Dhizaina Matambudziko uye Anoshanda Mhinduro dze6oz uye 10oz Inorema Mhangura PCBs

MaPCB emhangura ane 6oz copper PCB uye 10oz copper PCB configurations ave akakosha mumashandisirwo ane simba guru anosanganisira masisitimu ekudzora mota dzemagetsi, maindasitiri emagetsi, uye madhiraivha e LED ane simba guru. Kusiyana nemabhodhi emhangura akajairwa (anowanzoita 1oz), magadzirirwo aya ePCB emhangura ane simba guru anofanira kubata current load yakakwira zvakanyanya uku achichengetedza structure yakasimba uye kushanda zvakanaka kwekupisa.

Kugadzira uye dhizaini yemabhodhi emhangura akanyanya kukora anounza matambudziko einjiniya akasarudzika anoda ruzivo rwakanyanya mumaitiro enyama, maitiro ekugadzira, uye hunyanzvi hwekuunganidza.

Dhizaina Zvinetso zveHeavy Copper PCBs

1. Tevera Upamhi uye Kuganhurwa kweChipamhi mu6oz uye 10oz Mhangura PCB

Heavy copper PCB dhizaini inoisa zvinoomesesa zvinodiwa paudiki hwekutevera hupamhi uye nzvimbo nekuda kwekuwedzera kwemhangura ukobvu. Paunenge uchigadzira nzira dzemazuva ano dzinotakura 6oz yemhangura PCB application, mainjiniya anofanirwa kuzvidavirira kune ese magetsi ekuita uye manufacturability zvipingaidzo. Iyo etching process yemhangura yakakora inogadzira maenji eparutivi, inoda nzvimbo yakafara pakati pematanho kana ichienzaniswa neyakajairwa huremu hwemhangura kudzivirira zvikabudura uye kuve nechokwadi chechokwadi chekugadzira goho.

Kuverenga simba rekutakura zvinhu panguva ino kunofanirwa kufunga nezvekurasikirwa kweI²R, izvo zvinonyanya kukosha munzira dzine simba guru. Semuenzaniso, trace yePCB yemhangura ye10oz inotakura 50 amperes inoda upamhi hweinenge 0.5 inches (12.7mm) kuti irambe ichikwira tembiricha ye10°C, zvichienzaniswa ne1.5 inches (38mm) yemhangura ye1oz. Vagadziri vanofanirwa kushandisa mafomula eIPC-2221 kana maturusi ekuverenga akavimbiswa kuti vaone zviyero zvetrace zvakachengeteka zvinodzivirira kupisa kwakanyanya pavanenge vachisangana nezvipingamupinyi zvenzvimbo.

2. Lamination uye Layer Stack-up Nyaya

Iyo lamination process ye10oz yemhangura PCB yekuvaka inopa matambudziko akakura ane chekuita nebhodhi flatness uye layer adhesion. Makobvu emhangura akaturikidzana anogadzira kusaenzana kwekumanikidza kugovera panguva yekutsikirira, zvichitungamira kune ingangoita uta, twist, uye delamination kutadza. Iyo coefficient yemafuta ekuwedzera kusawirirana pakati pemhangura (17 ppm/°C) uye FR-4 dielectric zvinhu (14-17 ppm/°C muXY direction) inowedzera matambudziko aya panguva yekutenderera tembiricha.

Kugoverwa kwemhangura kwakafanana pakati pezvikamu zvakakosha pakuderedza kukanganiswa kwemhangura mukugadzirwa kwePCB dzemhangura dzakakora. Kana rumwe rutivi ruine mhangura yakawanda kupfuura rumwe, simba rekuwedzera rinoita kuti bhodhi rirambe richichinja. Dhizaini chaiyo yezvikamu inoda mapatani emhangura akafanana negirazi panzvimbo dzakatarisana pese pazvinogoneka, zvichienzanisa kugoverwa kwemhangura kuti pave nerutivi rwakati sandara rwemuchina.

3. Solderability uye Gungano Matambudziko

Kupisa kwehuremu hwemhangura gobvu kunopa zvakakosha solderability nyaya panguva yechikamu musangano pane 6oz copper PCB magadzirirwo. Maprofiles akajairika akagadziridzwa mabhodhi emhangura e1oz anoratidza kuti haana kukwana nekuti mapedhi emhangura anorema anoita semazino ekupisa, achidzivirira solder kuti isasvike tembiricha yekunyungudika (kazhinji 183 ° C yeSnPb kana 217 ° C yeSAC305). Izvi zvinoguma nekutonhora kwemasoja majoini, kusakwana kunyorova, uye kusavimbika kubatanidza magetsi.

Kusarudzwa kwepamusoro pekupedzisira kunokanganisa zvakananga mitengo yekubudirira kwegungano pamabhodhi anorema emhangura. Iwo anonyanya kupedzisa kupedzisa kwe6oz uye 10oz copper PCB magungano anosanganisira:

• ENIG (Electroless Nickel Immersion Gold) -Inopa yakanakisa solderability uye inomira akawanda reflow mitsetse pasina kushatisa.
• Kunyudza Sirivha - Inopa kugadzikana kwakanaka kwekupisa uye inodhura-inoshanda kuchengetedza kune inorema mhangura nzvimbo.
• HASL (Hot Air Solder Leveling) - Inoburitsa yakasimba solder coating asi inoda kudzora nekungwarira nekuda kwenjodzi yekuvhundutsa yekupisa pamhangura yakakora.
• OSP (Organic Solderability Preservative) -Inopa yakaderera mutengo sarudzo asi inoda yakasimba maitiro ekutonga uye shoma pasherufu hupenyu.

4. Thermal Management Zvinodiwa

Kunyange hazvo ukobvu hwemhangura hwakakwira mumagadzirirwo ePCB emhangura anorema huchiwedzera kufambiswa kwekupisa (mhangura: 400 W/m·K), hazvigadzirise matambudziko ekugadzirisa kupisa otomatiki . Kugadzirwa kwekupisa kunonyanya kutarisisa zvikamu zvemagetsi uye madonhwe emagetsi akakwira, zvichida dhizaini yenzira yekupisa nemaune kuti iparadzire kupisa zvinobudirira muchimiro chebhodhi.

Thermal kuburikidza nearrays akaiswa zvine hungwaru pasi pemagetsi emagetsi anopa akakosha akatwasuka ekutamisa nzira dzekufambisa mu6oz uye 10oz mhangura PCB magadzirirwo. Iko kupisa kwekupokana kuverenga kunoenderana kuburikidza nedhayamita, huwandu, uye plating ukobvu. Semuyenzaniso, imwe chete 12 mil (0.3mm) kuburikidza ne 1 mil plating ine inokwana 70°C/W yekupisa kwekudzivirira, inoda 10-15 vias muhurongwa kuti ibudirire kuchinjisa kupisa kwezvikamu zvinorasa 5-10 watts.

Inoshanda Solutions ye6oz uye 10oz Copper PCB Dhizaini

1. Optimized Stack-up uye Copper Distribution

Kuita symmetric layer gadziriro inoderedza kushushikana kwemakanika uye warpage mune inorema mhangura PCB yekugadzira. Paunenge uchigadzira bhodhi-nhanhatu ine 6oz yemhangura pamatanda ekunze, huremu hwemhangura hwemukati hunofanirwa kuenzana kuti hugadzire kurongeka kwekwakarerekera. Semuenzaniso, gadziriso inoshandisa 6oz-1oz-1oz-1oz-1oz-6oz inogovera masimba ekuwedzera zvakaenzana panguva yekudziya kutenderera, kuchengetedza bhodhi flatness mukati mekugadzira uye kushanda kwehupenyu.

2. Trace Width uye Current Capacity Optimization

Kuverenga kwakaringana kwehupamhi hwemhangura inorema inoda kutariswa kwe tembiricha yeambient, kukwira kwetembiricha inogamuchirika, uye copper thermal conductivity properties. Iwo anoshanda magadzirirwo ekufunga kwe10oz yemhangura PCB yazvino nzira dzinosanganisira:

• High current traces -Shandisa hupamhi hudiki 0.3-0.5 inches pamhepo inodarika makumi matatu amperes kuchengetedza tembiricha yakachengeteka.
• Parallel trace routing -Govera mitoro kune akawanda maconductor kana nzvimbo ichibvumidza, kuderedza kushushikana kwemunhu ne40-60%.
• Makona akakomberedzwa - Tsiva 90-degree angles ne45-degree kana curved traces kuti uderedze kutsvikinyidzana kwazvino.
• Nzvimbo yakakwana -Chengetedza zvishoma 0.020-0.030 inches pakati pezvinorema zvemhangura maficha kuti uve nechokwadi chekugadzirwa kwakavimbika.

3. Enhanced Soldering Process Control yeHeavy Copper PCB

Kugadzirisa reflow profiles zvakananga kune inorema mhangura maassemblies inovimbisa yakavimbika solder majoini ekuumbwa pa6oz uye 10oz copper PCB dhizaini. Yakawedzerwa preheat zones (150-180 masekondi pa150-180 ° C) inobvumira zvishoma nezvishoma tembiricha yakaenzana pane dzakakora mhangura maficha isati yasvika peak reflow tembiricha. Iyo nguva iri pamusoro pe liquidus inofanira kuwedzerwa ne20-30% kana ichienzaniswa neyakajairwa profiles, kazhinji 60-90 masekonzi pachinzvimbo 40-60 masekonzi.

Pad geometry magadzirirwo anovandudza kupisa hunhu panguva yegungano maitiro. Kukudza nzvimbo dzepadhi ne15-25% kupfuura zvishoma zvinodikanwa zvinowedzera kutarisana nesolder paste, kunatsiridza maitiro ekunyorova. Strategic placement of thermal relief spokes (kazhinji 4 spokes pa 0.015-0.020 inches wide) kubatanidza mapedhi kumhangura inodurura zviyero zvegungano zvinodiwa nekushanda kwekushisa kwekushanda.

4. Controlled Lamination Processing

Matanho-lamination matekiniki anogadzirisa akasarudzika matambudziko ekutsikirira anorema mhangura akaturikidzana nekuvaka bhodhi chimiro zvishoma nezvishoma kwete mukutenderera kumwe chete. Kune 10oz yemhangura yePCB kugadzirwa, vagadziri vanowanzo tsikirira matanda ekunze kutanga nemacores, vobva vawedzera mamwe asara mumabasa ekudhinda anotevera. Iyi nzira inobvumira zvirinani kuyerera kwe resin kuyerera uye inoderedza yakavharirwa njodzi dzemhepo pakati pehukomba hwemhangura maficha uye prepreg zvinhu.

Tembiricha uye kudhindwa kweprofile kugadziridzwa kunoenderana nekupisa kwehuwandu hwemisiyano mune gobvu mhangura zvinhu. Mamiriro ekudhinda akajairika anosvika ku90-120 maminetsi pa170-180 ° C nekumanikidza kubva ku300-400 PSI, zvichienzaniswa ne60-90 maminetsi pa150-170 ° C kumabhodhi akajairwa. Vacuum-assisted lamination inobvisa magasi akavharirwa zvakanyanya mukuvaka kwemhangura inorema uko kwakajairwa kudzvanywa kwemuchadenga kunogona kuratidza kusakwana.

5. Comprehensive Thermal Management Strategy

Kugadzirisa huremu hwemhangura pakati pezvikamu kunovandudza mashandiro ekupisa uye kugona kugadzira zvinhu mukugadzirwa kwePCB dzemhangura dzinorema . Kushandisa mhangura ye10oz pazvikamu zvekunze kuti uwane simba guru remagetsi uku uchichinja kuita huremu hwe4oz kana 2oz pazvikamu zvemukati kunoenzanisa zvinodiwa pakushanda nematambudziko elamination. Iyi nzira yehybrid inochengetedza nzira dzakakosha dzemagetsi uku ichideredza ukobvu hwebhodhi rose uye kuoma kwekugadzira.

Mhangura yakasimba inodururwa pamatanda ekunze anoshanda seanoparadzira kupisa anobudirira kana akanyatsobatanidzwa nendege dzemukati dzinorema dzemhangura kuburikidza neyakakwana kuburikidza nezvimiro. Thermal dhizaini yekufunga inosanganisira:

• Via spacing - Position thermal vias pa 0.050-0.080 inches centre-to-center spacing yekunyatsopisa kupararira pasi pezvinhu zvemagetsi.
• Yakazadzwa vias -Shandisa mhangura-yakazara uye yakavharwa vias kubvisa mhepo mikaha uye kuderedza kupisa kwekupisa ne30-40% zvichienzaniswa neasina kuzadzwa.
• Maitiro ekuyamura kupisa - Kuenzana pakati pesimba remagetsi (4 spokes shoma) uye thermal performance (yakataura yakafara 0.020-0.030 inches).

mhedziso

Kubudirira kugadzira nekugadzira 6oz yemhangura PCB uye 10oz yemhangura PCB zvigadzirwa zvinoda kunzwisiswa kwakadzama kwemaitiro enyama, zvipingaidzo zvekugadzira, uye zvinodiwa zvemagungano zvakasarudzika kune inorema yemhangura kuvaka. Matambudziko ekutanga anosanganisira kuteedzera hupamhi kuganhurirwa, kuomarara kwelamination, kunetsekana kwekutengesa, uye zvichemo zvekutonga kwemafuta zvinogona kugadziriswa nenzira yakarongeka kuburikidza neakasimbiswa dhizaini mazano uye magadzirirwo ekugadzira.

Sei tichifanira kusarudza Highleap Electronics yekugadzira PCB dzemhangura dzinorema ? Zvigadzirwa zvedu zvinosanganisira:

• Advanced kugadzira tekinoroji - Yakasarudzika yekumisikidza michina uye maitiro ekudzora e6oz kusvika 10oz mhangura PCB kugadzirwa ine idiki warpage.
• Dhizaini engineering rutsigiro - Yakakwana DFM yekuongorora masevhisi ekukwidziridza inorema mhangura marongero ekugadzira uye kuita kusati kwatanga kugadzira.
• Quality assurance - Yakaomarara yekupisa bhasikoro, kuyambuka-chikamu, uye magetsi ekuyedza mapuroteni anovimbisa kuvimbika mukushandisa-simba repamusoro.
• Gungano unyanzvi - Yakakwenenzverwa reflow profiles uye yakasarudzika masheji maitiro akagadziridzwa akakora endarira bhodhi musangano.

Bata timu yedu yeinjiniya kuti mukurukure zvinodiwa nePCB yenyu yemhangura yakawanda uye muwane nhungamiro yehunyanzvi pakugadzirisa magadzirirwo ezvishandiso zvenyu zvine simba guru.