High-Speed PCB Via Processing Techniques
Vias zvinhu zvakakosha mu-multi-layer PCBs, inoshanda seyakakosha magetsi ekubatanidza pakati pematanho akasiyana. Sezvo kudiwa kwekukurumidza, kwakavimbika PCBs kunowedzera, kunyanya mu-high-speed uye high-frequency applications, nzira dzinoshandiswa kugadzirisa vias dzave dzakanyanyisa uye dzakasiyana-siyana. Sarudzo ye kuburikidza nekugadzirisa inogona kuve nemhedzisiro yakakura pakuita, kuvimbika, uye kugadzira. Muchinyorwa chino, isu tinoongorora kiyi kuburikidza nekugadzirisa matekiniki anoshandiswa mune yazvino-yekumhanya maPCB uye tiongorore mabatiro avanoita dhizaini nekuita.
Via Soldermask Kuvhura
Imwe yeakareruka kuburikidza nekugadzirisa matekiniki ari kusiya iyo via pad pachena, nzira inozivikanwa sepa soldermask kuvhura. Iyi tekinoroji inosanganisira kugadzira soldermask kuvhura pamapadhi, ichisiya mhangura iri pachena. Kunyange zvazvo nzira iyi yakanyatsojeka, inowanzoshandiswa kune chaiyo mamiriro ezvinhu akadai apo iyo vias inoda kuongororwa kana kuyerwa zvakananga. Semuyenzaniso, kana uchiita macheki ekuongorora kana kuyedza magetsi, zvakakosha kuti uwane mukana wakananga kune padhi.
Zvisinei, nzira iyi inouya nekutengeserana-offs. Kufumura mhangura kuburikidza nemapadhi pasina chero dziviriro kunogona kutungamira mukuora kana oxidation, kunyanya mumadhizaini ekumhanya. Muzvishandiso uko kuchengetedza chiratidzo chekuvimbika kwakakosha, senge muRF kana yakakwirira-frequency maseketi, kufumura vias kazhinji hazvikurudzirwe. Kusavapo kwekuvhara soldermask kunowedzera mikana yekukanganiswa kwemagetsi (EMI) uye kuderedzwa kwechiratidzo nekufamba kwenguva.
Via Yakafukidzwa neSoldermask
Muzhinji PCB magadzirirwo, kunyanya ayo anoda kugadzikana magetsi ekushanda, vias akafukidzwa soldermask. Izvi zvinosanganisira kuisa soldermask pamusoro peiyo pad kudzivirira kuti isaonekwe kune zvekunze zvinhu. Chivharo chinobatsira kudzikisira njodzi yetsaona zvikabudura kana zvisingadiwe kubatana pakati vias uye zvakatenderedza zvikamu.
Iyi nzira inowanzoshandiswa mumhando dzakasiyana-siyana dzekushandisa, kubva pamabhodhi ematunhu kusvika kune mamwe maitiro akaoma. Inonyanya kushanda mukuona kuparadzaniswa kwemagetsi uye kuderedza mukana wekukanganiswa kwechiratidzo. Nekudaro, nepo soldermask ichipa chidziviriro, iyo kuburikidza padhi pazasi inoramba yakavharirwa, uye mhangura yakavharwa kubva pakusangana yakananga nekunze.
Zvakakosha kurangarira via dhayamita paunenge uchishandisa nzira iyi-kazhinji, vias ane dhayamita yakakura kupfuura 0.5mm anogona kupa matambudziko pakuona yakachena uye inoshanda soldermask Anwendung. Yakakura vias ingada mamwe matanho kuti ave nechokwadi chekuti soldermask kuvhurwa kwakanyatso kurongeka uye kuti hapana magapu asingadiwe anoramba ari mukugadzira.
Via Yakazadzwa neSoldermask
Mune zvimwe zviitiko, iyo via haina kungofukidzwa ne soldermask, asi yakazara yakazara nezvinhu. Iyo via yakazadzwa ne soldermask nzira yakagadzirirwa kupa mhinduro yakasimba, kunyanya kana PCB ichida kumwe kugadzikana uye kutendeseka kwemuchina. Nekuzadza zvizere via ne soldermask, unotoisimbisa, kudzivirira chero solder kuti irege kuyerera ichipinda mukati meiyo solder process. Izvi zvinoita kuti iyo via irambe yakavharirwa zvizere uye inodzivirira mukana we solder wicking mugomba.
Mabhenefiti eiyi nzira anooneka mu-multi-layer PCBs uye yakakwirira-density magadzirirwo, apo vias inoda kuvharwa zvakavimbika kudzivirira kubatana kusingadiwi. Mune zvikumbiro izvi, iyo vias yakazadzwa inopa yakachena gungano kwacho uye inogona kubatsira nekupisa utariri, kunyangwe paine zvisingakwanisi maererano nehukuru hwemavhairasi hunogona kunyatsozadzwa. Kune vias hombe kupfuura 0.5mm, kuve nechokwadi chekuzadzwa kwakakwana kunogona kuwedzera kunetsa, uye voids kana mapundu anogona kuramba aripo, izvo zvinogona kutungamira kuzvinhu zvekuvimbika.
Via Yakazadzwa neResin
Kune mamwe madhizaini akaoma uye akavimbika, kunyanya kana uchibata nemapofu (aya asingaendi nzira yese kuburikidza nePCB), kuzadza resin kunowanzodikanwa. Iyi tekinoroji inoshandisa epoxy resin kuzadza iyo via, ichipa kugadzikana kwemichina uye kudzivirira delamination panguva yePCB lamination process. Resin-yakazadzwa vias zvakare inovimbisa zvirinani soldering mhando, kunyanya kana vias ichidhiriwa pane solder pads, uko kutadza kunyatsozadza vias kunogona kutungamirira kune hurombo solder majoini uye kukanganisa magetsi kubatana.
Nepo resin-yakazadzwa vias inosimudzira iyo mechanic kusimba kwePCB, ivo vanowedzerawo dura redziviriro kubva pakuyerera kwezvinhu panguva yelamination. Nekudaro, iyi nzira inounza dambudziko rekupisa. Resin, ichiri kushanda pakugadzikana kwechimiro, haipe iyo yekupisa inodiwa kune yakakwirira-simba maapplication, uye inogona kuwedzera kupisa kwemafuta mune mamwe madhizaini. Izvi zvinonyanya kukosha mumashandisirwo emagetsi epamusoro-soro, akadai seanowanikwa mumagetsi emotokari, uko kubata kupisa zvakanaka kwakakosha.
Via Yakazadzwa neCopper Paste
Iyo via yakazadzwa nemhangura paste nzira inonyanya kukosha mukushandisa uko zvese zvinopisa manejimendi uye kutendeseka kwechiratidzo kwakakosha. Pano, iyo via inozadzwa nemhangura paste mushure mekunge madziro akaputirwa. Iyo mhangura paste inovandudza iyo kuburikidza neiyo thermal conductivity, ichiita kuti ive yakakodzera kune yakakwirira-simba masisitimu akadai se5G maseketi, mota dzemagetsi, uye yakakwirira-frequency masisitimu ekutaurirana.
Mhangura-yakazadzwa vias akagadzirirwa kubata yakakwirira currenti uye kupisa dissipation. Iyo yekupisa conductivity yemhangura paste yakakwira zvakanyanya kupfuura resin kana soldermask, zvichiita kuti ive sarudzo yepamusoro kana kubata kutonhora kwakanyanya kwakakosha. Maitiro aya anobatsirawo kune yakakwira-kumhanya chiratidzo kutendeseka nekuti yakawedzerwa mhangura inobatsira kudzikisa impedance uye chiratidzo chekuratidzira, izvo zvinogona kukanganisa mashandiro mune zvine hunyoro zvikumbiro.
Imwe yematambudziko nemhangura paste yekuzadza ndeye kuve nechokwadi chekufanana mukuita kwekuzadza. Kuzadza kana kudzikisa iyo via kunogona kukonzera kusavimbika kubatanidza kana kupisa kusina kunaka. Pamusoro pezvo, iyo Via's surface inofanirwa kukwenenzverwa panguva yekugadzira kudzivirira ma voids kana hurema hunogona kukanganisa kutendeseka kwemuchina uye mashandiro ekupisa.
Misiyano Pakati peEshanu Via Hole Magadzirirwo Nzira
Via Yakavharwa neSoldermask vs. Via Yakazadzwa neSoldermask
Musiyano mukuru pakati peidzi nzira mbiri uri pahupamhi hwemasolder mask coverage. Via yakafukidzwa ne soldermask inosanganisira kuisa soldermask pamusoro pepadhi yenzira, ichisiya imwe nzira iri pachena. Izvi zvinopa kuvharika kwekutanga, kuve nechokwadi kuti padhi yakadzivirirwa kubva kune zvinosvibisa uye kuderedza njodzi yemapfupi maseketi. Kune rimwe divi, kuburikidza nekuzadza ne soldermask kunosanganisira kuzadza iyo via ne soldermask, kunyatsovhara gomba rese. Izvi zvinogadzira chitarisiko chisina kujeka uye chinogona kudzivirira solder kubva mukuyerera ichipinda mukati panguva yekuungana, ichivandudza kusimba kwePCB uye kushanda kwayo.
Via Yakavharwa neSoldermask vs. Soldermask Kuvhura
Via yakavharwa ne soldermask inoreva iyo soldermask application iyo inovhara zvizere solder pad yeVia, ichidzivirira kubva kune ekunze zvinhu. Kusiyana neizvi, kuvhura kwe soldermask kunosiya solder pad ye via pachena nekusaivhara ne soldermask. Iyi nzvimbo yakafumurwa inobvumira kumwe kurapwa kwepamusoro, senge tin plating, iyo inogona kuita kuti via padhi ive yakanakira pamusoro-mould soldering kana yekubatanidza. Nepo soldermask kuvhura inofambisa nyore gungano mune zvimwe zviitiko, inowedzera njodzi yekusvibiswa kana mapfupi maseketi kana isina kunyatso dzorwa.
Via Yakavharwa neSoldermask Kuvhura vs. Via Yakazadzwa neSoldermask
Via yakavharwa nesoldermask kuvhura inosiya iyo via pad pachena, ichibvumira mwenje kuti upfuure nepaburi, izvo zvinogona kubatsira pakuona kuona kana zvimwe zvinangwa zvekuyedza. Nekudaro, iyi nzira haina kunyatsosimbisa iyo via. Via yakazadzwa ne soldermask, nekusiyana, inosanganisira kuzadza iyo yose ne soldermask, kunyatsovhara gomba uye kugadzira iyo kuburikidza isina-translucent. Iyi nzira inowanzofarirwa mumagadzirirwo apo kudzivirira kusvibiswa kana kudzivirira iyo via kubva kune solder wicking kwakakosha.
Via Filled with Resin vs. Via Filled with Copper Paste
Musiyano wekutanga uripo pakati pekuzadzwa neresin uye kuburikidza nekuzadzwa nemhangura paste uri mune izvo zvinoshandiswa uye zvavanoda mashandisirwo. Via yakazadzwa neresin inoshandisa epoxy resin kuzadza iyo via, izvo zvinowanzoitwa mumabofu vias kudzivirira delamination panguva yelamination. Iyi nzira inoshanda pakuchengetedza kuvimbika kwechimiro asi haibatsiri zvakanyanya pakupisa kupisa. Kusiyana neizvi, kuburikidza yakazadzwa nemhangura paste inoshandisa yakakwirira-inopisa conductivity yemhangura paste kuzadza iyo via, izvo zvakakosha kune yakakwirira-inoshanda PCB inoda zvirinani kutonga kwekupisa. Copper paste ine high thermal conductivity coefficient (8 W/m·K), zvichiita kuti ive yakanaka kune-high-power kana high-frequency applications uko kunenge kuchinetsa kutonga kwekupisa.
Kuenzanisa kweVia Processing Methods

Mainjiniya vanowanzo simbisa nyaya iyi pamwe chete nekugadzirwa kwePCB yelaminate ine low-loss uye AlN nealumina PCB pavanenge vachigadzira PCB kana PCBA yakavimbika.
mhedziso
Mukugadzirwa kwePCB inomhanya zvakanyanya uye ine frequency yakakwira , kugadziriswa kwevias kunoita basa rakakosha mukuona kuti inoshanda zvakanaka. Nzira yega yega yekurapa kuburikidza nevias inopa mabhenefiti akasiyana uye kufunga nezvayo, uye kusarudza nzira chaiyo zvinoenderana nezvinodiwa zvekushandisa. Kunyangwe chinangwa chiri pakupatsanurwa kwemagetsi, kusimba kwemuchina, kuvimbika kwechiratidzo, kana kutonga kwekupisa, kunzwisisa simba nemiganhu yeimwe neimwe kuburikidza nekugadzira nzira kwakakosha.
Kune mainjiniya anoshanda nemaPCB anomhanyisa, zvakakosha kuti unyatso ongorora zvinodiwa neprojekiti usati wafunga nezve nzira yekurapa. Semuyenzaniso, maapplications epamusoro-simba anogona kubatsirwa kubva kune copper paste-filled vias, nepo akawanda-layer, akakwirira-density madhizaini anogona kukoshesa kuburikidza nekuzadza ne soldermask kuitira nyore kuungana. Chero zvazvingava, kusarudza iyo chaiyo kuburikidza nenzira kwakakosha pakuona kuvimbika kwenguva refu uye kuita kwePCB yakapera.
KuHighleap Electronic, isu tine hunyanzvi mukugadzira maPCB anoshanda zvakanyanya akagadzirirwa kuzadzisa zvinodiwa zveprojekiti yega yega. Nehunyanzvi hwedu mukugadzira zvinhu zvemhando yepamusoro uye kugadzira maPCB , tinova nechokwadi chekuti zvese zvedhizaini yenyu zvakagadziridzwa kuti zvishande zvakanaka uye zvigone kugadzirwa. Taura nesu nhasi kuti tikuudzei kuti tingabatsira sei kuunza purojekiti yenyu inotevera yePCB inokurumidza.
FAQs
1. Chinangwa chekushandisa kuburikidza ne soldermask kuvhura muPCB kugadzira?
Via soldermask kuvhurika kunowanzo shandiswa kana yakananga kuwana via inodiwa pakuyedza kana kuyerwa zvinangwa. Nekudaro, zvinouya nenjodzi senge solder bridging kana solder wicking padhuze neSMT pads, izvo zvinogona kutungamira kune mapfupi maseketi panguva yegungano. Iyi nzira inoshandiswa zvakanyanya mukugadzira prototype uko kuyedzwa kwakakosha.
2. Sei kuburikidza akafukidzwa soldermask kuwedzera PCB kuvimbika?
Via yakavharwa ne soldermask inodzivirira yakafumurwa vias kubva pakukonzera mapfupi maseketi kana electromagnetic interference (EMI) nekuona kuti via's pad yakavharwa zvizere. Nekudaro, kana iyo via dhayamita ichipfuura 0.5mm, kuwana yakakodzera soldermask kufukidzwa kunogona kuve kwakanetsa, zvichitungamira kune anogona kuvhara mapeji.
3. Ndeapi matambudziko ane Via yakazadzwa ne soldermask?
Via yakazadzwa ne soldermask inosimbisa iyo via kudzivirira solder kubva mukuyerera mukati mayo, kuvandudza simba remakanika uye kusimba kwenguva refu. Nekudaro, kuzadza hombe vias (kupfuura 0.5mm) kunogona kuve kwakaoma, sezvo kuzadza kusina kukwana kunogona kuitika, zvingangokanganisa kuita kana kutendeseka kwechimiro.
4. Ndepapi paunofanira kushandisa kuburikidza nekuzadza neresin muPCB kugadzira?
Via yakazadzwa neresin inowanzo shandiswa mumabofu vias kudzivirira delamination panguva yelamination uye kunatsiridza solderability. Kunyange ichishanda kuchengetedza kutendeseka kwechimiro, resin ine yakadzika yekupisa conductivity pane zvimwe zvinhu, izvo zvinogona kukonzera nyaya mu-high-simba maapplication.
5. Ndezvipi zvakanakira kushandisa via fill with copper paste?
Via yakazadzwa nemhangura paste inokwidziridza conductivity uye chiratidzo chekuvimbika, zvichiita kuti ive yakanaka kune yakakwirira-frequency kana yakakwirira-simba maapplication. Nekudaro, inzira yakaoma uye inodhura, inoda kunyatso kunyorera kudzivirira nyaya senge thermal hotspots kana kusaita zvakanaka, zvichiwedzera kumutengo wakazara uye nguva yekugadzira.
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Nzira yekuwana sei quote yePCBs
Rega timhanyire DFM/DFA ongororo yako uye tidzokere kwauri neshumo.
Unogona kurodha mafaera ako zvakachengeteka kuburikidza newebhusaiti yedu.
Isu tinoda ruzivo rwunotevera kuti tikupe iwe quote:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Pamusoro pekugadzira PCB, isu tinopa huwandu hwakakwana hwemagetsi masevhisi, anosanganisira PCB dhizaini, PCBA (Yakadhindwa Circuit Board Assembly), uye turnkey mhinduro. Kunyangwe iwe uchida rubatsiro neprototyping, dhizaini yekusimbisa, kutsvagisa chikamu, kana kugadzirwa kwakawanda, isu tinopa yekupedzisira-kusvika-kumagumo rutsigiro kuti uve nechokwadi chekubudirira kweprojekiti yako. Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.
