Kugadzirwa kweTMM PCB

Nzira yekugadzira Rogers TMM yakasiyana neFR4 yakajairika uye yakasiyanawo nezvinhu zvakawanda zve microwave zvakapfava zvePTFE. TMM sisitimu yakasimba ye thermoset yakazadzwa neceramic. Izvi zvinoipa kugadzikana kwakanaka uye kugona kwayo kupinza maburi, asi zvinorevawo kuti zvivakwa zvitete zvinoda kubatwa nekungwarira uye ceramic filler inogona kukurumidzisa drill uye router wear. Saka hunhu hwekugadzira hunoenderana nekudzora zvinhu, kuongorora stackup, basa re RF-aware CAM, kurongeka kwekuboorera, kugadzirira maburi, kuenderana kweplating, kusarudzwa kwekupedzisira uye kuongororwa kwakayerwa.

Gwaro iri rakanyorerwa mainjiniya nevatengi vanoda ruzivo rwekugadzira zvinhu vasati vaburitsa TMM RF PCB. Kuti muwane sarudzo ye dielectric uye kuenzanisa magiredhi, onai gwaro re TMM high-frequency PCB . Kuti muwane ongororo yehunyanzvi hwemutengesi, onai gwaro rekugadzira nekugadzira re TMM PCB . Kuti muwane kuronga mitengo uye kugadzirira RFQ, onai gwaro remitengo re TMM PCB.

Gwaro iri rekugadzira rinotarisa pakuburitswa kwema stackup, kuboorwa, kucherwa kwelamination, kunyoreswa, kugadzirwa kwesimbi uye RF-aware DFM yemabhodhi eTMM. Shandisa gwaro rine chekuita nekutenga nekugadzira.

TMM PCB Kugadzira Mabhodhi eRF neMicrowave

Zvinofanira kudzorwa nemugadziri wePCB

Ongororo yekugadzira yeTMM RF PCB inofanira kuratidza kuti bhodhi richavakwa sei, matanho api ekuita zvinhu anonyatsonzwisisika, zvinhu zvipi zveDFM zvinoda kusimbiswa uye kuti ndezvipi zvinodzora zvinodiwa kugadzirwa kusati kwatanga.

Kune PCB yedhijitari yakajairwa, kubudirira kwekugadzira kunowanzo tariswa nekuyedzwa kwemagetsi, kugamuchirwa kwemativi uye kuenderana kwekubatanidza. Kune TMM RF PCB, zvinhu izvozvo zvinongova pokutangira. Bhodhi rinofanirawo kuchengetedza geometry yemutsara wekutumira, nzvimbo yekutarisa-ndege, kuvimbika kwepasi, maitiro ekurasikirwa ane chekuita nekupedzisa uye maficha eRF anotsanangurwa mumucheto. Bhodhi rinogona kutaridzika zvakanaka richiri kutadza kupindura kwefirita, antenna match kana insertion-loss target.

Kushanda kweRF semugumisiro wekugadzira

Kushanda kweRF kwakagadzirwa zvishoma nenzira yekufananidzira uye zvishoma zvinogadzirwa pasi pekugadzira. Dielectric constant, ukobvu hwemhangura, copper profile, mutsetse wakafara, mutsetse wakafara, mamiriro emasiki anosonerwa, kupedzisa kwepamusoro uye ukobvu hwakapera zvese zvinopesvedzera mhedzisiro chaiyo. Mugadziri haagone kushandura hunhu hwe dielectric hwe laminate, asi anogona kudzora kusimbiswa kweukobvu, etch compensation, copper plating, finish selection, kuvhurwa kwemasiki uye impedance coupon layout.

Ndosaka kuronga kugadzira kuchifanira kutanga CAM tooling isati yatanga. Kana dhirowa richiti "Rogers TMM material" chete uye risingatsanangure giredhi, ukobvu hwe dielectric, huremu hwemhangura, finish kana controlled-impedance structures, mugadziri anofanira kuita fungidziro. fungidziro idzodzo dzinogona kuchinja mutengo, goho uye maitiro eRF akayerwa. Pakeji yakazara yefaira inodzivirira dambudziko iri.

Nzvimbo dzine njodzi dzekugadzira dzinofanirwa kuongororwa nekukurumidza

Nzvimbo dzine njodzi huru mukugadzirwa kweTMM dzinosanganisira kubata laminate zvakatetepa, kubhoorwa kweabrasive, mitsetse mitete yeRF ine high-Dk, dense via fences, hybrid stackup symmetry, final routing pedyo neRF features, solder mask pamusoro pemitsetse yekutumira, nickel-bearing finishes panzira refu dze microwave uye zvinhu zvisina kunyorwa. Hapana kana chimwe chezvinhu izvi chinoita kuti bhodhi reTMM riome otomatiki. Zvinongoda kuongororwa kwakakodzera usati watanga kugadzira.

Maitiro akavimbika anovakwa zvichienderana nenjodzi dzinozivikanwa. Mainjiniya eCAM anoona RF-critical geometry. Mainjiniya ekugadzirisa anosarudza miganhu yekuboorera uye parameters dzenzira. Mainjiniya emhando yepamusoro anotsanangura makuponi uye kuongorora. Kutenga kunosimbisa giredhi chaiyo yeTMM uye kuwanikwa kwezvinhu. Kana matanho aya akabatana, kuvaka kunova panzvimbo iri nani yekuwana RF geometry inodzokororwa uye kugadzirwa kwakavimbika.

Kuwanda kwezvinhu: Chinyorwa chino chinotaura nezvekugadzirwa kwePCB kana dhizaini yacho ichitsanangura TMM laminate. Kuwanikwa kwezvinhu zvekupedzisira, zvinodiwa zvechitupa uye ruzivo rwakatenderwa rwekuunganidzwa kwezvinhu zvinofanirwa kusimbiswa muRFQ.

 Maitiro eTMM Zvinhu uye Zvinokonzera Kugadzirwa

Kuvakwa kwethermoset yakazara neceramic

Magirazi eRogers TMM akagadzirwa ne thermoset microwave. Chimiro chayo chakagadzirwa ne ceramic chinobatsira pakugadzikana kwehukuru, maitiro e dielectric anodzorwa uye kuomarara kwemakanika. Sisitimu ye thermoset resin inoreva kuti zvinhu hazvinyorove uye hazvifambe se thermoplastic systems panguva yekugadzirisa kwakajairika. Izvi zvinotsigira maitiro emakanika anodzokororwa uye zvinoita kuti zvinhu zvikwezve kune stripline, microstrip uye high-reliability plated-through-hole applications.

Kubva pamaonero ekugadzira, dhizaini iyi ine zvirevo zviviri zvinoshanda. Chekutanga, maitiro ePCB anotorwa anogona kushandiswa kana chitoro chichiziva kubata laminate nefrequency yakakwira. Chechipiri, ceramic filler inoita kuti mashandiro emakanika akadai sekuboora nekufambisa zvinhu ave abrasive kupfuura FR4 yakajairwa. Saka kusarudza maturusi uye miganhu yehupenyu hwematurusi ndizvo zvakakosha kudzora maitiro.

Kugadzirisa kunzwisisika muzvivakwa zvitete

TMM yakasimba, uye mapaneru matete anogona kutsemuka, kupwanyika kana kutsemuka kana akakotama, kudonhedzwa, kurohwa kana kukweshwa zvine simba. Maitiro ekubata anofanira kuderedza kushushikana kwemuchina usati wagadzira patani yedunhu. Mapaneru anofanira kutsigirwa panguva yekufamba, kuchengetwa akati sandara, kudzivirirwa kubva mukukuvadzwa kwemucheto uye kucheneswa nenzira dzisingagadzire simba rekukotama risingakoshi.

Izvi zvinokosha nekuti kukuvara kwekubata nekukurumidza kunogona kuonekwa gare gare sekurasikirwa kwegoho. Chip diki yemucheto inogona kuva kuputika kwenzira. Kutsemuka kudiki kunogona kushayisa simba panel yakatetepa yeantenna. Buri rematurusi rakaomarara rinogona kukanganisa kunyoreswa. Kugadzirwa kwakanaka kunotanga nekuchengetedza zvinhu, kwete nekuboorwa.

Kuramba kwemakemikari ekugadzirisa maitiro uye kuenderana kwakajairika kwePWB

Zvinhu zveTMM zvakagadzirirwa kutsungirira makemikari akawanda ekugadzira mabhodhi emagetsi akadhindwa. Kuenderana uku kunobvumira maitiro akajairwa ekufungidzira ePCB, etching uye metallization kana hwindo rekugadzira rakakodzera kuvakwa kwakatarwa. Kusiyana nema substrates akawanda akavakirwa paPTFE, TMM kazhinji haidi nzira dzakafanana dzekugadzira maburi.

Kuenderana kwemaitiro hakurevi kuti kukopa ma parameter ese eFR4 zvakananga. Mugadziri anofanira kuramba achiongorora kugadzirira kwemhangura, mhando yekuboorera, topography yemadziro emaburi, etch compensation, kufanana kweplating uye mhando ye routing zvichienderana nebasa reRF rebhodhi.

Kusarudzwa kwegiredhi reTMM sechikamu chekugadzira

Kusarudzwa kwemagiredhi eTMM kunochinja magadzirirwo emagetsi uye kuronga kugadzirwa. Magiredhi epasi-Dk akadai seTMM3 neTMM4 anowanzogadzira mitsetse yakafara yeRF yeimpedance imwechete, nepo magiredhi epamusoro-Dk akadai seTMM10, TMM10i uye TMM13i achitsigira miniaturization yedunhu asi anogona kugadzira geometry yakamanikana uye kunzwisiswa kwe etch kwakasimba. Magiredhi akasarudzwa anokanganisawo kuwanikwa kwe laminate, kuronga mapaneru uye, mune dzimwe nguva, kutarisira kubhowa.

Kuyerera kweMaitiro ekugadzira PCB eRogers TMM

Kusimbiswa kwezvinhu uye ongororo yeinjiniya

Maitiro ekugadzira anotanga nekusimbisa giredhi reTMM chairo, ukobvu hwe dielectric, copper cladding, huremu hwe copper, fomati yemapaneru, huwandu hwe layer, stackup, surface finish uye zvinodiwa zvemagwaro. Danho iri rinofanira kuitika mutengo usati wabvumidzwa pamabasa akaoma nekuti data rezvinhu zvisiripo rinogona kuchinja nguva ye lead nemari. Kana bhodhi iri rekudzokorora, mutengesi anofanira kuenzanisa revision itsva ne stackup yapfuura uye process notes.

Ongororo yeinjiniya inofanirawo kuona zvinhu zvakakosha zveRF: mitsetse ye50 ohm, mipata yewaveguide yecoplanar yakadzika pasi, mafirita akabatana emucheto, maantenna epatch, urefu hwe resonator, connector launches, via fences, cavity boundaries uye thermal-via arrays. Zvinhu izvi hazvifanirwe kuchinjwa nekugara uchichenesa CAM pasina mvumo.

Kugadzirira jira uye mapatani emhangura

Kune maPCB eTMM ane mativi maviri uye ane mativi maviri, patani yekunze yemhangura inotorwa mufananidzo uye inochekwa kuti igadzire geometry yeRF. Kune akawanda layer kana hybrid builds, ma layer emukati anotanga agadzirwa, oteverwa ne lamination uye outer-layer processing. Chinangwa chikuru chekugadzira hachisi chekungobvisa mhangura isingadiwe. Chinangwa ndechekugadzira RF geometry yakapedzwa inoenderana nedhizaini yemuenzaniso.

Kucheka kunofanira kuverengerwa ukobvu hwemhangura, chimiro chemhangura, upamhi hwetrace, nzvimbo yemutsara, plating effect uye kufanana kwepaneru. Magiredhi eHigh-Dk anogona kugadzira mitsetse yakatetepa, zvichiita kuti kutsauka kudiki kwe etch kuve kwakakosha. Kana upamhi hwemutsara huri chikamu che impedance kana resonance, kuongororwa kunofanirwa kutarisa pahukuru hwakapedzwa, kwete chete hunyanzvi.

Kuboora, kugadzira simbi uye kupedzisa kwekupedzisira

Kuboora kunogadzira maburi, kuburikidza nefenzi, maburi ekukwirisa, maburi ekubatanidza, maburi ekupisa nemidziyo yekuisa. Chigadziko chesimbi cheTMM chinopfupisa hupenyu hwechishandiso kana tichienzanisa neFR4, saka kusakara kwechibooreso kunofanira kudzorwa. Mushure mekuboora, kugadzirira maburi, simbi uye kuputira zvinogadzira mabhareni emhangura anopa kuenderera mberi kwemagetsi uye RF grounding.

Mushure mekugadzirisa mhangura, bhodhi rinogashira chifukidzo chesolder kana chataurwa, kupedzisa kwenzvimbo, kurongeka kwenzira, kuyedzwa kwemagetsi, kuyerwa kweimpedance kana zvichidikanwa, kuongororwa kwekupedzisira uye kurongedza. Basa rekuvimbika kwepamusoro rinogonawo kuda microsection, chitupa chezvinhu, stackup record, plating thickness report uye chitupa chekuenderana. Chikwata chekugadzira chinofanira kudzora kubhoorwa uye kugadzirira maburi nekuti zviri mukati mekuzadza zvinogona kukanganisa kupera kwemidziyo uye kunaka kwemadziro emaburi. Lamination, kunyoreswa uye tsananguro yemhangura zvinofanirwa kudzorwa zvichienderana ne stackup yakapedzwa kuitira kuti RF layers dzisatariswe se generic multilayer layers. Hunhu chaihwo hwezvinhu hunofanirwa kusimbiswa zvichienderana nemagwaro emupi we laminate aripo egiredhi rakataurwa uye kuvaka.

Kuronga Stackup Usati watanga CAM neTools

Mabhodhi eTMM ane mativi maviri uye ane mativi maviri

Mabhodhi eTMM ane mativi maviri uye ane mativi maviri akajairika mumapatch antennas, mafirita, macouplers, manetwork ekubatanidza ma power amplifier, maRF test fixtures uye ma microwave circuits ari nyore. Magadzirirwo aya anogona kutaridzika seari nyore, asi maitiro avo eRF anogona kukanganiswa zvakanyanya nehukobvu hwe dielectric hwakapedzwa, ukobvu hwemhangura, upamhi hwemutsara, mask yekusolder uye kupedzisa kwenzvimbo.

Kune mapuranga ane mativi maviri ane fenzi dzakagadzirwa nemadziro kana kuti coplanar structures dzakagadzirwa nepasi, mhando yekuboorera neplating inova chikamu cheRF path. Pattern yevhu inofanira kugadzirwa, kwete kungoenderana nemagetsi chete. Maburi madiki, ma dense arrays uye high aspect ratios zvinofanirwa kuongororwa nekukurumidza nekuti zvinokanganisa plating, mutengo uye kuvimbika.

Kuvakwa kweTMM yakawanda

Mabhodhi eTMM eMultilayer Rogers anoshandiswa kana dunhu richida maRF layers akavigwa, stripline, shielding planes, kuwedzera nzira yekufambisa, kugoverwa kwesimba kana kusimba kwezvakatipoteredza. Mugadziri anofanira kuongorora kunyoreswa, nzira yekuisa lamination, zvinhu zve bond, ukobvu hwekupedzisira, chiyero chepurasitiki uye kupisa. Stackup inofanira kunge yakaenzana uye yakanyorwa kuitira kuti kugadzirwa kudzokorore kuvaka kwakakodzera.

Zvimiro zveStripline neRF zvakavigwa zvinoda kushanda pamwe chete kwakasimba kupfuura zvakajairwa zvemadigital multilayer. Dielectric iri pamusoro nepasi peRF trace, copper roughness, plating thickness uye reference-plane integrity zvese zvinokanganisa impedance uye insertion loss. Dhizaini inotevedzera bondline thickness imwe inogona kuchinja kana kugadzirwa kukashandisa imwe adhesive kana prepreg system.

Mapuratifomu eHybrid TMM neFR4

Matanda eHybrid TMM neFR4 anobatsira kana jira rimwe chete kana maviri aine masaini eRF uye jira rimwe chete rinopa simba redhijitari, simba remafrequency mashoma, kudzivirirwa kana rutsigiro rwemakanika. Nzira iyi inogona kuderedza kushandiswa kwelaminate yepamusoro, asi inowedzera lamination uye zvisarudzo zvekusawirirana kwezvinhu. Bhodhi rehybrid harifanirwe kutorwa sechinzvimbo chezvinhu zvisina basa.

Rutivi rweRF runofanira kuramba ruri pamusoro pezvinhu uye ukobvu hwe dielectric hunoshandiswa mumuenzaniso. Rutivi rusiri rweRF runogona kushandisa FR4 kana chimwe chinhu chinoenderana kana warpage, z-axis expansion, maitiro ekunamatira uye kuvimbika kwe plated-hole zvikaongororwa. Pakuronga kwebhizinesi kwe hybrid vs all-TMM builds, gwara reRogers TMM PCB rinotsanangura kuti sarudzo dze stackup dzinokanganisa sei quotation.

Zvinyorwa zvekugadzira zvinhu zvakagadzirwa

Dhirowa rakasimba rekugadzira rinofanira kutaura giredhi chaiyo yeTMM, ukobvu hwepakati, huremu hwemhangura, mhangura yakapedzwa, kupedzisa kwenzvimbo, mamiriro emasiki emuchina, zvivakwa zve impedance, kushivirira kwe dielectric uye zvinodiwa zvekugamuchira. Rinofanirawo kuratidza chero zvinodiwa zvisingatsiviwe. Mutsara wekuti "kana zvakaenzana" unofanirwa kushandiswa nekungwarira nekuti zvinhu zvakafanana zvemakanika zvinogona kunge zvisiri zvinhu zvakafanana zveRF.

Kana stackup ichiri kugadzirwa, timu yeinjiniya inofanira kukumbira kuongororwa kweDFM isati yaburitswa kekupedzisira. Mugadziri anogona kazhinji kupa mazano ekugadzirisa upamhi hwemutsara, kuisa coupon, kuburikidza nekuvandudzwa kweaspect ratio kana shanduko dzepanelo isati yatanga kugadzirwa. Shanduko idzodzo dziri nyore RF isati yatanga kugadziriswa uye kugadziriswa kweRF.

Kufungidzira, Kunyora uye Kudzora Geometry YeRF Yakakosha

Kudzivirirwa kweCAM kwemhangura yakakosha yeRF

Mainjiniya eCAM vanowanzo chenesa mapedhi, zvidimbu zvemhangura, maburi emasiki, mhete dzeannular uye nzvimbo dzekugadzira pamapuranga akajairwa. Pabhodhi reRogers TMM RF, shanduko dzakafanana dzinogona kuchinja mashandiro. Mapedhi eAntenna, kureba kweresonator, mipata yepakati pedhijitari, nzvimbo dzeGCPW pasi, mapedhi ekutanga, nzvimbo dzekubvisa kuburikidza nefenzi uye zvivakwa zvakabatana pamucheto zvinogona kunge zviri zviyero zvedunhu zvinoshanda.

Dhirowa rekugadzira rinofanira kuratidza zvinhu zvakakosha uye zvinotenderwa. Kana mugadziri akasazvizivisa, mugadziri anofanira kubvunza asati achinja mhangura. Kuchinja kudiki kweCAM kunovandudza kugadzirwa kunogonawo kuchinja frequency yepakati kana urefu hwechikamu. Mhinduro chaiyo haisi yekurambidza CAM edits; ndeyekusiyanisa kuchenesa kwekugadzira nguva dzose kubva pakuchinja kwejometri kunoenderana neRF.

Kubhadhara kwe etch kwehupamhi hwemutsetse wapera

Upamhi hwemutsetse weRF hunofanira kudzorwa sechinhu chakapedzwa, kwete chete sechinhu cheunyanzvi. Kugadziriswa kwe etch kunofanirwa kufunga nezvekukora kwemhangura, chimiro chemhangura, nzira yekuisa plating, huwandu hwemitsara uye nzvimbo yepaneru. Izvi zvakakosha zvikuru kune magiredhi epamusoro eDk TMM, uko target impedance ingada marongero akamanikana uye mipata midiki.

Kuongorora upamhi hwemutsara kwapera kunofanira kusungirirwa kumatanho chaiwo eRF. Kuyera mutsetse wakajairika chete pane panel hakungamiriri mukana wekusvira wakabatana kana kuburitswa kweconnector. Kana dhizaini yacho iine mafambiro akawanda e impedance, geometry yega yega yakakosha inofanira kunge iine nzira yakatsanangurwa yekushivirira uye yekuyera.

Kunyatsonzwisisa uye kunzwisisika kwe etch neHigh-Dk miniaturization

Magiredhi eHigh-Dk TMM anowanzo sarudzwa kuderedza saizi yedunhu. Miniaturization inokosha, asi inowedzera kukosha kwekugadzirwa kwezvikamu zvidiki. Kuchinja kudiki muhupamhi hwe resonator, gap, antenna edge kana feed line kunogona kukonzera kukanganisa kukuru kupfuura kuchinja kwakafanana padhizaini yakakura yeDk.

Vagadziri vanofanira kuongorora kana mitemo yekugadzira ichienderana nechikamu chakasarudzwa cheTMM uye huremu hwemhangura. Kana bhodhi reDk rakakwirira riine mipata yakasimba kwazvo, mutengo nenguva yekutanga inofanira kusanganisira kuongororwa uye njodzi yekukohwa inodiwa kudzora mipata iyoyo. Kune marongero emu microwave, gwara reRogers TMM microwave PCB rinowedzera kuti geometry, kurasikirwa uye kushivirira kugadzirwa kunoshanda sei.

Kuenzana kwemhangura uye kugadzikana kwehukuru

Kuenzana kwemhangura kunokanganisa maitiro epaneru, kufanana kwemavara uye kugadzikana kwemuchina. Kupararira kwemhangura kusina kuenzana kunogona kukonzera kuchinjika kana shanduko yemaitiro emunzvimbo, kunyanya muma hybrid stackups. Mabhodhi eRF dzimwe nguva ane mapuraneti makuru epasi kune rumwe rutivi uye masaini mashoma kune rumwe rutivi, saka marongerwo emapaneru nemapuranga anofanirwa kuongororwa kuti aone kugadzikana kwemaitiro.

Mhangura yenhema inogona kubatsira kugadzira, asi haifanirwe kuiswa painochinja RF coupling, antenna radiation, ground return kana isolation. Chero copper balancing iri pedyo neRF structures inofanira kutenderwa neRF engineer.

Kuboorera uye Kugadzirira Maburi eTMM Yakazadzwa neCeramic

Abrasive ceramic filler uye kushandiswa kwezvishandiso

Chigadziko chesimbi cheTMM chinoita kuti kuchera kuwedzere kukwesha kupfuura kuchera FR4. Kusakara kwezvishandiso kunogona kukonzera madziro akaomarara, kupisa kwakanyanya, kukuvara kwakaita sekunge pamusoro, njodzi yekubuda kwechinhu uye kupaka. Mugadziri ane hunyanzvi anotarisira izvi nekushandisa madhiri ecarbide akakodzera, kuderedza kuwanda kwezvibodzwa, kudzora kumhanya kwenzvimbo uye mutoro wechip, uye kuongorora mhando yedhiri usati waisa jira.

Kusashanda zvakanaka kwezvishandiso hakusi kungodhura chete. Idambudziko rekuvimbika. Mabhodhi eRF anowanzo kuve nema "ground vias" akawanda, ma "connector vias" uye ma "thermal vias". Kana hunhu hwe "drill" hukaderera pane imwe panel, RF grounding uye plated-through-hole reliability zvinogona kuora panguva imwe chete.

Maburi ekushandisa akaboorwa pane kubhoorwa

Maburi ekushandisa nemaburi ekupinza anofanira kuboorwa pane kuboorwa. Kuboorwa kunogona kukonzera kutsemuka, kupwanyika uye mipendero yemaburi isina kunaka muzvinhu zvakasimba zvakazara neceramic. Maburi ekushandisa akaboorwa anovandudza kunyoreswa uye anoderedza kukuvara kwemuchina, izvo zvakakosha pakugadzira mifananidzo, lamination, routing uye kugadzirisa coupon.

Ichi chinhu chidiki chinoratidza kukura kwemaitiro. Mugadziri anobata TMM sepepa rakasimba anogona kukonzera kukuvara kusingadzivisike RF board isati yapinda mumaitiro makuru. Nzira yekushandisa maturusi inofanira kunge iri chikamu chemirairo yebasa reTMM.

Kudzora ma parameter ekuboorera uye miganhu yehuwandu hwema hit-count

Zvinodiwa pakuboorera zvinofanirwa kuenzaniswa nehupamhi hwemaburi, ukobvu hwezvinhu, kukwirira kwematanda uye mamiriro echishandiso. Kumhanya kwespindle kunochengetedza, kudzorwa kwekudya kunoiswa mukati uye kubviswa kwemachipisi kwakavimbika kunobatsira kuderedza kupisa uye kuchengetedza hunhu hwemaburi. Miganhu yehuwandu inofanira kunge yakanyanya kusimba kupfuura zvinofungidzirwa zveFR4 nekuti zvinhu zvakazadzwa neceramic zvinogona kupfupisa hupenyu hwekuboorera.

Kune mafenzi akakora, zvinobatsira kuongorora huwandu hwese hwemaburi ekuboorera uye nzvimbo yemaburi akakosha. MaRF launch vias, maconnector vias uye thermal-via arrays zvinogona kudiwa kuti zviongororwe zvakanyanya kupfuura maburi asingashande. Kana bhodhi riine nhamba yepamusoro yemaburi ekuboorera, mhando yekuboorera inofanira kuverengerwa mumitengo uye nguva yakatarwa.

Kuchekwa kwemakemikari uye kukwirira kwemadziro emaburi

TMM kazhinji haidi kugadziriswa kwemadziro egomba nenzira yePTFE isati yaiswa. Zvisinei, kuchenesa madziro nemakemikari kunogona kuvandudza kukwirira kwemadziro mushure mekuboorwa uye kutsigira kugadzirwa kwesimbi zviri nani. Maitiro acho anofanira kuchenesa nekugadzirira madziro pasina kudzorwa kwesimbi kusingadiwe kunze kwekunge paine chikonzero chekuvaka chakakodzera.

Chinangwa chinoshanda chiri nyore: kugadzira madziro ane maburi anogona kugadzirwa nesimbi nguva dzose. Madziro akachena, akasimba anotsigira mhangura isina magetsi kana kuiswa zvakananga. Madziro asina kusimba kana akakuvara anogona kukonzera zvikanganiso zveplating, maburi kana nzvimbo dzisina kusimba dzinozokundikana mushure mekupiswa nekupisa.

Kuburikidza neaspect ratio uye ongororo yehukobvu hwebhodhi

Chiyero cheVia aspect chakakosha kana mapuranga eTMM akakora kana kuti hybrid stackups painosanganisa TMM nezvimwe zvinhu. Bhodhi gobvu rine mavias madiki rinogona kutaridzika zvakanaka muCAD asi rinowedzera kuoma kweplating. Magadzirirwo eRF anowanzo shandisa mavias akagayiwa, saka huwandu hwese hwemavias hunofanira kuongororwa zvichienderana nekugona kwekugadzira.

Vagadziri vanofanira kudzivirira maburi madiki asina basa kana mavias makuru achikwanisa kusangana neRF performance. Vanofanirawo kuongorora ma annular rings, kutora ma pads uye nzvimbo dzakatenderedza kuburikidza nefenzi. RF grounding yakanaka haidi kuregeredza miganhu yekugadzira. Inoda kuyera zvinodiwa ne electromagnetic ne drill uye plating capacity.

Kuisa mapurasitiki, Kuvimbika kwePTH uye Zvivakwa

Kuvimbika kwepurasitiki kuburikidza negomba semukana weTMM

Maitiro ekuwedzera kwekupisa kweTMM anogona kutsigira magadzirirwo akavimbika emaburi akaputirwa mumabhodhi eRF akavimbika. Hunhu uhwu hunobatsira, asi hahubvisi kudiwa kwekuboorwa nekuputirwa zvakanaka. Bharero rekupedzisira remhangura richiri kuenderana nemhando yemadziro emaburi, kucheneswa, kuiswa, ukobvu hwekuisa maburi nemagetsi uye kuongororwa.

Mumabhodhi eRF, ma-vias anowanzo shanda semagadzirirwo emagetsi. Kudzora simba remagetsi kuburikidza nefenzi. Ma-vias ekupisa anofambisa kupisa kubva kumidziyo yemagetsi. Ma-vias ekubatanidza-kutanga anodzosa simba remagetsi. Saka, simba rinobva mubhareri rinogona kukonzera RF kuora risati raonekwa sedunhu rakavhurika.

Pasi nepamafenzi uye nzira dzekudzoka dzeRF

Fenzi dzinoshandiswa pasi pevhu dzakajairika mu coplanar waveguide, mafirita, magadzirirwo emagetsi, nzvimbo dzekudzivirira uye ma RF modules ane nzvimbo yakakwira. Kugadzira kunofanirwa kuchengetedza nzvimbo yegomba, saizi yekuboorera yakapedzwa, mhando yeplating uye kuramba kuripo kwevhu. Zvivharo zvepasi zvisina kuvharwa zvakanaka zvinogona kuwedzera mwaranzi, kubatana kana kusawirirana kwe launch.

Ongororo yeDFM inofanira kutarisa nzvimbo, mhete ye annular, mamiriro e mask yekusolder uye kugona kwayo kuputira. Kana via pitch yakanyanya kusimba kupfuura ukobvu hwebhodhi rakasarudzwa, mugadziri angangoda kugadzirisa patani yefenzi. Via fence isingagone kugadzirwa kakawanda haisi muganhu weRF wakavimbika.

Kuvimbika kwezvishandiso zvekupisa uye simba rekuwedzera simba

Mabhodhi emagetsi anowanzo shandisa ma "thermal vias" pasi pema "device pads" kuti atumire kupisa kunzvimbo yepasi, simbi inotakura kana kuti "heat spreader". Ma "vias" aya anofanira kugadzirwa, kuputirwa nguva dzose uye kuenderana nezvinodiwa zvekusungirirwa. Kana ma "vias" akavhurika, akazadzwa, akavharirwa kana kuti akaputirwa, mufananidzo wekugadzira unofanira kunyatsotsanangura zvinodiwa.

Dhizaini yekupisa inofanira kufunga nezvekushandisa madziro ekubatanidza, kupukuta simbi, kupfava kwebhodhi uye kubatana kwemashure. Kupisa kwakanyanya kunogona kuvandudza kuyerera kwekupisa chete kana chimiro chakagadzirwa chakavimbika uye kana kupisa kwacho kuchipfuura laminate. Maitiro ekupisa uye kuronga mitengo yezvivakwa izvi zvakabatana zvakanyanya negwara rePCB rinogara kwenguva refu reTMM.

Kupatsanurwa kwechikamu chidiki senzira yekusimbisa kugadzirwa

Kupatsanurwa kwechinhu chimwe chete kunobatsira kana bhodhi reTMM riine zvinodiwa zvekuvimbika zvakanyanya, zvivharo zvidiki, zvakakora kuburikidza nefenzi, kuvakwa kwakakora kana kupisa kwakasimba. Izvi zvinosimbisa ukobvu hweplati, mhando yemadziro emaburi, mamiriro emhete yeannular uye kusimba kwelaminate. Kune mapurogiramu akakosha, kupatsanurwa kwechinhu chimwe chete kunogona kuitwa pamakuponi pane kutora sampuro inoparadza kubva pachigadzirwa.

Mushumo wechikamu chidiki hautsivi bvunzo dzeRF, asi unobatsira kutsanangura njodzi yekuvimbika. Kana bhodhi rikakundikana mushure mekutenderera kwekupisa, data rechikamu chidiki rinogona kuparadzanisa kuneta kwebharero, maburi epurasitiki, kuputika kweresin uye matambudziko anokonzerwa nekubatanidzwa.

Kuronga Nzira, Hunhu hweMupendero uye Kugadzira Michina

Kuronga nzira senzira inosarudzwa yekupedzisira yekuongorora

Kufambisa ma "routing" kunowanzo shandiswa pakugadzirisa ma "TMM board" ekupedzisira nekuti kunopa mipendero yakadzorwa uye kunodzivirira njodzi yekukuvadzwa inokonzerwa nekubaya kana kukora. Hunhu hwemipendero hunokosha nekuti ma "RF board" mazhinji anoisa zvinhu zvinoshanda pedyo ne "board outline". Ma "patch antennas", "edge launch connectors", "cavities", "slots" uye "coupled structures" zvese zvinogona kukanganiswa nemipendero yakakombama kana yakakuvara.

Kuronga nzira kunofanira kushandisa maturusi akakodzera ecarbide, kudya kunodzorwa uye kumhanya, uye miganhu yehupenyu hwematurusi. Kuronga kwakakodzera kunoenderana nekukora kwezvinhu, kuunganidzwa, mhangura, kuomarara kwemupendero uye kushivirira kwemucheto. Kufanana nekuboora, kuronga nzira yeTMM yakazadzwa neceramic kunofanirwa kutorwa senzira inodzorwa yemakanika kwete yekufunga nezveramangwana.

Magadzirirwo eRF anotsanangurwa nemucheto uye magadzirirwo eantenna

Mabhodhi eAntena nemabhodhi emicrowave anowanzo shandisa mupendero webhodhi sechikamu chechimiro cheRF. Kuoma kwemupendero, maburi, kuvhurika kwelaminate kana kushivirira kwekunze kusina kunaka zvinogona kuchinja resonance, maitiro emwaranzi kana connector fit. Kana mupendero wacho wakakosha paRF, dhirowa rinofanira kuratidza kushivirira uye kunaka kwenzvimbo yacho.

Pakuronga magadzirirwo eantenna, gwara reTMM antenna PCB rinotsanangura kuti kugadzikana kwezvinhu, geometry yemhangura uye kudzora kwekunze kunokanganisa sei maitiro eantenna. Kubva pakuona kwekugadzira, chinhu chikuru ndechekudzivisa kubata magadzirirwo eantenna semaumbirwo akajairwa emakanika.

Nzvimbo dzinoiswa mipata, maburi uye zvidimbu zvemukati

Makomba nemakomba anowanikwa muma microwave modules, ma filters, ma shields, nzvimbo dze connector uye nzvimbo dze mechanical mounting. Maficha aya anofanirwa kuongororwa kuti aone kana paine radius shoma, maturusi anosvika, copper clearance, burr control uye dimensionally tolerance. Makona emukati akapinza anogona kunge asingashande pakufambisa uye anogona kukonzera stress concentration.

Kana muganhu wegomba uchikanganisa maitiro emunda, mugadziri anofanira kuuisa sewakakosha. Kana kuri kubviswa kwemuchina chete, mugadziri anogona kunge aine rusununguko rwakawanda. Kupatsanura kwakajeka kunobatsira mugadziri kuchengetedza mashandiro asina mitengo yakawandisa yezvinhu zvisina kukosha.

Maitiro ekugadzira panelization uye tab

Kugadziriswa kwemapaneru kunokanganisa mashandiro, nzira yekufambisa, kuungana uye kunaka kwebhodhi rekupedzisira. Mapaneru eTMM anofanira kutsigirwa pasina kuisa ma tabs kana kurumwa nembeva uko kunokuvadza mipendero yeRF kana nzvimbo dzeantenna. Kuisa ma V-scoring uye kupwanya kazhinji hazviwanzo kuve sarudzo dzisina kunaka kune ma TMM RF frameworks ane hungwaru, kunyanya kana mhando yemipendero ichikosha.

Matabhu anofanira kuiswa munzvimbo dzakachengeteka uye anobviswa nenzira isingakanganise laminate. Kana dhizaini yacho iine maconnector ekuburitsa edge, antenna edges kana cavity boundaries, dhirowa repanelization rinofanira kudzivirira nzvimbo idzodzo kubva kumatabhu, break-off features uye rough depanelization.

Sarudzo Yekupedzisa Pamusoro peRF Performance uye Assembly

Kupera kwepamusoro sesarudzo yekugadzira RF

Kupedzisa pamusoro kunofanirwa kusarudzwa sechikamu chedhizaini yeRF, kwete kusarudzwa otomatiki kubva pamutemo wekutenga wakajairika. Pama microwave frequency, magetsi anoyerera pedyo nepamusoro pe conductor. Saka kupera kunogona kukanganisa kurasikirwa kwe conductor, kugona kwayo kusunganidzwa, kugara kwenguva refu, kubatana kwewaya uye maitiro e connector interface.

OSP nesirivha yekunyudza zvinowanzo fungidzirwa senzira dzeRF dzinorasikirwa zvishoma kana mamiriro ekugadzira achibvumira. ENIG neENEPIG zvinogona kupa kugara kwenguva refu uye zvakanakira kugadzira, asi zvikamu zvine nickel zvinogona kuwedzera kurasikirwa kweRF pamitsetse ye microwave yakareba kana inononoka. Kupera kwakakodzera kunoenderana nehuwandu, kureba kwemutsetse, bhajeti rekurasikirwa, kusungirirwa, nguva yekuchengetedza, kubatana kwewaya uye kusvibiswa kwezvakatipoteredza.

OSP uye sirivha yekunyudza kuti zvishandiswe pakurasikirwa zvishoma

OSP inodhura zvishoma uye inochengetedza nzira yeRF current iri pedyo nemhangura, asi inoda nguva yekuisanganisa nekungwarira uye inogona kusakodzera kuchengetwa kwenguva refu kana kudzokororwa kakawanda. Kunyudza sirivha kwakajairikawo kuma microwave circuits asingadhuri zvakanyanya, asi inoda kubatwa nekudzora uye kudzorwa kwetsvina.

Kupedzisa uku kunowanzo kwezva maRF lines, mafirita uye ma antenna feeds. Zvisinei, kunofanira kuramba kuchizadzisa maitiro ekubatanidza uye zvinodiwa zvekuvimbika mumunda. Kupedzisa kurasikirwa zvishoma kunokonzera njodzi yekugona kusunganidzwa hakusi sarudzo yakanakisa yekugadzira otomatiki.

ENIG neENEPIG zvekuvaka zvinotungamirwa negungano

ENIG neENEPIG zvinowanzo sarudzwa kana kubatanidzwa kwacho kuchida kugara kwenguva refu, kusungirirwa zvakanaka, kusungirirwa kwewaya, nzvimbo dzinobata zvinhu zvakasimba kana kubatana kwacho kunoda simba. Zvinogona kukodzera pamabhodhi eTMM, asi zvinofanirwa kuongororwa kuti zvionekwe kana paine kurasikirwa kweRF kana zvichivhara mitsetse mirefu yekutumira kana ma resonator.

Mamwe magadzirirwo anoshandisa nzira yekupedzisa yakasarudzwa kana nzira yekupedzisa yakasarudzwa nemasiki kuti ienzanise kurasikirwa kweRF uye zvinodiwa pakugadzira. Kana kupedzisa kwakasarudzwa kuchidikanwa, dhizaini inofanira kutsanangura zvakajeka kuti ndeapi nzvimbo dzinogamuchira kupedzisa kupi uye kuti shanduko dzinodzorwa sei.

Pedzisa magwaro ane chekuita nedhirowa dzekugadzira

Mufananidzo wekugadzira unofanirwa kuratidza kupedzwa uye chero zvirambidzo zveRF. Mashoko asina kujeka akadai sekuti "standard finish" anogona kukonzera mutengesi kuti afunge nezve ENIG, OSP kana imwe default. Kana RF model ichifunga nezve copper, OSP kana immersion silver, fungidziro iyoyo inofanira kunyorwa pasi.

Kudzorwa Kwekupindirana, Makuponi uye Kusimbiswa kweRF

Kudzorwa kweimpedance sechisungo chekugadzira

Kudzora kupindirana hakusi kungogadzira chete. Chisungo chekugadzira ndechekuvaka nekusimbisa chimiro chetambo yekutumira mukati mehunyanzwi hwakatarwa. Mugadziri anofanira kuverenga kana kusimbisa upamhi hwetambo kubva pamhando chaiyo yeTMM, ukobvu hwe dielectric, ukobvu hwemhangura, mamiriro emasiki e solder, finish uye reference plane.

Dhirowa inofanira kutsanangura rudzi rwemutsetse, kukosha kweimpedance, kushivirira, mareferensi ezvikamu uye zvinodiwa zvemakuponi. Kana dhizaini yacho iine microstrip, coplanar waveguide yakadzika uye stripline, chimiro chega chega chingada kuongororwa zvakasiyana. Kuponi imwe chete ye50 ohm inogona kusamiririra nzira yega yega yeRF.

Maitiro ekukopa eTDR uye kurasikirwa nekuisa

Makuponi eTDR anobatsira pakusimbisa impedance. Makuponi ekuisa-kurasikirwa anobatsira kana bhajeti yekurasikirwa ichikosha pamutsetse. Makuponi echikamu chidiki anobatsira pakuisa plating uye kusimbisa stackup. Chirongwa chekugadzira TMM chakakura chinoshandisa kuponi yakakodzera kudzora njodzi.

Mapurogiramu emhando yepamusoro anowanzo batsirwa nemakuponi akawanda kupfuura mapurogiramu ekugadzira nekuti dhizaini yacho ichiri kusimbiswa. Kana dhizaini yacho yangobvumidzwa, zvinodiwa zvemakuponi zvinogona kuenzaniswa pakugadzirwa. Kuchinja uku kunowanikwa mugwaro rekugadzira maprototype eTMM PCB.

Ukobvu hwakapedzwa uye kutonga kwekufungidzira kweDk

Kusapindirana kunoenderana nechikamu chekupedzisira che dielectric, kwete chete pane data re laminate. Ukobvu hwemhangura hwakapedzwa, kumanikidzwa kwe lamination, kusiyana kwe bondline uye kupedzisa kwepamusoro zvinogona kuchinja mhedzisiro. Kune magadzirirwo e high-frequency, dhizaini inodzorwa inofanira kuratidza kukosha kwechinangwa uye kushivirira pane kuvimba nemazita ezvinhu zvakajairika.

Iyo Dk inoshandiswa mumodhi yekugadzira inofanirwa kuenderana nedata rezvinhu uye huwandu hwema frequency edunhu. Mugadziri haafanire kutsiva imwe TMM grade yakasiyana kana imwe dielectric thickness pasina mvumo yeinjiniya. Kuti uwane mamiriro ekugadzira RF line, ona gwara rekugadzira reTMM RF PCB.

Kuongororwa kweRF kupfuura kuenderera mberi kwemagetsi

Kuyedzwa kwemagetsi kunosimbisa kuvhurwa nekupfupika, asi hakusimbisi maitiro eRF. Kana njodzi yechigadzirwa ichi ichiratidza kuti ndizvo zvakanaka, mutengi anogona kukumbira kuyerwa kweimpedance, kupinza-kurasikirwa nemakuponi, kuponi dze resonator, S-parameter test fixtures kana kuyedzwa kweRF inopisa/inotonhora. Chirongwa chaicho chinoenderana nekushandiswa uye bhajeti.

Mugadziri haafanire kutsanangura zvinodiwa zveRF pasina mvumo yemutengi. Zvisinei, inofanira kutsigira hurongwa hwekuyedza hwemutengi nekuisa makuponi, magwaro uye marekodhi emaitiro akadzorwa. Chinangwa ndechekubatanidza data rakayerwa nebhodhi rekupedzisira rakagadzirwa. Marekodhi anotsanangurwa pano anopawo humbowo hwekuti mutengesi wekugadzira TMM anokodzera here , kunyanya kuteverwa kwezvinhu uye marekodhi ekuongorora akanangana nenzvimbo.

Kugadzirwa kweHybrid Rogers TMM Multilayer

Kubatanidza zvinhu uye kusarudzwa kwekunamatira

Zvivakwa zveTMM zveHybrid zvinogona kusanganisa Rogers TMM neFR4, ma bonding films, prepregs, metal carriers kana zvimwe zvinhu zveRF. Chinangwa chinowanzo kuve chekuisa TMM chete painobatsira mashandiro eRF uku uchishandisa zvinhu zvisingadhuri kana zvinobatsira zvemakanika kune dzimwe nzvimbo. Izvi zvinogona kushanda, asi sisitimu yekunamira inofanira kunge inoenderana nemaitiro acho uye chinangwa chekuvimbika.

Kusarudzwa kweglue kunokanganisa ukobvu hwebondline, tembiricha yelamination, kunyoreswa, nzvimbo ye dielectric, kuburikidza nekugadzirira uye kuvimbika. Inofanira kutenderwa panguva yeDFM pane kuchinjwa panguva yekutenga. Gure rakasiyana rinogona kuchinja impedance, warpage uye plated-hole stress.

Kuenzanisa, kurwa kwepage uye kutonga kunyoresa

Ma "hybrid stackups" anofanira kunge akafanana sezvinobvira. Kusawirirana kunogona kugadzira "warpage" panguva ye "lamination", "soldering" kana "field tembiricha" kuchinja. "Warpage" inokanganisa kugona kwe "assembly", "connector alignment", "shielding fit" uye "antenna position". Izvi zvinogonawo kuita kuti "impedance" uye "ukobvu" zvisaenzane panel yese.

Kunyoresa kwakakoshawo nekuti maRF vias, maficha ekuburitsa uye mareferensi estripline anofanirwa kuenderana necopper pane akawanda layers. Maumbirwo ehybrid anofanirwa kusanganisira kutenderwa kwechokwadi kwekunyoresa, kwete fungidziro dzeCAD dzakanakisa.

Kuvimbika kweburi rinopinda nepakati pemaburi mumatanda ezvinhu zvakasanganiswa

Buri rakaputirwa nezvinhu zvakasanganiswa rinowana kukura kwakasiyana uye mamiriro epamusoro pamadziro aro. Maitiro eTMM ekuwedzera kupisa anogona kubatsira, asi stack yese inokosha. Kana FR4, bond film neTMM zvese zviripo mugomba rimwe chete, kuchera, desmear uye plating zvinofanirwa kunge zvinoenderana nekuvakwa kwakazara.

Kune mabhodhi akakosha pakuvimbika, mugadziri anofanira kukurudzira makuponi anomiririra stack chaiyo uye aspect ratio. Coupon iri nyore yeTMM ine layer mbiri ingasamiriri stack yakakora yehybrid ine buri rakafanana.

Kuchinjana kwemitengo nekugadzirwa kwezvinhu muzvivakwa zvehybrid

Kuunganidza zvinhu zvakasiyana-siyana kunogona kuderedza mutengo wezvinhu, asi kunogonawo kuwedzera lamination, engineering uye goho risingatarisirwi. Mutengo wekupedzisira unoenderana nehuwandu hwema layer, kuwanikwa kwezvinhu, bond system, kuoma kwe drill, zvinodiwa pakuongorora uye huwandu hwekugadzira. Dhizaini yakanaka inoshandisa hybrid kuvaka nechikonzero, kwete chete nekuti inoita kunge yakachipa.

Vatengi vanofanira kuenzanisa zvese-TMM uye sarudzo dzehybrid vachishandisa RF inodiwa uye magwaro akafanana. Mutengo wakaderera we laminate ungasave mutengo wakaderera wepurojekiti kana hybrid stack ikava yakaoma kugadzira.

Kudzora Kugadzira Mask, Legend uye Assembly-Need

Kuchengetedza masiki eSolder paRF traces

Masiki inosonerwa inogona kuchinja impedance, kurasikirwa uye kushanda zvakanaka kwenzvimbo ye dielectric yakatenderedza maRF traces. Magadzirirwo mazhinji eTMM RF anochengetedza mask inosonerwa kure nemitsetse yakakosha yekutumira, ma patch antenna, ma resonator uye connector launches. Mamwe magadzirirwo anobvumira mask munzvimbo dzisina kukosha kudzora ma solder uye kudzivirira kusvibiswa.

Dhirowa rekugadzira rinofanira kutaura nzira yekuisa masiki. Kana zvikasadaro, mugadziri anofanira kubvunza asati ashandisa mitemo yemasiki yakajairwa. Sarudzo yekufukidza kana kuratidza mitsetse yeRF inogona kukonzera kusawirirana pakati pekufananidzira nekugadzira.

Kuiswa kwengano kure nezvinhu zveRF

Nyaya yeSilkscreen inofanira kuchengetedzwa kure neRF-critical copper, nzvimbo dzekuburitsa connector, maantenna uye nzvimbo dzakadzorwa kunze kwekunge zvabvumidzwa zvakananga. Ukobvu hweinki uye nzvimbo yacho zvinogona kuita sezvishoma, asi pa microwave structures dzinonzwa dzinogona kuchinja dielectric loading yemuno kana kukonzera njodzi yekusvibiswa.

Zviratidzo zvekubatanidza zvinogona kutamiswa kunzvimbo dzisina kukosha, nzvimbo dzemakanika kana mifananidzo yemagwaro. Kana bhodhi riri diki kwazvo, zviratidzo zvelaser kana machira ekurongedza zvingave zviri nani pane kuisa legend pedyo neRF structures.

Kutanga kwekubatanidza uye kutonga kwechimiro chekubatanidza

Kuburitswa kweconnector inzvimbo dzinonyanya kukundikana nekuti dzinosanganisa RF geometry, mechanical fit, soldering uye ground transition. Kugadzira kunofanirwa kudzora saizi yepad, ground clearance, kuburikidza nenzvimbo, daro remumucheto, kupedzisa uye kuvhurwa kwemasiki. Kuburitswa kwakatorwa kubva pa connector datasheet kungave kuchiri kuda kugadziriswa kuti kuonekwe ukobvu hweTMM nemhangura.

Pakugadzira, mutengesi anofanira kuchengetedza chimiro che "launch geometry" muCAM uye kuona zviyero zvakakosha. Kana chinobatanidza chichida "edge plating", "castellations", "tight routing tolerance" kana "special finish", zvinodiwa izvozvo zvinofanirwa kutaurwa zvakajeka mudhirowa.

Kufunga nezvekubatanidza waya uye kusungirirwa kwezvikamu

TMM inogona kukodzera kushandiswa pakubatanidza waya, asi kuvakwa kwekubatanidza waya kunofanira kuratidza kupedzisa kwepamusoro, kuchena kwemapedhi, mamiriro ekuchengetera uye kurongedza. ENEPIG kana imwe finish inogona kudiwa zvichienderana newaya yakagadzirwa uye maitiro ayo.

Zvinodiwa pakugadzira zvinotungamirwa neboka zvinofanira kutsanangurwa usati watora mashoko. Bhodhi rakagadzirirwa kubatanidza waya, kubatanidza mudziyo wemagetsi kana kubatanidza nekupisa kwakanyanya rine zvinodiwa zvakasiyana pakugadzira pane coupon yekuyedza yeRF yakasungirirwa.

Kudzora Kugadzira Kunonamira pakupisa uye pakuvimbika

Zvinodiwa zvekugadzira zvinogara kwenguva refu pakupisa

Zvinhu zveTMM zvinowanzosarudzwa kuti zvigadzikane pakupisa uye kuti zvive zvakavimbika pakuputira maburi. Kugadzira kunofanira kuchengetedza zvakanakira izvozvo kuburikidza nekuboorera, kuputira, kupedzisa, kurongedza uye kunyora zvinyorwa. Kugadzikana pakupisa hakusi kungori chinhu che laminate chete; chinodiwa pabhodhi rakapedzwa.

Kana chigadzirwa chichishanda panze, mundege, kutaurirana nesatellite, radar, mota kana nzvimbo dzine simba guru reRF, hurongwa hwekugadzira hunogona kuda thermal cycling, solder-float exposure, reflow simulation, microsection kana impedance measurement patembiricha. Zvinodiwa izvi zvinofanirwa kuverengerwa muRFQ pane kuwedzerwa mushure mekugadzirwa.

Amplifier yesimba uye ruzivo rwekugadzira kupisa

Mabhodhi emagetsi anowanzoda ma "thermal vias", nzvimbo dzemhangura dzakakora, kubatana kwepasi neshure, kubatana kwesimbi kana kuti kuenzanisa kupisa. Kugadzirwa kunofanira kuongororwa kuburikidza nekuzadza, ukobvu hweplating, kuvhura mask, kupedzisa kwemashure, kutsetseka uye ukobvu hwekupedzisira. Kutamiswa kwekupisa kunoenderana nenzira yakazara, kwete chete pa "laminate thermal conductivity".

Kana bhodhi rikabatanidzwa nearuminiyamu kana brass, chimiro chemuchina nekupisa chinofanira kuiswa mudhirowa yekugadzira. Kushivirira maburi, kutsetseka, kupedzisa uye sarudzo dzeplating zvinogona kukanganisa kubatanidzwa kwekupedzisira.

Kutenderera kwekupisa uye kuongororwa kwePTH

Kutenderera kwekupisa kunogona kuratidza maburi asina kusimba, mabara akatsemuka, mhete dzisina kusimba uye kushushikana kwezvinhu. Kune mabhodhi eTMM akavimbika zvakanyanya, chirongwa chekuyedza chinogona kusanganisira kupatsanurwa kwepamberi nekumanikidzwa, kuongororwa kwekuenderera mberi uye kutarisa kusimba. Makuponi anofanirwa kumiririra kugadzirwa kuburikidza neaspect ratio uye stackup.

Mutengesi haagoni kutonga kugamuchirwa kwechinhu pasina zvinodiwa nemutengi. Mutengi anofanira kutsanangura huwandu hwemadenderedzwa acho, huwandu hwemadenderedzwa acho uye zvinodiwa zvekugamuchirwa kana chikumbiro chichida zvitupa zvepamutemo. Mugadziri anofanira kutsigira chirongwa nemakuponi anomiririra uye zvinyorwa zvinoteverwa.

Kudzora zvakatipoteredza uye kuchengetwa kwezvinhu

Kudzora zvakatipoteredza kunosanganisira kubata kwakachena, kudzora oxidation, kudzivirira kupera, kutonga hunyoro pazvinenge zvakakodzera uye pakurongedza kwakakodzera. Kusagona kweTMM kumakemikari akawanda ekugadzira hakubvisi kudiwa kwekuchengetwa zvakanaka uye kubata. Zvinodiwa pakupedzisa pamusoro uye pakuungana zvinogona kuisa miganhu yenguva yekushanda.

Kuti zvinhu zvigare kwenguva refu zvichigadzirwa, zvinyorwa zvekurongedza nekuchengetera zvinhu zvinofanira kunge zvakajairwa. Bhodhi rine magetsi akakodzera panguva yekutumirwa rinogona kukonzera matambudziko ekubatanidza zvinhu kana kupedzwa kwechinhu chacho kana kuchengetwa kwacho kusina kunaka.

Rondedzero yeRogers TMM PCB DFM Pamberi pekuburitswa kweFaira

Ongororo yezvinhu uye zvinhu zvakaunganidzwa

• Taura giredhi chaiyo yeRogers TMM, senge TMM3, TMM4, TMM6, TMM10, TMM10i kana TMM13i.
• Dana ukobvu hwe dielectric, ukobvu hwebhodhi rakapedzwa uye kushivirira.
• Tsanangura huremu hwemhangura, mhangura yakapedzwa uye profile yemhangura kana kurasikirwa kwakakosha.
• Taura kana kuchinjwa kuchibvumirwa kana kuti kuchirambidzwa.
• Tsvaga zvinhu zvakasanganiswa, masisitimu ekunamira uye manotsi elamination.
• Chengetedzai zvinhu zvakasanganiswa zvakaenzana kana zvichibvira.
• Simbisa kana dhizaini yacho ichishandisa microstrip, stripline, GCPW kana mhando dzemitsetse yakawanda.

Ongororo yeRF geometry

• Maka zviratidzo zveimpedance inodzorwa uye zvikamu zvereferensi.
• Tsvaga RF-critical dimensions dzakadai se antenna edges, filter resonators, coupled gaps uye launch pads.
• Ratidza kutenderwa kwemutsara wapera uye miganhu kana zvichidikanwa.
• Tsanangura nzira yekuchengetedza mask inosungirirwa pamadziro iri pedyo neRF traces, antennas uye launches.
• Simbisa kuti bhajeti reRF rinoenderana nebhajeti remagetsi.
• Dzivirira kuburikidza nefenzi, nzvimbo dzakavhurika pasi uye geometry yekutanga kweconnector panguva yeCAM.
• Ipai hunhu hwakayerwa hwemakuponi eRF akakosha kana zvichidikanwa.

Ongororo yekuongorora kuchera nekuputira

• Ongorora uchishandisa chiyero cheaspect ratio zvichienderana nekukora kwebhodhi.
• Dzivisa maburi madiki asina kufanira akakora kuburikidza nefenzi.
• Ipai mhete dze annular dzinoenderana nehunyanzvi hwekugadzira.
• Tsanangura zvakajeka zvakavharirwa, zvakazadzwa, zvakavharirwa kana kuti zvakavharirwa uchishandisa zvinodiwa.
• Taura zvinodiwa zvechikamu chidiki chemapuranga kuti zvive zvakakosha pakuvimbika.
• Simbisa zvinodiwa pakukora kweplate uye kirasi yekugamuchirwa.
• Shandisa makuponi anomiririra pakuvaka kwakakora kana kwakasanganiswa.

Ongororo yenzira uye yemakanika

• Shandisa nzira yekufambisa zvinhu panzvimbo pekurova kana kuisa mapoinzi pamatanho eTMM anonzwa.
• Dzivirira mipendero yeantenna, kuburitswa kwemupendero uye miganhu yemukati kubva kumatabhu.
• Tsanangura kushivirira kwemufananidzo uye hunhu hwemucheto wakakosha.
• Ongorora nzvimbo dziri mukati uye maburi emukati kuti uone kana paine nzvimbo ine dhayamita yezvishandiso uye nzvimbo yakacheneswa nemhangura.
• Chengeta mhangura yemumucheto yakavharwa panogona kukonzera zvikanganiso pakubuda kwenzira.
• Simbisa kugadzwa kwekupedzisira kwepaneru pamwe nezvinodiwa zvekubatanidza uye RF.

Ongororo yeRFQ package

• Data reGerber, ODB++ kana IPC-2581.
• Faira rekuboorera reNC netafura yekuboorera.
• Kudhirowa kwekugadzira nezvinhu, stackup, finish uye tolerances.
• Tafura yekudzivirira inodzorwa uye zvinodiwa zvemakuponi.
• Kudhirowa kwekubatanidza kana chikamu chakabatanidzwa chikakanganisa magumo kana chifukidzo.
• Zvinodiwa pabvunzo, zvinodiwa pamagwaro uye kirasi yekugamuchirwa.
• Huwandu, nguva yekutungamirira, chimiro chemuenzaniso kana mamiriro ekugadzirwa uye nhoroondo yekudzokorora.

Zvinyorwa zveUnhu, Magwaro uye Kudzora Shanduko muKugadzira

Kurongeka kwezvinyorwa uye zvinyorwa zvechitupa

Kutevedza zvinhu kwakakosha pamabhodhi eRF nekuti giredhi rezvinhu, ukobvu hwe dielectric uye cladding yemhangura zvinopesvedzera mashandiro. Zvinyorwa zvekugadzira zvinofanirwa kuratidza nzvimbo ye laminate, stackup inotenderwa, huremu hwemhangura, finish uye chero kutsauka. Chitupa chekutevedzera chinowanzo batsira kumaindasitiri, ndege, dziviriro uye zvigadzirwa zvinogara kwenguva refu.

Kutevedzana kwedata kunobatsirawo kuongorora kutadza. Kana bhodhi rikakundikana mushure mekuongororwa kana kuratidzwa mumunda, zvinyorwa zvezvinhu uye maitiro zvinobatsira kuona kana chikonzero chaive muganhu wedhizaini, shanduko yekugadzira, kukuvara kweassembling kana kushushikana kwezvakatipoteredza.

Kuvharirwa, kupatsanurwa kwechikamu chidiki uye mishumo yehukuru

Mishumo yemhando yepamusoro inofanira kuenderana neruzivo rwengozi yebhodhi. Muenzaniso uri nyore ungangoda bvunzo yemagetsi uye kuongororwa kwemativi. Module yeRF yekugadzira ingangoda mishumo ye impedance, microsection, data re plating thickness, final thickness report, critical dimension measurements uye chitupa chezvinhu.

Mutengi anofanira kutaura kuti ndeapi marepoti anodiwa. Zvikasadaro, vatengesi vakasiyana vanogona kutaura nezvemhando dzakasiyana dzezvinhu. Mutengo wakaderera unogona kungobvisa humbowo hwekuti mumwe mutengesi akabatanidza chii.

Kudzora shanduko yekugadzira yemagadzirirwo eRF akakodzera

Kana bhodhi reTMM RF rave kushanda, shanduko dzinofanira kudzorwa nokungwarira. Kuyera kwezvinhu, ukobvu hwe dielectric, copper foil, surface finish, solder mask, line width, via structure, bond material uye routing method zvese zvinogona kukanganisa mhedzisiro. Kunyangwe shanduko inoita seisina kunaka pabhodhi redhijitari inogona kukosha pakugadzira microwave.

Kudzora shanduko mukugadzirwa kunofanira kusanganisira kuteverwa kwekugadzirisa, kubvumidzwa kweinjiniya uye, kana zvichidikanwa, kubvumidzwa kushoma. Izvi zvinodzivirira mutengi nemugadziri kubva pakutsiviwa kusingadzoreki.

Ongororo yekugona kwemupi

Mutengesi weRogers TMM PCB anofanira kuratidza ruzivo nekushandisa ma laminates ane frequency yakakwira, ongororo ye RF-aware CAM, kubhoorwa kunodzorwa, nzira yakakodzera yekufambisa zvinhu, kuponi kwe impedance, mishumo yekuongorora uye ongororo ye hybrid stackup. Kusarudzwa kwemutengesi kunofanirwa kufunga kana mutengesi achigona kuchengetedza maficha akakosha eRF uye kupa humbowo hunodiwa, kwete mutengo chete.

Pakuenzanisa vatengesi, bvunza kana mutengo wacho uchisanganisira kutevedza zvinhu, kuyedzwa kwe impedance, microsection, ongororo yeDFM, kurongedza uye magwaro. Kuti uwane maonero ekusarudza vatengesi, ona gwara rekugadzira nekugadzira reTMM PCB . Kuti uwane RFQ, ipa giredhi chaiyo yeTMM, ukobvu hwebhodhi, mhangura, makirasi emaburi, huwandu hwema layer uye zvinodiwa zve impedance. Kana tsananguro yekuvaka yakazara, fungidziro shoma dzemaitiro dzinodiwa mumutengo wacho.