chidudzirwe.

HVLP Copper Foil Inokanganisa Sei Kuunganidzwa KwePCB Nekupindwa Kwemhepo Kukuru?

HVLP foil inongova imwe chete inoshanduka muPCB inomhanya zvikuru. Impedance inonyanya kutsanangurwa ne conductor geometry uye chimiro che dielectric chakakomberedza, nepo conductor roughness ichiva yakakosha pakuongorora kurasikirwa kwe high-frequency. Saka izvi zvinofanirwa kufungwa pamwe chete panguva yekugadzira stackup.

Stackup inofanira kuenderana nemodhi yemagetsi

Muunganidzwa wakagadzirira kugadzirwa unofanirwa kutsanangura chivakwa chaicho chinoshandiswa kuverenga chinangwa chekugadzira. Zvichienderana nebhodhi, izvi zvinogona kusanganisira:

• Mhando dzepakati nedzeprepreg uye ukobvu hwekupedzisira hwe dielectric.
• Zviyero zvemhangura zvemukati nekunze.
• Rudzi rwefoil yemhangura rwakatenderwa uye chimiro chepamusoro.
• Upamhi uye nzvimbo dzakatarwa dzekutevera dzinodzorwa ne-impedance.
• Zvinangwa zve impedance zvine magumo rimwe chete uye zvakasiyana.
• Hukama pakati pezviratidzo nezviratidzo.
• Kuburikidza nezvivakwa uye chero kuchera kunodiwa.

Basa reHighleap rekuisa PCB layer stackup rinokosha kana kuvaka kwacho kuchida kuongororwa kusati kwagadzirwa. Chinangwa chacho chiri nyore: stackup inoshandiswa pakuenzanisa inofanira kunge yakafanana nestackup ichagadzirwa.

Kune mabhodhi anonyanya kukosha kweimpedance, kugadzirwa kwePCB kunodzorwa neimpedance kunopa hurongwa hwekugadzira hwezvibodzwa zvinodzorwa uye zvinodiwa zvekusimbisa. Hunhu hweimpedance hunodiwa uye kushivirira kunofanirwa kutsanangurwa usati wagadzirwa pane kufungidzirwa kubva muzita relaminate kana chikamu chefoil.

Mhangura isina chimiro chakanyanya haisi chinhu chinotsiva mainjiniya echiteshi

Kana chiteshi chikasasvika pachinangwa chacho chekurasikirwa nechinhu, kuchinja kuita dhaimondi yemhangura isina kusimba kunogona kubatsira kana kurasikirwa nedhaimondi kwakakosha. Hazvizogadzirise matambudziko anokonzerwa nekufamba kwenguva refu, kugadzirwa kwe dielectric kusina kukodzera, kupfuudzana kwakawanda kuburikidza nema stubs, kushanduka kusina kunaka kweconnector, kana kuenderera mberi kwe reference-plane. Pakugadzira kwakatarwa ne laminate iyoyo, kuvakwa kweMEGTRON 9 kwema channels ane mwero wepamusoro kunofanirwa kushandisa fungidziro dzakafanana dzedhaimondi yemhangura semuenzaniso wekurasikirwa.

Ndosaka HVLP ichifanira kutsanangurwa sechikamu chezvinodiwa zvemagetsi zvinoyerwa. Zvinobatsira kuudza mugadziri wezvinhu zvinodiwa pakuvaka uye pakushanda pane kungokumbira "mhangura yakaderera inowanikwa."

Ndezvipi Zvinodiwa Pakugadzira Zvakakosha paHVLP Copper Foil PCBs?

Chinangwa chikuru chekugadzira ndechekuchengetedza chivakwa chezvinhu zvakatenderwa ukuwo uchigadzira geometry yemhangura inodiwa, ukobvu hwe dielectric, kunyoreswa, mavias, uye kupedzisa kwepamusoro. HVLP haigadzire maitiro ePCB akasiyana zvachose, asi magadzirirwo ekumhanya kwepamusoro anowanzosiya mukana mudiki wekuchinja.

Lamination uye ukobvu hwe dielectric

Foil, resin system, uye prepreg zvinofanirwa kuenderana nekugadzirwa kwakatarwa kwe multilayer. Mamiriro ekudzvanya, kuyerera kwe resin, kugoverwa kwemhangura, uye ukobvu hwekupedzisira hwe dielectric zvese zvinopesvedzera stackup yapera. Kune bhodhi rinodzorwa ne impedance, post-lamination dielectric geometry inokosha nekuti chikamu chechimiro chemagetsi.

Maitiro eHighleap ekugadzira PCB lamination anofukidza danho rekubatanidza ma multilayer. Stackup inoburitswa inofanira kutsanangura core inotarisirwa uye kuvakwa kwe prepreg pane kuvimba nehuwandu hwema layer.

Kugadzira mifananidzo, kutema, kuboora, uye kuputira

Foil yakasarudzwa haigone kutsiva ma "trace geometry" asingadzoreki. Kufungidzira nekunyora kunofanira kugadzira upamhi hwe "trace" hwakapedzwa uye nzvimbo dzinodiwa nedhizaini. Izvi zvinonyanya kukosha kune "small differential pairs", "fine-pitch BGA breakout regions", nedzimwe nzvimbo uko shanduko diki dzinogona kukanganisa mashandiro emagetsi.

Kuburikidza nehunhu chinhu chakasiyana chinodiwa. Nzvimbo yegomba, dhayamita rakapedzwa, plating, annular ring, uye urefu hwestub zvese zvine chekuita nekubatana. Kana ongororo yechiteshi ichida kubviswa kweyakawandisa kuburikidza nehurefu hwestub, sevhisi yeHighleap's PCB backdrilling inogona kuiswa mukugadzirwa.

Kuongorora uye kuongorora

Zvichienderana nedhizaini, kusimbiswa kunogona kusanganisira kuongorora mativi, kuongororwa kwekunyoreswa kwezvikamu, kuyedzwa kwemagetsi, kuyedzwa kweimpedance, kuongorora zvikamu, uye kuongorora nemaziso. Basa rekugadzira PCB reHighleap rinofukidza nzira yekugadzira kubva kuinjiniya nekugadzirira zvinhu kuburikidza nekugadzira nekuyedza bhodhi.

Ongororo yeDFM isati yagadzirwa inonyanya kubatsira kana bhodhi richisanganisa HVLP foil nezvidimbu zvidiki, huwandu hwakawanda hwemachira, dense vias, controlled impedance, kana tight mechanical tolerances. Chinangwa ndechekuona njodzi dzekugadzira dhizaini isati yasvika pakugadzirwa kwehuwandu.

Ndeapi Mashandisirwo Anobatsira Kubva kuHVLP Copper Foil?

HVLP copper inonyanya kubatsira kana kurasikirwa neconductor kuchikanganisa bhajeti yechiteshi. Mashandisirwo akajairika anosanganisira maserver ane kumhanya kwakanyanya, maswichi, marouter, michina yekuchengetera, optical communication hardware, uye mamwe masisitimu anoshandisa serial interfaces dzinoda simba.

Makomputa anomhanya zvakanyanya uye networking

Mabhodhi eserver nenetworking anogona kusanganisa nzira dzemagetsi refu, data rakawanda, minda yeBGA yakamanikana, masaini akawanda, uye zvinodiwa zvakasimba zve impedance. Mumagadzirirwo aya, kurasikirwa neconductor chikamu chimwe chebhajeti remugero wese, zvichiita kuti copper profile ive pfungwa yekugadzirwa kwayo.

Kune michina yakaoma yemakombiyuta, kugona kweHighleap kugadzira HPC PCB kunogona kutsigira mabhodhi ane layer akawanda uko zvinonetsa zvekufambisa nekukurumidza uye zvekugadzira zvinoda kugadziriswa pamwe chete.

RF, microwave, uye magadzirirwo ezviratidzo zvakasiyana-siyana

Mhangura isina chimiro chakanyanya inogonawo kuva yakakosha pakugadzirwa kweRF ne microwave, asi sarudzo yacho inofanira kunge yakavakirwa pakugadzirwa kwetambo yekutumira. Kuwanda kwemagetsi, zvinhu zve dielectric, ukobvu hwemhangura, modhi ye roughness, geometry yemutsara, uye chinangwa chekurasikirwa zvese zvinofanirwa kufungwa nezvazvo.

Nekuda kwechikonzero ichi, "HVLP" haifanirwe kutorwa segiredhi rebasa rinoenderana nezvinodiwa nevanhu vose. Mubvunzo wakakodzera ndewekuti kuvakwa kwemhangura kwakataurwa kunotsigira here chinangwa chemagetsi chetambo chaiyo yekufambisa.

Maitiro ekuraira HVLP Copper Foil PCB kubva kuHighleap

Pakugadzira kwagara kuripo, nzira inokurumidza yekutaura ndeyekupa zvese zvinodiwa pakugadzira kwete kungotaura kuti "HVLP PCB." Kana zvinodiwa zvemagetsi nezvinhu zvichitsanangurwa zvakajeka, kududzirwa kushoma kunodiwa panguva yekuongorora kweinjiniya.

Ruzivo rweRFQ runokurudzirwa

• Mafaira ekugadzira eGerber kana ODB++.
• Mafaira ekuboorera eNC uye pepa rebhodhi.
• Kuunganidza zvese zviri mudura.
• HVLP foil grade chaiyo kana kuti mutengesi/chigadzirwa chakatenderwa.
• Zvinyorwa zveLaminate uye zvekugadzirira.
• Zviremu zvemhangura zvakapedzwa uye ukobvu hwebhodhi.
• Hunhu hweimpedance inodzorwa uye kushivirira.
• Zvinodiwa pakupedzisa pamusoro uye chifukidzo chemasiki.
• Ruzivo rwehuwandu uye kubatanidzwa kwepanel.
• BOM, data repakati, mifananidzo yekuunganidza, uye zvinodiwa pakuyedza kana PCBA ichidikanwa.

Kana dhizaini yacho yatove yakagadziridzwa uchishandisa musanganiswa wefoil nelaminate, taura izvozvo zvakajeka muRFQ. Kana dhizaini yacho ichiri kugadzirwa, ipa frequency yekushanda kana data rate, target impedance, zvinodiwa nechiteshi, nhamba yezvikamu, uye saizi yebhodhi kuitira kuti kuvaka kuongororwe sesystem yakazara.

Kubva paPCB isina chinhu kusvika paPCBA yapera

Highleap inogona kuramba ichienderera mberi nekugadzirwa kwebhodhi risina chinhu kana paine chikonzero chekubatanidza. Basa redu rePCB rinotsigira kubatanidzwa kweSMT neTHT, kuwanikwa kwezvikamu, kuongororwa, kuyedzwa kwemagetsi, uye kuyedzwa kwebasa zvinoenderana nezvinodiwa neprojekiti.

Kune vatengi vanoda purogiramu imwe chete yekugadzira kubva kuPCB isina chinhu kuburikidza nemagetsi akaunganidzwa, turnkey PCB assembly inosanganisa kugadzirwa kwePCB, kuwanikwa kwezvikamu, kuunganidza, kuongorora, uye kuyedza. Izvi zvinobatsira kana kuvakwa kwezvinhu, bhodhi rakagadzirwa, uye chigadzirwa chakaunganidzwa zvese zvichifanira kuramba zvakaenderana nedhizaini imwe chete yakaburitswa.

Basa reHighleap harisi rekutengesa HVLP copper foil sechinhu chinogadzirwa chega. Isu tinogadzira PCB tichishandisa chivakwa chemhangura nelaminate chakatenderwa nemutengi, uye tinogona kuramba tichigadzira PCBA kana zvichidikanwa.