RO4450F Prepreg yeMultilayer PCB Production
RO4450F inoshandiswa sechikamu chekuvaka ma bonding ane layer yakawanda, saka chinangwa chekugadzira isystem ye dielectric yakapedzwa kwete pepa re bondply chete. Basa rayo rinofanira kutsanangurwa ne stackup yakaburitswa uye zvinhu zviri pedyo. "RO4450F prepreg" haina ruzivo rwakakwana kugadzira bhodhi re multilayer RF. Mhedzisiro ye bonding inoenderana negiredhi chaiyo kana succulent yakatenderwa, girazi style, resin content, ply count, copper topography, press cycle uye target cured spacing. Portfolio yaRogers ye public bonding-material iripo inounganidza zvigadzirwa pasi pemhuri yeRO4400/RO4400T pane kupa RO4450F yega yega, saka zita rakumbirwa uye kuwanikwa kwazvino zvinofanirwa kusimbiswa usati watenga. Kana runyorwa rwezvinhu rwuchisanganisira RO4450T, RO4450T bonding-layer fabrication inofanira kuongororwa zvichienderana nezvinodiwa zvakafanana zve dielectric-spacing uye reliability.
Highleap inobata zvinhu zvinosunganidzwa sechikamu chekuvakwa kwakazara. Ongororo ye stackup inofanira kuona macore ari kubatanidzwa, nzvimbo yemagetsi yekudzivirira, huwandu hwe resin hunodiwa kuzadza mhangura uye humbowo huchaburitsa mhedzisiro yemuchina. Hapana kutsiva giredhi kunofanirwa kuitwa pasina mvumo yakanyorwa yemutengi uye modhi yakagadziridzwa apo nzvimbo ye dielectric yakakosha pamagetsi.
RO4450F inobatwa pano sechikamu chekuvaka kwekubatanidza kwe multilayer. Prepreg haigone kutsanangurwa yakazvimirira kubva kuma cores ari pedyo, copper uye finished dielectric thickness; saka ongororo ye lamination inotanga kubva pa complete stackup uye target pressed construction.
RO4450F Chikamu cheSistimu yeBonding, Kwete Laminate Yakazvimiririra
Mubhodhi reRF rine ma multilayer, laminate ine mhangura inopa ma core circuit layers uye bondply kana prepreg inogadzira kunamira uye dielectric spacing pakati pe subassemblies. RO4450F inosarudzwa sechikamu chesystem iyoyo. Dhizaini yacho inofanira kuratidza kuti ndeapi ma cores ari kusungirirwa, kungave kuvakwa kwacho kuri kweRogers chete kana kuti kwehybrid, uye kuti mutsetse we bond wakagadzirwa unofanira kuzadzisa nzvimbo yemagetsi ipi.
Nei kuvakwa chaiko kuchikosha
Magirazi akasiyana-siyana uye zviri mukati me resin zvinogona kudzvanya kusvika pakukora kwakasiyana uye kuzadza mapatani akasiyana emhangura. Pliti imwe chete inogona kukwana pamusoro pemhangura isina kusimba asi isina kudya pamusoro penzvimbo yakakura kana isina kuenzana. Pliti dzakawanda dzinogona kuwedzera ukobvu uye kupindira kwekuchinja. Kuvakwa kwakakodzera kunobva munzvimbo yemhangura, ukobvu hwemhangura, zvinhu zvakachekwa kana zvakachekwa, kumanikidzwa uye nhungamiro yezvinhu.
Ko ukobvu hwe prepreg hwakafanana neukobvu hwakagadziriswa here?
Hapana kuenzana kwevanhu vose kunofanira kufungidzirwa. Mhedzisiro yacho inogadziriswa inoenderana nekuyerera kwe resin, kugoverwa kwemhangura, kumanikidzwa, tembiricha uye girazi rinotakura. Shandisa data rekuvaka remutengesi uye ruzivo rwemugadziri kuti upe muunganidzwa wezvinhu, wobva waongorora nechikamu chidiki apo nzvimbo yacho yakakosha. Dhirowa yekutenga inofanira kutaura chivakwa chakatenderwa kana chinangwa che dielectric chakapedzwa uye mutemo wekuchinja-chinja.
Ko RO4450F inogona here kubatanidza Rogers kunamira kuFR-4?
Kugadzirwa kwemhando yehybrid kunogona kuitika, asi kunofanirwa kuve kwakakodzera kuti zvinhu zvienderane, kugadziriswa, CTE, kunyoreswa, maitiro ekuboorera uye warpage. Hazvina kukwana kuti zvinhu zvikwanise kunamira. Bhodhi rapera rinofanira kugara richisangana uye richigadziriswa. Highleap inoongorora nzira yehybrid PCB lamination isati yasimbisa kugadzirwa kwemhando ye "stackup".
| Chinhu chakaunganidzwa | Nei zvichifanira kutsanangurwa | Humbowo hwezvinoburitswa |
|---|---|---|
| Laminate inoenderana | Inotsanangura kuenderana kweDk, ukobvu, mhangura uye mushonga. | Kukora kwakakodzera uye ukobvu hwepakati. |
| Kuvaka kweRO4450F | Rudzi rwegirazi neresin zvinosarudza kuyerera kwemvura uye nzvimbo yakaringana. | Kodhi yekuvaka yemutengesi kana tsananguro yeply yakatenderwa. |
| Kuverengwa kwezvikamu zvemapeji | Inodzora huwandu hwe resin uye ukobvu hwe bond-line. | Kuverengerwa kwehuwandu hwezvinhu zvakaunganidzwa uye kudhindwa. |
| Kugoverwa kwemhangura | Zvinoita kuti pave nekudiwa kwe resin yemuno uye kusiyana kweukobvu. | Ongororo yeCAM copper-density. |
| Nzira yekugamuchira | Inoshandura "kusunga zvakanaka" kuita zvinodiwa zvinoyerwa. | Kubviswa kwechikamu chidiki, kupindira, kudiwa kwekupisa kana kusina chinhu. |
Gadzira Mutsetse weBond Kubva kuCopper Geometry uye Dielectric Spacing
Tambo yekubatanidza inofanira kugutsa zvinodiwa zvemakanika uye zvemagetsi. Inofanira kunyorovesa pamusoro uye kufukidza mhangura pasina maburi kana nzara. Inofanirawo kugadzira nzvimbo ye dielectric inoshandiswa muRF uye impedance models. Zvinangwa izvozvo zvinogona kupesana: resin yakawanda inogona kuwedzera kuzadza asi kuchinja ukobvu; kumanikidzwa kwakanyanya kunogona kuderedza maburi asi kufambisa resin uye kuchinja kunyoreswa.
Kugadzirwa kwemhangura kunoita kuti resin idiwe
Matanda emhando yepamusoro, madanda ezviratidzo mashoma, mhangura yakakora uye nzvimbo dzakakura hadzishandise resin zvakaenzana. Musanganiswa unodzvanya zvakanaka pa coupon yakafanana unogona kuita zvakasiyana pane panel yechigadzirwa ine nzvimbo huru dzisina mhangura. Highleap inoongorora huwandu hwemhangura uye topography yemuno. Matambudziko ekuzadza anogona kugadziriswa nekuchinja huwandu hweply, copper balancing, local design kana press construction, zvichienderana nekutenderwa nevatengi.
Makomba, zvichekwa uye nzvimbo dzekuchengetedza dzemunharaunda
Maburi anogona kugadzira nzira dzekuyerera kana nzvimbo dzisina rutsigiro. Kana chigadzirwa chine gomba, simbi yakakomberedzwa, chikamu chakavharirwa kana pamusoro peRF yakafumurwa, mufananidzo unofanirwa kuratidza muganhu nemamiriro eresin anogamuchirika. RO4450F haisi chinhu "chisingafambi"; kufamba kweresin kwakajairika kunofanirwa kufungwa. Zvishandiso kana zvinhu zvinomisa kufamba zvinogona kudiwa kune zvivakwa zvakakosha.
Nzvimbo yeImpedance
Mugadziri wemumunda anofanira kushandisa chivakwa chakagadziriswa chakatenderwa. Kana tambo yekubatanidza iri chikamu che stripline kana broadside-coupled structure, kushivirira kunogona kukanganisa impedance uye coupling. Highleap inogona kupa zviyero zve trace kubva ku manufacturable stackup, asi muridzi wedhizaini anofanira kubvumidza mhedzisiro yemagetsi. Ongorora maitiro eRogers PCB stackup usati waomesa artwork yakatenderedza ukobvu husina kusimbiswa hwe prepreg.
Chimiro chegirazi chinofanira kuoneka mukuburitswa
Kana girazi rakati richidikanwa pakukora, kuzadza kana kushanda kwemagetsi, rinofanira kudzorwa mukudhirowa kana kuunganidzwa kwakatenderwa. Chiziviso chakafara chinobvumira chero RO4450F kuvaka kunogona kuchinja tambo yekubatanidza uye maitiro anoshanda e dielectric. Kana kupa kwemagetsi kuchida imwe nzira, fekitori inofanira kudzorera chivakwa chakagadziriswazve kuti chibvumidzwe.
Chimiro chezvinhu: Peji rino rine chekuita nekugadzirwa kwePCB uchishandisa zvinhu zvakatarwa zveRogers. Highleap Electronics inogadzira bhodhi rakapedzwa nePCBA; kugadzirwa kwelaminate uye kutengeswa kwezvinhu zviri kunze kwechikamu chedu chebasa.
Chii Chingakanganisika Munguva yeRO4450F Lamination
Zvikanganiso zvinofanira kukurukurwa nenzira dzakasiyana. Maburi anogona kukonzerwa negasi rakavharirwa, kusvibiswa pamusoro kana kusayerera kwakakwana. Nzara inogona kukonzerwa nekusava neresin yakakwana kana kufamba kwakanyanya. Kuonekwa negirazi kunogona kuratidza kuti resin haina kukwana panzvimbo yacho. Kubviswa kweresin kunogona kusanganisira kusvibiswa, kusashanda zvakanaka, hunyoro kana kusabatana zvakanaka. Chikanganiso chekunyoresa chinogona kukonzerwa nekufamba kwezvinhu kana maturusi.
| Deite | Vangangove vari ivo vanopa rubatsiro | Kusimbisa kunobatsira |
|---|---|---|
| Voids | Kuvharwa kwemhepo, kusvibiswa, kunyoroveswa kusina kukwana kana kudzvanywa. | Kuvhiyiwa kwemushonga mudiki, X-ray kana zvakakodzera uye kuongorora mashandiro acho. |
| Nzara yeResin | Resin isina kukwana, mhangura yakawanda, kuyerera kwakawanda kana topography yenzvimbo yacho. | Chikamu chebond-line uye cheki ye copper-encapsulation. |
| Kusiyana kwakanyanya kwemutsara wechisungo | Kusaenzana kwehuwandu hwemhangura, kupararira kwezvinodhindwa kana kusaenzana kwekuvaka. | Kuyerwa kweukobvu hwenzvimbo dzakasiyana-siyana. |
| Delamination | Mamiriro epamusoro, hunyoro, kuenderana kwemvura kana kushushikana nekupisa. | Kubviswa kwechikamu chidiki uye bvunzo yekupisa yakatsanangurwa. |
| Warpage | Zvinhu zvisina kuenzana, kusaenzana kwemhangura kana kusaenzana kwekushomeka. | Kuyerwa kwebow/twist kwapera mushure mekuratidzwa zvinoenderana nemusangano. |
Ma voids uye nzara ye resin matambudziko akasiyana
Nzvimbo isina chinhu inzvimbo isina kuzadzwa; nzara haina kukwana kana kuti haina kufukidza resin panzvimbo imwe chete. Maitiro ekugadzirisa anogona kusiyana. Kuwedzera kwekumanikidzwa kunogona kusagadzirisa chinhu chisina resin, uye kuwedzera resin kunogona kusagadzirisa kusvibiswa. Zvikamu zvekutanga zvinofanirwa kuongororwa zvichienderana nemaitiro chaiwo pane kunyora kuti "hapana mavoids".
Delamination inogona kuonekwa mushure mekuungana
Bhodhi rinogona kutaridzika zvakanaka mushure mekugadzirwa uye rinogona kuparadzaniswa panguva yekuyerera kwemvura kana kupisa. Hunyoro, kugadzikiswa kusina kukwana, kusaenderana kwezvinhu uye kushushikana kwenzvimbo zvinogona kukonzera. Kurongeka uku kunofanirwa kutsanangura chero chinhu chinodiwa kana bvunzo yekupisa. Ona hurukuro inoshanda yekubvisa PCB paunenge uchiisa zvinodiwa.
Warpage inokanganisa RF geometry uye gungano
Zvinhu zvakagadzirwa nemhangura uye mhangura isina kuenzana zvinogona kukotama bhodhi. Warpage inogona kuchinja kukodzera kweconnector, BGA coplanarity uye saizi ye cavity. Dhizaini yacho inofanira kuenzanisa zvinhu nemhangura pazvinogoneka, uye timu ye assembly ingangoda rutsigiro. Ongorora miganhu ye warpage yePCB maererano ne assembly yekupedzisira, kwete bhodhi risina chinhu chete.
Kufanirwa kweHybrid Rogers Multilayer Usati Wagadzira
Paneri yekuedza inoruramiswa kana stackup iri itsva, tambo yekubatanidza ichikosha pamagetsi, mhangura inorema kana kuti isina kuenzana, kana bhodhi richisanganisa zvinhu nekufamba kwakasiyana. Muedzo unofanirwa kupindura mibvunzo yakatsanangurwa: ukobvu hwakagadziriswa, kuvharika, kunamira, kunyoreswa, kupindira, kupona kwekupisa uye kupwanyika.
Chirongwa chechikamu chidiki
Zvikamu zvinofanira kupfuura nepakati pemhando yepamusoro yemhangura, maburi akaiswa purasitiki uye nzvimbo dzekubatanidza. Nzvimbo imwe chete iri nyore inogona kusaratidza mamiriro akaipisisa. Dhirowa kana hurongwa hwemhando yepamusoro hunogona kuona nzvimbo dzemuenzaniso uye zvinodiwa zvekugamuchira maburi, kuratidzwa kwegirazi, kuzadza resin, ukobvu hwe dielectric uye kupaka.
Humbowo hwekupisa uye kuvimbika
Bvunzo inodiwa inoenderana nekushandiswa kwekupedzisira. Inogona kusanganisira solder-float, reflow simulation, thermal stress, IST kana cycling yemutengi. Highleap haifanirwe kuwedzera bvunzo isina chekuita chete kuti mushumo utaridzike wakazara. Humbowo hwakasarudzwa hunofanira kuratidza njodzi chaiyo yekuvakwa.
Impedance uye RF kuwirirana
Kana RO4450F ikagadzira dielectric inodzorwa, makuponi anofanira kuratidza core, bond line uye copper imwechete. Ukobvu hwakayerwa kubva ku microsection hunogona kuenderana ne impedance. Kune microwave structures, resonator yakatsaurirwa kana S-parameter coupon inogona kubatsira kupfuura TDR chete.
Musangano wenyaya yekutanga
Kana bhodhi riine mapakeji makuru eBGA, zvinobatanidza kana nhoo, kubatanidza kunogona kuratidza matambudziko ekupisa ayo bhodhi risina chinhu risingaratidze. Chinhu chekutanga chePCBA chinogona kusanganisira kuongorora solder, X-ray, bvunzo inoshanda uye kuenzanisa mativi. Shandisa hurongwa hwakatsanangurwa hwePCBA hwekuongorora chinhu chekutanga kana njodzi yekubatanidza lamination ne assembly dzichipindirana.
Zvinodiwa zveRO4450F zveKutenga, Kuchengeta uye RFQ
Mutengi anofanira kupa zvinhu chaizvo uye kuvakwa kwacho, macores anoenderana, stackup, copper, critical dielectric spacing, drill plan, finished thickness, surface finish, test requirements and test requirements. Highleap inosimbisa kuwanikwa kwezvinhu uye kana purojekiti ichida trial lamination. Zuva remuenzaniso rinopihwa chete mushure mekunge matanho estock nequalification anzwisiswa. Ongororo yeHighleap lamination inotarisa pakugoverwa kwe resin, layer registration uye final dielectric thickness mushure mekudzvanya. Hwindo reprocess rinofanira kuiswa kubva pakuvakwa kwacho nekuti bondply sarudzo haigone kuparadzaniswa nemacores ari pedyo ne copper layers. Makoshero chaiwo epfuma yezvinhu anofanira kuongororwa zvichienderana nemagwaro emutengesi aripo egiredhi rakatarwa uye kuvakwa kwacho.
- RO4450F chaiyo yakagadzirwa kana kuti magirazi akaita segirazi uye huwandu hwema ply;
- kufananidza Rogers laminates uye chero FR-4 kana zvimwe zvinhu zvakasanganiswa;
- kuunganidzwa kwapera uye ukobvu hwemutsara wekubatanidza hwakagadzirwa nechinangwa;
- huremu hwemhangura, kupararira kwemhangura uye ruzivo rwekuchekwa/kuburitswa kwemhangura;
- impedance, RF coupon, microsection uye zvinodiwa nekupisa;
- huwandu hwemuenzaniso nehuwandu, chitupa chezvinhu uye zvinodiwa pakutevedza;
- BOM, centroid, dhizaini yemusangano uye data rekuyedza kana PCBA ichidikanwa.
Zvinodiwa zvekuchengetedza zvinhu uye kugara kwenguva refu musherufu zvinoitwa zvichienderana nenhungamiro yemutengesi uye kudzorwa kwefekitori. Mutengo wekutengeserana unoratidza kutenga zvinhu, maturusi, muripo wekuyedza kana wekuongorora, kugadzira, kuunganidza, mitemo yekubhadhara uye kutumira. International express inogona kushandiswa kune akawanda ma prototypes; huwandu hwezvinhu zvinotumirwa zvinogona kushandisa sarudzo dzakabvumiranwa dzekutumira zvinhu kana dzekutakura zvinhu.
Mushure mekuendeswa, Highleap inogona kuongorora nyaya dzekuisa lamination kana kuunganidza zvinhu vachishandisa zvinhu, mapepanhau, kuongorora uye zvinyorwa zvemarobhoti. Matanho ekugadzirisa anofanira kunge akavakirwa pane zvakakanganisika zvakaonekwa uye zvakataurwa papurojekiti. Izvi zvinopa rutsigiro rwakakosha mushure mekutengesa kupfuura vimbiso yakakura yekuti bhodhi rega rega rehybrid rinoongororwa pasina mamiriro ezvinhu.
Mufambi wenhau anofanira kudzorwa seruzivo rwekugadzira
Kune RO4450F stackup inokodzera, zvinhu zvakawanda, layup orientation, ply count, press stages uye inspection zvinofanirwa kunyorwa pasi pemaitiro emufekitori. Mutengi haadi magadzirirwo emuchina chaiwo, asi kudzokorora maodha kunofanirwa kushandisa nzira imwecheteyo yekuvaka yakatenderwa uye inodzorwa. Kuchinja kwegirazi kana ply count kunofanira kukonzera ongororo.
Kuchengeta nekugadzirira zvinokanganisa kuenderana kwelamination
Zvinhu zvinosungana zvinofanira kuchengetwa uye kubatwa zvichienderana nenhungamiro yemutengesi. Nhoroondo yekuonekwa, kurongedza uye kugadzirira zvinogona kukanganisa kugadziriswa. Highleap inoongorora hunhu hwezvinhu zvinopinda uye inoshandisa manejimendi ekutonga ezvinhu zvakataurwa. Kana zvinhu zvakapihwa nemutengi zvikashandiswa, mamiriro azvo uye kuteverwa kwazvo zvinofanirwa kubvumwa zvisati zvagadzirwa. Mutengo we RO4460G2 multilayer bonding details unoda nzira yekuvaka yakatenderwa uye nzira yekudzvanya.
Kuboorera kunotanga mushure mekunge hybrid stack yagadzikana
Zvinhu zvakasiyana zvinogona kukonzera kupera kwezviboorwa nekusmear kwakasiyana. Kusarudzwa kwezvishandiso, kuwanda kwezviboorwa, uye desmear zvinofanirwa kuenderana nekugadzirwa kwekupedzisira kwehybrid. Chikamu chidiki chegomba chakaputirwa chinogona kusimbisa mamiriro einterface uye kuramba kwemhangura. Tambo yakanaka yekubatanidza yoga haigadzi kuti kubatanidza kwakaboorwa kwakavimbika.
Kukodzera kwegungano kunogona kuratidza kushushikana kwakavanzika kwelamination
Kudzokorodza, kusarudza kusungirira, kudzvanya uye kugadzirisa patsva zvinowedzera kushushikana kwekupisa kana kwemakanika. Panel yekuyedza inogona kupasa bvunzo isina bhodhi uye kuramba yakakombama kana kupatsanurana panguva yekuunganidza. Kana njodzi iri yakakura, sanganisira chinhu chekutanga chakaunganidzwa kana kuratidzwa kwekupisa kunoratidza usati waburitsa vhoriyamu.
Kuenzanisa kwekutengeserana kunoda kuvakwa kweply chaiyo
Makotesheni maviri eRO4450F anogona kusiyana nekuti anoshandisa magirazi akasiyana, kuverenga maply, goho rezvinhu kana kuongorora. Kumbira vatengesi kuti vadzose stackup yakarongwa. Mutengo wakaderera wakavakirwa pa resin shoma kana tambo yakasiyana yebond haisi chigadzirwa chimwe chete. Highleap inoratidza fungidziro idzi muchipo kuitira kuti kutenga kugone kuongorora musiyano wehunyanzvi nehwekutengeserana pamwe chete.
Ukobvu hwemutsara webond hunofanira kutorwa munzvimbo dzine zvadzinoreva
Chikamu chinopfuura nepakati penzvimbo imwe chete chingasamiriri nzvimbo ine chiratidzo chakawanda kana nzvimbo yakakura yemhangura. Hunhu hwemhando yacho hunogona kuratidza nzvimbo dzinoverengeka dzinoratidza kudiwa kwakanyanya kwe resin. Highleap nemutengi vanofanira kubvumirana kana kugamuchirwa kwacho kwakavakirwa pahuwandu hwenzvimbo, avhareji kana huwandu hwakatarwa.
Muripo weImpedance unofanirwa kutevera mhedzisiro yakamanikidzwa
Kana trial lamination ikagadzira stable bond line yakasiyana zvishoma nepakutanga, kugadziriswa kunodiwa kungave kugadzirisa trace controlled pane kumanikidza press kunze kwehwindo rayo rakagadzikana. Mutengi anofanira kubvumidza geometry yakagadziriswa. Kugadzikana kwekugadzira kunowanzo kukosha kupfuura kutsvaga ukobvu hwedzidziso kuburikidza nekuchinja kwakanyanya kwekumanikidza.
Kuwedzera zvinhu zvehybrid kunoda mukana wekunyoresa
Matinji akasiyana anogona kufamba zvakasiyana panguva yekukanda simbi. Kukura kwemifananidzo uye maturusi zvinofanira kuverengerwa mudungwe wese. Mhete dzakasimba dze annular uye kurongeka kwegomba zvinogona kuda jira rekuyedza. Highleap inoongorora zvinangwa zvekunyoresa isati yagamuchira dhizaini isingasiyi mukana wekufamba kwezvinhu.
Kudzokororwa kwemirairo kunofanirwa kureva kugadziriswa kwestackup kwakakodzera
Odha yekutenga inofanira kuratidza stackup chaiyo uye artwork yakatenderwa panguva yekugadziriswa. Kana ukobvu hutsva hwe laminate, foil kana RO4450F hukakurudzirwa, shanduko inoongororwa kuti ionekwe kuti yakakora sei, yazara sei, yakavharwa sei uye yakavimbika. Izvi zvinodzivirira kuti odha yakadzokororwa isave itsva isina kurongwa.
Nzvimbo dzekubatanidza uye dzebhokisi
Mabhodhi eHybrid RF anogona kuiswa muzvigadziko zvesimbi kana kutakura zvinobatanidza zvinoisa bhodhi. Kukombama uye kusimba zvinokanganisa kukwana. Kana Highleap ikapa gungano, madhirowa edzimba uye zvinodiwa zvekubatanidza zvinobatsira kuronga zvigadziriso nekuongorora. Kana mutengi akaungana kune imwe nzvimbo, zvirambidzo izvi zvinofanirwa kuverengerwa muRFQ isina bhodhi.
Zvinyorwa zvemhando yepamusoro uye mhinduro mushure mekutengesa
Highleap inogona kuchengetedza zvinyorwa zvemagetsi, zvekudzvanya, zvechikamu chidiki, zvemagetsi uye zvekubatanidza mukati mechirongwa chakabvumiranwa. Dambudziko rekubvisa kana divi rakataurwa rinoongororwa zvichienderana nezvinyorwa izvozvo uye muenzaniso wakadzoserwa. Maitiro ekugadzirisa akavakirwa pamaitiro. Iyi ndiyo nzira inoshanda yekusimbisa mhando uye mushure mekutengesa kwekuvaka kwakasarudzika kwebonding.
Nyaya yezvinyorwa: RO4450F chinhu cheRogers bonding. Gara uchishandisa data rechigadzirwa chazvino uye gwara rekugadzirisa kuti uwane chivakwa chaicho; chinyorwa chino hachitsananguri kutenderera kwekudzvanya kwepasi rose. Pakutenga, tsanangura basa rebondply, zvinhu zviri pedyo, ukobvu hwe dielectric, copper uye layer count. Izvi zvakakwana kuti uongorore nzira ye lamination uye utore PCB yakapedzwa yakawanda pane kuti utore zvinhu zve bonding zvakazvimiririra.
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Taconic RF 35 vs RO4350B PCB
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Kugadzirwa kwePCB yeTMM4 firita kunodzorwa ne...
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Nzira yekuwana sei quote yePCBs
Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
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- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.