Mugadziri weTaconic TSM-DS3 PCB weThermally Stable RF Multilayers
Highleap Electronics inogadzira nekubatanidza maTaconic TSM-DS3 PCBs eradar, phased arrays, ATE, amplifiers, filters, aerospace RF, uye layers dzakawanda. Kotesheni iyi inotarisa pakuvaka kwakazara—TSM-DS3 cores, bonding material, pressed thickness, registration, drilling, plating, coupon, assembly, uye Environmental Acceptance—kwete kungoshandisa laminate datasheet chete.
TSM-DS3 Multilayer Build Scope paHighleap
Highleap inotsigira maRF multilayer akagadzirwa neTSM-DS3 ane TSM-DS3, anosanganisira PTFE kana mahybrid constructions, controlled impedance, sequential lamination, dense via structures, uye advanced interconnect structures pakati pema layer kana complete stackup yaongororwa. Mapaneru makuru, unjaired bond lines, thin dielectric spacing, uye RF-critical registration zvinoongororwa zvichienderana nekuvakwa chaiko kwete chati ye generic capacity.
Zvakakosha: Zvivakwa zveTSM-DS3 zvinogona kutsigirwa kubva kumasampuru einjiniya uye nzvimbo dzekuyedza kuburikidza nekugadzirwa kwehuwandu hwakadzokororwa. Mapurojekiti ane zvinodiwa zvinoda kupisa, chikamu, kuvimbika, kana kubatana anogamuchira ongororo yemaitiro asati asimbiswa nzira yekupedzisira yekuvaka.
Best fit
Radar ne phased arrays zvinonzwa tembiricha, maATE interface boards, high-layer-count RF, ma filters, amplifiers, uye aerospace electronics.
Chikanganiso chikuru
Kubata laminate yakasimba sevimbiso yekushanda zvakanaka kwechigadzirwa pasina kutsanangura mhangura, kubatana, kupisa, imba, kubatanidzwa, uye kuyedzwa.
Kugadzirwa kwezvinhu
Kusimbiswa kwezvinhu, kugadzira zvinhu zvakaunganidzwa uye mainjiniya ekubatanidza zvinhu, kugadzirisa PTFE, kuwedzera, kudzora impedance, ma via, kuunganidza, uye kusarudzwa kwevatengi.
Mashoko ekuwedzera pamutengo
Ruzivo rwepakati/prepreg, ukobvu hwakadzvanywa, RF uye miganhu yetembiricha, kuburikidza nechimiro, saizi, huwandu, pasuru yekubatanidza, uye chirongwa chekuyedza.
Kana TSM-DS3 iriyo RF Material iri nani
Taconic TSM-DS3 iPTFE laminate ine ceramic shoma, ine fiberglass reinforcement shoma. AGC inoburitsa nominal Dr ye3.0 ± 0.05, thermal conductivity inosvika 0.65 W/m·K, uye inosimbisa kugadzikana kwe dielectric pamusoro pekupisa. Kukosha kwayo kwekutengeserana hakusi kungo "kurasikirwa kwakaderera." Inongova musanganiswa weRF factorability, thermal behavior, reinforcement, uye multilayer suitability.
Sarudza TSM-DS3 kana
- chikamu, impedance, kana resonance zvinofanira kuramba zvichizivikanwa pakupisa;
- PCB yakakura, ine zvidimbu zvakawanda, kana kuti inoda michina yakawanda;
- radar, phased-array, amplifier, filter, kana ATE performance zvinoenderana ne repeatable dielectric spacing;
- Sisitimu yekubatanidza inoenderana nekuderedza kurasikirwa inogona kukodzera.
Sarudza chimwe chinhu kana
- Chinangwa chikuru ndechekushandisa antenna zvakanaka zvishoma;
- FR-4 yakajairika kana thermoset low-loss grade yatove inosangana nebhajeti rezvakatipoteredza uye remugero;
- dhizaini yacho haina tembiricha yakatsanangurwa kana chinodiwa chechikamu;
- Mutengi haakwanise kubvumidza kuvakwa kwepakati/prepreg kwakazara.
TSM-DS3 inowanzova yakakosha mushure mekunge mugadziri aona dambudziko resisitimu—chikamu chinoenderana nekupisa, kurira kusina kugadzikana, kunyoreswa pane panel hombe, kana RF multilayer yakaoma—kwete nekuda kwekuti chigadzirwa chinoshanda nefrequency yakakwira.
Kugona Kugadzira TSM-DS3 Multilayer
Highleap inogona kuongorora mabhodhi eRF akaomarara, magadzirirwo eTSM-DS3 akawanda, uye ma hybrid stackups. Mapurojekiti anogona kusanganisira fastRise 27 kana chimwe chinhu chakabvumidzwa chekubatanidza, sequential lamination, yakaputirwa nemaburi, ma blind kana laser-drilled structures, controlled impedance, uye turnkey assembly. Chinhu chimwe nechimwe chinosimbiswa zvichienderana nedhizaini chaiyo; hapana peji rezvinhu zvakajairika rinogona kuratidza huwandu hwema layer hunogona kuitika kana kuburikidza ne structure.
| Nzvimbo yekugadzira | Ongororo yeHighleap engineering | Sarudzo yemutengi inodiwa |
|---|---|---|
| Mutsetse wepakati newakabatana | Tarisa ukobvu hwepakati peTSM-DS3, mhangura, zvinhu zvinosunga, huwandu hweply, ukobvu hwakadzvanywa, kudiwa kweresin, uye symmetry. | Bvumidza kuunganidzwa kwekupedzisira uye chero shanduko yekuvaka inotengwa. |
| Kukura kwepaneru nekunyoresa | Ronga kufamba kwezvinhu, kuenzana kwemhangura, zvinangwa zvekushandisa, kutevedzana kwelamination, uye kunyoreswa kwelayer-to-layer. | Tsvaga kurongeka kwakakosha kweRF, maburi, ma arrays, ma connectors, uye makanical datums. |
| Kuboorera nekuputira | Tsanangura kuvhurwa kwePTFE, nzira yekuboorera, mhangura yemadziro emaburi, chiyero cheaspect, via-fill kana microvia stages, uye cross-section sampling. | Ipa kuburikidza nekirasi yekuvimbika uye chero chinodiwa che thermal-cycle kana IST. |
| Kudzora RF | Kuvharirwa kwemuenzaniso kubva pakuvaka chaiko uye chirongwa, resonator, insertion-loss, kana makuponi anoenderana nevatengi. | Taura parameter yekugamuchira, frequency, tolerance, uye nzira yekuyedza. |
| gungano | Ongorora zvinobatanidza zvine huremu hwakawanda, magaba ekudzivirira, nzvimbo dzinoshandiswa pakupisa, kudzoreredza mvura, rutsigiro rwebhodhi, kuchenesa, uye kuyedza kupinda. | Ipai BOM, dhizaini yemakanika, chigadzirwa chekuyedza, uye zvinodiwa zvakatipoteredza. |
Muenzaniso, kugadzirwa kwakaderera, uye kugadzirwa kwakadzokororwa zvinogona kutaurwa. Kuchinja kuenda kukugadzirwa kunoda kuzivikanwa kwezvinhu zvakachengetwa, kuvaka kwekudzvanya, kuwedzera data, uye zvinodiwa pakuburitsa; zvikasadaro chikamu chimwe nechimwe chinova kuyedza kutsva.
Zvinodiwa zveMagadzirirwo eKushanda kweRF paTembiricha Yakagadzikana
Mashoko ekuti "laminate inogadzikana nekupisa" haatsananguri mashandiro echigadzirwa. Mhinduro yebhodhi inokanganiswawo nekuwedzera kwemhangura, kushushikana kwemba, majoini esolder, zvinobatanidza, zvikamu, kufamba kwemhepo, uye kupararira kwekupisa. Saka RFQ inofanira kushandura zvinodiwa nezvakatipoteredza kuita zvinodiwa nebhodhi kana chigadzirwa.
Ipai zvinhu izvi zvemagetsi nekupisa
- tembiricha yekushanda nekuchengetedza;
- kubvumidzwa kwekuchinja kwe impedance, phase, kunonoka, resonance, kana insertion-loss pamusoro petembiricha;
- huwandu hwema frequency, simba remagetsi, duty cycle, uye manyuko ekupisa emunharaunda;
- reference-plane, connector, antenna, uye calibration structures;
- nzvimbo dzekupisa, zvinhu zvinotakura simbi, zvinoparadzira kupisa, torque yekumisikidza, uye zvirambidzo zvekuvhara;
- bvunzo yekupisa inodiwa, kuvhunduka, kutsva, kana kushanda kwayo;
- kubatana kwemakuponi nezvigadzirwa uye nzira yekubvisa embedding yemutengi.
Highleap inogona kugadzira zvinhu zvichipesana nezvinodiwa izvi, asi system-level RF uye thermal qualification zvinoramba zviri basa reinjiniya rakafanana. Mhedzisiro ye bare-board impedance patembiricha yemumba haigone kuratidza mashandiro e phased-array muhuwandu hwese hwekushanda.
Kuvaka TSM-DS3 ne fastRise 27 kana Zvimwe Zvishandiso zveBonding
MuPCB yeRF ine layer yakawanda, tambo yekubatanidza yakagadzirwa imhando yemagetsi. Ukobvu hwayo hunogadzirwa panguva yekuisa lamination uye zvinoenderana nekugadzirwa kwayo, huwandu hwemhangura, topography, kumanikidzwa, tembiricha, vacuum, saizi yepaneru, uye kuyerera kweresin. Ukobvu hwepepa risina kujekeswa hausi nzvimbo ye dielectric yakapedzwa.
- Simbisa kuti zvinoenderana. Simbisa zvinhu zvakasarudzwa zvekubatanidza neTSM-DS3 surfaces, copper treatment, process yekuporesa, nhoroondo yekupisa, nezvimwe zvinhu zviri pedyo.
- Mepu yekuda resin. Ongorora huwandu hwemhangura, nzvimbo dzakakura dzakajeka, maburi, nzvimbo dzinozadzwa nemhepo, uye kukwirira kwenzvimbo yacho.
- Isa zvinangwa zvekukora zvakadzvanywa. Shandisa zvivakwa zveply zviripo uye data rekugadzira pane kushandisa nhamba yemhando yepamusoro.
- Rongai lamination yakatevedzana. Verenga kutenderera kwega kwega kwekudhinda uye kuratidzwa kwekupisa kwezvikamu zvemukati, zvinhu zvakaputirwa, uye microvias.
- Kudzora kufamba kwezvikamu. Shandisa zvinangwa zvekuyera nekunyoresa zvichibva pane zvakazara zvekudhinda.
- Makuponi anowirirana. Iva nechokwadi chekuti coupon ine zvinhu zvakafanana, copper, press cycle, uye plating se functional circuit.
Kuti uwane rumwe ruzivo, ona Highleap's fastRise 27 prepreg uye RF via-design guide.
Mashandisirwo: Zvinogadziriswa Nechinhu Chiri Muchigadzirwa
Zvigadzirwa zvemagetsi zvePhased-array uye radar
Kushanda kweArray kunoenderana nekuenderana kwechikamu, mafambiro ekudyisa anodzokororwa, maitiro ekupisa, uye kunyoreswa kwepaneru hombe. TSM-DS3 inogona kutsigira zvinodiwa izvi kana mutengi achidzorawo mafambiro echinhu, zvinobatanidza, radome, calibration, uye magiraidi ekupisa echikamu chechigadzirwa.
ATE interface uye probe-card structures
Saizi huru yebhodhi, huwandu hwakawanda hwemachira, mavhavha akakora, kudzorwa kweimpedance, kusatana kwemechanical, uye thermal cycling zvinogona kuitika pamwe chete. Dhizaini yacho inofanira kutaura kuti ndeapi mativi uye nzira dzemagetsi dzinodzora kururama kwezvishandiso; kushandisa tight tolerances kwese kwese kunowedzera mutengo zvisingadiwi.
Ma amplifiers, mafirita, uye RF yemuchadenga
Kurasikirwa kushoma uye kugadzikana kwetembiricha kunogona kuderedza kudonha kwemvura, asi kuwanda kwesimba, pasi, kuvimbika kwemaburi akaputirwa, kuiswa kwemuchina, uye kuchena kwekubatanidza zvinhu kunoramba kuri kwakakosha. Laminate chimwe chezvikamu zvehurongwa hwekudzora.
Mazhinji eRF ane fomati hombe
Kusimbiswa uye maitiro ekushandisa zvinhu zvinogona kutsigira zvivakwa zvinoda mativi akawanda, asi copper balance, press sequence, panel scaling, drilling, uye assembly support zvinofanirwa kugadzirwa zvakanangana nehukuru hwebhodhi.
Zvinhu Zvinodiwa Nemari uye Nguva Yekutungamira
| Factor | Nei zvichikosha | Kudzora kwekutengeserana |
|---|---|---|
| Kuvaka kwepakati/kusati kwaitwa pamuviri | Ukobvu husingawanzoitiki, mapuru akawanda, kana mafirimu akakosha ekubatanidza anokanganisa kuwanikwa uye kutsanangurwa kwemuchina wekudhinda. | Bvumidza zvivakwa zviripo nekukurumidza. |
| Kuverengwa kwezvikamu uye kutenderera kwekudzvanya | Kutenderera kwakawanda kunowedzera kunyoreswa, kuzadzwa kwe resin, kuvimbika, uye njodzi yakakura. | Shandisa hunyanzvi hushoma hunosangana nezvinodiwa zvekufambisa uye zvekuparadzanisa. |
| Saizi yebhodhi uye kurongeka kweRF | Mapaneru makuru anoda kuyera, kutsigira, kudzora kutsetseka, uye kuongororwa kwakawanda. | Tsanangura datums dzinokosha uye kushivirirana kwechokwadi. |
| Mabhurugwa nema microvia | Kuboora neLaser, kuzadza, kurongedza zvinhu zvakatevedzana, uye kuvimbika kwemamakuponi zvinowedzera matanho ekuita. | Shandisa HDI chete kana zvichidikanwa ne breakout kana RF transition. |
| Kufanirwa kwekupisa/RF | Makamuri ezvakatipoteredza, zvigadziro, kuyera, kuongorora data, uye mienzaniso inodzokororwa zvinowedzera mari uye purogiramu. | Tsanangura bvunzo chaiyo yekugamuchira uye chirongwa chemuenzaniso. |
| Assembly yakaoma | MaBGA makuru, zvinobatanidza zvinodzvanywa, nhoo, zvinotakura, uye zvinopindirana nekupisa zvinogona kutonga mutengo wePCBA. | Tumira data rekuunganidza uye remakanika neRFQ isina bhodhi. |
Nguva yekushandisa zvinhu uye huwandu hushoma hweodha zvinofanirwa kuongororwa kuti zvionekwe kuti zvakagadzirwa sei chaizvo. Highleap haizotore mufananidzo unokurumidza kushandisa imwe stackup uye ichaendesa chigadzirwa kune chimwe chinyararire.
Zvekutumira Kuti Uwane TSM-DS3 Quotation
Ipai ukobvu hweTSM-DS3 chaihwo uye hurefu hwayo, mhando yemhangura nehuremu hwayo, zvinhu zvinosungirirwa, stackup yakazara, zvinangwa zvekukobvu zvakadzvanywa, tafura yeimpedance, huwandu hwefrequency, miganho yechikamu kana kurasikirwa, tembiricha yekushanda, kuburikidza nezvivakwa, zviyero zvakakosha zvekunyoresa, saizi yebhodhi nepaneru, kupedzisa kwenzvimbo, huwandu, fungidziro, chinangwa chekutumira, uye zvinodiwa zvemhando/bvunzo.
Kuti muunganidze, wedzerai BOM, centroid, mifananidzo, ruzivo rwechinobatanidza neshield, thermal interfaces, reflow ne cleaning limit, coating, test access, fixture information, Environmental profile, uye reporting tarisiro.
Zvinobatsira kubva kuHighleap ipakeji yesarudzo dzekugadzira: kuwanikwa kwezvinhu, kuunganidzwa kwakarongwa, nyaya dzekugadzira, mvumo yevatengi inodiwa, nzira yekushanda, humbowo hwekuongorora/kuyedza, zvinokonzeresa mari, uye njodzi dzinouya panguva yekutanga. Ndizvo zvinodiwa nemutengi kuti asarudze kana fekitari ichigona kuvaka chigadzirwa.
Mibvunzo Inowanzo bvunzwa Nezvekutengeserana
Highleap inogona kugadzira multilayer Taconic TSM-DS3 PCB here?
Ehe, mapurojekiti akakodzera eTSM-DS3 ane layer yakawanda uye hybrid anogona kuongororwa. Kugona kwekupedzisira kunoenderana nezvinhu zvekubatanidza, ukobvu hwakadzvanywa, huwandu hwe layer, saizi, kuburikidza nekugadzira, kunyoresa, kuunganidza, uye zvinodiwa pakuedza.
TSM-DS3 iri nani pane TLY-5 here?
Hazviwanzoitiki. TSM-DS3 inowanzo sarudzwa kuti igare zvakanaka uye igone kufanotaura zvakawanda; TLY-5 inokwezva kune antenna yeDk yakaderera uye antenna isina kurasikirwa zvakanyanya kana mmWave. Sarudza zvichienderana nezvinodiwa nechigadzirwa, kwete nekutarisa zviri nyore.
Ko fastRise 27 inogona kushandiswa sechinhu chekubatanidza here?
Inogona kukodzera zvivakwa zvakabvumidzwa, asi zvinoenderana, huwandu hweply, kudiwa kweresin, ukobvu hwakadzvanywa, kutenderera kwekudzvanywa, uye nhoroondo yekupisa inofanira kuongororwa kuti iite stackup yese.
Miedzo ipi inogona kubatanidzwa?
Zvichienderana neprojekti, mutengo unogona kusanganisira bvunzo yemagetsi, kuongororwa kwehukuru hwakakosha, microsection, impedance, resonator kana phase coupons, thermal cycling, AOI/X-ray, functional test, kana bvunzo yeRF yakatsanangurwa nevatengi.
Mutengo unotsanangurwa sei?
Mutengo unoenderana nekuvakwa kwezvinhu, saizi yebhodhi, huwandu hwezvikamu, mashandisirwo ekudhinda, chimiro, kushivirira kwakakosha, huwandu, kuoma kwekubatanidza, uye humbowo hweRF hunodiwa kana humbowo hwezvakatipoteredza. Tumira data rese kuti uwane mutengo wekambani.
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Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
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- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.