Kugadzira PCB yeTMM13i

Kugadzira PCB yeTMM13i kwakagadzirirwa kuita ultra-compact RF geometry, uko kugoverwa kwekutsungirira kunogona kuva chikamu chebhajeti rekugadzira magetsi. Mubvunzo unobatsira wekugadzira ndewekuti ndeapi mativi akakosha uye kuti mativi iwayo achasimbiswa sei. TMM13i inoshandiswa kana microwave circuit ichifanira kuva diki uye mugadziri achida substrate ye thermoset inenge iri isotropic, ine thermoset yakawanda kwazvo yeDk. Chinhu ichi chinogona kudzvanya resonators, mafirita, ma patch antennas uye matching networks, asi mabhenefiti emagetsi anochinja pfungwa pakugadzira, datums, finish thickness uye production change control. Kana imwe high-Dk grade yakasiyana iri kuongororwa, TMM10i manufacturability consideration consideration review yakasiyana; magiredhi haafanirwe kutsiviwa pasina mvumo yekugadzira patsva.

Highleap Electronics inogadzira maPCB ichishandisa zvinhu zveTMM13i uye maPCB assemblies emacompact RF modules. Chivako ichi chinoonekwa sechinhu che microwave chakanyatsogadzirwa kupfuura bhodhi redunhu rakadhindwa.

Peji reTMM13i rinotarisa pakuvaka RF kudiki-diki uye kudzora shanduko dzekugadzira. Kana prototype yacho yabvumidzwa, kuvaka kwezvinhu zvakatenderwa, saizi dzakakosha, kupedzisa, nzvimbo dzekugara, uye nzira yekuyedza zvinofanirwa kuve zvinorehwa nekuvaka kwakadzokororwa.

Zvinochinja neTMM13i muUltra-Miniature RF Design

Kukwirira kwakanyanya kweDk kunoderedza wavelength inotungamirirwa uye kunoita kuti zvivakwa zvakapararira zvitore nzvimbo shoma. Maitiro anenge e-isotropic anobatsira apo electromagnetic field inotambanuka nemativi akati wandei uye inosangana neimba, cavity kana simbi iri pedyo. Chinochinja ndechekuti kukanganisa kudiki kunova chikamu chikuru chechinhu chekupedzisira.

Kushivirira kunofanira kugoverwa sebhajeti reRF

Kuchinja kwefrequency kana impedance kunogamuchirwa kunofanira kugoverwa pakati pezvinhu zvakaita seDk, ukobvu, etch, machining, finish, housing uye assembly. Kushandisa imwe chete generic PCB tolerance hakuratidzi kuti ndeipi variable iri kushandisa margin.

Chimiro chezvinhu: zita rechigadzirwa cheRogers rinoshandiswa kuratidza laminate yakatarwa yekuvaka PCB. Highleap Electronics inopa kugadzirwa nekubatanidzwa kwePCB, nepo laminate ichiwanikwa uye ichisimbiswa yoga.

Kugadzira Machining Nesimbi Zvakakwana zveTMM13i Modules

Mifananidzo yeRF, mutsetse wakarongwa, maburi, zvinhu zvekuisa uye imba zvinofanira kushandisa datum scheme yakafanana. Highleap inoongorora machining sequence kuitira kuti routing kana drilling isaparadze reference inodiwa kuti iongororwe gare gare. Zvinhu zvidiki zvinogona kuda rutsigiro rwakatsaurirwa uye kusarudzwa kwezvishandiso kuti zvirambe zvakanaka.

Mapedhi eBond uye mafinishe akasarudzwa

Mapedhi ewaya, nzvimbo dzinosungirirwa nesimbi uye zvinhu zvidiki zvekubatanidza hazvifanirwe kuwana magumo asina kutaurwa. Kupedzisa kunofanirwa kuenderana nenzira yekubatanidza, uye ukobvu hwayo hunofanira kuverengerwa mubhajeti rejometri. Kupedzisa kwakasarudzwa kunogona kuchengetedza zvivakwa zve-high-Q RF zvisina simbi isingakoshi uku zvichipa kubatana kwakakodzera kune dzimwe nzvimbo.

Nhungamiro yeHighleap yekubatanidza waya paPCB inobatsira kana TMM13i yava hwaro hwemodule ye microwave yakasanganiswa.

Zvipingamupinyi zveTembiricha, Dzimba uye Michina

TMM13i inogona kukwikwidzana nemidziyo yeceramic mune zvimwe zvigadzirwa zve microwave, asi haisi yekutsiva ceramic inodonha. Kuomarara kwemuchina, metallization, thermal conductivity, machining uye assembly zvinosiyana. Dhizaini yacho inofanira kuenzanisa module yese kwete Dk chete.

Kwakakodzera zvinhu zvacho

Mashandisirwo akajairika anosanganisira ma resonator madiki, mafirita e narrowband, ma compact patch antennas, ma matching networks uye ma microwave modules akasungirirwa zvakanaka. Chishandiso ichi hachina kukodzera zvakanyanya kana bandwidth yakakura uye geometry yakakura yekugadzira zvinhu zvichikosha kupfuura saizi. Sezvo resonator footprint ichiderera, ma tolerances ekugadzira ma high-Dk Rogers boards anova chikamu chebhajeti re tolerance emagetsi.

Kuti muenzanise zvakawanda nenzira dzeceramic, ona ceramic PCB vs organic PCB.

Kudzora Kuchinja Kwekugadzira kweTMM13i PCB

Kana Dr yakakwira zvikuru, kuchinja kudiki pakukora, mhangura, kupera kana kugadzira zvinhu kunogona kufambisa mhinduro yeRF. Saka chivakwa chakatenderwa chinofanira kuratidza chivakwa chaicho chezvinhu, saizi dzakakosha, kupera, chimiro cheimba uye data requalification. Chero chinotsiviwa chinofanira kuongororwa chichienzaniswa nemuenzaniso wakaburitswa.

Purogiramu yemuenzaniso uye yekufanirwa

Highleap inogona kupa mishumo yezvikamu zvekutanga, zvikamu zvepakati, bvunzo dzemagetsi uye RF correlation yakatsanangurwa nevatengi. Prototype, low-volume uye repeat production zvinogona kuteverwa ne component assembly kana bond, die-attach kana SMT process yatsanangurwa. Highleap inoongorora fine features, pad geometry, plated holes, metallization uye dimensional control yakatenderedza compact RF area. Nyaya yekutanga inofanira kugadzira rekodhi yezvikamu zvakakosha kuitira kuti repeat production ive ne measurement acceptance points. Magadzirirwo chaiwo ezvigadzirwa zvematerial anofanirwa kuongororwa zvichienderana nemagwaro emutengesi aripo egiredhi rakatarwa uye kuvaka.

Mibvunzo yeTMM13i

TMM13i ingori diki here yeTMM4? Kwete. Kuchinja kwakakwirira kweDk geometry, kushivirirana uye kudyidzana kwedzimba.

Kupedzisa kunogona kuchinjwa here mushure mekugadzirisa? Kuchinja kwekupedzisa kunogona kuchinja mapedhi madiki nemaburi, saka kunofanirwa kuongororwazve uye kusimbiswazve. Kune mutengo weTMM13i, ipa giredhi chaiyo, stackup, zvinhu zvidiki, ukobvu hwebhodhi, kupera, huwandu uye zvinodiwa zvekusimbisa RF. Mutengo unofanirwa kuratidza kunyatsojeka kwekuvakwa kwakaburitswa.