Unyanzvi hwePCB hweLayer HDI gumi hweMicrovias neBGA Escape

PCB yeHDI ine 10 layer haitsanangurwi nekungova ne10 layers dzemhangura kana fine-pitch BGA. Ibhodhi rakadhindwa rine 10 layers rinoshandisa imwe kana kupfuura high-density interconnect techniques - kazhinji ma microvias akaboorwa nelaser, blind or buried interconnections, via-in-pad, sequential buildup, fine conductor geometry, kana musanganiswa weizvi - kugadzira nzira dzekufambisa idzo dhizaini yemazuva ano yaisagona kupa mukati menzvimbo yebhodhi iripo. Dhizaini yeHDI yakanaka saka inotanga nedambudziko rekufambisa uye kuvimbika, kwete ne buildup notation yefashoni.

Highleap Electronics inogadzira mabhodhi echinyakare neHDI multilayer uye inoongorora magadzirirwo ese ekubatanidza usati waburitsa stackup. Ongororo iyi inofanira kubatanidza sarudzo ina dzinowanzo tariswa zvakasiyana: nzira yekubuda mupakeji, huwandu hwemazinga ekuvaka, kuvaka kwezvinhu ne dielectric, uye hurongwa hwekukodzera. DFM chaiyo yepurojekiti uye stackup review ndiyo nzvimbo yakakodzera yekusimbisa sarudzo idzodzo. Ruzivo rwefekitori rwakawanda runowanikwa papeji yekugadzira yeHDI PCB , nepo chinyorwa chino chichitarisa pane sarudzo dzeinjiniya dzematanho gumi.

Kana Bhodhi reZvikamu gumi Richida HDI

HDI inoruramiswa kana ichigadzirisa dambudziko rehuwandu hwemagetsi, hwemagetsi, hwemakanika kana hwekuvimbika. Haifanirwe kuwedzerwa chete nekuti chigadzirwa chacho chine 0.5 mm BGA, chinoshandisa interface inokurumidza, kana kuti chinotsanangurwa sedhizaini yepamusoro. Mamwe mapakeji e0.5 mm ane mapatani ekubvisa vanhu vakawanda uye anogona kupukunyuka ne microvia level imwe chete. Mamwe mapakeji ari papitch imwe chete ane minda yakazara yebhora, ma domain akawanda esimba uye akawanda ma high-speed pairs, uye angada mazinga maviri ekuunganidza kana nhamba yakasiyana ye layer. Package pin map inonyanya kukosha sepitch inosarudzwa.

Zvikonzero zvinowanzo shandiswa pakushandisa HDI pabhodhi rine nhurikidzwa gumi

• Kubuda kwepakeji: Mitsetse yemukati yeBGA haigone kusvikwa nepedhi rekupinda nepaburi uye geometry yeantipad iripo.
• Kudzoreredza nzira dzekufambisa: minda mikuru inoshandisa nzvimbo yakawanda pamatanho akawanda uye inoshandisa simba remabhuroko kana mapuraneti ekutarisa.
• Kuchinja kupfupi kwakamira: ma microvia asingaonekwe anogona kuderedza zvisingadiwi kuburikidza nehurefu uye parasitic inductance kana dhairekitori rechiratidzo riri pedyo nedivi rechikamu.
• Kuiswa kwepadhi kuburikidza ne-in-pad: microvia yakazadzwa uye yakarongwa inodiwa zvakananga munzvimbo ine chikamu chechinhu kuchengetedza huwandu hwefeni.
• Hamvuropu yemakanika diki: Mutsetse webhodhi haugone kukura uye mamwe marongero enzira anogona kugadzira ukobvu husingagamuchirwi, mutengo kana zvipingamupinyi zveaspect-ratio.
• Kubatana kwakakamurwa: Nzvimbo dzakasarudzwa dzinoda HDI nepo nzvimbo dzine huwandu hushoma dzichigona kuramba dzakajairika, zvichibvumira kugadzirwa kweHDI isina chikamu pane mhinduro yezvikamu zvese.

Nyaya apo HDI ingasava mhinduro yekutanga yakanakisisa

Kana kuzara kwemidziyo kuchikonzerwa nekusarongeka zvakanaka kwezvikamu, kuchinja kwezvikamu zvisina kufanira, ma antipads akakura, kuchengetedza kwakawandisa kana nzira isina simba ye power-pin, kuwedzera ma microvia kunogona kuvanza dambudziko remarongerwo pane kurigadzirisa. Kuwedzera bhodhi zvishoma, kuchinja sarudzo yekubvisa vanhu muBGA, kufambisa boka rimwe rezviratidzo kuenda kune rimwe divi, kana kushandisa bhodhi remazuva ese rine zvikamu gumi nemaviri kunogona kuva nenjodzi shoma pane kumanikidza kuunganidza HDI yakaoma. Ongororo yedhizaini inofanira kuenzanisa dzimwe nzira idzi kirasi yekugadzira isati yagadziriswa.

Maitiro Ekuverenga neKusarudza 1+8+1, 2+6+2 uye 3+4+3

Muchinyorwa chakafanana cheA+B+A , "A" yega yega inhamba yezvikamu zvemhangura zvakaunganidzwa zvakawedzerwa kunze kwechikamu chepakati che "B". Nhamba idzi dzinowedzera kuhuwandu hwezvikamu zvemhangura. Saka 1+8+1, 2+6+2 uye 3+4+3 zvese zvivakwa zvezvikamu gumi. Chinyorwa ichi hachitsananguri kubatana kwega kwega, huwandu chaihwo hwemabasa ekudzvanya, mashandiro echikamu, kana kuti chikamu chepakati chezvikamu chine mavhiya akavigwa. Zvinhu izvozvo ndezvemudhirowa wekugadzira uye stackup yakatenderwa.

Usasarudze buildup kubva paBGA pitch chete

Sarudzo yekuvaka inofanira kuitwa kubva pakudzidza kwekubuda kwakapedzwa. Pachinguva, chidzidzo ichocho chinofanira kuratidza huwandu hwemitsara yezviratidzo inofanira kubva papakeji, simba uye pasi kuburikidza nekuiswa, nzvimbo yepakati pemaviri, kuenderera mberi kwereferensi, nzira yefeniti inotarisirwa pane yega yega layer yezviratidzo, uye huwandu hwenzira dziripo pakati pemapedhi ari pedyo kana kuburikidza nenyika. Bhodhi re2+6+2 harisi "riri nani" otomatiki pane 1+8+1; rinongoruramiswa chete kana chikamu chechipiri chekuvaka chikagadzira mukana wekufambisa nzira usingakwanise kupa nhanho yekutanga.

Kubatana kwechero-layer chisarudzo chakasiyana

Any-layer HDI inowanzo shandisa ma microvia akazadzwa kubatanidza ma layer maviri akatevedzana muchimiro chose. Inopa kushanduka kwakanyanya kwe vertical-routing asi zvakare inogadzira ma interfaces akazadzwa akawanda, ma process loop akawanda uye mikana yakawanda yekunyoresa kana kukanganisa kwe interfacial. Haifanirwe kushandiswa senzira yekutsiva yekupedzisa escape architecture. Kana any-layer ichidikanwa, dhirowa inofanira kuratidza inobvumidzwa kuburikidza nema stacks, stack heights dzakarambidzwa, skip-via rules uye reliability test vehicle.

Microvia Geometry, Capture Pads uye Via-in-Pad

Mitemo yeMicrovia inofanira kubvumirana nemugadziri wezvinhu zvichienderana nehukobvu hwe dielectric, laser system, foil treatment, copper-fill process uye kugona kunyoresa. Mutemo we "75 μm via ne 225 μm pad" hauna kuchengetedzeka kune chero laminate kana chero nhanho yekuunganidza. Kuvhura kwelaser kwakafanana kunogona kugadzira mamiriro akasiyana ekupinda, pakati pemadziro uye target-pad kana resin system, girazi style kana copper foil ikachinja.

Maparamita akakodzera muongororo yedhizaini yeHDI

• Kuvhurwa kweLaser uye geometry yakapedzwa: taura kana dhayamita yemufananidzo iri paburi rebasa reunyanzvi, dhayamita yekupinda, dhayamita yepamusoro yakapedzwa kana dhayamita shoma yakatariswa.
• Dielectric ukobvu: shandisa ukobvu hwe dielectric hwakadzvanywa panzvimbo ye microvia, kwete kukosha kwe prepreg catalog isina kudzvanywa.
• Nhamba yepamusoro: Mugadziri wezvinhu anofanira kusimbisa hwindo rayo rine kudzika kusvika padhayamita. Dhizaini inochengetedza zvinhu kazhinji haidi kuti divi riwedzere kudzika kupfuura dhayamita yaro inoshanda.
• Tora nyika: Saizi yacho kubva padhayamita yelaser, nzvimbo inodiwa, bhajeti rekunyoresa uye kugona kwayo kugadzira zvinhu.
• Antipad: Sarudza kubva pakubvisa magetsi, kudyidzana kwemunda we impedance uye kunyoreswa kwekugadzira; haisi kuwedzera kwakasimba kwe capture pad.
• Kuzadza kwemhangura: tsanangura nzira yekuzadza, dimple inobvumidzwa kana bump, zvinodiwa pakuronga uye kana via ichizotsigira imwe microvia kana chikamu chevhu.
• Pamusoro pemhangura mushure mekuzadzwa: Tarisa kana kuputira nekuputira kwacho zvichiwedzera mhangura yekunze kana kuti yakaungana kupfuura hwindo rekupinza tambo dzakapfava.

Nguva yekutanga inoshanda - kwete mutemo wekuburitsa

Madhizaini mazhinji eHDI ekugadzira anoshandisa ma microvia elaser ari pakati pe75-125 μm dhayamita ane ma dielectric akamanikidzwa e50-100 μm. Aya ma values ​​anobatsira pakuongorora kwekutanga, asi haasi mvumo yekugadzira. Dhizaini iri pedyo nemucheto wehwindo iroro inogona kusagadzirwa mushure mekunge girazi rakagadzirwa, resin, target copper uye finished copper zvasarudzwa. Mhinduro yakatenderwa ye stackup uye DFM inofanira kutsiva ma values ​​eraibhurari akajairika.

Via-in-pad, yakazadzwa ne via uye yakavharirwa ne via haisi mazwi anochinjika

Nzira yekuisa mukati mechikamu chechinhu inowanzo fanirwa kuzadzwa nekurongwa kuitira kuti solder isadonhe mugomba uye pedhi rekubatanidza rirambe rakati sandara. Kune HDI microvia, copper filling inowanzo shandiswa kana nzira yekuisa ichitsigira BGA pad kana imwe microvia yakarongedzwa. Nzira yekuisa muchina yakazadzwa ne resin uye yakavharirwa ne copper chimiro chakasiyana chine maitiro akasiyana ekugadzirisa uye kuvimbika. Zvinyorwa zvekugadzira zvinofanirwa kuratidza mhando yekuisa muchina, zvinhu zvekuzadza, zvinodiwa zvechivharo, kudzika kwenzvimbo kunogamuchirika uye nzira yekuongorora.

Zvivako zvisina ivhu kana kuti zvidiki-diki zvinoda kusarudzwa kwakasiyana

Magadzirirwo anoderedza kana kubvisa nzvimbo dzekubata dzakajairika, anoshandisa maconductors akanaka kwazvo ekuwedzera, kana anoshanda muchimiro chakafanana ne substrate haafanire kuratidzwa sekuwedzera kweHDI yakajairwa. Anoda ongororo yehunyanzvi hwekuita, mitemo yeunyanzvi yakatsaurirwa, zvinodiwa zvekuongorora uye nzira yekugadzira yakabvumiranwa. Kuverengerwa kwezvikamu gumi hakuiti kuti chimiro cheSLP chiwanikwe otomatiki.

Microvia dzakaunganidzwa, dzakamira uye dzisingapindi

Ma microvia akakanganisika

Ma microvia akakamurwa anodzikiswa pamatanho akatevedzana ekuvaka uye anobatanidzwa nechikamu chipfupi che conductor pachikamu chepakati. Anoshandisa nzvimbo yakawanda yekufambisa kupfuura stack yakamira, asi anodzivisa kuisa interface yega yega pa axis imwechete uye anowanzo nyoresa copper filling. Apo package geometry inobvumira offset pasina kukanganisa kubuda kwesignali kana kuenderera mberi kweplane, zvivakwa zvakakamurwa kazhinji ndizvo zvinotanga nenjodzi shoma.

Akaturikidzana microvias

Ma microvia akarongwa anoisa ma vias akazadzwa akatevedzana padivi rimwe chete. Anochengetedza nhanho diki diki dzakamira uye anogona kudiwa pasi pemapakeji akakora akazara. Kuvimbika kwawo kunoenderana nehukuru hunopfuura via dhayamita: kugadzirira target-pad, mhando ye copper-fill, kuchena kwe interface, chimiro cheplating, kudzokororwa kwe lamination uye huwandu hwemazinga akarongwa zvese zvinokosha. Ruzivo rweindasitiri rwakaratidza kutadza kwakavanzika kwe interfacial mune mamwe ma stacked constructions, saka dhizaini haifanirwe kubata microsection inogamuchirika sehumbowo hwekuvimbika.

Siya ma microvia

Skip microvia inopfuura nepakati pema "dielectric layer" anopfuura rimwe chete kuti isvike pane chinangwa chisiri pedyo. Haisi kungori nzira yakadzika ye "adjacent-layer via". Laser inofanira kubvisa ma "resin" akawanda/magirazi uku ichichengetedza "target-pad integrity", uye kudzika kwakawedzerwa kunogona kutetepa hwindo re "process" rakakwana. Skip vias dzinofanira kushandiswa chete kana mugadziri akwanisa kuyera musanganiswa chaiwo we "dielectric", kudzika, kuvhura uye chimiro che "target". Mufananidzo unofanirwa kuratidza kana skip vias dzichibvumidzwa; hadzifanirwe kuoneka sedzinoreva.

Zvivakwa zvehybrid

Bhodhi rinogona kushandisa ma microvia akarongwa munzvimbo zhinji, ma stacked pairs chete kana routing ichida kuti aendeswe, ma mechanical vias akavigwa pakati pe subassembly, uye ma through-holes e connectors. Iyi mixture architecture inowanzo dhura mari uye yakasimba pane kumanikidza imwe through style mu design yese. Zvisinei, inoda via map inoratidza zvakajeka start and stop layers uye inodzivirira netsaona stacking pama interfaces asina kukodzera.

Kuyerera kwemaitiro eLamination neHDI

Kuunganidzwa kwakarongeka inzira yekugadzira inodzokororwa, kwete lamination imwe chete inoteverwa nekuboorwa nelaser. Peya imwe neimwe itsva ye dielectric/copper inofanira kunge yakanamirwa, yakanyoreswa, yakatorwa mifananidzo sezvinodiwa, yakaboorwa nelaser, yakacheneswa, yakacheneswa nesimbi uye kana imwe microvia ichaiswa pamusoro payo - yakazadzwa uye yakarongwa isati yawedzerwa imwe nhanho yekuvaka.

Kuyerera kwe2+6+2 kunomiririra

1. Vaka chivakwa chepakati chine nhurikidzwa nhanhatu. Matanda emukati anotorwa mifananidzo, anochekwa uye anoongororwa. Kana pakati paine mavias akavigwa, kuchera, simbi uye imwe sublamination ingangodiwa nzvimbo isati yapera.
2. Wedzera peya yekutanga yekuvaka. Ma dielectric nemhangura zveL2 neL9 zvakanamirwa pakati. Muripo wekunyoresa unobva pakufamba kwakayerwa kubva pachikamu chepakati.
3. Gadzira ma microvia epamusoro-soro. Dzorera nelaser L2-L3 neL9-L8, wozochenesa, gadzira simbi wozoisa pasi kana kuzvizadza zvichienderana nehurongwa hwepamusoro.
4. Wedzera peya yechipiri yekuvaka. Laminate L1 neL10 pamusoro penzvimbo dzakagadzirwa.
5. Gadzira ma microvia ekunze. Kuboorera neLaser L1-L2 uye L10-L9. Pedzisa kuburikidza nekuzadza/kuronga nzvimbo uko chikamu chinoda.
6. Gadzira maburi asara akadzika kana kuti akadzika zvakadzika. Kuboorwa kwemuchina, kucherwa kwemvura, uye kugadziriswa kwegomba rakaputirwa zvinorongwa kuti zvichengetedze chimiro chemhangura chakatenderwa.
7. Kushanda kwekunze, chifukidzo, kupedzisa, chimiro uye kuyedza.

Muenzaniso uyu unosanganisira muchina wekudzvanya wepakati pamwe chete nemichina miviri yekuwedzera. Kuudaidza kuti bhodhi rekuti "two-cycle" kana kuti "three-cycle" pasina kutsanangura kana muchina wekudzvanya wepakati uchiverengwa kunokonzera kuvhiringidzika kwekutenga nekugadzira. Mashoko ekuti mufambi anofanira kutaura kutevedzana kwemaitiro chaiwo pane kuvimba nechidimbu.

Chii chinochinja kakawanda chekuravira

• Kufamba kwechimiro kunoungana. Kukura kweunyanzvi uye muripo wekuboorera zvinofanirwa kunge zvichienderana nehurongwa hwezvinhu, kurongeka kwepaneru uye nhoroondo yemaitiro akayerwa.
• Kuyerera kweresin kunowedzera kudziviswa. Zvinhu zvemhangura zvakazadzwa, kuwanda kwemhangura uye kusawirirana kwemhangura munzvimbo zvinogona kukonzera nzara ye resin kana kuti ukobvu hwe dielectric husina kuenzana.
• Mhangura yepamusoro inogona kuungana. Kuputira, kuzadza uye kuputira mapaneru kakawanda zvinogona kuderedza kugona kwekucheka makona ekunze akanaka kana kuti akaungana.
• Nhoroondo yekupisa inowedzera. Kusarudzwa kwezvinhu kunofanirwa kufungwa nezvekushandiswa kwemuchina wekudzvanya nekugadzira, asi tembiricha yekuora chete haisarudze kukodzera kwawo.
• Mabhajeti ekunyoresa akasimba. Murwi wakadzama unoenderana nemifananidzo yakanyoreswa yakazvimiririra, mapatani elaser uye ma target pads.

Kutevedzana kwekugadzirwa kwacho kwakazara kunotsanangurwa mugwaro rekugadzira PCB rine zvidimbu gumi . Chinangwa chedhirowa reHDI ndechekuita kuti maitiro acho ave pachena: via yega yega inofanira kunge iine chigadziko chekutanga, chigadziko chekumira, mamiriro ekuzadza uye hukama hunobvumidzwa ne via dziri pamusoro nepazasi payo.

Kuronga Kutiza kweBGA neMepu yePitch nePin

Kukwira kwepakeji inzira inobatsira yekuongorora, asi haigone kufanotaura huwandu hunodiwa hwega. Kubuda kwekupedzisira kunoenderana nedhayamita yevhu, nzira yekusolder-mask, kubviswa kwevanhu mubhora, huwandu hwemitsara, kugoverwa kwesimba/pasi, zvinodiwa zve differential-pair, mutsipa unobvumidzwa kusvika pasi, masaini aripo uye kana nzira dzingapfuura pakati penyika kana microvia capture pads.

0.8 mm kureba

MaBGA mazhinji e0.8 mm anogona kufambiswa ne "dog-bone fanout" uye ma "vias" akaboorwa ne "mechanically", kunyanya kana package isiri grid yakazara. HDI inogona kubatsira kuderedza kuvharika kwe "through-via", kuchengetedza ma "reference planes", kana kupfupisa shanduko dzakasarudzwa dzinomhanya zvakanyanya, asi hazvifanirwe kufungidzirwa kuti ndizvo zvinodiwa.

0.65 mm kureba

Pa 0.65 mm, mhinduro dzechinyakare neHDI dzinogoneka. 1+8+1 architecture ine via-in-pad inogona kurerutsa fanout, asi sarudzo inoenderana nekuti mitsara yemukati inogona kusvikwa here pasina kutyora zvinodiwa neannular-ring, solder-mask kana routing-channel. Power-via pattern inowanzo sarudza kubudirira kupfuura nhamba yesignal.

0.5 mm kureba

BGA yakazara ye 0.5 mm inowanzo batsirwa ne microvia-in-pad. Chikamu chimwe chete chekuunganidza chinogona kukwana pa package isina vanhu kana nhamba shoma yemutsara; dense full matrix inogona kuda mazinga maviri kana kugadziriswa kwe layer assignment. Hazvina kuchengetedzeka kuvimbisa kuti package yega yega ye 16-row inogona kupukunyuka ne 2+6+2 pasina kuongorora pin map, makirasi maviri uye kugoverwa kwesimba.

0.4 mm kureba

Pakukwira kwe0.4 mm, geometry yekubata-nyika, tsananguro yesolder-mask, escape neck-down uye copper-fill planarization zvinova zvakakosha. Multi-level HDI yakajairika, asi 3+4+3 haidiwi otomatiki. Mamwe mapakeji anogona escape nematanho maviri ekuunganidza uye kucheneswa kwevanhu; mamwe anoda chero layer, finer conductors kana maitiro akafanana ne substrate. Nzira yekugadzira inofanirwa kusimbiswa usati waisa land pattern uye kuburikidza ne library.

Pasi pe 0.4 mm pitch

Mapakeji e-sub-0.4 mm anogona kushandura dhizaini kubva kuHDI yetsika yekubvisa kuenda kune yakagadziriswa semi-additive kana substrate-like. Kuchinja ikoko kunokanganisa chimiro chemuchina wekufambisa, ukobvu hwemhangura, kuongorora, kunyoreswa kwemasikisi esimbi, fomati yepaneru uye hunyanzvi hwemupi. Inofanira kubatwa sekirasi yakasiyana yemaitiro pane kushambadzirwa sesarudzo yenguva dzose ye "microvia smaller".

Chidzidzo chekupukunyuka chinofanira kupiwa sei

• mufananidzo we "layer-by-layer fanout" we "densest package quadrant";
• raibhurari ye microvia ne capture-land yakabatana ne stackup yakarongwa;
• huwandu hwenzira dzinoshandiswa dzekufambisa zvinhu padanho rega rega;
• simba nepasi kuburikidza nekugoverwa, kusanganisira kurwisa kuputika kwendege;
• kuzivikanwa kwenzvimbo yekutarisa-ndege yenzira yega yega inomhanya zvakanyanya;
• kubatana kwakadzika kunodiwa kweblind uye chero chipi zvacho chisingadzivisike kuburikidza nema stacks;
• runyorwa rwezvinofungidzirwa zvinoda mvumo yemugadziri.

Zvishandiso, Impedance uye Kuvimbika kweSignali

Kusarudzwa kwezvinhu zveHDI inzira yakabatana, kuvimbika uye sarudzo yemagetsi. Chinhu chisina kupararira zvakanyanya hachiiti kuti laminate ive yakakodzera kugadzirwa kwezvikamu zvakatevedzana, uye tembiricha yakanyanya kuora haivimbise kuvimbika kwe microvia otomatiki. Magadzirirwo chaiwo epakati neakagadzirwa kare, kurapwa kwe copper-foil, kuyerera kwe resin, kugadzikana kwehukuru, mhinduro ye laser uye resipi yekudzvanya yakakodzera zvese zvine basa.

Mibvunzo inokosha yemhando gumi yeHDI stackup

• Prepreg yakasarudzwa inowanikwa mugirazi uye resin inoburitsa ukobvu hwe dielectric hwakadzvanywa hunodiwa here?
• Mugadziri wezvinhu akatsanangura here kufamba kwezvikamu kuburikidza nehuwandu hwema "buildup press" anofungidzirwa?
• Ko resin system laser inoboora nekupukuta zvakanaka pakadzika kwe microvia here?
• Maitiro ekuzadza mhangura anogona kusangana nezvinodiwa zve planarity pasina kugadzira mhangura yakawanda pamusoro pevhu here?
• Ko laminate inotenderwa here kuti ishandiswe pakugadzirisa mamiriro ekunze uye kuti ishandiswezve pakugadzirisa mamiriro ekunze?
• Kune machaneli anomhanya zvakanyanya, dhizaini yeDk, Df uye copper-roughness inputs dziripo here pakuvaka chaiko - kwete kungotaura nezvenyaya yemhuri chete?

Mhuri dzinoshanda zvakanaka dzakadai sePanasonic MEGTRON, Isola I-Tera kana Tachyon, uye zvinhu zve laminate zvine kurasikirwa kwakaderera zvinofukidza zvinodiwa zvakasiyana zvemagetsi uye zvekugadzirisa. Hazvifanirwe kunzi zvinochinjika nekuti kukosha kwazvo kweDk kana Df kunoita sekunge kwakafanana. Kutsiva kunogona kushandura impedance, kurasikirwa neinsertion, maitiro egirazi-weave, pressed thickness, drill response uye lamination movement. Zvimwe zvinhu zvinofanirwa kudzorwa kuburikidza nerunyorwa rwakatenderwa kana mvumo yakanyorwa yevatengi mushure mekuverengerwazve kwestackup.

Kudzorwa kweimpedance munzvimbo yeHDI

Maconductor akanaka ari pedyo neminda ye microvia anonzwa mhangura yakapedzwa, ukobvu hwe dielectric, mask yekusolder, nzvimbo dzakavhurika uye chimiro che etch. Modhi ye impedance inofanira kushandisa stackup chaiyo yakarongwa uye inosanganisira chikamu chakamanikana chemutsipa-pasi apo chakakosha pamagetsi. Kukosha kweraibhurari yakafanana ne "3 mil line yakaenzana ne50 ohms" hakuchinjiki pakati pemasystem emidziyo kana huremu hwemhangura.

Pakeji yekugadzira inofanira kuratidza kirasi yega yega ye impedance ne layer, geometry, reference plane, target uye tolerance. Mutengesi anobva adzorera upamhi hwemutsetse wekugadzira uye dielectric construction kuti ibvumidzwe. TDR certification inofanira kutevedzera magwaro ekutenga uye dhizaini yakakodzera ye coupon; nhamba uye kuiswa kwema coupon zvinodiwa zvakabvumiranwa, kwete otomatiki "one per panel half" kana "one per panel quarter." Ruzivo rwakawanda runowanikwa mu impedance-control engineering guide.

Ma microvia haabvisi kudiwa kwekuongorora shanduko

Nzira pfupi yekuona jira (blind via) inowanzova ne stub shoma isingashandiswe pane nzira yekuona jira (through-via), asi shanduko yacho inosanganisira capacitance yepad, antipad discontinuity, return-path geometry uye pamwe shanduko yereference-plane. Nzira dzinomhanya zvakanyanya dzinofanira kuongororwa sedzakabatana zvakakwana. Mune zvimwe zviitiko nzira yekuona jira (back-drilled through-via) inosarudzwa pane nzvimbo yakareba ye microvia; mune dzimwe, nzira isina kudzika ndiyo mhinduro yakachena. Sarudzo inofanira kubva pakuongorora nzira uye kuvimbika, kwete kubva pamutemo wekuti HDI inogara iri nani pamagetsi.

Kukodzera, Kuedzwa Kwekuvimbika uye Kuongorora Kugadzirwa

IPC-6016 haifanirwe kutsanangurwa seyero yekugamuchirwa kwemabhodhi eHDI iripo. Yakamiswa, uye zvinodiwa zvinoenderana neHDI zvakatamisirwa kune zvinodiwa zvechigadzirwa. Kune bhodhi reHDI rakasimba rine mativi gumi, zvirevo zvekushanda kwekutanga zvinowanzova IPC-6012 pakugadziriswa uye kirasi yakataurwa mumagwaro ekutenga. Zvivakwa zveHDI zvinochinjika uye zvakasimba zvinogadziriswa zvinogadziriswa kuburikidza neIPC-6013; mabhodhi ane frequency yakakwira anogona kushandisa IPC-6018 kana zvichibvira. IPC-A-600 inopa dudziro yekuona yemamiriro ekugamuchirwa asi haitsivi zvirevo zvekushanda zvinotonga.

Nei ma microvia akaunganidzwa achida zvinopfuura kuparadzaniswa kwenguva dzose

Chikamu chakakwenenzverwa chinoongorora chikamu chidiki kwazvo chechimiro chea via uye hachigone kuratidza interface isina kusimba iyo inovhurwa chete mushure mekudzokororwa kwemvura kana kupisa. Kune zvigadzirwa zvine mazinga akawanda akaunganidzwa, kusangana kwakanyanya kana mamiriro ebasa akaomarara, hurongwa hwekufanirwa hunofanirwa kusanganisa kuongororwa kwechimiro nemota yekuyedza inotariswa nemagetsi. Kuponi chaiyo, preconditioning, nhamba yemabhasikoro, tembiricha uye muganhu wekukundikana zvinofanirwa kutsanangurwa nezvinodiwa nemutengi kana kubvumirana nemugadziri.

Zvishandiso zvinobatsira zvekugamuchira uye zvekugamuchira

• Kutevedzera gungano reConvection reflow: inoshandiswa kuratidza bhodhi kana coupon kune chimiro chakatsanangurwa chekuyerera kwemvura isati yaongororwa chimiro kana magetsi.
• Kutenderera kwekupisa kunokonzerwa nemagetsi eDC: inodziisa coupon yekuyedza yedaisy-chain nemagetsi uye inotarisa shanduko yekuramba kuburikidza nekudzokororwa kwemaitiro.
• Kuvhunduka kwekupisa kana kutenderera kwekamuri: inoshandiswa kana zvirevo zvechigadzirwa zvichida shanduko dzezvakatipoteredza dzinomiririra mamiriro ebasa.
• Kuongorora kwechikamu chidiki: inoongorora mamiriro e target-pad, mhando yekuzadza, chimiro che plating, kunyoreswa, dielectric integrity uye humbowo hwekupatsanurwa kana kutsemuka.
• Kuongorora kweAOI ne laser-drill: inoongorora zvikanganiso zveunyanzvi, kurongeka kwezvinangwa uye geometry yemaburi padanho rakakodzera rekugadzira.
• Kuedzwa kwemagetsi: inosimbisa kuenderera mberi uye kuparadzaniswa kwebhodhi rakapedzwa zvichienderana nezvinodiwa pakutenga.
• TDR: inosimbisa makuponi e-controlled-impedance kana i-impedance control yatsanangurwa.

Zvinyorwa zvekukodzera, kugamuchirwa kwenzvimbo uye zvinyorwa zvekutumirwa zvakasiyana

Chitupa chekugona kwemutengesi chinogona kuitwa nguva nenguva pachivakwa chinomiririra. Kuedzwa kwekutanga kunogona kudiwa kana paiswa zvinhu zvitsva, zvinhu kana kuburikidza ne stack. Kugamuchirwa kwezvigadzirwa kunogona kushandisa makuponi kana sampuro dzakatsanangurwa nehurongwa hwekutonga uye magwaro ekutenga. Zvinyorwa zvekutumira ndiwo mishumo inounzwa nemabhodhi. Matanho matatu aya haafanirwe kuputswa kuita chirevo chekuti bhodhi rega rega kana panel yega yega inowana bvunzo yega yega yekuvimbika.

Mutengo, Vatyairi veLead-Time uye Package yeQuote

Mutengo weHDI unokonzerwa nemaitiro ekugadzirisa uye njodzi yekukohwa, kwete nekuwedzera kwemari yakabatana nezita rekuunganidza. Mabhodhi maviri akafanana e2+6+2 anogona kudoma zvakasiyana kana rimwe rikashandisa ma microvia e100 μm akarongwa papaneru yakajairwa uye rimwe richishandisa stacked via-in-pad, ultra-fine lines, low-loss material, tight registration uye yakawanda qualification documentation.

Zvinodhura zvakanyanya uye zvinokonzeresa purogiramu

• nhamba yematanho ekuunganidza uye akavigwa kuburikidza ne sublamination;
• huwandu hwe microvia dzakatarwa kana dzakatarwa uye kukwirira kwakanyanya kwe stack;
• kuzadza mhangura, kuronga uye kudzika kwepasi kunobvumidzwa;
• upamhi/nzvimbo shoma yemuchina wekufambisa mushure mekutevedzana kweplating inodiwa;
• kuwanikwa kwezvinhu, saizi yepaneru uye nhoroondo yekugadzikana kwezvikamu;
• ukobvu hwakapedzwa, chiyero cheburi rinopinda nepaburi uye hwakasanganiswa kuburikidza nematekinoroji;
• makirasi ekudzivirira uye zvinodiwa zvemakuponi;
• kirasi yechigadzirwa, zvinodiwa zvechinyorwa chekutanga uye mishumo inodiwa;
• saizi yebhodhi, dhizaini yearray, kushandiswa kwepaneru uye goho rakafanotaurwa;
• huwandu, kupatsanurwa kwekutumira uye kana nzira yekukurumidzira iripo.

Nekuti zvinhu izvi zvinoshanda pamwe chete, chinyorwa hachiburitse huwandu hwakatarwa kana mazuva emuenzaniso akavimbiswa. Gwaro remitengo yePCB rine layer gumi rinotsanangura maitiro ekuenzanisa makotesheni pasina kuvhiringidza mutengo wezvinhu, NRE yemaitiro, maturusi ekuyedza uye logistics.

Mafaira anodiwa pamutengo weHDI weinjiniya

• Ruzivo rwekugadzira rweGerber X2, ODB++ kana IPC-2581;
• Data rekuboorera/kuronga reNC rine tafura yekutanga/yekumisa yemunhu wese asingaoni, akavigwa uye achishandisa laser;
• dhizaini yekugadzira ine ukobvu hwakapedzwa, mhangura, kupedzisa, kirasi uye mativi ekutsungirira;
• kuunganidzwa kwakarongwa kana mvumo yekuti mugadziri agadzire imwe;
• tafura ye impedance runyorwa rwechinyorwa, geometry, reference plane, chinangwa uye tolerance;
• Data reBGA kana mufananidzo wefeniti yemapakeji akakora zvakanyanya;
• zvirambidzo zvezvinhu uye mutemo wekutsiva zvinhu;
• zvinodiwa kuburikidza nekuzadza, chivharo uye planarity;
• zvinodiwa pakukodha, kuongorora, uye mushumo;
• huwandu, purogiramu yekutumira, zvinodiwa nepaneru/array uye chimiro chekuunganidza kana kuvimbika kuchienderana nekuratidzwa kwemvura zvakare.

Tumira PCB ye10 Layer HDI yeDFM neQuote

Rondedzero Yekuburitsa HDI Usati Wagadzira

Dhizaini yeHDI inongogadzirira kutaurwa chete kana buildup notation, kuburikidza nemepu uye chinangwa che routing zvichitsanangura kuvakwa kwakafanana. Pakeji yekuburitsa inofanira kuratidza yega yega isina kujeka, yakavigwa uye inopfuura nepakati; ratidza kuti ndeapi ma microvia akaunganidzwa, akarongwa, akasvetukira kana kuti ari mupad; uye taura mamiriro anodiwa ekuzadza, kuronga uye chivharo. Chidzidzo chekubuda kwepakeji chinofanira kuratidza kuti nei buildup level yega yega ichidikanwa pane kushandisa package pitch semutemo wega wekusarudza.

• Omesa midhuri yepakati, kurongeka kwekuvaka uye kurongeka chaiko kwe lamination.
• Simbisa dhayamita yelaser-via, ukobvu hwe dielectric, nzvimbo yekubata, nzvimbo yakanangwa uye chiyero cheaspect seimwe yejometri yakakodzera.
• Tsvaga ma microvia stacks anoda kuvimbika zvichienderana nechimiro.
• Dzoserai gadziriro yekugadzira uye geometry ye impedance kuti zvibvumidzwe zvisati zvaburitswa shanduko dzehunyanzvi.
• Tsanangura maumbirwo emakuponi, kuwanda kwemuenzaniso, zvinodiwa pakugamuchira uye mishumo yakaunzwa mumagwaro ekutenga.
• Kufanirwa kwemutengesi akasiyana, kubvumidzwa kwekutanga uye kugamuchirwa kwenzvimbo; hazvisi chirongwa chimwe chete chekuyedza.

Mhedzisiro inonyanya kuvimbika inowanzo kuve yakavakwa isina kuoma iyo inobvisa pasuru, inochengetedza mapurani ekutarisa uye inosangana nehurongwa hwekukodzera kwechigadzirwa. Kuwedzera imwe nhanho yekuunganidza kunogona kudzoreredza nzvimbo yekufambisa, asi zvakare kunowedzera kuunganidzwa kwekunyoresa, kuratidzwa kwekupisa, mashandiro ekuzadza/kuronga uye njodzi yekukohwa.