Kugadzira PCB yeRO4450T Bondply

RO4450T bondply inova chinhu chemagetsi chinosungirirwa kana chadzvanywa muRF multilayer. Chinangwa chekugadzira ndechekudzokorora geometry uye kunyoreswa kwe dielectric yakagadzirwa neRF design. Kukura kwekambani: Highleap Electronics inogadzira uye inounganidza PCB yakagadzirwa. Giredhi reRogers rakataurwa papeji rino rinozivisa laminate yakatarwa; Highleap haigadziri kana kutengesa Rogers laminates. RO4450T bondply Kugadzira PCB inzira inodzorwa ye multilayer lamination ye Rogers PCB stackups ine frequency frequency. RO4450T haishandiswe se standalone core laminate. Inoshanda se bonding layer mu RO4000 multilayer constructions, kunyanya ne RO4003C, RO4350B, uye hybrid Rogers/FR4 stackups dzakasarudzwa. Kana kuvaka kukachinja kune izvi, RO4460G2 bondply processing inoda mvumo itsva ye press cycle uye dielectric thickness.

Pakugadzirwa kweRF PCB, chinhu chikuru chinodiwa kwete chete kuwanikwa kwezvinhu. Kuunganidzwa kwakazara kunofanirwa kuongororwa kuti uone ukobvu hwe dielectric, huremu hwemhangura, chinangwa che impedance, kugadzikana kwe lamination, kunyoresa, kuboora, kuisa ma plating, uye kudzokorora kwekuongorora. Highleap inoongorora ruzivo urwu isati yasvika pa quotation kuitira kuti PCB yapera ikwanise kusangana nezvinodiwa zve mechanical uye RF performance. Highleap inoongorora bondply pamwe chete ne cores, copper uye target pressed thickness. Lamination pressure, resin distribution uye registry zvinofanirwa kubatwa se one process window, kunyanya apo impedance kana phase length zvinoenderana ne final geometry. Chaiyo material property values ​​inofanira kuongororwa zvichienderana ne script yemutengesi we grade yakatarwa uye building.

RO4450T bondply inoonekwa sesarudzo yekuvaka kubva pane layer kuenda pane layer. Zvinhu zvakakosha pakugadzira inyaya dze dielectric layers dziri pedyo, ukobvu hwakadzvanywa, kunyoreswa, maficha emhangura uye lamination sequence inoshandiswa kuzadzisa RF stackup yakaburitswa.

RO4450T Bondply yeRogers Multilayer PCB Stackups

RO4450T chikamu chemagetsi akaunganidzwa.

RO4450T inowanzo shandiswa sechinhu chekubatanidza muzvivakwa zvePCB zvine ma frequency akawanda. MuRO4003C, RO4350B, kana kuti hybrid Rogers stackups, bondply layer inogona kukanganisa stripline structures, broadside coupling, RF transitions, layer-to-layer spacing, uye impedance repeatability. Kuenzanisa zvinodiwa zve RO4450F prepreg process kunobatsira chete ne resin system chaiyo, kuvaka uye finished stackup yakataurwa.

Highleap inoongorora kuvakwa kwePCB yese isati yagadzirwa, kusanganisira zvinhu zvepakati, callout yebondply, ukobvu hwemhangura, ukobvu hwebhodhi rakapedzwa, lamination sequence, uye zvinodiwa zve impedance. Izvi zvinobatsira kusimbisa kana dhizaini inogona kugadzirwa nguva dzose kubva pakugadzirwa kweprototype kusvika pakudzokorora.

• RO4003C uye RO4350B maPCB eRF ane layer yakawanda
• MaPCB emhando yepamusoro eHybrid FR4/Rogers
• Mamodule eRF ane ma "dielectric bonding layers" anodzorwa
• Mapuroteni ePCB ane impedance yakawanda
• Kugadzira zvigadzirwa kunoda kushanda kwakasimba kweRF

Kuti zvive nani, RO4450T layer inofanira kuratidzwa zvakajeka mu stackup draw. Dhirowa inofanira kuratidza core yega yega, bondply, copper layer, reference plane, impedance layer, uye finished thickness required.

Misoro yenyaya dzekugadzira ine chekuita nePCB lamination , hybrid PCB lamination , uye Rogers PCB stackup.

RO4450T Ukobvu uye Kudzora Kusapindirana

Rutivi rwebondply runofanira kuiswa mumodhi ye impedance.

MuPCB ine ma multilayer akawanda ane frequency yakakwira, ukobvu hweRO4450T uye maitiro e dielectric zvinofanirwa kuverengerwa mukuverenga stackup. Kana modhi ye impedance ichingotarisa copper geometry chete asi isingatarise bonding layer, bhodhi rapera rinogona kupotsa target impedance kunyangwe kana circuit pattern yakachekwa nemazvo.

Usati washandisa CAM tooling, Highleap inotarisa kana marongero akadzorwa anoreva Rogers core, RO4450T bondply layer, kana kuti chimiro che dielectric chakabatanidzwa. Ukobvu hwemhangura hwakapedzwa, mukana wekuisa plating, kuenderera mberi kwe reference plane, uye dhizaini ye impedance coupon zvinoongororwawo.

• Ukobvu hweBondply uye callout yezvinhu
• Chimiro che dielectric chakarongwa nechikamu
• Kukosha kwe impedance inodzorwa uye kushivirira
• Kukora kwemhangura kwakapedzwa uye kuputika kwesimbi
• Nzvimbo yepoupon yeImpedance uye zvinodiwa pakuyedza

Kuchinja kudiki pakureba kwe dielectric, huremu hwemhangura, kuyerera kwe resin, kana dhizaini ye reference plane kunogona kukanganisa mhedzisiro yemagetsi. Nechikonzero ichi, tafura ye stackup ne impedance inofanira kubvumidzwa mafaira ekugadzira asati aburitswa.

Kudzora Kuravira kweRO4450T

Kuenderana kwelamination kunosarudza kudzokorora kweRF.

RO4450T lamination inoda kudzora kumanikidzwa, tembiricha, kuyerera kwe resin, kunyoreswa, njodzi yekusashanda, uye ukobvu hwekupedzisira hwe dielectric. Izvi zvinhu zvekugadzira zvinokanganisa zvakananga kunaka kwebhodhi rapera, kunyanya mukugadzirwa kwe multilayer RF PCB.

Kune hybrid Rogers/FR4 stackups, Highleap inoongorora kuenderana kwezvinhu, kusawirirana kweCTE, copper balance, drill quality, uye inobvumira kutsiviwa kwezvinhu zvisati zvataurwa. Izvi zvinodzivirira stackup kuti isave hybrid construction isingadzoreki panguva yekugadzira.

• Dhizaini yemaitiro ekudzvanya uye lamination
• Kudzora kunyoresa kwemabhodhi eRF ane layer yakawanda
• Njodzi yekubuda kwemvura isina chinhu, kupatsanurwa kwemvura, uye kuyerera kwemvura kubva muresin
• Ongororo yeCopper balance uye marongerwo epaneru
• Kugona kwe lamination yakatevedzana kana zvichidikanwa
• Kuenderana kwezvinhu zveHybrid Rogers/FR4

Kana dhizaini yacho ichida lamination yakatevedzana, nzvimbo dzakachekwa, kugoverwa kwemhangura isina kuenzana, kana kudzora ukobvu hwacho, zvinodiwa izvi zvinofanirwa kunyorwa mudhirowa yekugadzira. Magwaro akajeka anobatsira kuderedza kubata kwemainjiniya, njodzi yekutsiva zvinhu, uye kunonoka kwekugadzirwa.

Zvinodiwa zveRO4450T PCB Quote 

Pakeji yakazara yeRFQ inovandudza kururama kwemutengo.

Kuti titaure nezve RO4450T bondply PCB, Highleap inoda data rakazara rekugadzira. Faira reGerber rega harikwani kuti pave neongororo chaiyo ye stackup, kusimbisa impedance, kuronga lamination, kana kuongorora mutengo.

• Mafaira eGerber, ODB++, kana IPC-2581
• Mufananidzo wekugadzira
• Dhirowa yekurongedza zvikamu zvezvikamu
• RO4003C, RO4350B, RO4450T, kana kuti zvinhu zvakasanganiswa
• Kurema kwemhangura uye zvinodiwa zvemhangura zvakapedzwa
• Tafura ye impedance inodzorwa uye kushivirira
• Chinodiwa pamusoro pekupedzisa
• Chinodiwa chekukora kwebhodhi chakapedzwa
• Mushumo weImpedance, kuponi yekuyedza, kana chinodiwa chekuongorora chakakosha
• Mafaira ekuunganidza kana sevhisi yePCBA ichidikanwa

Tumira pasuru yekugadzira kuburikidza nefomu reHighleap PCB quote . Highleap inogona kuongorora kuwanikwa kwezvinhu, kugona kwekuunganidza zvinhu, njodzi ye lamination, kutonga kwe impedance, mwero wekuongorora, uye nguva yekutungamira usati wasimbisa quote. Kune RFQ, sanganisira kuvakwa kwe layer yakazara, ukobvu hwechinangwa, mhangura, saizi yebhodhi uye huwandu. Kuunganidza zvinhu zvakakwana kwakakosha kuti pave ne quote ine revo ine bondply.