Maitiro Ekugadzira PCB Ezvikamu gumi kubva kuDFM kusvika pakuongororwa

Bhodhi redunhu rakadhindwa rine zvidimbu gumi rinogadzirwa kuburikidza nehurongwa hwakarongwa umo mashandiro ese anokanganisa rinotevera. Kubhadharwa kwemabasa ehunyanzvi mukati mechikamu kunokanganisa kunyoreswa mushure mekuiswa kwesimbi; kuisirwa kwesimbi kunosarudza ukobvu hwe dielectric uye kurongeka kwekuboorwa; kuboorwa uye kuchekwa kwesimbi kunokanganisa kunamatira kwemhangura; kuputira kunochinja geometry yemuchina wekufambisa; uye bvunzo dzekupedzisira dzemagetsi nedzechimiro dzinoona kana maitiro akaunganidzwa akaramba ari mukati mehwindo rekugadzira rakaburitswa. Kubata mabasa aya sekutarisa kwakazvimirira kunovanza chokwadi chakakosha chekugadzira: kuwanda kwezvikamu zvakawanda kunogadzirwa nekutarisira ma interfaces pakati pematanho.

Chinyorwa chino chinotsanangura maitiro akajairwa ekugadzirisa zvinhu zvine mativi gumi, chobva chatsanangura kuti HDI, rigid-flex, mixed-material uye special-feature constructions zvinosiyana papi. Hachiratidze tembiricha imwe chete yekudhinda, kumhanya kwedhiri rimwe chete kana chirongwa chimwe chete chekutora sampling, nekuti ma parameter iwayo anoenderana nehurongwa hwezvinhu zvakasarudzwa, board geometry, specification yechigadzirwa uye maitiro efekitari akakodzera. Mufambi wepurojekiti anogadzirwa mushure mekuongorora kweDFM uye anova murairo wekutonga wekugadzira.

Highleap Electronics inopa kugadzirwa kwePCB dzine layer yakawanda , asi mutengi nemugadziri vanofanira kutsanangura pamwe chete stackup yakaburitswa, tolerances, kuburikidza nemaumbirwo, kirasi yekugamuchira uye magwaro. Ongororo yakakura yePCB ine layer gumi inotsanangura sarudzo dze stackup nekutenga; peji rino rinotevera bhodhi kuburikidza nekugadzirwa.

Kuburitswa Kweinjiniya: Zvinofanira Kugadziriswa Usati Wagadzira

Kugadzira hakutangi kana mafaira eGerber asvika. Kunotanga kana data rinouya rashandurwa kuita package yekugadzira inotenderwa, inoenderera mberi mukati. Zvikanganiso zvinodhura zvikuru zvema layer gumi zvinotanga usati wafungidzira: layer isina kujekeswa kuburikidza nekutanga, upamhi hwetrace hunopesana necopper yakapedzwa, stackup isingaswedere pedyo nehukobvu hunodiwa, kana kutsiva kwezvinhu zvinoshandura impedance mushure mekunge marongerwo aoma.

Seti yedata inowanzo dikanwa

• Ruzivo rwema layer rwaGerber X2, ODB++ kana IPC-2581 rune ma layer akarongeka zvakajeka;
• Mafaira ekuboorera eNC ne enzira akaparadzaniswa nerudzi rwemaburi uye nhanho yekutanga/yekumisa;
• dhizaini yekugadzira ine ukobvu hwakapedzwa, mhangura yakapedzwa, bhodhi, tolerances, kupedzisa uye zvinodiwa zvekugamuchirwa;
• zvirambidzo zve stackup kana stackup, kusanganisira impedance reference layers;
• tafura yekudzivirira inodzorwa ine layer, geometry, target uye tolerance;
• kuburikidza nekuzadza, kuchera kumashure, sinki yekumisikidza, kuputira mupendero, maburi akacheneswa kana kuti kudzika kwenzira kana zvichibvira;
• kutsanangurwa kwezvinhu uye mutemo wekutsiva;
• zvinodiwa zvepaneru kana kuti zvekutumira;
• kutara, kutevedzana, kurongeka uye zvinodiwa nemishumo;
• chimiro chemuunganidzi kana zvinodiwa zvekuvimbika zvakanyanya kana zvichikanganisa kufanirwa kwebhodhi risina chinhu.

Kuongorora kweCAM neDFM

Chikwata cheCAM chinoongorora kuenderana kwenetlist, nzvimbo dzakacherwa kubva pakuboorwa kuenda kumhangura, nzvimbo dzakatenderedzwa, kunyoreswa kwemasikisi ekusolder, nzvimbo yemhangura kubva kumucheto kuenda kumucheto, kugona kutenderera, kuiswa kwemakuponi, kuenzana kwemhangura uye kudyidzana pakati pebhodhi nepaneru yekugadzira yakarongwa. Zvimiro zveimpedance zvinodzokororwa zvinoverengerwa patsva uchishandisa zvivakwa zvemidziyo zvakarongwa uye mhangura yakapedzwa. Kana mutengesi achichinja upamhi hwemutsara kana nzvimbo kuti isangane neimpedance, shanduko yacho inofanira kudzoserwa kuti ibvumidzwe pane kuiswa chinyararire mudata rekugadzira.

Pabhodhi rine zvidimbu gumi, DFM output inofanira kupindura mibvunzo mishanu kana kupfuura:

1. Ko danda riri kurongwa rinogona kuvakwa kusvika pakukora kwaro uye pakushivirirana kwaro here?
2. Chivako chega chega chakaboorwa chinogona kusangana nezvinodiwa zvekunyoresa, annular-ring uye aspect-ratio here?
3. Ko geometry yemuchina wekufambisa inodiwa inogona kuchekwa here mushure mekuputirwa kunodiwa?
4. Ko kukosha kwe impedance kunogona kuwanikwa here nezvivakwa zvezvinhu zviripo?
5. Miedzo nemishumo yakatarwa zvinoenderana nekirasi yechigadzirwa nemagwaro ekutenga here?

Dhizaini yepaneru yekugadzira

Bhodhi rega rega rakaiswa mupaneru yekugadzira ine maburi ekushandisa, zvinangwa zvekunyoresa, kuba maplate, makuponi, maumbirwo ekuyedza uye miganho yeprocess. Kurongeka kwepaneru kunogona kukanganisa mafambiro edimensional, divi rekuruka kwegirazi, routing leeve uye bow/twist. Paneru haisi nzira yekungoisa zvidimbu zvakawanda mupepa; ndiyo nzira yeprocess inoshandiswa nemifananidzo, kuchera, kupaka uye michina yekuyedza.

Kufungidzira, Kucheka uye AOI yemukati mechikamu

Patani yega yega yemukati yemhangura inotanga pamwoyo wakaputirwa nemhangura. Moyo unocheneswa, woputirwa ne photoresist, wotorwa mifananidzo, wogadzirwa, wochekwa wobviswa. Upamhi hwe conductor hwakapedzwa hunobva mukugadziriswa kwemifananidzo, ukobvu hwemhangura, resist chemistry, exposure, developer condition, etchant chemistry uye spray dynamics. Chirevo chekuti chitsama chega chega chinobatirira pakushivirira kumwe chete saka chinotsausa; kugona kunoenderana ne geometry uye kuvakwa kwemhangura.

Kugadzirira uye kuzivikanwa kwezvinhu

Macores anoburitswa zvichienderana nerudzi rwezvinhu, ukobvu, huremu hwemhangura, chimiro chegirazi uye bhora. Mapurojekiti ezvinhu zvinodzorwa anogona kuda kuzivikanwa kwakanaka uye kuteverwa kwebhora zvisati zvapinda mumifananidzo. Kusvibiswa kwepamusoro, oxidation kana kukuvara kwekuchengetedza kunogona kuderedza kunamira kwephotoresist uye simba rekubatanidza pakati pelaminar, saka zvinodiwa pakubata nekubika zvinotevedzera nhungamiro yekugadzirisa yemutengesi welaminate uye maitiro akakodzera efekitori.

Kufungidzira zvakananga neLaser

Kudhirowa kweLaser direct imaging kunoburitsa resist kubva kudhijitari uye kunodzivisa zvikanganiso zvine chekuita nemafirimu. Sisitimu iyi inoenzanisa patani nezvinangwa zvepaneru uye inoshandisa chiyero chinobva munhoroondo yezvinhu uye maitiro. Kugona kunyoresa kunoenderana nehukuru hwepaneru, ukobvu hwepakati, kugadzikana kwezvinhu, mhando yezvinangwa uye michina iri kushandiswa; haifanirwe kuderedzwa kusvika pakuva imwe chete yema micrometer.

Kuchekwa uye muripo wemutyairi

Mhangura yemukati inobviswa nemakemikari munzvimbo dzisina kudzivirirwa. Nekuti kuchekwa kunokanganisawo madziro emuchina wekufambisa, hunyanzvi hweCAM hunowedzerwa nehuwandu hwakakodzera ukobvu hwemhangura uye maitiro ekucheka. Mitsetse mitete pamhangura yakakora inoda muripo wakawanda uye inogona kugadzira ma profiles etrapezoidal anokanganisa impedance. Ichi ndicho chimwe chikonzero nei upamhi hwemutsara wepamusoro mufaira rekugadzira husiri upamhi hwekupedzisira hweunyanzvi hwekugadzira.

Automated optical inspection

AOI inoenzanisa panel yakachekwa nedata redhijitari rakatenderwa uye maflags opens, shorts, nicks, protrusions, residual copper nezvimwe zvisingawanzoitiki pattern. AOI inowanzo shandiswa kune ese ma inner-layer panels, asi kugamuchirwa kweAOI hakuratidzi hunhu hwe dielectric, plating integrity kana completed-board viable. Zvikanganiso zvakaonekwa zvinoongororwa pasi pemaitiro akadzorwa. Mitemo yekugadzirisa inofanira kutsanangurwa nesystem yemhando yefekitori uye zvinodiwa nevatengi; kugadzirisa kondakita yakavanzika hakufanirwe kufungidzirwa kuti kwakagamuchirwa kune chigadzirwa chakavimbika zvikuru.

Kurapa Bond, Layup uye Lamination

Mushure mekugamuchirwa kwemukati mechikamu, pamusoro pemhangura panofanira kunge pakagadzirwa kuti pabatane ne resin system. Kugadziriswa kwacho kunofanira kupa kunamira pasina kugadzira chimiro chakawandisa chinoderedza kurasikirwa kwe conductor nekukurumidza. Maitiro e oxide yakajairika, oxide yakaderera uye oxide-alternative ese anogona kukodzera kana akakodzera nechinhu chakasarudzwa.

Magadzirirwo eLayup

Dura rine zvidimbu gumi rinogona kuvakwa kubva kumacores akasiyana-siyana uye prepreg interfaces, kana kubva musanganiswa wemacores ne other copper foil. Hapana chinodiwa che "macores mashanu." Nhamba yacho inoenderana nekugadzirwa kwe stackup. Semuenzaniso, mamwe magadzirirwo anoshandisa macores mana ane mativi maviri eL2-L9 pamwe ne outer foil, nepo mamwe achishandisa ma core pairings akasiyana kudzora kuwanikwa kwe dielectric kana kuvaka kwakavigwa. Pepa re layup rinofanira kuenderana ne layer order yakatenderwa uye kuziva zvinhu, girazi style, resin content, copper uye orientation ye interface yega yega.

Sei nzira yekubika yakagadzirwa isina kururama

Tembiricha yekudzvanya, kumanikidzwa, vacuum, ramp, kugara uye kutonhora zvinosarudzwa kubva pane zvinodiwa nemutengesi welaminate uye resipi inokodzera mugadziri. Chirevo chakajairika chakadai sekuti "200 deg C, 350 psi kwemaminitsi makumi mapfumbamwe" hachina kukodzera pane high-Tg FR-4, low-loss PPE systems, polyimide, PTFE-based hybrids kana mixed constructions. Kutenderera kwekupukuta kunofanirwa kuita kuti resin ibude, void remove uye full cleanse pasina kudzvanywa zvakanyanya, kudya resin shoma kana kufamba kusingadzoreki.

Kudzora lamination

• zvinhu uye kusimbiswa kwenzvimbo usati waisa mari;
• kucheneswa kwekamuri kana kuchengetedzwa kwenzvimbo kwakakodzera maitiro acho;
• kudzidziswa kwemabhuku uye ongororo ye copper-balance;
• kutarisa kwevacuum uye press-profile;
• kufanotaura kwekuyerera kweresin uye ukobvu;
• kuongororwa kwechinangwa chekunyoresa mushure mekudhindwa;
• ukobvu hwepaneru hwakapedzwa uye cheki dzebow/twist;
• kuponi kana kupatsanurwa kwechikamu chekutanga kana zvichidikanwa.

Zvikanganiso zvakajairika zvekusunga

Mavanga anogona kukonzerwa nemhepo yakavharirwa, kusvibiswa kana kusakwana kweresin. Kushaya simba re resin kunoitika kana mhangura yakakora, zvinhu zvakawanda zvinozadzwa kana kumanikidzwa kwakanyanya zvichisiya dielectric isina kukwana. Kubviswa kwe dielectric kunogona kukonzerwa nekugadzirwa kusina kunaka kwenzvimbo, hunyoro, zvinhu zvisingaenderane kana kugadziriswa zvisirizvo. Kuyerera kwakanyanya kwe resin kunogona kuchinja ukobvu hwe dielectric uye impedance. Kusanyorwa zvakanaka kwemukati me layer kunogona kubva mukuyera kwemifananidzo, maturusi, kufamba kwepaneru kana kuvaka kusina kuenzana. Dambudziko rega rega rine chikonzero chakasiyana; hapana chinogadziriswa nekushandisa Tg yepamusoro chete.

Kuboorera Kwemuchina, Kuboorera NeLaser uye Zvinhu Zvinodzorwa Nehudzamu

Kuboora kunogadzira geometry yekubatana kwezvikamu zviviri. Ruzivo rwekugadzira runofanira kuparadzanisa maburi akaputirwa, maburi asina kuputirwa, maburi akavigwa, maburi asina kuvharwa, maburi emakanika asina kujeka, ma microvia e laser, mabhora ekumashure, ma countersink uye nzira dzakadzika dzakadzorwa. Kubatanidza izvi mu tafura imwe chete isina musiyano ndiyo inowanzo kukonzera mibvunzo yekugadzira uye maturusi asina kururama.

Mechanical drilling

Zvishandiso zveCarbide zvinosarudzwa zvichienderana nehukuru hwegomba rakapedzwa, zvinhu, mapaneru, mhando yemadziro inodiwa uye kushivirira kwenzvimbo. Kumhanya kwespindle, infeed, chip load, backup uye entry materials zvinhu zvinoshanduka pane maitiro kwete hunhu hwakagadzika. Zvidhinha zvidiki zvemakanika zvinogona kuda kuderedzwa kwepaneru uye hupenyu hupfupi hwematurusi. Zvinhu zvakazadzwa neceramic kana kuti zvine frequency yakakwira zvinogona kuwedzera kupfeka uye kuda maturusi akasiyana. Mutengesi anofanirawo kufunga nezve plating allowance: dhayamita yakaboorwa yakakura kupfuura dhayamita yegomba rakapedzwa.

Kunyoresa chibooreso uye smear

Buri rakaboorwa rinofanira kugara mukati menzvimbo yekubata mukati mechikamu chemukati mushure mekunge mifananidzo yese, lamination uye kushivirira kuboorwa zvabatanidzwa. Mabhodhi makobvu, maburi madiki uye huwandu hwezvikamu zvakakwirira zvinoderedza mukana we annular-ring uripo. Kupisa uye kushanda kwemuchina panguva yekuboorwa zvinogona kuputira resin pamusoro pemhangura yemukati yakafumurwa, saka kugadzirira maburi nemadziro kwakakosha usati waisa simbi.

Laser kuchera

Ma microvia eHDI anowanzo gadzirwa neCO2, UV kana maitiro e laser akabatanidzwa akasarudzwa kune dielectric ne copper structure. Masisitimu eCO2 anoshandiswa zvakanyanya kune resin-based buildup dielectrics, kazhinji nekugadzirira kuvhura mhangura; UV inogona kugadzirisa mhangura ne dielectric nekudzora kwakanaka. Nzira yakanakisisa inoenderana nehukuru hwegomba, kudzika kwechinangwa, kusimbisa, nzira yekuvhura mhangura, throughput uye michina yakakodzera. Blanket anoti wavelength imwe chete inogara ichidiwa kune dhayamita yakatarwa inofanira kudzivirirwa.

Back-drilling

Kuboorera kumashure kunobvisa chikamu chisina kushandiswa chegomba rakaputirwa mushure mekunge bhodhi rabatanidzwa. Dhayamita yechishandiso, divi rekupinda, kudzika kwekumisa uye stub inobvumirwa yasara inofanira kunyorwa. Stub inogoneka inoenderana nenzvimbo yestub, ukobvu hwebhodhi, nzira yekudzora kudzika, kunyoresa uye kusimbiswa. Mutemo wepasi rose we "mamirioni mana kubva pasuru yechiratidzo" hauna kukodzera; dhizaini inoda kuburitswa kwakachengeteka kune stub yakabatana uku ichisangana nechinangwa chestub yechiteshi.

Zvimwe zvinhu zvinodzora kudzika

Ma counterbores, ma countersinks, ma cavities, mari yepockets uye nzira dzakadzika dzinoda data rakasiyana remakanika uye tsananguro dze tolerance. Kutevedzana kwavo kunogona kukanganisa plating, solder mask uye final profile. Kuda kudzika kunofanira kuratidza datum surface, target depth kana kuti salt thickness, tolerance uye kana chinhu chacho chakaiswa plated.

Desmear, Mhangura Isina Magetsi uye Kuputira Magetsi

Mushure mekuboora, madziro emaburi haafambi uye anogona kunge aine resin residues, girazi rinobuda uye marara emakanika. Kugadzirira maburi nemadziro uye simbi zvinogadzira nzira yekufambisa iyo gare gare electroplating inovaka kusvika pakukora kunodiwa.

Kurapwa kwetsvina uye kugadzirisa mamiriro emuviri

Maitiro ePermanganate, plasma kana akabatanidzwa anobvisa smear uye anogadzirisa dielectric. Kemikari iyi inofanira kuenzaniswa ne resin system; over-processing inogona kurwisa dielectric kana glass interfaces, nepo pasi-processing inogona kusiya kusvibiswa pa inner-layer copper uye kunetesa interconnect. Kuvakwa kwezvinhu zvakasanganiswa uye kurasikirwa zvishoma kunogona kuda conditioner yakakosha nekuti resin chemistry yavo yakasiyana neFR-4 yakajairika.

Danho rekutanga rekufambisa

Mhangura isina electrode kana nzira yekubatanidza simbi zvakananga inoisa firimu rakatetepa rinofambisa mhepo pamadziro egomba rakagadzirwa. Chinangwa ndechekugadzira kufambisa mhepo nguva dzose kwe electrolytic plating. Ukobvu humwe chete hwezita hahusi hwese mumapurogiramu; kufukidza, kunamira uye kuramba uchienderera mberi kwakakosha kupfuura kutaura nhamba ye generic isina gwara rinotonga.

Kuputira mhangura kweElectrolytic

Kuisa simbi mu electroplating kunovaka mhangura mubharero uye pamusoro pemhangura yakavhurika. Simba rekukanda rinova rakaoma sezvo chiyero chegomba chichiwedzera. Kuwanda kwesimbi, kuvhunduka, makemikari uye kugoverwa kwemagetsi epaneru zvinodzorwa saka pakati pegomba panowana mhangura yakakwana pasina kuwedzera kwehuwandu hwesimbi. Kugamuchirwa kwechigadzirwa kunoongororwa zvichienderana nezvinodiwa nekushanda uye magwaro ekutenga, kwete zvichienderana nemutengo wekutengesa wakasiyana.

Kuzadza microvia

Ma microvia akazadzwa anoshandisa plating chemistry yakagadzirirwa kuzadza kubva pasi uku ichideredza ma voids, seams uye surface copper yakawandisa. Kana imwe microvia ikaiswa pamusoro, pamusoro payo panofanira kunge pakanyatsorongeka zvakakwana kune dielectric inotevera uye target pad. Dimple inobvumirwa kana bump uye nzira yekuongorora inofanira kutsanangurwa. Maitiro e microvia akazadzwa akasiyana nekubatanidza gomba rinopinda ne resin uye kufukidza chivharo pamusoro paro.

Kudhirowa Mifananidzo Yekunze, Kuisa Mapatani Uye Kucheka

Kugadziriswa kwekunze kwakasiyana nekuchekwa kwemukati memukati memukati nekuti maburi akaiswa pamusoro uye maconductor epamusoro anowanzo gadzirwa panguva yekuchekwa kwepatani. Maitiro akajairika anoratidzira patani yekunze, maplate copper munzvimbo dzakavhurika, anoisa etch resist senge tin, anobvisa photoresist, anocheka base copper isingadiwe uye obva abvisa etch resist. Mamwe maitiro akakodzera anogona kushandiswa, asi kutevedzana kunofanirwa kuchengetedza zvinodiwa nemadziro emaburi uye conductor.

Mhangura yakapedzwa inofanira kuzivikanwa basa reunyanzvi risati raburitswa

Kondakita yekunze haienzane neukobvu hwefoil yekutanga. Kuisa maburi uye kuiisa pattern kunowedzera mhangura, uye maitiro ekuisa maburi kana kuiisa pa wrap anogona kuwedzera. Saka kugona kwemutsara mutete kunofanira kuongororwa zvichienderana nemhangura yepamusoro yakapedzwa, kwete kukosha kwefoil ye catalog. Izvi zvinonyanya kukosha pamabhodhi eHDI, uko kuiisa patsva kunogona kutetepa hwindo re etching.

Outer-layer AOI

Mushure mekuchekwa, zvikamu zvekunze zvinoongororwa nemaziso kuti zvionekwe kana paine kuvhurika, mashoti mapfupi, kukuvara kwemuchina, kusarongeka kwemhangura nemapad. Data reAOI haritsivi kuyedzwa kwemagetsi nekuti zvimwe zvikanganiso zvinogona kuvanzwa, zvichiitika kana kuti zvine chekuita nekubatana kwemaburi. Idanho rimwe chete muhurongwa hwekuongorora hwakarongwa.

Kuisa mapuranga emucheto uye castellations

Mipendero yakaputirwa nemaburi akaputirwa zvinoda kuti chimiro nehurongwa hwemapuratifomu zvienderane. Nzvimbo dzekuputira mipendero dzinogona kupfuudzwa dzisati dzapfurwa uye dzopedzwa gare gare. Mapuratifomu anoda kuiswa kwemaburi uye nzira yekupedzisira inosiya geometry yakatarwa yehafu yegomba. Zvinhu izvi zvinofanirwa kuratidzwa pamufananidzo uye hazvigone kufungidzirwa zvakachengeteka kubva kumifananidzo yemhangura chete.

Solder Mask, Legend, Surface Finish uye Profiling

Kugadzirira uye kutora mifananidzo yemasiki esimbi

Pamusoro pemhangura panocheneswa, chifukidzo chemvura chinotorwa mufananidzo chinoiswa, chinoomeswa, chinotorwa mufananidzo, chinogadzirwa uye chinorapwa zvizere. Kunyoreswa kwemasiki kunoongororwa zvichienderana nehukuru hwepedhi, nzira yevhu inosarudzwa nemasiki kana kuti isina kutsanangurwa nemasiki, kuburikidza nezvinodiwa zvematende uye pitch yezvikamu. Hukobvu hwemasiki hwakagadzika haukodzeri inki yega yega, chimiro nenzvimbo; specification yechigadzirwa nezvinhu zvakatenderwa zvinodzora zvinodiwa.

Ngano uye chiratidzo

Ngano haifanirwe kunge isina mapedhi akafumurwa, nzvimbo dzekuyedza uye nzvimbo dzakakosha. Kurongeka kwemavara, kodhi yezuva, kodhi yenzvimbo, chiratidzo cheUL uye zvitupa zvevatengi zvinoiswa zvichienderana nehurongwa hwekudhirowa nekutevera kugadzirwa. Zviri mukati zvinofanirwa kubvumidzwa usati wagadzirwa nekuti kuwedzera kana kutamisa makodhi mushure mekugadzirwa kunogona kukanganisa hunyanzvi hunodzorwa nevatengi.

Sarudzo yekupedzisa pamusoro

Kupedzisa kunodzivirira mhangura yakafumurwa uye kunoita kuti pave nekusungirirwa, kubatana kwewaya kana kubatana kwekupfeka. Sarudzo yacho inobva panzira yekuungana, kupidigura kwechikamu, kuchengetwa, kurasikirwa kweRF, kupfeka kwekubatana uye zvinodiwa nemutemo.

• ENIG: Yakarongwa uye inoshandiswa zvakanyanya pakugadzira simbi dzakatetepa. Zvinodiwa zvinofanirwa kutariswa nekuvandudzwa kweIPC-4552 pane kuvimba nehukobvu hwekushambadzira hwakareruka.
• ENEPIG: inotsigira kusungirirwa uye mamwe mashandisirwo ekubatanidza waya kana zvatsanangurwa uye zvichidzorwa pasi peIPC-4556.
• OSP: dziviriro yakatetepa yeorganic yakakodzera mamiriro ekubatanidza uye ekubata anoenderana.
• Chirongo chesirivha kana chekunyudza: yakasarudzwa kuti ishandiswe pakubatanidza, kugadzirisa kana kugadzirisa zvinodiwa nemagetsi, ine zvinhu zvinodzora kuchengetedza nekubata.
• HASL: yakasimba pakushandisa zvinhu zvakawanda zvinopinda nepaburi uye zvakakura asi haina kuenzana zvakanyanya pane zvinopera mumvura.
• Ndarama yakaoma yakaputirwa nemagetsi: inoshandiswa zvakasiyana pazvigunwe zvakapfekwa zvakaita semupendero weminwe; ukobvu hwenickel negoridhe hwakatarwa kuti zvishandiswe pakubata.

Kuongororwa kweukobvu hwekupedzisira kunotevera zvinodiwa pakupedzisa uye hurongwa hwekutora sampuli hwakabvumiranwa. Hazvifanirwe kushambadzirwa sekuyerwa kweXRF kwepedhi rega rega kana bhodhi rega rega kunze kwekunge izvo zvichidikanwa uye zvichiitwa.

Kuongororwa kwekupedzisira

Kuronga, kubhomba, kucheka nelaser kana V-scoring zvinoparadzanisa bhodhi kana kugadzira delivery array. Dhirowa inofanira kutsanangura zviyero zvekupedzisira, edge tolerances, tabs, breakaway rails, V-score yasara ukobvu uye zvirambidzo zve component-to-edge. Bow and twist zvinoongororwa pabhodhi rakapedzwa kana array pasi pezvinodiwa zvekugamuchira.

Kuedzwa kweMagetsi, TDR uye Kusimbiswa kweMagadzirirwo

Kuenderera mberi kwemagetsi uye kuparadzaniswa

Kuyedzwa kwemagetsi kusina vanhu kunoratidza kuti ma network akagadzirirwa akabatana uye ma network asina kurongwa anoramba akaparadzana. Midziyo yekuyedza inobhururuka yakajairika kune ma prototypes uye vhoriyamu shoma nekuti inodzivisa chigadzirwa chakatsaurirwa. Kuyedzwa kwechinhu kunogona kuvandudza throughput kuti huwandu hwekugadzirwa hugadzikane. Ma parameter ekuyedza, data uye kufukidzwa zvinofanirwa kutevedzera zvinodiwa zvekutenga uye zvinodiwa zveIPC-9252 zvinoshanda. Kupfuura nemutengo wechinhu uye chigadzirwa zvinoenderana nedhizaini uye hazvifanirwe kutaurwa sezvinhu zvepasi rose.

Kusimbiswa kweTDR impedance

Mabhodhi anodzorwa-anopindira anosimbiswa pamakuponi akagadzirwa achishandisa time-domain reflectometry. Kuponi inofanira kuburitsa layer yakakodzera, copper, dielectric uye reference configuration zvakakwana kuti imiririre chimiro chechigadzirwa. IPC-TM-650 2.5.5.7A inotsanangura nzira dzekuyera TDR, nepo coupon geometry, frequency yebvunzo, acceptance tolerance uye reporting zvinodzorwa nemagwaro eodha. Hapana mutemo mukuru wekuti +/-5% inoda "coupon imwe chete pahafu yepanel" kana +/-3% inoda "imwe pakota yepanel."

Kuongororwa kwechikamu chidiki uye chimiro

Makuponi anomiririra anogadzirwa, anokwenenzverwa uye anoongororwa kuti aonekwe kuti anyoreswe sei, mhangura ine maburi, kubatana kwemukati, mamiriro e dielectric, microvia fill, wrap plating nezvimwe zvinhu zvechimiro. Muenzaniso wechirongwa unobva pane zvinotsanangurwa zvechigadzirwa uye magwaro ekutenga. IPC-A-600 itsananguro yakatsanangurwa yemamiriro ekugamuchirwa anoonekwa; zvinodiwa pakushanda zvinobva pane zvakatsanangurwa zvakaita seIPC-6012, IPC-6013 kana IPC-6018.

Kuedza kwekupisa kwepakutanga uye kuvimbika

Zvimwe zvigadzirwa zvinoda kudzokororwa kwemusanganiswa wemagetsi, kushushikana kwekupisa, kuvhunduka kwekupisa kana kutenderera kwemagetsi kusati kwaongororwa chimiro. Nzira yacho inofanira kutaurwa uye chimiro, huwandu hwezvinhu zvakasangana nazvo, coupon uye chiyero chekukundikana chinotsanangurwa. "Three-cycle microsection," "1,000-cycle IST" nemamwe mazwi akafanana haasi emhando dzose echirongwa chekuvimbika chakanyorwa.

Mashandisirwo Anoitwa Zvinhu zveHDI, Rigid-Flex uye Hybrid

Kuunganidzwa kweHDI kwakatevedzana

HDI inodzokorora lamination, laser drilling, kuchenesa, metallization uye kazhinji copper filling padanho rega rega re buildup. Chikamu chepakati chinogonawo kunge chine ma vias akavigwa. Sezvo kudzika kwe buildup kuchiwedzera, kubhadhariswa kwekunyoresa, pamusoro pe copper uye kufamba kwe dimensional kunowedzera kuoma kudzora. Gwaro re 10 layer HDI engineering rinotsanangura kuti 1+8+1, 2+6+2 uye 3+4+3 zvakasiyana sei.

Kuvakwa kwakasimba-kwakachinjika

Kugadziriswa kwakasimba kunounza ma polyimide cores, coverlay, adhesive kana adhesive flex materials, nzvimbo dzakasimba dzakasarudzwa, zvinhu zvinobatanidza zvishoma uye shanduko dzinodzorwa dzinochinjika kusvika pakasimba. Mamiriro ekudzvanya anosarudzwa kune sisitimu yezvinhu zvakatenderwa; tembiricha yepamusoro yegumbeze haishande pazvivakwa zvese. Kurongeka kwekugadzirwa kunofanirwa kuchengetedza nzvimbo dzakapfava dzakavhurika, kudzora kuyerera kwe resin uye kuchengetedza geometry yemhangura yenzvimbo inokotama. Kuedzwa kwekukotama kana dynamic-flex qualification inodiwa chete kana yakatsanangurwa nedhizaini uye zvinodiwa zvechigadzirwa, kwete otomatiki kune yega yega inotumirwa yakasimba.

Zvinhu zvakasanganiswa zvinomhanya zvakanyanya uye RF

Ma "hybrid stackups" anosanganisa zvinhu zvakasiyana-siyana nema "resin systems", "copper options", "dimensional movement" uye "surf treatments". Kuenderana kwe "bond" uye "z-axis expansion" zvinofanirwa kuongororwa. Kuboorera ne "desmear" zvinogona kuda magadzirirwo chaiwo echinhu, uye "impedance model" inofanira kushandisa "Dk" chaiyo ye "dielectric" yega yega. Chinhu chinogadzira "seFR-4" chichiri kuda muripo wacho wakakodzera uye data rekudzvanya.

Mari yemhangura inorema, mari yemhangura uye zvinhu zvakaiswa mukati

Kugadziriswa kwe etch yemhangura inorema, kuzadza resin uye plane balance. Mari dzakaiswa mukati kana inlays dzinounza pocket machining, bonding uye planarity controls. Zvinhu zvakaiswa mukati kana active zvinoda process architecture yakasiyana uye directional specification. Izvi zvinofanirwa kubatwa semainjinier variants, kwete kungobatanidzwa muchirevo chekuti standard flow imwe chete inotsigira chinhu chega chega chakakosha.

Zvinyorwa Zvemhando Yepamusoro, Kuteverwa Uye Kuburitswa Kwezvinhu

Zvinyorwa zvinounzwa pamwe chete nekutumira zvinhu zvinofanirwa kutsanangurwa muchibvumirano chekutenga kana chibvumirano chemhando. Odha yekutengeserana yakajairika ingada chitupa chekutevedzera mitemo uye kusimbiswa kwekuyedzwa kwemagetsi. Chirongwa chekurapa, chemotokari, chendege kana chekudzivirira chinodzorwa chingada zvitupa zvezvinhu, kuteverwa kwenzvimbo, zvikamu zvidiki, data rekupedzisa, mhinduro dzeimpedance, zvinyorwa zvechinyorwa chekutanga kana mafomu evatengi. Hazvina kururama kutaura kuti kutumira kwega kwega kwezvikamu gumi kunosanganisira otomatiki mushumo wega wega unogoneka.

Mapoka erekodhi akajairika

• chitupa chekutevedzera zvinodiwa;
• chitupa chekuongorora magetsi kana pfupiso;
• Mushumo weTDR wemakirasi e impedance akatarwa;
• kuzivikanwa kwezvinhu uye kurongeka kwenzvimbo kana zvichidikanwa;
• mushumo wechikamu chidiki pasi pechirongwa chekutora sampuli chakabvumiranwa;
• data rekuyera pamusoro pechinhu kana zvichidikanwa nekondirakiti;
• kuongorora zvinhu zvakakosha kana kuongorora zvakadzama;
• RoHS, REACH kana zvimwe zviziviso zvinoshanda kune chigadzirwa chakapihwa;
• zvinyorwa zvechinyorwa chekutanga kana zvechitupa;
• data re serialization uye rekutevera huwandu hwezvinhu zvakagadzirwa.

Kutevedza uye kuchengetedza

IPC-1782 inopa hurongwa hwemazinga ekutevedza, asi haigadzi mutemo mumwe chete wekuchengetedza kwemakore gumi kune PCB yega yega. Nguva yekuchengetedza, huwandu hwedata uye kuwanikwa zvinotemerwa nechibvumirano chemutengi, sisitimu yekutonga uye maitiro emhando yemutengesi. Mutengo uyu unofanirwa kuratidza chero zvinodiwa zvekuchengetedza zvisingawanzoitiki kana zvedhijitari nekuti zvinokanganisa manejimendi uye chiyero chekuongorora.

Kusunungurwa kwekupedzisira

Kuburitswa kwekutumira kunosimbisa kuti mashandiro anodiwa uye kuongororwa kwapera, kusaenderana kwagadziriswa, huwandu hunoenderana, kurongedza kunodzivirira kupedzisa uye mamiriro ehunyoro kana zvichidikanwa, uye magwaro anodiwa akabatanidzwa kana kuwanikwa. Nzira yekurongedza, kuvharira vacuum, desiccant, hunyoro uye chiratidzo chehupenyu hwesherufu zvinoenderana nekupedzisa, nguva yekuchengetera uye zvinodiwa nemutengi.

Kumbira Ongororo Yekugadzira yePCB ye10 Layer