Yakakwana Nhungamiro yeHybrid Lamination: Kudzora Warpage muYakakwira-Frequency uye FR-4 Zvishandiso.

Kuiswa kwelamination yemhando yepamusoro, senge CORE (semuenzaniso, hydrocarbon-ceramic low-loss laminate , RF-35A), uye zvinhu zveFR-4 zvakajairika kwave chinhu chakakosha mukugadzirwa kwePCB (Printed Circuit Board). Laminate yemhando yepamusoro yePCB inosanganisa hunhu hwemagetsi hwemhando yepamusoro yelaminates ine mutengo wakaderera uye kugadzikana kweFR-4. Izvi zvinoita kuti maPCB emhando yepamusoro elaminates ave mhinduro yakanaka yekushandiswa nekukurumidza, RF, uye microwave uko kushanda zvakanaka uye mashandiro anofanirwa kuenzana. Pakuvaka mabhodhi emhando yepamusoro eRogers neFR-4 , system yekubatanidza, press cycle uye layer alignment zvinofanirwa kuongororwa se stackup yakazara isati yagadzirwa.

Nekudaro, kugadzira hybrid laminate PCBs kunopa matambudziko akakosha nekuda kwekusiyana kwakasiyana kwezvinhu zvenyama, senge coefficient ye thermal expansion (CTE), dielectric constant (Dk), uye kugadzikana kwekupisa. Uku kusaenzana kunowanzo konzera kushushikana kwemagetsi panguva yekugadzira uye kunotevera kupisa bhasikoro, izvo zvinogona kutungamira kune warpage, delamination, kana kutadza kwemuchina. Nyaya dzakadai hadzingokanganisa kusimba kwePCB kwemaitiro uye kuvimbika kwemagetsi asi dzinogona kuderedza goho rekugadzira uye kuwedzera mutengo wekugadzira.

Chinyorwa chino chinopa mazano akadzama uye nzira dzakanakisisa dzekuvandudza maitiro e hybrid PCB laminate, tichitarisa pakudzora warpage uye kuona kuti kuvimbika kwacho kwakavimbika. Hurukuro iyi inosanganisira nzira dze four-layer hybrid laminate PCB stackups, dzinowanzo gadzirwa seCORE (high-frequency material) + PP (prepreg) + CORE (FR-4), uye inoongorora kuti kusarudzwa kwakakodzera kwezvinhu, stackup symmetry, uye process control zvinogona sei kuwedzera zvakanyanya mhedzisiro yekugadzira. Paunenge uchishandisa RO4460G2 bonding layers muRF stackups , press cycle, copper distribution uye finished dielectric spacing zvinofanirwa kubvumirana nemugadziri.

Matambudziko muHybrid Lamination

Kubatanidzwa kwezvinhu zvine frequency yakakura, zvakaita se hydrocarbon-ceramic low-loss laminate uye RF-35A, ne FR-4 mu hybrid PCB laminations kwakakosha kumashandisirwo anoda high-speed uye RF performance. Zvisinei, kusiyana kwezvinhu zvinogadzira matambudziko anofanirwa kugadziriswa kuti pave nechokwadi chekuti ma PCB akavimbika uye anogona kugadzirwa. Chimwe chezvinhu zvinonyanya kushungurudza ndechekusawirirana kwekuwedzera kwekupisa. Zvinhu zvine frequency yakawanda zvinowanzova ne coefficient yakaderera yekuwedzera kwekupisa (CTE) pane FR-4. Kusawirirana uku kunounza kushushikana kukuru kwemuchina panguva yekudzikisa uye thermal cycling processes, izvo zvinogona kutungamira mukupwanyika, kucheka, kana kutotsemuka kwe vias nema microvias. Kusarudza zvinhu nekungwarira uye kugadzirisa stackup kwakakosha pakugadzirisa nyaya iyi.

Thermal Kuwedzera Mismatch

Imwe yematambudziko akanyanya kukosha muhybrid lamination iko kusapindirana mune coefficients of thermal expansion (CTE) pakati pepamusoro-frequency zvinhu uye FR-4. Yakakwira-frequency zvinhu zvinowanzo ratidza yakaderera CTE hunhu kana ichienzaniswa neFR-4, iyo inogadzira kushushikana kwemagetsi panguva yese yelamination process uye inotevera yekupisa bhasikoro (semuenzaniso, panguva ye solder reflow). Kushushikana uku kunogona kutungamira kuzvinhu zvakakomba, senge warpage yePCB yekupedzisira, delamination pane zvinhu zvinosangana, uye microvia kupaza. Aya matambudziko anogona kukanganisa kutendeseka kwemuchina uye kushanda kwemagetsi kwePCB. Kusarudzwa kwezvinhu uye nekungwarira stackup dhizaini kwakakosha kudzikamisa mhedzisiro yekusawirirana kwekuwedzera kwekupisa.

Prepreg Selection uye Symmetry

Prepregs (PP) inoita basa rakakosha mumahybrid laminations, anoshanda seanonamira uye dielectric layers pakati pelaminates. Zvisinei, kusarudzwa kusina kunaka kana kushandiswa kusina kunaka kwe prepregs kunogona kukonzera kusaenzana kwakanyanya kwekunetseka, zvichiita kuti warpage. Usymmetrical prepreg stackups inowanzokonzera kusaenzana kweresin kuyerera panguva yelamination, iyo inowedzera kushushikana uye mechanical deformation. Symmetrical stackup dhizaini inokurudzirwa kuve nechokwadi chekugovera resin yunifomu uye kusagadzikana chiyero. Zvakakodzera resin zvemukati uye prepreg ukobvu kusarudzwa kwakakoshawo kuchengetedza kugadzikana kwemakanika uye kuderedza kukanganisa kwemukati.

Surface Pedzisa-Inoenderana Stress

Sarudzo yekupedza kwepamusoro inogona kukanganisa zvakanyanya warpage uye kugadzikana kwemakanika kweiyo hybrid PCB. Maitiro akadai sekupfapfaidza tini (HASL) anosanganisira tembiricha yakakwira iyo inogona kuunza kumwe kushushikana kwekupisa kune laminated board. Izvi zvinonyanya kunetsa kune hybrid laminations, uko CTE kusawirirana pakati pepamusoro-frequency zvinhu uye FR-4 inoita kuti vanzwe zvakanyanya kushushikana kwakadaro. Nekuda kweizvozvo, HASL haiwanzo kukurudzirwa kumabhodhi ehybrid. Pane kudaro, mamwe anopedzisa senge ENIG (Electroless Nickel Immersion Goridhe) kana OSP (Organic Solderability Preservatives) anosarudzwa, sezvo achiisa kushomeka kwekupisa uye akakodzera kune mahybrid application.

Kusiyanisa kwezvinhu

Kusiyana kwezvinhu ndeimwe dambudziko guru mu hybrid laminations. Kunyangwe mukati mechikamu chimwe chete chezvinhu, zvigadzirwa zveFR-4 kubva kuvagadziri vakasiyana zvinogona kuratidza kusiyana muhunhu hwakakosha, senge resin content, glass transition temperature (Tg), uye thermal stability. Kusawirirana uku kunogona kutungamira mu delamination, kuwedzera warpage, uye kudzikira kwehunhu hwemakanika muPCB yekupedzisira. Kushandisa zvinhu zveFR-4 zvakasimbiswa, zvakaita seShengyi S1141 neS1170, izvo zvakaedzwa kuti zvienderane nezvinhu zvine frequency yakakwira, zvinoita kuti zvive zvakavimbika uye zvinoenderana mu hybrid laminations.

Hybrid laminations emhando yepamusoro-frequency zvinhu uye FR-4 inotarisana nematambudziko akati wandei, kusanganisira kupisa kwekuwedzera kusawirirana, prepreg kusarudzwa uye symmetry, kushushikana kwakanangana nepamusoro, uye kusiyanisa kwezvinhu. Kugadzirisa matambudziko aya kunoda kusarudzwa kwezvinhu, kwakasimbiswa prepreg dhizaini, uye kwakaringana maitiro ekudzora panguva yekugadzira. Nekutevera maitiro akanakisa uye kutora madhizaini akagadziridzwa, vagadziri vanogona kugadzira yakavimbika uye yepamusoro-inoshanda mahybrid PCB ane mashoma ehondo uye kusimba kwenguva refu.

Zvinokurudzira zveHybrid Lamination Dhizaini

1. Kusarudzwa kwezvinhu

Kusarudzwa kwezvinhu kwakakosha kudzikisa warpage mumahybrid laminations. Zvichienderana neruzivo runoshanda uye empirical data, zvinotevera zvinongedzo zvinokurudzirwa:

• Kune 20mil 25FR + FR-4 Laminations : Tsiva 25FR ne hydrocarbon-ceramic low-loss laminate. hydrocarbon-ceramic low-loss laminate inopa kushandirana kuri nani kwemuchina uye kupisa ne FR-4 uye inoshanda zvakanaka kwazvo mukushandiswa kwe high-frequency.

• Pa 20mil hydrocarbon-ceramic low-loss laminate + FR-4 Laminations : Sarudza zvinhu zveFR-4 zvine ukobvu hwe 0.51mm, 0.36mm, kana 0.18mm. Pakati peizvi, 0.51mm ne 0.36mm zvinofarirwa nekuda kwekugadzikana kwazvo kwemuchina uye mwero wakaderera we warpage.

• PamaLaminations e20mil RF-35A + FR-4 : Shandisa zvinhu zveFR-4 zvine ukobvu hwe0.10mm, 0.18mm, kana 1.0mm. Sarudzo idzi dzakaratidzwa kuderedza kusawirirana kwestress zvinobudirira, zvichideredza warpage.

2. Symmetrical Prepreg Stackup Dhizaini uye Kurongeka-Yakananga Kugadziriswa

Prepreg (PP) inoita basa rakakosha mukuenzanisa kushushikana kwemakanika mune iyo laminated chimiro. An unsymmetrical prepreg dhizaini inowanzokonzera kusaenzana kwekushushikana kwekugovera, zvichitungamira kune yakakosha warpage uye kusagadzikana kwemagetsi. Kugadzirisa nyaya iyi, anotevera symmetrical prepreg stackup madhizaini anokurudzirwa senge nhungamiro yekuve nechokwadi chakakwana resin kuyerera uye kushushikana chiyero panguva yekuyamwisa:

• Chiuru + 1080 + 2116
• Chiuru + 3313 + 7628
• 2116 × 2

Aya magadzirirwo anobatsira kudzikisira kusagadzikana kwemukati kusagadzikana, kuderedza warpage, uye kuchengetedza kugadzikana kwemuchina pane ese mahybrid laminations.

Nekudaro, zvakakosha kuti uzive kuti imwe neimwe yakananga kurongeka ingangoda kugadziridzwa kwakavakirwa painjiniya yezvinyorwa, zvinodiwa zve impedance, uye kufambira mberi kwekugadzira. Semuenzaniso, maodha anosanganisira impedance control angangoda imwe stackup kana magadzirirwo ekugadzirisa kuti asangane nemagetsi chaiwo. Mazano akapihwa pano ndiwo mazano akajairwa ezvina-layer hybrid laminations uye anogona kunge asiri kuvhara izvo zvakasarudzika zvinodiwa zveese magadzirirwo.

Kuti uwane ongororo yakadzama yeiyo chaiyo maitiro uye zvinhu zvinodikanwa zveodha yako, tinokukurudzira kuti ubate timu yedu. Mainjiniya edu anozogonesa iyo stackup dhizaini uye maitiro maparamendi kuti aenderane neayo chaiwo ekugadzira mamiriro uye kuve nechokwadi chezvakanakisa mhedzisiro yePCB yako.

3. Surface Finish Recommendations

Kupfapfaidza Tin (HASL) :

• • Kupfapfaidza kwematani kazhinji hakukurudzirwe kumabhodhi ehybrid anosanganisa zvinhu zvakakwirira-frequency neFR-4 nekuda kwekushushikana kwekupisa kwainounza, izvo zvinogona kutungamira mukuwedzera warpage.
  • Kana kupfapfaidza netini kusingadzivisike, zvinongogamuchirwa chete kune hydrocarbon-ceramic low-loss laminate + FR-4 hybrid laminations. Hunhu hwekupisa uye hwemakanika hwe hydrocarbon-ceramic low-loss laminate hunoita kuti irambe yakasimba pakumanikidzwa kunounzwa nekupedzwa kwenzvimbo iyi.

4. Inotarisirwa Warpage Performance

Nekutevedzera zviri pamusoro apa, iyo inotarisirwa warpage kuita kwemahybrid laminations ndeaya anotevera:

• Kune laminate ine hydrocarbon-ceramic ine kurasikirwa kwakaderera + FR-4 Hybrid Laminations: Warpage inogona kudzorwa mukati me0.7%.
• YeRF-35A + FR-4 Hybrid Laminations: Warpage inogona kuchengetwa pazasi 1.0%.

Mhedzisiro iyi inovandudza zvakanyanya kugadzikana kwemakanika uye kuenderana neindasitiri zviyero zveyakavimbika PCB kugadzirwa.

5. Yakagamuchirwa FR-4 Zvinhu

Chete chaiwo FR-4 zvinhu zvakaedzwa uye kusimbiswa kune yakasanganiswa laminations ine yakakwirira-frequency zvinhu. Izvi zvinotevera FR-4 zvinhu zvinokurudzirwa:

• S1141
• S1170

Zvese zviri zviviri, zvakagadzirwa neShengyi Technology, zvinoratidzira kuenderana kwakanyanya nepamusoro-frequency zvinhu, kuve nechokwadi chemhedzisiro yakavimbika ine yakaderedzwa warpage.

6. Custom Solutions kune Zvimwe Zvishandiso

Kune ma hybrid laminations ane zvinhu zvine frequency yakawanda kunze kwe hydrocarbon-ceramic low-loss laminate uye RF-35A, mazano ari pamusoro apa anogona kunge asingashande pasi rose. Nyaya yega yega inofanira kuongororwa zvichibva pane hunhu hwezvinhu zvirimo, zvakaita se:

• Coefficient of Thermal Expansion (CTE)
• Glass Transition Temperature (Tg)
• Dielectric Constant (Dk)
• Resin Content

Vagadziri vanorayirwa kuti vabatane nevanopa zvinhu uye kuita miyedzo yakakwana kuti vaone iyo yakakwana stackup dhizaini uye lamination maitiro ezviitiko izvi.

Maitiro ekufunga nezveHybrid Lamination

1. Post-Lamination Stress Relief

Iyo lamination process yemahybrid PCBs, kunyanya ayo anosanganisira yakakwirira-frequency zvinhu senge 25FR yakasanganiswa neFR-4, inoda hune hunyanzvi hwekupisa uye mashandiro ekudzivirira kudzivirira warpage uye kuve nechokwadi kuvimbika. Post-lamination baking inhanho yakakosha yekusunungura kushushikana kwemukati kunogadzirwa panguva yelamination process. Izvo zvakakosha kubvumira bhodhi kuti igadzikane munzvimbo inodzorwa inopisa pasina kushandisa kuwedzera kumanikidza. Izvi zvinodzivirira kuwedzera deformation uye inobvumira iyo resin system kurapa zvizere, iyo inoderedza zvakanyanya kusara kwemagetsi kushushikana. Kudziya kwakafanana uye kunonoka kupisa kutonhora panguva ino kunobatsira kuchengetedza bhodhi kudzikama uye chimiro chechimiro, kunyanya kana uchibata nezvinhu zvine akasiyana ekuwedzera ekuwedzera kwemafuta, senge yakakwira-frequency laminates uye FR-4.

2. Kuongorora Kwekupedzisira Kugadzirisa Kubika

Muzviitiko apo warpage inowanikwa panguva yekupedzisira yekuongorora, kugadzirisa kubheka kunogona kunyatsogadzirisa bhodhi uye kudzoreredza flatness. Kubika bhodhi rakasanganiswa pa 150 ° C kwemaawa maviri pasina kuisa kumanikidza kunobvumira zvidimbu zvelaminate kuti zvizorodze uye kugovera zvakare kushushikana zvakaenzana. Munguva iyi inodzorwa kupisa kuratidzwa, iyo laminate resin inopfava zvishoma, kufambisa kushushikana kwekushushikana pakati pematanho. Kuti udzivise kudzokororwa kwekuchinja, kutonhora nekukurumidza uye kwakafanana kwakakosha. Kuisa bhodhi panzvimbo yemarble yekutonhodza kunovimbisa chikuva chakati sandara uye chakagadzikana, zvichiita kuti laminate igadzikane zvakaenzana ichichengetedza kudzika kwayo kwakagadziriswa. Iyi nhanho inonyanya kukosha kune yakasanganiswa stackups, sezvo kutonhora kusina kuenzana kunogona kuwedzera warpage nekuda kwekusiyana kwezvinhu pakati peiyo yepamusoro-frequency core uye FR-2.

3. Kuvimbisa Dimensional Kugadzikana uye Kuvimbika Kwenguva Yakareba

Ose ari maviri e-post-lamination uye kugadzirisa kubheka maitiro anoita basa rakakosha mukuona kuvimbika uye kurongeka kwemahybrid PCB. Nekutevera maitiro aya, vagadziri vanogona kuwana kudzora kushushikana kushushikana, kuwedzera kugadzikana kwedimensional, uye kudzivirira delamination kana kutadza kwemuchina panguva dzinotevera dzegungano. Idzi gadziriso dzetekinoroji dzakanyanya kukosha kune maapplication anoda kukwirisa-frequency kuita, sezvo ivo vachiona kuti iyo hybrid stackup inochengetedza hunhu hwayo hwemagetsi nemagetsi mukati mehupenyu hwechigadzirwa.

Kuwana Optimal Hybrid Lamination: Mabhenefiti Akakosha uye Indasitiri-Yakasimbiswa Maitiro

Nekuita izvo zviri pamusoro kusarudzwa kwezvinhu, stackup dhizaini, uye maitiro ekudzora kurudziro, PCB vagadziri vanogona kuwana zvinotevera mabhenefiti:

1. Yakaderedzwa Warpage: Mabhodhi eHybrid ane hydrocarbon-ceramic low-loss laminate + FR-4 anogona kusvika padanho re warpage mukati me0.7%, nepo mabhodhi eRF-35A + FR-4 achigona kuchengetedza warpage iri pasi pe1.0%. Matanho aya ari mukati mezvinodiwa zveindasitiri uye anovimbisa kushanda kwakavimbika.
2. Kuvimbika Kwakawedzerwa: Kuderedza warpage kunoderedza njodzi yekutadza kwemuchina, senge delamination kana kuputika, panguva yekuungana uye kushanda.
3. Kuvandudzwa Kwekuita Kwemagetsi: Kuchengetedza flatness uye kugadzikana kwemagetsi kunochengetedza kutendeseka kwe-high-frequency signals, zvichiita kuti zvive nani kushanda kwemagetsi.
4. Higher Yield: Yakaderedzwa warpage inotungamirira kumabhodhi mashoma akarambwa, kuvandudza zvibereko zvekugadzira uye kuderedza mari.
5. Kuenderana kwezvinhu: Kushandiswa kwakabvumidzwa FR-4 zvinhu uye symmetrical stackup dhizaini inovimbisa kuenderana pakati pepamusoro-frequency zvinhu uye zvakajairika FR-4.

Aya nhungamiro akarongedzerwa kugadzirisa iwo chaiwo matambudziko ehybrid lamination uye akavakirwa pane yakakura indasitiri ruzivo uye kusimbiswa. Kune chero mimwe mibvunzo kana tsika dzinodiwa, vagadziri vanokurudzirwa kushandirapamwe nevanopa zvinhu uye PCB vanogadzira kugadzira mhinduro dzakagadziridzwa dzezvavanoda chaizvo.