RT duroid 6002 PCB Quote uye Stackup
Peji rino rine basa rekutaura nezve quotation uye stackup-definition yeRT/duroid 6002. RFQ inobatsira inoratidza giredhi, ukobvu, mhangura, layers, saizi yebhodhi, zvinodiwa zve impedance, kuchera, kuongorora uye huwandu usati waonekwa sewakaenzana nemutengo.
Mufananidzo 1. Rogers RT/duroid 6002
Chirevo cheRT duroid 6002 PCB chinofanira kutsanangura kuvakwa kwacho kwapera, kwete chete giredhi rezvinhu. Ukobvu, mhangura, huwandu hwezvikamu, tekinoroji yemaburi, zvinangwa zve impedance uye kuongororwa zvinogona kuchinja mutengo wekugadzira kupfuura zvinoratidzwa nezita rekambani chete. Rogers RT/duroid 6002 ipurasitiki yePTFE yakazadzwa neceramic, ine girazi-microfiber yakasimbiswa ine dielectric constant ye2.94 ±0.04 uye dissipation factor ye0.0012 pa10 GHz. CTE yayo iri mu-plane ye16 ppm/°C - yakaenzana nemhangura - yakabatana ne low z-axis CTE ye24 ppm/°C uye data rakaburitswa reASTM E595 outgassing (kana zvichibvira) rinogona kunge rakakosha kune satellite, phased-array, defense, uye mamwe madhizaini akatarisana nenzvimbo, asi purojekiti inofanira kusimbisa magwaro aripo egiredhi uye zvinodiwa zvekupasa. Gwaro iri reinjiniya rinoongorora data rakasarudzwa reRT/duroid 6002, mashandiro emagetsi nekupisa, mitemo yekugadzira, referensi yeimpedance, magadzirirwo estackup, maitiro ekugadzira nhanho nhanho, kuenzanisa neRogers laminates dzakabatana (5880, 6006, 6010, RO3003, RO4350B), mashandisirwo eindasitiri, kuongorora mitengo, uye mibvunzo inopfuura makumi maviri inowanzo bvunzwa yeinjiniya.
Zviri Mukati
- Chii chinonzi Rogers RT/duroid 6002?
- RT/duroid 6002 Sheet Yese yeData uye Zvivakwa Zvezvinhu
- Dielectric Constant, Chinhu Chinoparadza, TCDk Yakatsanangurwa
- Kufambisa Kwekupisa, CTE, uye Maitiro Ehunyoro
- Nei CTE Matching Drives Yakaputirwa NeHole Kuvimbika
- RT/duroid 6002 vs 5880 vs 6006 vs 6010 vs RO3003 vs RO4350B
- RT/duroid 6002 Impedance Calculator: 50Ω Microstrip, Stripline, Differential
- Dhizaini yeStackup: Magadzirirwo eAll-PTFE Multilayer uye Hybrid FR4
- Maitiro Ekugadzira PCB yeRT/duroid 6002 Nhanho Nenhanho
- Mashandisirwo gumi epamusoro muindasitiri: Satellite, Radar, 5G, Aerospace
- Kuongorora Mutengo, Nguva Yekutora Mari, Kuwanikwa, uye Kwekutenga
- Matambudziko Akajairika Einjiniya uye Gwaro Rekugadzirisa Matambudziko
- Mibvunzo Inowanzo bvunzwa Nezve RT/duroid 6002 (mibvunzo nemhinduro zvinodarika makumi maviri)
- Kugadzira PCB paHighleap Electronics RT/duroid 6002
1. Chii chinonzi Rogers RT/duroid 6002?
Rogers RT/duroid 6002 ipurasitiki yePCB yakagadzirwa neRogers Corporation. Iine zvikamu zvitatu zvinoumba PTFE (polytetrafluoroethylene) matrix, ceramic filler particles, uye girazi rakarukwa rekusimbisa. Zvinhu izvi ndezveRT/duroid 6000 series, iyo inosanganisirawo RT/duroid 6006, 6010.2LM, 6035HTC, uye 6202. Mukati meiyi series, RT/duroid 6002 yakagadzirirwa magadzirirwo anoda kushanda kwakanyanya mu microwave uye kugara kwenguva refu munzvimbo dzine kupisa kwakanyanya - musanganiswa usingakwanise kupihwa nePTFE laminates dzisina kuzadzwa.
Hunhu hunotsanangura huinjiniya hweRT/duroid 6002 hwakapetwa kana:
- Kufananidza CTE nemhangura: chiyero chekuwedzera kwekupisa kwe16 ppm/°C chakafanana zvakanyanya nemhangura pa17 ppm/°C, izvo zvinovandudza zvikuru kuvimbika kwemaburi akaiswa mukati mekupisa.
- Kubvisa mweya munzvimbo dzakasiyana: kushanda kweASTM E595 kwakakodzera neTML <1.0% uye CVCM <0.1%, izvo zvingave zvakakosha pakuongororwa kwekukodzera nzvimbo asi hazviratidzi kugamuchirwa kwepurojekiti.
- Kurasikirwa kwakaderera kwe microwave: chinhu chinobvisa magirazi che0.0012 pa10 GHz, chiri pakati pemagirazi ePTFE akasimbiswa pasi pemagirazi.
- Nhaka yekubhururuka: Nhoroondo yepurogiramu inogona kupa ruzivo rwakakosha, asi dhizaini itsva ichiri kuda humbowo hwayo hwekuti yakaitwa sei uye humbowo hwekugamuchirwa kwayo.
RT/duroid 6002 inowanzo tsanangurwa kana dhizaini ichibatanidza ma microwave frequency ari pakati nepakati kusvika akakwira (1–40 GHz) nenzvimbo dzakanyanya kupisa — cycling yekupisa kwemauto, space thermal vacuum, automotive grade-1 underhood — uye inoda kuvimbika kwepurasitiki kuburikidza nehuwandu hwema cycle hwakatarwa nehurongwa hwekufanirwa hunoshanda. Mukati meRogers high-frequency PCB materials portfolio yakakura, RT/duroid 6002 inodiwa chero ECSS-Q-ST-70-08C inofanirwa kusimbiswa zvichienderana neprojekti iripo pane kufungidzirwa kubva kuzita rezvinhu.
2. RT/duroid 6002 Datasheet Yakazara & Zvimiro Zvezvinhu
Tafura iri pazasi inoratidza hunhu hwekutarisa hwakasarudzwa hwakataurwa mumabhuku ehunyanzvi eRT/duroid 6002 akaburitswa; simbisa gadziridzo yazvino, ukobvu, uye nzira yekuyedza usati waburitsa dhizaini. Hunhu hunoyerwa nenzira dzekuedza dzeIPC-TM-650 kunze kwekunge zvataurwa neimwe nzira. Hunhu hwakajairika uye hunoshanda pane ese masarudzo ehukobvu akajairwa. Gara uchiongorora uchienzanisa negadziridzo yazvino yeRogers Corporation datasheet usati waburitsa dhizaini yekupedzisira.
| Property Category | pfuma | ukoshi | chikwata | Test Method / Mamiriro |
|---|---|---|---|---|
| Electrical | Dielectric constant (Dk, dhizaini) | 2.94 ± 0.04 | - | IPC-TM-650 2.5.5.5 @ 10 GHz |
| Dissipation factor (Df) | 0.0012 | - | IPC-TM-650 2.5.5.5 @ 10 GHz | |
| Kuwanda kwekupisa kweDk | + 12 | ppm / ° C. | −50 kusvika +150 °C | |
| Vhoriyamu kudzivisa | 10¹⁰ | MΩ·cm | IPC-TM-650 2.5.17.1 | |
| Simba re dielectric | 45 | kV / mm | ASTM D149 | |
| Thermal | Kupisa kwemafuta | 0.44 | W/m/K | ASTM C518 |
| CTE x-axis (iri mundege) | 16 | ppm / ° C. | IPC-TM-650 2.4.41 | |
| CTE y-axis (iri mundege) | 16 | ppm / ° C. | IPC-TM-650 2.4.41 | |
| CTE z-axis (kukora-kuburikidza) | 24 | ppm / ° C. | IPC-TM-650 2.4.41 (0–100 °C) | |
| Mechanical | Simba rekusimba (x) | 50 | MPa | ASTM D638 |
| Density | 2.1 | g / cm³ | ASTM D792 | |
| Girazi shanduko (Tg) | >327 (PTFE inonyunguduka) | ° C | - | |
| Environmental | Kunyorovesa mwando | 0.02 | % | ASTM D570 (D48/50) |
| TML inokunda gasi | % | ASTM E595 | ||
| Kukunda CVCM | % | ASTM E595 | ||
| kutevedzera | Kupisa chiyero | UL94 V-0 | - | Halogen-isina |
| RoHS / REACH | Zvinogamuchirika | - | - |
Ukobvu huripo: 0.127 mm (5 mil), 0.254 mm (10 mil), 0.508 mm (20 mil), 0.762 mm (30 mil), 1.524 mm (60 mil). Ukobvu hwakagadzirwa hunowanikwa kana watenga zvinhu zveRogers.
Kufukidza kwemhangura kwakajairika: 0.5 oz (17.5 μm), 1 oz (35 μm), 2 oz (70 μm). Kunowanikwa mumhando dze electrodeposited (ED), reverse-treated foil (RTF), low-profile copper (LP), uye resistive foil.
Saizi dzemapaneru: Yakajairika 18″ × 24″, 18″ × 36″, 24″ × 36″. Saizi dzemapaneru makuru dzinowanikwa kana dzatengwa.
3. Dielectric Constant, Dissipation Factor, TCDk Yakatsanangurwa
Maitiro eDielectric constant frequency. Dhizaini yeDk ye2.94 inoyerwa paIPC-TM-650 2.5.5.5 (clamped stripline resonator) pa10 GHz. Kukosha kwayo kwakasimba kwazvo pakushanda kwayo. Kubva pa1 GHz kusvika pa40 GHz,Dk inosiyana neasingasviki 1.5%. Pa77 GHz,Dk inoderera kusvika pa2.91; pa94 GHz kusvika pa2.89. Kune magadzirirwo eradar e77 GHz emotokari, vagadziri vanowanzo shandisaDk = 2.92 nechivimbo.
Chinhu chinoparadza mafrequency akakwira. Df inokwira zvishoma nezvishoma nekuwedzera kwehuwandu nekuda kwe polarization roll-off. Zvinofungidzirwa kuti Df values: 0.0012 @ 10 GHz, 0.0018 @ 24 GHz, 0.0024 @ 40 GHz, 0.0030 @ 77 GHz. Kurasikirwa kwekuisa kwe50-ohm microstrip pa 0.254 mm RT/duroid 6002 ine 1 oz reverse-treated copper inenge 0.04 dB/cm pa 10 GHz, 0.10 dB/cm pa 24 GHz, 0.18 dB/cm pa 77 GHz. Izvi zvinosanganisira zvese dielectric uye conductor loss contributions ne typical RTF copper roughness (Rz ≈ 2 μm).
TCDk yakanaka — chinhu chisingawanzoitiki. TCDk ye +12 ppm/°C haina kujairika; akawanda ma PTFE laminates ane negative TCDk values anotangira pa -40 kusvika -400 ppm/°C. Iyo positive coefficient inobva mu specific ceramic-glass composite formulation. Pakati pe military tembiricha range ye -55 °C kusvika +125 °C, total Dk variation inongova ±0.011 — kugadzikana kwakanyanya kunobvisa kudiwa kwe tembiricha muripo muma filter designs akawanda.
Dr anisotropy. RT/duroid 6002 inoratidza musiyano uri pasi pe1% pakati peDk yakayerwa nenzira yekukombama kana yekuzadza kwegirazi. Iyi near-isotropy yakakosha pakuita differential pair routing, dual-polarization antennas, uye balanced filter designs uko weave-induced skew paFR4 inowanzo kanganisa mashandiro.
Kufanana kweDk panel yese. Kusiyana kweDk panel-to-panel uye lot-to-lot kunochengetwa mukati me ±0.04 kubva pane nominal. Mukati mepanel imwe chete, kufanana kweDk kunowanzova mukati me ±0.02. Kuenderana uku kwakakosha pakugadzira firita uye antenna centre-frequency repeatable mukugadzira volume.
Nei Df 0.0012 ichikosha. 0.001 yega yega yeDf inowedzera inenge 0.04 dB/cm yekurasikirwa kwe dielectric pa10 GHz yejairika microstrip geometry. Mutsetse wekudyisa we10 cm RF paRT/duroid 6002 unopa 0.04 dB yekurasikirwa kwe dielectric yese zvichienzaniswa ne0.16 dB paFR4 (Df ~0.020). Kune network refu dze feed muma antenna e phased-array ane zvinhu 32 kana 64, kuchengetedza kurasikirwa kwakawanda kwezvinhu zve low-Df kunoshandura zvakananga kukuvandudzwa kweEIRP yesystem uye antenna gain.
4. Kufambisa Kwekupisa, CTE, uye Maitiro Ekunyorova
Kufambiswa kwemhepo nekupisa (0.44 W/m/K). Zviri pakati nepakati pama RF laminates — zvakakwirira kupfuura PTFE isina kuzadzwa (0.20 W/m/K) asi zvakaderera pane zvinhu zvinorema zve ceramic zvakaita seRO4360G2 (0.80 W/m/K). Kune ma amplifier ane simba guru, RT/duroid 6002 yoga haigone kubvisa kupisa kunogara kwenguva refu pamusoro pe 2 W/cm². Matekiniki ekuparadzira kupisa akadai se copper coins, embedded copper inlays, kana thermal vias pasi pe active devices anodiwa kune ma power applications ari pamusoro pe density iyi.
Kunyudzwa kwehunyoro (0.02%). Pakati pezvinhu zvakaderera muindasitiri. 0.1% yega yega yehunyoro hunonyudzwa muPCB substrate inosimudzira Dk kumusoro neinenge 0.02. Kusakwanisa kwehunyoro kwakanyanya kweRT/duroid 6002 kunoreva kuti kunyudzwa kweDk munzvimbo dzine hunyoro hakuna kukosha - zvakakosha kune nzvimbo dzekunze dzemasero, radar yengarava dzegungwa, uye masisitimu eradar emamiriro ekunze anoiswa munzvimbo dzine hunyoro hwakawanda.
Kubuda negasi (ASTM E595). Kurasikirwa Kwese Kwese (TML) pasi pe1.0% uye Zvinhu Zvinogona Kugadziriswa Zvinokonzereswa Nemhepo (CVCM) pasi pe0.1% zvinogona kutsigira ongororo yekukosha kweNASA kana ESA yekubhururuka muchadenga kana humbowo hwakazara hwepurojekiti hwagamuchirwa. Ichi ndicho musiyano mukuru uchienzaniswa neFR4 nezvimwe zvinhu zvakawanda zve hydrocarbon ceramic, izvo zvinokundikana miganhu yeE595 uye hazvigone kubhururuka pamasateliti e optical uko kusvibiswa kwegasi kunogona kukanganisa lens negirazi.
Kuenderana kwekubatanidza kusina mutobvu. Kuenderana kwekudzoka kwemvura kunofanira kusimbiswa uchishandisa chimiro chekubatanidza chakaburitswa uye humbowo hwekufanirwa. Kunoenderana nemaprofile ese e solder asina mutobvu anosanganisira SAC305 neSAC405. Nguva yekuchengetedza mumapakeji efekitori asina kuvhurwa imwedzi gumi nemiviri. Kana mutengo wacho uchisanganisira mabhodhi akazadzwa nevanhu, kugadzirira kwekubatanidza kweRT/duroid 6002 kunofanirwa kuongororwa nezvinodiwa zveBOM uye zvekubatanidza zvikamu.
Tembiricha yekushandisa. Tembiricha yekushandisa inoenderera mberi -55 °C kusvika +125 °C yakajairwa. Kuratidzwa kwenguva pfupi pa280 °C kunotsigirwa panguva yekuyerera kwemvura uye kugadziriswazve. Tembiricha yepamusoro yekushandisa inoganhurirwa nehunhu hwe copper foil annealing pane laminate pachayo.
Kubatidza (UL94 V-0). Kuzvidzima kwega pasina halogenated fire retardants. Kutevedzera mitemo isina halogen sekureva kweIEC 61249-2-21. Kutevedzera mitemo yeRoHS neREACH.
5. Nei CTE Matching Drives Yakaputirwa Nemaburi Yakavimbika
Chinhu chimwe chete chinonyanya kukosha cheRT/duroid 6002 — uye chikonzero nei ichitsanangurwa mumidziyo yemhando yepamusoro — iCTE yayo iri mukati me16 ppm/°C inoenderana nemhangura pa17 ppm/°C. Kuti unzwisise kuti nei izvi zvichikosha, funga nezvezvinoitika mukati megomba rakaputirwa panguva yekupisa.
Munguva yekuchinja-chinja kwekushisa, laminate dielectric inowedzera uye inodzika zvishoma nezvishoma nepo copper plating iri mu via barrel ichikura uye inodzika zvishoma nezvishoma. Kusawirirana uku kunoungana nekupisa kwega kwega kusvika plate yecopper yaputika yatsemuka. Iyi nzira yekukundikana - kutsemuka kwebarrel - ndiyo inonyanya kukosha pakuvimbika kwePTFE-based multilayer PCB constructions uye chikonzero chikuru chekuti "kushandisa zvinhu zveRogers" hakusi, pachako, sarudzo yakachengeteka yekugadzira hardware yakasimba.
Nhamba. Ma laminates ePTFE asina kuzadzwa (akadai seRT/duroid 5880) ane z-axis CTE inosvika 237 ppm/°C zvichienzaniswa ne copper's 17 ppm/°C — kusawirirana kwe14×. Pasi peMIL-STD-883 Method 1010 thermal cycling (−65 °C kusvika +150 °C), mabhodhi anowanzo kundikana mushure me 100–500 cycles. RT/duroid 6002, ine z-axis CTE ye24 ppm/°C uye inoenderana ne in-plane CTE, inogara ichipfuura 1,000+ cycles muInterconnect Stress Testing (IST) uye inogona kuongororwa zvichienderana nezvinodiwa neECSS-Q-ST-70-08C uye IPC-6018 Class 3/A kana zviyero izvozvo zvichishanda.
Masvomhu ekusvuta. Pabhodhi rine ukobvu hwe1.6 mm rinotenderedzwa neΔT = 215 °C: 5880 inowedzera z-axis neinenge 510 μm/m × 215 = 109 ppm strain mubharero rega rega; 6002 inowedzera 24 × 215 = 5.2 ppm strain. Musiyano we21× mu cyclic strain unounza musiyano mukuru muhupenyu hwekuneta.
Ndosaka vagadziri vePCB vendege vachisvika paRT/duroid 6002 pamusoro peCTE RT/duroid 5880 ine kurasikirwa kushoma asi yakakwirira pese painoda maburi ane huwandu hwakakwira mu multilayer stack. Kufananidza CTE kunogonesawo ma hybrid stackups achibatanidza RT/duroid 6002 neFR4 - musiyano weCTE uri pakati pezvinhu zviviri izvi mudiki zvekuti warpage neregistration zvinochinja panguva yekubuda kwemhepo.
6. RT/duroid 6002 vs 5880 vs 6006 vs 6010 vs RO3003 vs RO4350B
Kusarudza laminate yeRogers yakakodzera kunoda kuenzanisa maparamita akakosha pazvinhu zvakasarudzwa. Tafura iri pazasi inoratidza RT/duroid 6002 zvichienderana nedzimwe nzira dzakajairika mukugadzirwa kwePCB ye microwave.
| Parameter | RT/duroid 6002 | RT/duroid 5880 | RT/duroid 6006 | RT/duroid 6010.2LM | RO3003 | RO4350B |
|---|---|---|---|---|---|---|
| Dk @ 10 GHz | 2.94 ± 0.04 | 2.20 ± 0.02 | 6.15 ± 0.15 | 10.2 ± 0.25 | 3.00 ± 0.04 | 3.48 ± 0.05 |
| Df @ 10 GHz | 0.0012 | 0.0009 | 0.0027 | 0.0023 | 0.0010 | 0.0037 |
| TCDk (ppm/°C) | + 12 | -125 | -410 | -425 | -3 | + 50 |
| CTE x,y (ppm/°C) | 16 | 31 | 47 | 24 | 17 | 10 |
| CTE z (ppm/°C) | 24 | 237 | 24 | 24 | 24 | 32 |
| Mamiriro ekunze anodziya (W/m/K) | 0.44 | 0.20 | 0.49 | 0.86 | 0.50 | 0.69 |
| Reinforcement | Girazi + zvedongo | Girazi chete | Ceramic chete | Ceramic chete | Ceramic chete | Girazi + zvedongo |
| Rudzi rwemidziyo | PTFE | PTFE | PTFE | PTFE | PTFE | Thermoset |
| Nyoni | 380 °C PTFE | 380 °C PTFE | 380 °C PTFE | 380 °C PTFE | 380 °C PTFE | 175 °C FR4-yakafanana |
| Kupfuura mhepo muchadenga | Pass | Pass | Pass | Pass | Pass | Not rated |
| Kuvimbika kwePTH | Excellent | eresera | Excellent | Excellent | Excellent | Excellent |
| Mutengo (zvichienzaniswa neFR4) | 5–7× | 4–6× | 5–7× | 6–8× | 4–6× | 2–3× |
| Best application | Ndege, satellite, zvikamu zvakarongwa | Kurasikirwa kwakaderera, mmWave links | Mafirita madiki, antenna | Ma resonator madiki | Radar yemotokari, mmWave | Chiteshi chebase che5G, RF circuits |
Nguva yekusarudza RT/duroid 6002 pane RT/duroid 5880: Kana chivakwa che multilayer chaiswa maburi anofanirwa kugara kwenguva refu, kana zvinodiwa zvekubuda kwegasi zvichishanda, kana dhizaini yacho ichida kugadzikana kuti inyoreswe zvakanaka. RT/duroid 5880 inokunda kana yarasikirwa zvachose asi inorasikirwa nePTH yakavimbika mukuvaka multilayer.
Nguva yekusarudza RT/duroid 6002 pane RO3003: Zvinhu zvese izvi zvine hunhu hwakafanana hwemagetsi uye kuvimbika kwePTH. RT/duroid 6002 inosarudzwa kana girazi-fiber richidikanwa kuti pave nekugadzikana kwehukuru, kana zvichidikanwa kuti zvinhu zvienderane neruzivo rwekare rwemuchadenga, kana kuti kana ASTM E595 ichidikanwa kuti pave negasi. RO3003 inosarudzwa kana dhizaini iri radar yemotokari yekutengeserana uye mutengo uri chinhu chakakosha.
Nguva yekusarudza RT/duroid 6002 pane RO4350B: Kana dhizaini yacho ichida PTFE-grade loss tangent (Df 0.0012 vs 0.0037), space outgassing certification, kana kushanda mu extreme thermal cycling. RO4350B inosarudzwa kana mutengo wakakosha kana kana FR4-compatible processing ichidikanwa.
Nguva yekusarudza RT/duroid 6002 pane RT/duroid 6006: RT/duroid 6006 ine Dr 6.15 — yakakwirira kupfuura 6002 — ichipa circuit miniaturization yakakura. Sarudza 6006 kana nzvimbo yebhodhi iri iyo inodzivirira kubatana. Sarudza 6002 kana kurasikirwa kuchikosha kupfuura saizi uye kana kugadzikana kwetembiricha kuchikosha.
7. RT/duroid 6002 Impedance Calculator: 50Ω Microstrip, Stripline, Differential
Tafura inotevera inopa hupamhi hwema "trace widths" e "common impedance targets" paRT/duroid 6002. Ma "values" anofunga kuti "Dk" = 2.94, "copper thickness" 35 μm (1 oz), "typical etch profile", uye "solder mask" isina "solder mask". Kune magadzirirwo ekugadzira, gara uchitarisa ne "field-solver tool" (Polar Si9000, HyperLynx, Ansys SIwave) inosanganisira copper roughness correction.
| Substrate ukobvu | 50 Ω upamhi hwe microstrip (1 oz Cu) | 50 Ω upamhi hwemutsara (1 oz Cu) | 75 Ω upamhi hwe microstrip | 100 Ω diff. pair (w/s) |
|---|---|---|---|---|
| 0.127 mamirimita (5 mil) | 0.30 mamirimita | 0.16 mamirimita | 0.15 mamirimita | 0.20 mamirimita / 0.10 mm |
| 0.254 mamirimita (10 mil) | 0.60 mamirimita | 0.32 mamirimita | 0.30 mamirimita | 0.40 mamirimita / 0.20 mm |
| 0.508 mamirimita (20 mil) | 1.25 mamirimita | 0.65 mamirimita | 0.60 mamirimita | 0.80 mamirimita / 0.40 mm |
| 0.762 mamirimita (30 mil) | 1.85 mamirimita | 0.98 mamirimita | 0.90 mamirimita | 1.20 mamirimita / 0.60 mm |
| 1.524 mamirimita (60 mil) | 3.70 mamirimita | 2.05 mamirimita | 1.85 mamirimita | 2.40 mamirimita / 1.20 mm |
Kutsvaga zvishoma uye mukaha mudiki. Kugadzirwa kwePTFE kwakajairika kunoita kuti pave nemukaha we100 μm uye 100 μm. Kugadzirwa kwepamusoro-soro kuburikidza ne laser direct imaging kunoita kuti pave nemukaha we75 μm uye 75 μm. Kune magadzirirwo emmWave ari pamusoro pe24 GHz, ronga upamhi hwemukaha uri pamusoro pe200 μm pese pazvinogoneka kuti ugadzirise kurasikirwa kwemubati.
Kuburikidza nedhizaini. Chibooreso chemakanika chakajairwa chinosvika 0.20 mm. Chiyero cheAspect chinosvika 10:1 chinogoneka nevagadziri vePTFE vane ruzivo. Kune magadzirirwo emmWave ari pamusoro pe20 GHz, shandisai mavias akaboorwa kumashure kana ma microvia akaboorwa nelaser kubvisa mhedzisiro ye stub resonance. Ona gwara retekinoroji ye backdrilling yemitemo yekugadzira.
Kusarudzwa kwefoiri yemhangura. RT/duroid 6002 inowanzo pihwa nemhangura ine electrodepositioned (ED) ine Rz ~5–6 μm. Kune magadzirirwo asina kurasikirwa zvakanyanya pamusoro pe20 GHz, sarudza foiri yakadzorerwa shure (RTF) ine Rz ~2 μm kana foiri ine low-profile (LP) ine Rz <1 μm. RTF inoderedza kurasikirwa kwemuchina ne20–30% pa10 GHz uye 40–50% pa30+ GHz.
Kufunga nezvemasiki eSolder. LPSM yakajairika inowedzera inenge 0.012 kuDk inoshanda uye inenge 0.001 kuDf inoshanda pazvisaririra zvakafukidzwa. Pakugadzira mmWave inokosha kurasikirwa, siya mask yesolder pazvisaririra zvechiratidzo kana kushandisa mafomura emasiki esolder emmWave akasarudzika.
Kugadziriswa kwesimbi. Kugadziriswa kwesimbi yetrapezoidal kunoburitsa 25–35 μm pasi pemhangura ye35 μm. Kugadzirisa nekukudza hunyanzvi neanenge 20 μm pamucheto wecritical kuitira kuti pave nekujeka kweimpedance ye±5%.
8. Dhizaini yeStackup: Magadzirirwo ePTFE Multilayer uye Hybrid FR4
RT/duroid 6002 inoshandiswa muzvikamu zvina zvikuru zve stackup zvichienderana nekuoma kweapplication uye mutengo wainoda.
Kugadzika 1 — RT/duroid ine mativi maviri uye RT/duroid ine mativi maviri. Kugadzika kwakajairika kwemasekitori eRF ega ega — macoupler, mafirita, maantenna. Inowanikwa muukobvu hwese kubva pa0.127 mm kusvika 1.524 mm. Uku ndiko kugadzika kwakajairika uye kunokurumidza kugadzirwa. Nguva yakajairika yekutungamira mazuva 7-10 kubva kuHighleap.
Kugadziriswa 2 — All-RT/duroid 6002 multilayer. Kusvika ku16 layers zvinogoneka kushandiswa uchishandisa Rogers 2929 PTFE bondply kana 3001 bondply pakati pemacores. Inopa hunhu hwe dielectric hwakafanana mukati me stack. Inoshandiswa kuma phased-array T/R modules, complex beam-forming networks, uye high-reliability stripline filters. Vacuum lamination pa380–400 °C inodiwa. Nguva yakajairika yekutungamira mazuva 14–21 ekuvaka kwe8-layers.
Kugadziriswa 3 — Hybrid RT/duroid 6002 / FR4 stackup. Ma layers eRT/duroid 6002 ane RF traces; ma layers eFR4 ane digital uye simba. Anoderedza mutengo wezvinhu ne30–60% zvichienzaniswa ne PTFE builds dzese uku achichengetedza mashandiro eRF pama layers akakosha. Kuenderana kweCTE kwakanaka nekuda kweRT/duroid 6002's matched in-plane CTE — asi sarudzo ye bondply (Rogers 4450F kana 4450T) uye lamination profile zvinofanirwa kusimbiswa kune yega yega configuration. Ona gwara reFR4 hybrid PCB kuti uwane mitemo yakadzama yekugadzira stackup.
Kugadziriswa 4 — Hybrid RT/duroid 6002 / RO4350B stackup. Sarudzo inodhura zvishoma inosanganisa mashandiro eRT/duroid 6002 RF ne RO4350B's FR4-compatible processing economics. Inoshandiswa kana RF layers imwe chete kana mbiri chete dzichida space-grade qualification.
Muenzaniso we6-layer hybrid stackup ye5G phased-array T/R module:
- L1 (Kumusoro): 1/2 oz RTF copper pa 0.254 mm RT/duroid 6002 — RF traces, antenna feeds
- Bondply: Firimu reRogers 2929 PTFE, 0.038 mm
- L2: 1 oz mhangura, pasi pevhu
- Nheyo huru: 0.508 mm RT/duroid 6002 — network yekudyisa yeRF
- L3: 1 oz mhangura, chiratidzo cherukoko
- Bondply: Rogers 4450F prepreg, 0.10 mm
- L4: 1 oz mhangura, chiratidzo cherukoko
- Pakati: 0.508 mm FR4 (Tg 170 °C) — zviratidzo zvedhijitari
- L5: 1 oz mhangura, pasi pevhu
- Bondply: FR4 prepreg, 0.10 mm
- L6 (Pasi): 1 oz mhangura, BGA escape uye DC routing
9. Maitiro Ekugadzira PCB RT/duroid 6002 Nhanho Nenhanho
RT/duroid 6002 inoda PTFE-grade yekugadzira padanho rega rega. Kufamba kwemaitiro ese:
Danho 1 — Bikai pa150 °C kwemaawa mana musati mabika kuti mubvise hunyoro hwakanyungudutswa. Kusiya kubika musati mabika kunokonzera matumbu panguva yekubikwa. Danho rakakosha pakuvaka kwekutanga.
Danho rechipiri — Kufungidzira nekunyora jira remukati. Kufungidzira nemifananidzo yakajairwa kana kuti ne laser direct imaging. Kushivirira kupenda ±15 μm kunogoneka pamabasa akakosha ane mamiriro ekucheka akadzorwa. Shandisa makemikari anoenderana nePTFE-laminated copper foil.
Danho rechitatu — AOI yemukati. Kuongorora otomatiki kwezvikamu zvese zvemukati usati waisa lamination.
Danho rechina — Lamination. Tembiricha yepamusoro 380–400 °C, nguva yekubata maminetsi 15–30 panguva yepamusoro, kudzvanywa 250–300 psi, vacuum yakazara inodiwa. Mwero wekutonhodza 2–3 °C/min unoderedza kushushikana kwasara. Kupisa kwakanyanya panel kunofanirwa kugara pasi pe ±5 °C kudzivirira kusawirirana. Sarudzo yeBondply: Firimu reRogers 2929 PTFE rezvivakwa zvePTFE zvese, kana Rogers 4450F prepreg yezvivakwa zvehybrid.
Danho rechishanu — Kuboora. Maboora eCarbide ane mwero wekudyisa wakafanana neFR4 nekuda kwekusimbiswa kwegirazi-fiber kunoderedza PTFE smear. Hupenyu hwemaboora hunosvika 500–700 hits pa bit zvichienzaniswa ne1,000+ yeFR4. Kutarisa mamiriro eboora otomatiki kwakakosha. Kune magadzirirwo emmWave, shandisa nzvimbo yekuboora kumashure kubvisa stub.
Danho 6 — Kubviswa kweplasma. Kushanda kweplasma kweCF₄/O₂ (200–400 W, maminetsi 5–15) kunodiwa kuti nzvimbo dzePTFE dzigamuchire kupurasitiki yemhangura isina electro. Sodium-naphthalene chemical etch ndeimwe nzira asi inopa mhedzisiro isingaenderane uye inogadzira marara ane njodzi.
Danho rechinomwe — Kuisa electrolytic plating isina electrolytic uye electrolytic plating. Isa 0.5–1.0 μm electroless copper mukati memaawa mana ekushanda kweplasma. Tevedzera ne electrolytic copper kusvika pa25 μm zvishoma (30–35 μm kuti ivakwe zvakanaka kana kuti ive space-grade). Shandisa pulse plating kuti uise electrolytic plating mumaburi ane high-aspect-ratio.
Danho 8 — Kufungidzira pamusoro pechikamu chekunze, kutema, AOI. Kemikari yakafanana neyemukati mechikamu. Kushivirira kwe ±10 μm etch kunogoneka kuburikidza ne LDI imaging.
Danho rechi9 — Chifukidzo chesolder uye kupedzisa kwepombi. Chifukidzo chesolder chemvura chinotorwa mifananidzo chine gadziriro ye micro-etch yekubatanidza. ENIG ndiyo kupedzisa kwepombi; sirivha inonyudzwa kana ENEPIG inofarirwa pama frequency ari pamusoro pe30 GHz kudzivirira kurasikirwa kunokonzerwa ne nickel.
Danho regumi — Bika mushure mekuputira. 150 °C kwemaawa mana kuti uderedze kushushikana kwasara, kunyanya zvakakosha kune zvivakwa zvakakora kana zvehybrid.
Danho 11 — Kuedzwa kwemagetsi uye kuongororwa kwe coupon yechikamu chidiki. Kusimbiswa kweTDR impedance, kuyedzwa kweVNA S-parameter yesarudzo, kuchekwa kwe coupon yekuyedzwa pa IPC-6012 Kirasi 3 / IPC-6018 Kirasi 3. Kuti uwane ma parameter akazara ekuita, ona referensi yekugadzira yeRogers PCB.
Danho 12 — Kuongorora kwekupedzisira nekurongedza. Kuongorora kwemagetsi kunoonekwa, kwakakura, uye kwekupedzisira. Kurongedza kwakavharirwa ne vacuum kuti kutumirwe kunzvimbo dzekuunganidza zvinhu kusingakuvadzi hunyoro.
10. Mashandisirwo gumi epamusoro muindasitiri: Satellite, Radar, 5G, Aerospace
1. Midziyo yesatellite payloads. Matransponder ekutaurirana, mafirita emutsiro, mamultiplexers, ma network ekugadzira beam esatellite dzekutengesa geostationary (Boeing 702, Lockheed A2100, Airbus Eurostar), LEO constellations (Starlink, OneWeb, Kuiper, Iridium NEXT), uye mabasa esainzi. Kusanganiswa kwe low loss, CTE matching, uye ASTM E595 outgassing certification zvinoita kuti RT/duroid 6002 ive substrate inoshanda yemabasa aya.
2. Radar yePhased-array. Active electronically scanned array (AESA) T/R modules kubva kuS-band kusvika kuKa-band. Stable Dk inochengetedza kururama kwebeam-steering mukati mezvinodiwa. Inoshandiswa muradar yekudzivirira moto inobhururuka, radar yekuongorora yegungwa, uye masisitimu ekudzivirira mhepo inodzika pasi.
3. Zvishandiso zvemagetsi zvekudzivirira. Radar yemauto inofambiswa nendege, vanotsvaga zvombo zvinokandwa, masisitimu ehondo yemagetsi, mapuratifomu ehungwaru hwezviratidzo. Chero chinodiwa cheMIL-PRF-31032, MIL-STD-202, kana MIL-STD-883 chinofanira kusimbiswa zvichienderana nemagwaro aripo iye zvino uye hurongwa hwekufanirwa kwepurojekiti.
4. MaAvionics emuchadenga. Radar yemamiriro ekunze, kudzivirira kurovera kwemotokari (TCAS), yambiro yekusvika pedyo nepasi, ma transponder ekuziva shamwari-kana-muvengi (IFF), uye michina yeADS-B. Nguva refu yebasa uye kushanda kwePTH kwakavimbika kuburikidza nekupisa cycling zvakakosha. Kune chirongwa chemuchadenga, magwaro ekugadzira 6002 anowedzera zvinodiwa zvekugamuchirwa uye kuteverwa kwekushandisa mupakeji ye stackup.
5. 5G mmWave infrastructure. Active antenna unit (AAU) feed networks, beam-forming circuits, uye front-end modules dze n257, n258, n260, n261 bands. Inoshandiswa mu 5G communication PCB applications uko kuvimbika kwe infrastructure kunoda kuvakwa kwe aerospace grade.
6. Kuedza nekuyera. Zvishandiso zveVNA calibration, zvikamu zvekubuda kwesignal generator, mabhodhi eATE interface uko kugadzikana kwenguva refu kweDk kunokosha pakuchengetedza calibration. Keysight, Rohde & Schwarz, naAnritsu vese vanotsanangura RT/duroid 6002 mumakiti avo e high-frequency calibration.
7. Kufungidzira nezvekurapa. Makoiri eMRI RF nemisoro yeNMR probe yepamusoro-soro panodiwa gadziriro yakasimba uye kuburitswa kwegasi shoma. Nzvimbo isina chinhu yeMRI bore neNMR cryostats inoda zvinhu zvinoburitswa negasi shoma.
8. Radar yemotokari. Radar dzepamberi nedzekona dze76–81 GHz dzeADAS uko kugadzikana kwekupisa kuri pakati nepakati uye kuvimbika kwePTH pasi pevhu kunokosha. Vatengesi veTier 1 vanosanganisira Bosch, Continental, Aptiv, uye Veoneer vanoshandisa RT/duroid 6002 kune radar yeADAS yakakosha pakuchengetedza.
9. Maelectronics eQuantum computing readout. Maketani eCryogenic microwave readout anoshanda pa4 K uye pasi. RT/duroid 6002's stable Drk kuburikidza ne wide thermal swings inotsigira superconducting qubit readout circuits inoshandiswa paIBM, Google, Rigetti, uye mapoka ezvidzidzo zvequantum.
10. Tsvagiridzo yekukurumidzisa zvidimbu zvema "particle accelerator" uye fusion. RF cavities, diagnostics ye "beam diagnostics", uye zvishandiso muCERN, ITER, nedzimwe nzvimbo dzakafanana dzefizikisi. Kuenderana kwe "vacuum" kubva mu "low outgas" kwakakosha mumachubhu e "beam".
11. Kuongorora Mutengo, Nguva Yekutora Mari, Kuwanikwa, uye Kwekutenga
Mutengo wezvinhu. RT/duroid 6002 inodhura ne5–7× mutengo weFR4 pa square meter, uye inodhura ne1.2–1.4× mutengo weRT/duroid 5880. Mutengo wepamusoro unoratidza zviri mu ceramic negirazi pamwe nekukwanisa kugadzira zvinhu kwakasimba uye zvirongwa zveRogers zvevatengi vendege.
Masokisi emugovanisi. Mazhinji evagovanisi (Mouser, Digi-Key, Newark, Sager) ane ukobvu hwe0.254 mm uye 0.508 mm ane ukobvu hwemhangura ye1 oz. Humwe ukobvu hunowanzo gadzirwa zvichienderana neodha ine nguva yekutora zvinhu kubva kuRogers Corporation kwemavhiki mana kusvika matanhatu. Ronga kutenga zvinoenderana nemapurojekiti ekutanga.
Mutengo wePCB wese. Pakuvaka kwe4-layer all-RT/duroid 6002, mutengo wezvinhu unomiririra angangoita 35–45% yemutengo wePCB wese. Chimwe chiri kugadzirwa — matanho chaiwo ePTFE anowedzera 2–3× mutengo webasa wekugadzira FR4 yakafanana. Mari dzeinjiniya (kuyedza impedance, microsectioning, outgassing certification) dzinowedzera 5–10% yebasa re space-grade.
Mitengo yehuwandu. Rogers inopa mitengo yezvikamu pa100 m², 1,000 m², uye 10,000 m² pagore. Kushanda zvakananga neRogers kutengesa kwenzvimbo kunokurudzirwa kune mapurogiramu ekugadzira anopfuura 1,000 m² pagore.
Nguva yekutungamira kuHighleap. Huwandu hweprototype (paneru 1–10) hunouya mumazuva 7–10 ekushanda. Kugadzirwa kunoitika mumazuva 14–21 zvichienderana nehuwandu uye huwandu hwezvikamu. Kuvaka nekukurumidza (mazuva 5–7) kunowanikwa nemari yekuwedzera yekuvaka kwekutanga uye kuchengetedzwa kweinjiniya.
Kwekutenga maPCB eRT/duroid 6002. Highleap Electronics inogadzira maPCB eRT/duroid 6002 ari emhando yepamusoro kuburikidza nekugadzirwa kwehuwandu hwezvinhu zviripo. Kutenga zvinhu zvakananga kubva kuRogers Corporation kunoda huwandu hushoma hweodha; pamagadzirirwo anoda mapaneru asingasviki makumi mashanu, kutsvaga maPCB akapedzwa kubva kubazi rekugadzira zvinhu zvakachipa.
12. Matambudziko Akajairika Einjiniya uye Gwaro Rekugadzirisa Matambudziko
Dambudziko 1: PTH barrel yakatsemuka mushure me200–300 thermal cycles. Chikonzero: kazhinji electrolytic copper crumb haina kukwana mu gomba barrel. Mhinduro: Wedzera plating kusvika 30 μm zvishoma, shandisa pulse plating kuti uise yunifomu, simbisa cross-section pane chinhu chekutanga.
Nyaya 2: Kuyerwa kweDk kwakakwira kupfuura kukosha kwedatasheet. Chikonzero: mupiro wemasikisi ekusolder, kunyudzwa kwehunyoro, kana mhedzisiro yekubatanidza michina yekuyedza. Mhinduro: yera substrate isina chinhu usati waisa mask; iva nechokwadi chekuti sampuro dzaomeswa pa105 °C kwemaawa mana usati wayera.
Dambudziko rechitatu: Kurasikirwa kwekuisa kwakakwira kupfuura zvinofungidzirwa nekufungidzira. Chikonzero: kazhinji mupiro wefoil yemhangura haubatanidzwi mukuenzanisa. Mhinduro: shandisa modhi yefoil yemhangura (Huray, Hammerstad-Jensen) mu field solver; simbisa nekuyerwa kweRz pafoil yekugadzira; tsanangura RTF copper yemagadzirirwo ari pamusoro pe20 GHz.
Dambudziko rechina: Kukundikana kwekunamatira kweplatifomu mumaburi akafukidzwa. Chikonzero: kusashanda zvakanaka kweplasma, nzvimbo ine tsvina, kana kunonoka kuiswa kwemhangura isina electrode. Mhinduro: simbisa nguva iri pakati peplasma nemhangura isina electrode kusvika pasi pemaawa mana; simbisa maparamita eplasma nekuyera simba repamusoro (kona yekubatana <30°).
Nyaya 5: Warpage mu hybrid stackup mushure mekuyererazve. Chikonzero: Kusawirirana kweCTE uye kugoverwa kwemhangura isina kufanana. Mhinduro: enzanisa huwandu hwemhangura mu stack kusvika mukati me ±10% pa layer; shandisa symmetric prepreg distribution; post-bake assemblies pa 105 °C kwemaawa maviri kuti uderedze kushushikana kwasara.
Nyaya 6: Kuchinja kwefrequency yepakati pefirita mukugadzirwa. Chikonzero: Kuchinja kwepaneru kubva paDk kuenda paneru kana kuti kubva pabatch kuenda kune batch. Mhinduro: simbisa Df/Dk pa coupon yeroti rega rega; shandisa margin yedhizaini ye ±2 % ye filter pass-band; sanganisira maficha ekuchekerera mumadhizaini ekugadzira.
Dambudziko rechinomwe: Kubviswa kwemvura pamusoro pechinongedzo panguva yekusungirirwa kwechinhu chinobatidza. Chikonzero: kushomeka kwekupisa kana kusasimba kwemucheto wechinongedzo pedyo nemapadhi ekubatanidza. Mhinduro: dzivisa chinongedzo chinobatidza chiri mukati me 0.25 mm kubva kumipendero yemapadhi ekubatanidza; shandisa sirivha kana ENEPIG panzvimbo peHASL panzvimbo penzvimbo dzekubatanidza.
13. Mibvunzo Inowanzo bvunzwa Nezve RT/duroid 6002 (mibvunzo nemhinduro zvinodarika makumi maviri)
Mubvunzo: Chii chinonzi dielectric constant yeRogers RT/duroid 6002?
A: Dhizaini yaDk yeRT/duroid 6002 i2.94 ±0.04 pa10 GHz, inoyerwa nenzira yeIPC-TM-650 2.5.5.5 clamped stripline. Kukosha uku kwakasimba kubva pa1 GHz kusvika ku40 GHz nekuchinja kuri pasi pe1.5%.
Mubvunzo: Chii chinonzi dissipation factor yeRT/duroid 6002?
A: Df i0.0012 pa10 GHz. Pa24 GHz Df inokwira kusvika pa0.0018; pa77 GHz kusvika pa0.0030.
Mubvunzo: Ko RT/duroid 6002 inoenderana here neFR4 processing?
A: Kwete. RT/duroid 6002 iPTFE laminate inoda 380–400 °C lamination, plasma activation ye plated through-hole adhesion, uye PTFE-specific drilling parameters. Mitsetse yekugadzirwa yeFR4 yakajairika haigone kuigadzirisa isina michina yePTFE yakatsaurirwa.
Mubvunzo: RT/duroid 6002 inoenzaniswa sei neRT/duroid 5880?
A: RT/duroid 5880 ine Df yakaderera (0.0009 vs 0.0012) asi z-axis CTE yakakwira zvikuru (237 vs 24 ppm/°C). Kune magadzirirwo e single-layer kana low-aspect-ratio, 5880 wins kana kurasikirwa. Kune magadzirirwo e multilayer ane plated through-holes, 6002 wins kana kuvimbika.
Mubvunzo: Ndeapi mapurogiramu anoshandisa Rogers RT/duroid 6002?
A: Mitoro yesatellite, radar yezvikamu, electronics dzekudzivirira, avionics dzemuchadenga, mmWave 5G infrastructure, MRI coils, michina yekuyedza, radar yemotokari yeADAS, uye cheni dzekuverenga dzequantum computing.
Mubvunzo: Ndeipi tembiricha yepamusoro yekushanda yeRT/duroid 6002?
A: Kushanda nguva dzose kusvika ku280 °C kunotsigirwa nePTFE matrix. Muganho wepamusoro wezvishandiso zvakawanda unotsanangurwa ne copper foil annealing uye solder reflow miganhu, kazhinji 260 °C peak.
Mubvunzo: Ko RT/duroid 6002 space inokodzera here?
A: Ehe. Zvinhu izvi zvinodarika zvinodiwa zveASTM E595 (TML <1.0 %, CVCM <0.1 %) zvinoshandiswa neNASA neESA pakugadzira michina yekubhururuka muchadenga. Nhaka yekubhururuka iripo mumapurogiramu esetiraiti ezvekutengeserana nemauto kubvira kuma1990.
Mubvunzo: Ndeipi mari inowanzobhadharwa yeRT/duroid 6002 kana ichienzaniswa neFR4?
A: Mutengo wezvinhu i5–7× standard FR4 pa square meter. Mutengo wePCB (kusanganisira PTFE processing premium) unowanzova 6–10× FR4 yakavakwa yakafanana.
Mubvunzo: Ko RT/duroid 6002 inogona kusanganiswa neFR4 mu hybrid stackup here?
A: Ehe. Kugadzirwa kweHybrid RT/duroid 6002 / FR4 kwakajairika pamagadzirirwo anodhura zvakanyanya apo maRF layers chete anoda mashandiro ePTFE. Kusarudzwa kweBondply (Rogers 4450F) uye lamination profile zvinofanirwa kusimbiswa kune yega yega configuration.
Mubvunzo: Ndeapi magadzirirwo epamusoro anokurudzirwa paRT/duroid 6002?
A: ENIG ndiyo yakajairika pakushandiswa kwakawanda. Kunyudza sirivha, ENEPIG, kana mhangura isina chinhu ine OSP zvinofarirwa pamafrequency ari pamusoro pe30 GHz kudzivirira kurasikirwa nemagineti kunokonzerwa ne nickel. HASL haiwanzo kurudzirwa nekuti thermal shock inogona kumanikidza copper-dielectric interface.
Mubvunzo: Chii chinonzi CTE yeRT/duroid 6002?
A: CTE iri mudenga (x,y) iri 16 ppm/°C, yakaenzana nemhangura. CTE yeZ-axis iri 24 ppm/°C. Kufananidza CTE ndiyo mukana mukuru wekuvimbika uchienzaniswa nemamwe ma PTFE laminates.
Mubvunzo: Ndingadhawunirodha kupi datasheet reRT/duroid 6002?
A: Zvinyorwa zvechigadzirwa zviripo zvegiredhi rakanyorwa zvinofanira kuwanikwa kubva kumugadziri uye zviongororwe zvichienderana neshanduro yakashandiswa pakugadzira kwakaburitswa. pasi peAdvanced Connectivity Solutions. Nguva dzose tarisa shanduro yazvino yekuburitsa dhizaini.
Mubvunzo: RT/duroid 6002 yakakora zvakadii?
A: Ukobvu hwakajairika hunosanganisira 0.127 mm (5 mil), 0.254 mm (10 mil), 0.508 mm (20 mil), 0.762 mm (30 mil), uye 1.524 mm (60 mil). 0.254 mm ne0.508 mm ndidzo dzinonyanya kuchengetwa.
Mubvunzo: Ko RT/duroid 6002 UL94 V-0 yakarongwa here?
A: Hongu. RT/duroid 6002 inozvidzima yoga yeUL94 V-0 isina halogenated flame retardants. Chinhu ichi hachina halogen zvinoenderana neIEC 61249-2-21, inoenderana neRoHS, uye inoenderana neREACH.
Q: Ndeipi nhamba yepamusoro yezvikamu zveRT/duroid 6002 PCBs?
A: Kusvika ku16 layers zvinogoneka mukugadzirwa kwePTFE yese. Kubatanidza kwakabatana neFR4 kunogona kusvika ku20+ layers. Kuverengwa kwelayers kwakatarwa kunosimbiswa mushure mekusanganisa, kusungira, kuboora, uye kuvimbika.
Mubvunzo: Zvinotora nguva yakareba sei kugadzira ma RT/duroid 6002 PCBs?
A: Nguva dzemuenzaniso uye nguva dzekugadzira dzinotaurwa mushure mekunge zvinhu, zvinhu zvakaunganidzwa, huwandu, uye zvinodiwa zvebvunzo zvaongororwa.
Mubvunzo: Ndeipi hupamhi hwetrace hushoma uye nzvimbo iri pakati peRT/duroid 6002?
A: Kugadzirwa kwakajairika: 100 μm trace uye 100 μm mukaha. Kugadzirwa kwepamusoro-soro kuburikidza ne laser direct imaging: 75 μm trace uye 75 μm mukaha.
Mubvunzo: Ko RT/duroid 6002 inoda kuchera kwakakosha here?
A: Ehe. Shandisa madhiri ecarbide ane mwero wekudyisa wakafanana neFR4 asi ane tarisiro yehupenyu hwemabhiti inosvika 500–700 hits pabhiti rega rega. Mabhodhi ekupinda ealuminium anokurudzirwa. Kuchekwa kweplasma kunodiwa mushure mekucherwa kwekunamatira kweplating.
Mubvunzo: Ndeipi bondply inoshandiswa pakuvaka RT/duroid 6002 multilayer?
A: Firimu reRogers 2929 PTFE (0.038 mm) rekuvaka kwePTFE yese. Rogers 4450F inogadzirira kuvaka kwehybrid ine FR4 kana RO4350B layers. Rogers 3001 bondply yemamwe mastackups akakosha.
Mubvunzo: Ko RT/duroid 6002 inogona kushandiswa pakugadzira radar yemotokari here?
A: Ehe. Vatengesi vemotokari dzeTier 1 vanoshandisa RT/duroid 6002 pa radar yeADAS ye76–81 GHz yepamusoro uko kugadzikana kwekupisa uye kuvimbika kwekufamba kwemhepo pasi pemotokari kwakakosha.
Mubvunzo: RT/duroid 6002 inoenzaniswa sei neRO3003 yeradar yemotokari?
A: Dzvuku dzose dzine dhisiki yakafanana (2.94 vs 3.00) uye PTH yakavimbika zvikuru. RT/duroid 6002 ine dhisiki yepamusoro (0.0012 vs 0.0010) asi girazi-fiber reinforcement kuti ive yakasimba. RO3003 inonyanya kushandiswa muradar yekutengeserana inodhura zvakanyanya; RT/duroid 6002 muhurongwa hwakakosha hwekuchengetedza.
Mubvunzo: Ndeupi musiyano uripo pakati peRT/duroid 6002 neRT/duroid 6202?
A: RT/duroid 6202 imhando itsva ine kurasikirwa kushoma ine Dr 2.90 uye Df 0.0015. Dzese dzine mashandiro akafanana eCTE matching uye outgassing performance. RT/duroid 6202 inofarirwa kune magadzirirwo matsva pa mmWave; RT/duroid 6002 ichiri kushandiswa mumashandisirwo ekare ane hunyanzvi hwakasimbiswa.
Mubvunzo: Ko Highleap ine zvinhu zveRT/duroid 6002 here?
A: Mamiriro echinhu che 0.254 mm uye 0.508 mm RT/duroid 6002, kugadzirwa kwemhangura, uye ukobvu hwakasiyana zvinosimbiswa kune yega yega RFQ; nguva yekutungamira inoenderana nekuvakwa kwakatenderwa uye kuwanikwa kwemagetsi.
14. RT/duroid 6002 PCB Kugadzira paHighleap Electronics
Highleap Electronics inogadzira ma RT/duroid 6002 PCBs pamitsetse yePTFE yakagadzirwa ne vacuum lamination ine kugona kwakazara kwe 420 °C. Tine makobvu ese eRT/duroid 6002 (0.127, 0.254, 0.508, 0.762, 1.524 mm) ane 0.5 oz, 1 oz, uye 2 oz copper foil options kusanganisira reverse-treated foil yemagadzirirwo asina kurasikirwa zvakanyanya.
Kugona kwekugadzirisa: Kusvika pa16-layer RT/duroid 6002 multilayer construction; all-PTFE uye hybrid (ine FR4, RO4350B, RO4003C) stackups; bofu, yakavigwa, uye microvias; back-drilling yekubvisa stub; inline plasma desmear (CF₄/O₂); sodium etch yekushandiswa kwenguva refu; automated drill condition monitoring neRogers-specific parameter libraries.
Kudzora Impedance: Imwe chete ±5%, musiyano ±7%, yakasimbiswa neTDR pa coupon yega yega panel. Kutevedzera Impedance kwakavakirwa pafield-solver-based impedance control modelling ine copper roughness correction. Kuyedzwa kweVNA S-parameter kunogona kutaurwa kana zvichidikanwa ne frequency range yakabvumiranwa, dhizaini ye coupon, fixtures, uye miganhu yekugamuchira.
Hunhu uye chitupa: ISO 9001, IATF 16949 (ndege yemotokari), IPC-6012 Kirasi 2 neKirasi 3, IPC-6018 Kirasi 3, MIL-PRF-31032 kutevedzera maitiro, mishumo yekuyedza yekubvisa gasi munzvimbo (ASTM E595). Mishumo yezvikamu zvakasiyana inowanikwa pane yega yega yezvirongwa zvinovimbika.
Kupedzisa pamusoro: ENIG (inonyanya kushandiswa), sirivha inonyudzwa mumvura, ENEPIG (inoenderana netambo), OSP, goridhe remagetsi rekubatanidza. Kupedzisa kwakasiyana kunowanikwa pakubatanidza tekinoroji yakasanganiswa.
Nguva yekutungamira: Maprototypes mazuva 5-10 ekushanda, kugadzirwa kwemazuva 14-21 ekushanda, kukurumidza kuripo.
Kumbira mutengo weRT/duroid 6002 PCB — isa mafaira eGerber, stackup, uye impedance kuti uwane mitengo mukati memaawa makumi maviri nemana.
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Nzira yekuwana sei quote yePCBs
Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.
