Chii chinonzi Multilayer PCB: kugadzira uye dhizaini

Kusiyana nemaPCB ane layer imwe chete kana maviri, maPCB ane layer yakawanda ane zvidimbu zvitatu kana kusvika makumi matanhatu zvemhangura, zvakakamurwa nezvinhu zvinodzivirira uye zvakanamirwa pamwe chete pasi pekupisa nekumanikidzwa. Aya ma layer ekuwedzera anobvumira magadzirirwo edunhu akaomarara uye akakora, achikwana zvikamu zvakawanda pabhodhi diki. Kugona uku kwakakosha mumagetsi emazuva ano, uko zvishandiso zviri kuramba zvichiwedzera kuva zvidiki asi zvine simba. Kushanduka kwemaPCB ane layer akawanda kwakakonzerwa nekudiwa kwezvigadzirwa zvemagetsi zvinoshanda, zvakavimbika, uye zvidiki. NeRO4450T bondply yemabhodhi eRF ane layer akawanda , ukobvu hwe bonding-layer hunofanira kuongororwa mu stackup yakapedzwa pane kungoonekwa sechinotengwa chete.

Yakajairwa Multilayer Zvivakwa

• 4-6 layers - yakaderera kusvika pakati nepakati kuoma
• 8-10 zvidimbu - zvakanyanya kuoma mabhodhi edhijitari
• 12-16 akaturikidzana - yepamusoro RF uye data kugadzirisa
• 20+ akaturikidzana - yakaomesesa yakabatana
• 60+ akaturikidzana - mamiriro ehunyanzvi HDI tekinoroji

Kugadzira Maitiro eMultilayer PCBs

1. Inner Layer Formation

Photolithographic patterning inoshandiswa kune mhangura-akapfeka laminates kutsanangura matunhu edunhu, achiteverwa nekubvisa mhangura isingadiwe, kuwedzera mitsara yekunyoresa dhairekitori uye maburi ekushandisa, kuyedza magetsi ezviteshi, uye kugadzirira kwepamusoro kwelamination.

2. Layer Lamination

Multiple layers anosungirirwa achishandisa sheet lamination presses, ine stackup gadziriro yemacores, prepregs, mhangura, uye dielectrics, inoporeswa pasi petembiricha uye kumanikidzwa kuumba yakasimba laminate.

3. Boora Makomba

Kuchera kwepamusoro kunogadzira zvishandiso uye kuburikidza nemakomba ane kunyoreswa kwakaringana kune yega yega.

4. Gomba Plating

Electroless copper plating inoteverwa neelectrolytic copper plating inovaka mhangura pamatanda emukati nemakomba akacherwa.

5. Outer Layer Processing

Kushandisa mask inonyungudutsa inotorwa nemufananidzo , kudhinda zviratidzo zvekuzivikanwa, kugadzira mapatani uye kuchekwa kwezvikamu zvekunze, uye kutenderera kwepaneru muPCB dzakasiyana-siyana.

6. Kuedzwa uye Kuvimbiswa Kwehutano

Inosanganisira otomatiki yekutarisa yekutarisa, net yekubatanidza kuyedza, impedance, yakakwira voltage, uye kuyedza kushanda, pamwe nedimensional yemhando yekudzora.

Multilayer PCB Dhizaini Mafungidziro

Nhamba yeZvikamu:

Kusarudza huwandu hwematanho inhanho yekutanga mu multilayer PCB dhizaini. Iyo layer count, iyo inogona kubva kune mana kusvika gumi kana anopfuura akaturikidzana, zvinoenderana nekuoma kwedhizaini, chikamu chechikamu, uye magetsi ekuita zvinodiwa.

Component Placement

Uchishandisa PCB dhizaini software, vagadziri vanoronga zvikamu uye vanotsanangura kubatanidza magetsi. Kurongeka kunofanirwa kukwirisa masaini ekufambisa, kuderedza kupindira, uye kuve nechokwadi chekupisa.

Signal Routing

Nzira yemagetsi inosanganisira kutsanangura hupamhi, nzvimbo, uye dhizaini yekugovanisa, kutarisa kuperera kwechiratidzo, kudzikisira-kutaura, uye kudzivirira chiratidzo chechiratidzo.

Layer Stacking Zvinotarisirwa:

Iwo akaturikidzana anofanirwa kurongedzerwa nenhamba dzakatonaka, uye ese masignal layers anofanirwa kunge ari padyo nendege yepasi sezvinobvira. Iyo nzira ye wiring pane imwechete yechiratidzo layer inofanira kuenderana. Sarudzo yehuwandu hwematanho zvakare inoenderana nerudzi rwechiratidzo chavanoda kufambisa, chakaiswa senge yakakwira frequency, yakaderera frequency, pasi, kana simba.

Chikamu uye Interface Arrangement:

Nenzira yakanaka, zvikamu zvinofanira kuiswa kune rumwe rutivi, uye nzvimbo uye kutaridzika kwezvikamu zvekugadzirisa zvinofanira kurongwa zvine musoro. Zvikamu zvine hukama hwepedyo hwemagetsi zvinoiswa zvakanaka pamwechete.

Gerber File Generation:

Kana nzira yemagetsi yatsanangurwa, mafaira eGerber anogadzirwa, ane ruzivo nezve layer stack-up, magetsi ekubatanidza, kuiswa kwechikamu, uye rumwe ruzivo rwekugadzira.

Kugadzira:

Mugadziri anoshandisa mafaira eGerber kugadzira mafotomasks, ayo anobva ashandiswa kugadzira zvidimbu zvePCB. Aya mataira akaiswa laminated kuumba yekupedzisira multilayer PCB.

Chiratidzo Kutendeseka Kufunga kweMultilayer PCB

Layer Stack-Up: Kunyatsoronga iyo layer stack-up kwakakosha. Chiratidzo uye pasi pasi zvinofanirwa kubatanidzwa zvakanyanya kuderedza impedance uye chiratidzo chekuratidzira.

Trace Routing: Mateki anofanira kufambiswa kudzivirira crosstalk uye electromagnetic interference (EMI). Kuchengeta nzira dzechiratidzo dziri pfupi uye dzakananga kunovandudza kutendeseka kwechiratidzo.

Kudzora Kusapindirana : Kuchengetedza kusapindirana kwakasimba muPCB kunodzivirira kukanganisa kwechiratidzo uye kuratidzwa kwacho.

Decoupling Capacitors: Izvi zvakakosha pakugadzirisa kuvimbika kwesimba uye kuderedza ruzha pane ndege dzemagetsi.

Via Dhizaini: Iyo dhizaini uye kuiswa kweiyo vias maitiro echiratidzo nzira uye inofanirwa kuvandudzwa kuchengetedza chiratidzo chekuvimbika.

Mutengo Kufunga kweMultilayer PCB

Complexity uye Layer Count: Mamwe maturu uye kuoma mukugadzira kunowedzera mutengo wekugadzira.

Zvishandiso Zvinoshandiswa: Yepamusoro-mhando kana yakasarudzika zvinhu zvinogona kukwidza mutengo wakazara.

Kugadzira Tekinoroji: Yepamberi yekugadzira matekiniki ezvakaoma madhizaini anogona zvakare kuwedzera kumutengo.

Saizi yePCB: Mahombe maPCB anoda zvimwe zvinhu uye kugadzirisa, kuwedzera mutengo.

Huwandu: Huru hwekugadzira inomhanya inogona kuderedza mutengo pachikamu nekuda kwehupfumi hwechiyero.