Chii chinonzi waya bonding paPCB?

Chii chinonzi Wire Bonding?

Wire bonding inzira yakakosha mukugadzira semiconductor yekubatanidza maseketi akasanganiswa (ICs) kumidziyo yemagetsi uye pakati pePCB. Iyo inomira kunze kwekudhura kwayo-kushanda uye kusimba mukuita majoini. Uchishandisa nzira dzewelding uye hunyanzvi hwakasiyana, kusungirirwa kwewaya kunosanganisira kunyatso batanidza waya dzesimbi kumachipi, zvinoda hunyanzvi hwetekinoroji kuti ive nechokwadi chekubatanidza uye kwakasimba. Iko kushanduka kwekubatanidzwa kwewaya kwakagadzirisa zvisingakwanisi zvekare solder bonding nzira, kuwedzera kuvimbika uye kushanda kwema semiconductor systems.

Kusunga waya kunoshandura zvinodiwa nePCB maererano nekupedzwa kwepedhi, kuchena, kubviswa kwegomba, uye kubata mapakeji, saka zvinofanira kutsanangurwa pamwe chete nekusarudza kupedzwa kwepamusoro pePCB uye, kune zvishandiso zvinopenya zvakanaka, kudzora kwepamberi kwekubatanidza mapakeji.

Ndeapi mashandisiro?

Mobile Phones

Mukugadzira nharembozha, kusungirira waya, kunyanya kumabhatiri emapaketi, kunopa zvakanakira pamusoro pechinyakare nzvimbo welding. Iyi tekinoroji, uchishandisa ultrasonic simba, inogonesa hukama hwakavimbika uye husina kukuvadza pakati pemasero ebhatiri, kuwedzera hupenyu hwebhatiri uye kushanda. Iyo inogadzirisa zvipimo zvenzvimbo welding, senge ingangoita mapfupi maseketi uye yakashata mhedzisiro yebhatiri manejimendi system (BMS) nekuda kwekupisa kwakanyanya uye yakasununguka yakabatana, ichiita waya yekubatanidza sarudzo yakasarudzika yekuunganidza mabhatiri mapaketi muindasitiri.

Automotive

Mumotokari dzemagetsi, kusungirirwa kwewaya kunoshandiswa mumabhatiri manejimendi masisitimu kubatanidza masero ebhatiri ega ega, kuve nechokwadi chekugovera simba uye manejimendi.
Kumotokari yemagetsi bhatiri pack, kubatanidza cylindrical maseru kune bhasibha mumabhatiri kunosanganisira maitiro akasiyana sewaya bonding, laser welding, uye spot welding. Wire bonding, uchishandisa ultrasonic simba, inoumba yakasimba atomic bond nekubvisa iyo oxide layer paaluminium, ichiwedzera kuvimbika kwekubatana. Iyi nzira inonyanya kubatsira pakugadzirisa maitiro kuburikidza nekusimudzira iyo yekuzvimisikidza yealuminum oxide, kuve nechokwadi chekufambisa maerekitironi kwekubatana kwakasimba.

Midziyo yekurapa:

Kune ma pacemaker, waya yekubatanidza inobatanidza dhizaini yekudzora dhizaini kune yayo sosi yemagetsi uye yekunzwa maelectrodes, yakakosha pakushanda kwakavimbika. Mumidziyo yekurapa, kusungirirwa kwewaya kwakakosha pamidziyo inoisirwa senge pacemaker uye defibrillators. Midziyo iyi inotsamira pawaya bonding yekubatanidza iyo silicon chip mukati memudziyo kune yayo sosi yemagetsi uye inobuda materminal. Izvi zvinoita kuti mudziyo utarise rhythm dzemoyo nemazvo uye kuendesa mapoinzi emagetsi pazvinenge zvichidikanwa, nekuvimbika uye nemazvo zvakakosha kuti murwere achengetedzeke uye hupenyu hurefu hwechishandiso.

Aerospace:

Mumasetellite, kubatanidza waya kunoshandiswa kubatanidza solar cell arrays kune masimba ekutonga masisitimu, yakakosha pakupihwa kwemagetsi munzvimbo dzemuchadenga. Mumuchadenga, kubatanidza waya kunoshandiswa mumasevhisi masisitimu, kunyanya kubatanidza solar panel kune simba rekutonga system. Izvi zvinogonesa kufambiswa kwesimba kubva kune solar panel kune masisitimu esatellite, zvakakosha pakushanda kwenguva refu kwesetiraiti munzvimbo ine hutsinye hwenzvimbo umo kuvimbika uye kusimba kwakakosha.

Panyaya dzesarudzo dzekugadzira dzine chekuita neizvi, Highleap inonyorawo rutsigiro rwekugadzira zvemagetsi uye zvikamu zvebhodhi redunhu , izvo zvinogona kubatsira kudzivirira manotsi asina kujeka mupakeji yekotesheni.

Advantage ye wire bonding

Kururamisa kwezvikamu zviduku.
Yakakwira yekubatanidza density pasina imwe PCB nzvimbo.
Kuderedza kushushikana kwekushisa pazvikamu zvakakosha.
Kuvimbika kwakakwidziridzwa kwepamusoro-kuita maapplication.
Yakanakira kubatanidza ICs zvakananga kune mumwe nemumwe kana kuPCB munzvimbo dzakasimba.

Chinangwa chikuru chekubatanidza waya muhunyanzvi tekinoroji, kunyanya munzvimbo ye-high-frequency PCB application (pamusoro GHz), ndeyekuvimbisa hukama hwakavimbika uye hwakasimba pakati pemachipisi uye zvinobatanidza. Izvo zvakakosha pakuchengetedza kutendeseka kwemasaini uye voltage pulses yakakosha mumagetsi emazuva ano. Wire bonding inotsigira chaiyo-nguva kutaurirana pakati pezvikamu, kuderedza kukanganiswa kwechiratidzo uye kufambisa kukurumidza kufambisa data. Izvi zvinoita kuti ive yakakosha muzvikamu zvakaita seEV kugadzira, uko kuita uye kuvimbika kwakakosha.

Nzira dzekubatanidza waya

• Thermosonic Bonding: Inosanganisa kupisa, ultrasonic simba, uye simba rekubatanidza waya, kazhinji goridhe kana mhangura, kune substrate. Ndiyo nzira yakajairika, inoshandiswa zvakanyanya mu semiconductor packaging.
• Ultrasonic Bonding: Inoshandisa ultrasonic vibrations pasina kushandisa kupisa kwekunze (kana kushoma kupisa) kusungira mawaya ealuminium, yakanakira zvinhu zvinonzwisisika.
• Thermocompression Bonding: Inovimba nekupisa uye kumanikidza kuzadzisa chisungo, pasina ultrasonic simba, yakakodzera kune chaiwo maapplication uko ultrasonic vibrations inogona kukanganisa.

Zvinhu zvakajairika zvinoshandiswa mukubatanidza waya

• Goridhe (Au): Inofarirwa kune yakanakisa conductivity, corrosion resistance, uye ductility, zvichiita kuti ive yakakodzera thermosonic bonding.
• Aluminium (Al): Inoshandiswa zvakanyanya kune yayo yakanaka magetsi conductivity uye yakaderera mutengo, yakakodzera kune ultrasonic uye thermocompression bonding.
• Mhangura (Cu): Inopa yepamusoro yemagetsi uye yekupisa conductivity ichienzaniswa nealuminium uye iri kuwedzera kushandiswa kwesimba rayo remuchina, kunyangwe ichida kunyatsobata nekuda kweoxidation.

Zvinhu zvakajairika zvinoshandiswa mukubatanidza waya

• Goridhe (Au): Inofarirwa kune yakanakisa conductivity, corrosion resistance, uye ductility, zvichiita kuti ive yakakodzera thermosonic bonding.
• Aluminium (Al): Inoshandiswa zvakanyanya kune yayo yakanaka magetsi conductivity uye yakaderera mutengo, yakakodzera kune ultrasonic uye thermocompression bonding.
• Mhangura (Cu): Inopa yepamusoro yemagetsi uye yekupisa conductivity ichienzaniswa nealuminium uye iri kuwedzera kushandiswa kwesimba rayo remuchina, kunyangwe ichida kunyatsobata nekuda kweoxidation.

Iyo nzira yekubatanidza waya

• Bhora Kuumbwa: Bhora diki rinoumbwa kumagumo kwewaya uchishandisa murazvo kana kubuda kwemagetsi.
• Kurongeka: Waya inowirirana nepedhi yekubatanidza pane chip kana substrate.
• Bonding: Bhora rinodzvanywa padhi uchishandisa kupisa, ultrasonic simba, kana zvese zviri zviviri.
• Loop Formation: Iyo waya inosungirirwa kune inotevera chisungo poindi kuchengetedza kuchinjika uye kuderedza kushushikana.
• Chechipiri Bond Formation: Waya inosungirirwa kune inotevera padhi, uye waya yakawandisa inogurwa.

Dambudziko rekubatanidza waya

Kunzwisisa mashandisirwo uye zvakatipoteredza zvinhu kwakakosha kune waya bhondi kuvimbika. Zvinhu zvakaita senge tembiricha yakakwira, humidity, uye tembiricha kuchovha bhasikoro zvinogona kukonzeresa kutadza nekuda kwenyaya dzakaita senge intermetallic compound formation, corrosion (kusanganisira galvanic corrosion muAu-Al systems), uye thermomechanical stress kubva kuCTE mismatches. Aya matambudziko anoda kunzwisisa kwakazara kwesimbi masisitimu uye kukanganisa kwezvakatipoteredza kuti uwedzere kusimba kwewaya bond uye kushanda.