Dhizaini yePCB Stackup yeLayer 10 yeImpedance nePlanes

Kugadzika kwezvikamu gumi igadziriro yemagetsi uye yekugadzira, kwete runyorwa rwezvikamu zvemhangura zvakaparadzaniswa nehukuru hwe prepreg. Izvi zvinosarudza kuti ndeapi masaini ane mareferensi anoenderera mberi, kuti huwandu hwakawanda hwe routing hunowanikwa, simba rinogoverwa kupi, kuti chii chinonzi trace geometry chinogadzirwa uye kuti panel inoita sei panguva ye lamination. Nekuti zvikamu gumi zvemhangura zvinogadzira mipata mipfumbamwe ye dielectric, shanduko diki mugap rimwe chete inogona kuchinja impedance, ukobvu hwese uye symmetry.

Mienzaniso iri pazasi ndiyo nzvimbo dzekutanga kugadzira kwete ma stackups ekuburitsa zvinhu. Magadzirirwo ekupedzisira epakati neakagadzirwa kare, ukobvu hwakadzvanywa, mafoil emhangura uye ma geometries anodzorwa zvinofanirwa kusimbiswa nemugadziri. Shandisa peji rino negwara rezvinhu uye tsanangudzo ye impedance.

Sarudza Chivakwa Chekushongedza Usati Wasarudza Kukora KweDielectric

Tanga nekuisa muzvikamu dhizaini: huwandu hwenzira dzekutenderera dzinomhanya zvakanyanya, ndege dzemagetsi dzinodiwa, huwandu hweBGA escape density, zvikamu zveanalog kana RF zvinonzwa, chimiro che through-via kana HDI, ukobvu hwakapedzwa uye zvirambidzo zvemakanika. Chinangwa hachisi chekuwedzera ma layers akanyorwa kuti "signal." Chinangwa ndechekupa nzira yega yega yakakosha reference inoshanda, kuchengetedza nzira dzekudzoka dzichienderera mberi uye kuchengetedza nzvimbo yakakwana yendege yekugovera simba.

Kutungamira nzira isarudzo yechipiri. Kuisa "horizontal" uye "vertical" layers hakugadzirise stackup ine ma "high-speed signal layers" ari pedyo uye pasina reference plane. Gadzirisa chimiro chemunda nekudzoka-nzira kutanga, wozopa nzira dzaunoda zvichienderana nenzvimbo uye kuzara kwenzvimbo.

MaArchetype matatu Anobatsira eLayer 10 Stackup

Chiyero chega hachiratidzi kuti stackup yakanaka. Marongero maviri e "6 signal / 4 plane" anogona kuita zvakasiyana zvichienderana nekuti mapuraneti akaiswa kupi. Kana dhizaini ichida ma layers matanhatu esignal, chengetedza ma layers ari pedyo neplane kuti awane mambure akakosha uye isa ma signals anononoka, mapfupi kana akatenderera pa pair isina kunaka.

Muenzaniso weReference-Plane-Rich 10 Layer

Kurongeka kwezvikamu zvinotevera ndiyo nzvimbo yekutanga yakasimba yebhodhi rakasimba rine zvikamu zvina zvikuru zvezviratidzo. Rakaenzana nemagetsi munzvimbo dzakakosha dzezviratidzo uye rinogona kugadzirwa rakafanana nemechanically nekuenzanisa zvivakwa zve dielectric ne copper. Hariburitse ukobvu hwe dielectric hwepasi rose kana upamhi hwe trace.

Kurongeka uku kunopa ma "layer" maviri emukati mechiratidzo mareferensi maviri epasi uye kunochengetedza chiratidzo chega chega chekunze chiri pedyo nepasi. Nzvimbo yega yega yemagetsi yepakati ine mubatsiri wepasi wekunze. Nzvimbo yepakati yeL5-L6 inogona kusarudzwa kuti ione ukobvu hwese uye kuenzana kwemagetsi pasina kutaurwa zvisirizvo se "power-ground dracoupling pair".

Magadzirirwo anoda nzira yakawanda yekufambisa anogona kushandura ndege kuita chiratidzo, asi mhedzisiro yacho inofanira kunge yakajeka. Semuenzaniso, kushandura L6 kuita chiratidzo kunobvisa ndege ine simba rakakura uye kunogadzira chiratidzo chiri pedyo nesimba reL5 nepasi reL7. Nzira dzakakosha padanho iroro dzinofanira kudzivirira kupatsanurwa kweL5 kana kugadzirwa kuti dzitaridze L7 zvakanyanya.

Kuvhara kwePress-Out, Copper uye Impedance

Ukobvu hweprepreg mushure mekunamirwa kwesimbi hauna kuenzana nehukuru hwayo hwekatalogu isina kugadziriswa. Ukobvu hwepressed hunoenderana negirazi, huwandu hweresin, huwandu hwemhangura, kurapwa, press cycle uye kuyerera kweresin yemuno. Mugadziri anofanira kupa press-out inotarisirwa yekuvakwa chaiko uye kuratidza kushivirira kunoshandiswa mu impedance model.

Mhangura yekunze imhando yepamusoro

Matanda ekunze anotanga nefoil yebase uye anowana mhangura panguva yekuputira maburi nepattern. Modhi inodzorwa-impedance inofanira kushandisa chikamu chetrace chakapedzwa, kusanganisira chimiro chetrapezoidal etch. Matanda emukati anowanzo temwa kubva pafoil pasina kukura kwakafanana kwepattern-plating, saka trace yekunze neyemukati ine zita rimwe chete re ounce haifanirwe kunge ine geometry imwechete.

Usaburitse upamhi hwetrace usati waisa stackup

Dhirowa rinogadzirisa 50 Ω pahupamhi hwakati uku richibvumira mutengesi kuchinja dhizaini ye dielectric kunokonzera kupesana. Bvisa stackup chaiyo uye geometry, kana kutsanangura chinangwa che impedance uye kupa mvumo kumugadziri kugadzirisa hupamhi/nzvimbo mukati memiganhu yakabvumiranwa. Chero shanduko inokanganisa clearance yenzira kana pair skew inofanira kudzokera kuti mutengi atende.

Shandisa ruzivo rwakakodzera rwezvinhu

Mugadziri wemagetsi anofanirwa kushandisa Drk yakagadzirwa zvakanangana nekuvaka kana kuti yakarongwa nemagadzirirwo, kwete musoro wemhuri wakatorwa kubva papepa redata. Maumbirwo epamusoro anofanira kunge aine chifukidzo chesolder kana chiripo. Kuongorora kurasikirwa nekukurumidza kunodawo Df, roughness yemhangura uye maitiro anoenderana nefrequency; kuverenga kwe impedance chete hakukodzeri kurasikirwa kwechiteshi.

Kuvimbika Kwesimba, Nzira Dzekudzoka uye EMI

Kuswedera pedyo kwesignali-to-reference spacing kunoderedza kuyerera kwe loop uye kupararira kwemunda, asi kuvandudzwa chaiko kunoenderana ne geometry; hazvifanirwe kushambadzirwa sekudzikiswa kwe dB kwakagadzika. Ma plane pairs anogona kupa distributed capacitance, asi kukosha kwawo kunotevera hukama hwe parallel-plate uye nzvimbo chaiyo inopindirana. Dielectric yakatetepa-ground inogona kubatsira, asi haibvisi discrete dracoupling kana package inductance.

Chengetedza ndege dzinomhanya zvakanyanya dzichienderera mberi. Kana ndege yemagetsi iine zvitsuwa zvakawanda, usaise nzira dzakakosha apo simba guru rekudzoka rinofanira kuyambuka muganhu wechitsuwa. Kana chiratidzo chiri pakati pesimba nenyika, sarudza kuti ndeipi ndege iri kutarisirwa uye iva nechokwadi chekuti imwe nzira inodzorwa.

Mipendero inopinda nefenzi inogona kubatsira matambudziko eRF akasarudzwa kana matambudziko e enclosure-current, asi kukwirira kwakasimba kwakatenderedza bhodhi rega rega redhijitari hakudikanwi uye kunogona kuderedza nzira yekufambisa kana kugadzira kubooka kwendege. Kukwira nekugumisa fenzi kunofanirwa kutevedzera ma frequency akanyanya uye nzira yekuvhara iri kudzorwa.

Ronga nzira yekudzoka pakuchinja kwega kwega kwechikamu

Chiratidzo chinoshandura simba remagetsi kubva pachimiro chemutsetse wekutumira kuenda kune chimwe. Kana marongero ese ari maviri achitarisa mapuraneti epasi, ma ground vias ari pedyo anogona kubatanidza mapuraneti iwayo uye kuderedza loop yekudzoka, asi huwandu hwawo nenzvimbo yawo zvinofanirwa kutevedzera geometry yekuchinja pane mutemo wedaro repasi rose. Kana nzira ikachinja pakati pema layer anotaurwa kune ma conductor akasiyana, akadai sekuvhurirwa pasi pane rimwe layer uye power plane pane rimwe, return current inoda nzira yekufambisa nemaune. Nzira iyoyo inogona kushandisa capacitor yakaiswa zvakanaka pakati pema reference conductors, assignment yakasiyana ye layer, kana transition yakagadzirwazve inoita kuti zvikamu zvese zvirambe zvichitaridzirwa pasi.

Saka, mufananidzo we stackup unofanira kuratidza chinangwa chechinyorwa chega chega che layer inodzorwa, kwete kungonyora layer se "signal." Kuburikidza neminda, ma anti-pads uye plane clearances zvinofanirwa kuongororwa pamwe chete nekuti kurongeka kwe layer ine ruzha rwemagetsi kunogona kukanganiswa nekuchinja kunobvisa mhangura yakawanda iri pedyo.

Kuenzana, Kuenzanisa Kwemhangura uye Njodzi Yekukotama/Kutsvedza

Kuenzana kwemuchina zvinoreva zvinopfuura kungopa mazita akafanana pakati pemutsetse wepakati. Batanidza huremu hwekunze hwemhangura, zvivakwa zve dielectric uye kufukidzwa kwemhangura kunotarisirwa. Rutivi rwechikamu chine density yakakura runogona kuva nemhangura yakawanda kupfuura divi rakapesana kunyangwe kana huremu hwe foil hwakafanana; CAM thieving kana dhizaini balancing ingangodiwa.

Kugamuchirwa kwebow and twist kunodzorwa nezvinodiwa zvechigadzirwa uye zvinodiwa pakubatanidza. Kubatanidzwa kweBGA kwakapfava kunogona kuda kuti chigadziko chive chakasimba kupfuura muganho webhodhi risina chinhu. Saka, ongororo ye stackup inofanira kufunga nezvehukuru hwepaneru, pepa rebhodhi, kugoverwa kwemhangura, kucheka, kusanganiswa kwezvinhu uye nzira yekubvisa mapaneru, kwete chete kuenzana kwelayer.

Zvinhu zveHybrid, HDI uye Rigid-Flex Variants

Kuvaka kwehybrid-low-loss

Zvinhu zvisinganyanyi kurasikirwa zvinogona kuwanikwa munzvimbo dzakasarudzwa, asi gadziriro chaiyo yepakati, prepreg kana bondply inofanira kunge yakakodzera. Usaise muganho weCTE-difference uye fungidzira kuti zvinoenderana. Ongorora kuyerera kwe resin, kunamira, kupora, kufamba kwe dimensional, maitiro ekuboorera/kudonha uye kuvimbika kwemaburi akaiswa pamusoro pezvinhu zvese.

Kuunganidzwa kweHDI

Mubhodhi re1+8+1, 2+6+2 kana 3+4+3, runyoro rwechikamu runotsanangura kugoverwa kwehuwandu, kwete nzira yakazara yekugadzira yega. Chikamu chega chega chehuwandu chinowedzera mifananidzo, lamination, laser drilling, metallization uye, kana zvichidikanwa, kuzadza/kuronga. Stackup inofanira kuona microvia span yega yega, yakavigwa kuburikidza, kuburikidza kuburikidza uye kurongeka kwekugadzirwa kwezvivakwa. Kuverengwa kwepress-cycle kunofanirwa kusanganisira subcomposite yepakati uye imwe neimwe sequential buildup, uchishandisa mazwi anotsanangurwa nemutengesi.

Kurongeka kwakasimba-kuchinjika

Bhodhi rine mativi gumi harisi iro rinofambisa mativi ese gumi munzvimbo inokombama. Kazhinji mativi akasarudzwa chete anongoramba aripo asi mamwe mativi emhangura anogumira munzvimbo yakaoma. Dhizaini yacho inofanira kuratidza huwandu hwe flex-layer, kuvaka kusina kunamira kana kunamira, chifukidziro, stiffeners, mhando yemhangura, divi rekukombama uye basa risingachinji kana rinoshanduka. IPC-2223 ndiyo dhizaini; mashandiro ebhodhi anochinjika uye akasimba anogadziriswa neIPC-6013.

Pakeji Yekuburitsa Stackup neGedhi reDFM

Muunganidzwa wezvigadzirwa unofanirwa kugadziriswa uye unosanganisira zvikamu gumi zvemhangura, mipata mipfumbamwe ye dielectric, giredhi rezvinhu nekuvakwa, chimiro chepakati/prepreg, ukobvu hwezita uye hwekushivirira, mhando yemhangura nehukobvu, ukobvu hwebhodhi rakapedzwa, zvivakwa zvinodzorwa, kuburikidza ne spans uye chero zvinyorwa zve sequential-lamination.

Pedzisa gedhi iri usati wasaina gwaro rekushandisa. "Kutevedzana kwekupedzisira mushure mekutumirwa kweGerber" kunomanikidza shanduko dzehunyanzvi dzinodzivisika uye kunogona kukanganisa kutevedzera nguva nechiteshi. Tumira kuvaka kuburikidza neongororo yeDFM netafura yekudzivirira inodzorwa uye fungidziro dzekufambisa dzakakosha.

Zvikanganiso Zvakajairika zveStackup uye Migumisiro Yazvo

Kuverenga mabasa zvisirizvo

Tafura ine zvikamu zvitanhatu zvezviratidzo asi iine zvikamu zvina chete zvezviratidzo inokanganisa chikonzero chose chekugadzira. Verenga mashandiro emhangura zvakananga uye simbisa nzvimbo yekutarisa yechiratidzo chega chega.

Kusiya mipata ye dielectric

Matanho gumi emhangura anoda kupatsanurwa kwe dielectric mapfumbamwe. Tafura inoronga matanda akasarudzwa e dielectric chete "pasi" pe "matatu" akasarudzwa inowanzosiya kana kuverenga kaviri mipata uye haigone kuenderana neukobvu hwakapedzwa.

Kushandisa upamhi hwetrace hwepasi rose

Zviyero zve50 Ω kana 100 Ω zvakagadziriswa zvakakopwa kubva kune chimwe chivakwa hazvifanirwe kuonekwa semitemo yekugadzirira kugadzirwa. Zvinofanira kuverengerwazve nemuenzaniso chaiwo we dielectric, copper uye material.

Kudana ndege mbiri dzemagetsi kuti peya inopatsanurana

Kukwanisa kushandisa plane capacitance kunobatsira pakati pemaconductors ane chaji yakatarisana, kazhinji simba nepasi. Maplane maviri emagetsi ari pedyo panjanji dzakasiyana haasi kutsiva peya yemagetsi-pasi uye anogona kukonzera kubatana pakati penjanji.

Kufungidzira kuti mavara emagetsi anogadzira kuenzanisa kwemakanika

Kurongeka kwemhangura kunoenderana nezvinhu, ukobvu uye kugoverwa kwemhangura. Mazita emadziro emhangura haana kukwana kana rumwe rutivi rune mhangura yakakora uye rumwe rusina nzira yakakwana yekufamba.

Gadzirisa Ukobvu Hwapera Usati Waburitsa Marongerwo

Ukobvu hwebhodhi hunobva pamipata mipfumbamwe ye dielectric yakadzvanywa, zvikamu gumi zvemhangura, mupiro we plating uye tsika yekuyera yemutengesi. Huwandu huri nyore hwe catalog cores uye prepregs hunogona kunge husina kunaka nekuti mhangura inopinzwa mu resin uye plating yekunze inowedzerwa mushure mekunyungudika. Stackup inoburitswa inofanira kuratidza kukosha kwakayerwa kwemutengesi uye tolerance, wobva wasimbisa kuti zvinodiwa zve connector, press-fit, card-edge uye enclosure zvinoshandisa tsananguro imwe chete.

Kushivirira ukobvu kunochinjawo impedance uye back-drill geometry. Dhizaini iri pedyo nemuganhu we contact range ye connector kana controlled-depth window inogona kuda kudzorwa kwakasimba kwekuvaka kupfuura bhodhi remazuva ese. Kana bhodhi rakatetepa richikurudzirwa kuderedza kuburikidza nehurefu, tarisa kuomarara, assembly handling, warpage uye connector compatible pane kungotora ukobvu se electrical variable chete.

Kudzora kugadziriswa kweStackup

Ipai kugadziriswa kwese kwakabvumidzwa kwestackup uye batanidzai dhizaini yekugadzira, tafura yeimpedance, modhi yekufananidza uye mutemo wekurongeka wakaiswa kune iyo revision. Shanduko inorongwa nemutengesi mu core, prepreg, copper kana material inofanira kugadzira stackup yakatsvuka uye kuona kuti ndeapi ma geometries anodzorwa anochinja. Izvi zvinodzivirira kuchinja kudiki kwekutenga kubva pakukanganisa zvirambidzo zve routing chinyararire.

Mhedzisiro yedanho repaneru

Mutsetse webhodhi rimwe chete unogona kuita zvakasiyana kana wakarongedzwa pane imwe panel yekugadzira. Kuba mhangura, dhizaini yechitima, kuiswa kwemakuponi, kurodha mapoinzi uye kurongeka kwezvinhu zvinopatsanurwa zvinogona kukanganisa kufanana kweukobvu uye kutenderera/kutenderera. Isa panelization muongororo yekutanga kana kutsamira, kudzika kwakadzorwa kana kuti impedance sampling kwakakosha.

Heavy Copper, RF uye Thermal Special Constructions

Mhangura inorema inochinja kupfuura simba rayo remazuva ano. Foil yakakora inoda kuomeswa zvakanyanya, inokanganisa kutsvedza kwenzvimbo nenzvimbo, inowedzera kudiwa kwe resin panguva yekunyungudika uye inogona kuita kuti kuenzana kwemhangura kuve kwakaoma. Bhodhi rine zvidimbu gumi rine zvidimbu zvine simba guru rinogona kuda zvivakwa zve prepreg zvakazadzwa ne resin, stepped copper kana localized bus structures pane kuti mhangura inorema zvakaenzana pachikamu chimwe nechimwe. Mutengesi anofanira kupa geometry inogoneka yeukobvu hwemhangura chaihwo uye saizi yepaneru.

Matanda eRF anogona kuiswa kunze kana mukati me hybrid stackup zvichienderana nekusvika kwekuvhura, kudzivirira uye kugadzirisa zvinhu. Zvivakwa zveRF zvinodzorwa zvinogona kuda pasi pe coplanar, kuburikidza nefenzi, cavity kana edge plating uye kupera kusina nickel mumashandisirwo akasarudzwa. Zvinhu izvi zvinofanirwa kubatwa sedhizaini chaiyo ye distributed-circuit; IPC-2228 uye gwara remupi wezvinhu zvakasarudzwa zvinogona kunge zvakakosha. Hazvifanirwe kuderedzwa kuita "kushandisa specialty low-loss laminate paL1."

Mari dzemhangura dzakaiswa mukati, zvinhu zvinopisa uye zvinoparadzira kupisa zvesimbi zvinogadzira ukobvu hwenzvimbo, plating uye lamination. Ma interfaces adzo, kupatsanurwa, planarity uye nzira yekupisa zvinofanirwa kutsanangurwa usati waburitsa stackup. Chinhu chinopisa chinogona kukanganisa impedance iri pedyo kana warpage kana chikawedzerwa mushure mekushandisa nzira. Rongedza muenzaniso wekupisa, dhizaini yemakanika uye kurongeka kwezvikamu zvemagetsi sedhizaini imwe chete.

Kune chero chivakwa chakakosha, kumbira kudhirowa kwechikamu chakasiyana uye mhinduro yeDFM yakanangana nemaitiro. Tafura yehukuru hwegumi haifanirwe kureva kuti sarudzo yega yega yesimbi ine mhangura, RF, flex uye embedded-thermal inogona kusanganiswa pasina chitupa chepurojekiti.

Kudzora Kuchinja KwemaStackup Mushure mekunge Marongerwo Atanga

Kana mitemo yekufambisa zvinhu, zvinangwa zvekunonoka uye mamodheru echiteshi zvabatanidzwa kune stackup yakatenderwa, shanduko yezvinhu kana yekuvaka ishanduko yeinjiniya kwete yekutsiva kutenga. Shanduko pakuvaka kwepakati kana prepreg, resin content, copper foil, finished copper, solder mask, via span kana lamination sequence zvinogona kukanganisa zvirambidzo zvekugadzira zvinopfuura chimwe panguva imwe chete.

Kana kutenga kuchida ukobvu hwe dielectric hwakasiyana, dzokorora kuongorora kwemagetsi nekwemakanika. Kuchinja prepreg imwe chete kunogona kuchinja upamhi hwetrace, nzvimbo yepakati, kunonoka kwekupararira, ukobvu hwese uye kuenzana kwe resin. Dhirowa yakagadziridzwa inofanira kuratidza chivakwa chitsva pane kuchengetedza nhamba yekare yekudzokorora. Iyi nzira inonyanya kukosha kana stackup ikashandiswazve muzvigadzirwa zvakasiyana-siyana kana nzvimbo dzekugadzira.

Rondedzero Yekutarisa Kusaina KweStackup

Muchina wekuisa zvinhu wagadzirira kuburitswa kana magadzirirwo emagetsi nezvinhu zvinogadzirwa zvagadziriswa. Pakeji yekusaina inofanira kuratidza zvikamu gumi zvemhangura uye mipata mipfumbamwe ye dielectric, kuziva nzvimbo yekutarisa yechikamu chega chega chechiratidzo chinodzorwa, uye kuvhara kuverenga kwekupedzisira kweukobvu uchishandisa ma pressed-not catalog-dielectric values.

• Simbisa mashandiro echikamu, kuenderera mberi kwereferensi uye kupatsanurwa kwechikamu chemagetsi.
• Kuenzanisa kugadzirwa kwe dielectric, kugoverwa kwemhangura nezvinhu zvakakosha zvine chekuita nenzvimbo yemakanika kana zvichibvira.
• Tsvagai nzira chaiyo yepakati, prepreg, resin-content uye copper-foil inoshandiswa mumhando dze impedance ne loss.
• Gadzirisa HDI sublaminations, buried vias, flex transitions uye hybrid-material bonds usati wanyora nhamba dzekupedzisira.
• Upamhi hwekugadzira zvinhu, mipata miviri uye ukobvu hwakapedzwa kuti zvibvumidzwe.
• Kiya kugadzirisa stackup usati wapedza kugadzirisa zvirambidzo zve routing uye mitemo yekufananidza kunonoka.

Dhirowa rinobatsira rekugadzira zvinhu zvakasiyana-siyana rinosanganisira muganhu wemagetsi uye murairo wekugadzira. Kana risingakwanise kutsanangura nzira yekudzoka, ukobvu hwese, kugadzirwa kwemhangura uye kutevedzana kwelamination, harisati ragadzirira kuburitswa.