Bofu kuburikidza nePCB: Mitemo Yekugadzira, Mhando dzeKuvaka, Mutengo uye Gwaro

Blind via PCB ibhodhi redunhu umo vias imwe kana dzakawanda dzinobatanidza jira rekunze remhangura kune rimwe jira remukati chairo pasina kupinda muukobvu hwebhodhi rose. Buri rinotanga pamusoro uye rinomira — chaizvo — pamhangura yemukati inotarirwa, iyo inoshanda senzvimbo yekugumisa chaiyo panguva yekuboorwa nelaser. Chinhu chimwe chete ichocho chinoparadzanisa blind via PCB kubva kumabhodhi akajairwa akawanda nenzira nhatu dzinotevera: via inotora chete zvidimbu zvainobatanidza pane kushandisa nzvimbo yekutenderera pakati pezvidimbu zvese; dhayamita yepad idiki (kazhinji 0.25–0.35mm zvichienzaniswa ne0.50–0.70mm yegomba rinopinda nepakati), zvichiita kuti fanout geometry isingakwanisike geometrically ne mechanical drilling; uye via haina stub yemhangura isina kushandiswa pasi pe signal exit layer, ichibvisa quarter-wave stub resonances inoparadza nzira dziri pamusoro pe10 Gbps. Gwaro iri rakanyorerwa mainjiniya emidziyo, vagadziri vePCB, uye mainjiniya ekutsvaga vanoda kuita sarudzo dzechokwadi nezvemaPCB asingaonekwe — kana vachizoashandisa, rudzi rwekuvaka rwupi, mitemo yekugadzira ipi isingakurukurwe, uye chii chinoparadzanisa mugadziri anokwanisa kubva kune uyo anokundikana kana awanda.

Tora Mutengo weBofu kuburikidza nePCB

Chii chinonzi bofu kuburikidza nePCB - uye chii chinoita kuti chisiyane?

Magadzirirwo Ematatu muHDI Boards

Nei Mapofu Achiwedzera Kuwanda Kwenzira

Pabhodhi rine zvidimbu gumi, jira rinopinda nepaburi rinotakura chiratidzo kubva kuL1 kuenda kuL2 asi rinotora nzvimbo yepad pazvidimbu zvese gumi. Dare rega rega rinopinda nepaburi rinorasikirwa negwara rekufambisa jira rega rega mudhizaini. Ne zvidimbu zve signal zvinopinda nepaburi mazana maviri pabhodhi rakakora, chirango chekufambisa jira chinowedzera mudungwe rese rejira.

Blind via kubva kuL1 kuenda kuL2 inoshandisa zvikamu zviviri chete. Zvimwe zvikamu zvisere hazvina pad vhara kubva kuviyo iyoyo zvachose. Pamwe chete nepad dhayamita diki — 0.10mm blind via ine 0.30mm land pad zvichienzaniswa ne 0.30mm drill ine 0.60mm pad yechiratidzo chakajairika kuburikidza — izvi ndizvo zvinoita kuti 0.50mm ne 0.40mm pitch BGA fanout zvikwanisike. Pamapitches iwayo, geometric contraindication yakakwana: dhayamita yepad-plus-annular-ring ye through-hole via inopfuura nzvimbo yepitch, saka blind via haisi sarudzo yekuita asi chinhu chinodiwa pa topological.

Tsanangudzo yeIPC-T-50M

Maererano neIPC-T-50M, microvia (izwi rinoshandiswa muIPC standards kune laser-drilled blind via) i blind structure ine aspect ratio yepamusoro ye1:1 uye hudzamu hwese husingapfuure 0.25mm hwakayerwa kubva pa capture land foil kuenda kunyika yaunoda. Zvivako zvinopfuura kudzika uku kana aspect ratio hazvipindi muIPC microvia definition uye zvinoda kuongororwa kweinjiniya kuti plating ive yakavimbika. Iyi haisi gwara - ndiyo muganhu unotsanangura kana copper plating chemistry inogona kusvika pasi pe via barrel.

Zviitiko Zvitatu Apo Mapofu Mavhiya Ari Sarudzo Yakarurama Yeinjiniya

Madhizaini mazhinji haadi ma "blind vias". Sarudzo yacho inofanira kutungamirirwa nechimwe chezvinhu zvitatu zveinjiniya, kwete nechido chekuoma kwebhodhi kana pfungwa yekuti HDI inoratidza mhando yepamusoro.

Chiitiko 1: Chikamu Chinopa Simba reKukwira Kwemajiyometiki

Iyi ndiyo nzira yakajeka uye inowanzo shandiswa. Pa 0.65mm BGA pitch, 0.30mm yakaboorwa neburi rine 0.15mm annular ring padivi rega rega inoda 0.60mm pad — isina kukwana mukati me 0.65mm ball space. Pa 0.50mm pitch, geometry imwecheteyo inokundikana: 0.60mm pad > 0.50mm pitch. 0.10mm blind via ine 0.30mm land pad inokwana mukati me 0.50mm ine margin.

Pakukwira kwe0.40mm, muganho unowedzera kusimba. Kunyangwe 0.10mm blind vias dzingada configuration ye via-in-pad — kuisa via zvakananga mukati meBGA land pad — nekuti hapana nzira ye routing iripo pakati pema pads ari pedyo kuti pave nekubuda kwetsika. Iyi haisi nzira ye routing; fanout geometry haina imwe mhinduro.

Chiitiko chechipiri: Kuburikidza neStub Resonance Kunoderedza Kuvimbika kweSignali Pamusoro pe ~10 Gbps

Gomba rinopinda nepakati rinobatanidza L1 neL4 pabhodhi rine zvidimbu gumi nematanhatu rinosiya stub yemhangura kubva kuL4 kuenda kuL16. Stub iyoyo inoita setambo yekutumira isina kuvharwa. Mafambiro ayo e quarter-wave resonant ndeaya:

f = c / (4 × L_stub × √ε_r)

Kune stub ye1.5mm muFR4 (ε_r ≈ 4.3), resonance iyi inoitika pa12 GHz. Pafrequency iyoyo, stub inoratidza simba rechiratidzo kudzokera muchiteshi, zvichigadzira notch yekurasikirwa kweinsertion inogona kudarika 15 dB - njodzi kune chero interface yeSerDes inoshanda pedyo kana kupfuura frequency iyoyo. Sekureva kweIEEE 802.3 100GBASE-CR4, kurasikirwa kukuru kweinsertion pa12.5 GHz i1.5 dB pa via; stub ye1.5mm inodarika iyi nehukuru hwakakura.

Kuboorera kumashure kunobvisa chikamu chikuru chestub asi kunosiya chikamu chakasara che 0.1–0.2mm nekuda kwekugona kwekuisa mabhora panzvimbo yacho. Kune machannel ari pa56 Gbps PAM4 (28 GHz Nyquist) zvichikwira, stub iyi yakasara inoramba yakakosha pamagetsi. Blind via haina stub pakuvaka - ndiyo chete nzira inobvisa zvachose stub resonance pasinei nekuwanda kwayo.

Kune PCIe Gen 3/4 neDDR4 dzinoshanda pa8–16 Gbps, stub resonance modelling inokurudzirwa usati wasarudza blind vias — back-drilling pabhodhi yakajairwa inogona kukwana uye isingadhuri zvakanyanya. Kune 112G SerDes, PCIe Gen 5/6, uye DDR5-6400+, blind vias inowanzo kuve mhinduro chaiyo yeinjiniya.

Chiitiko chechitatu: Zvipingamupinyi zveNzvimbo yeBhodhi Hazvigone Kuzadzikiswa neStandard Multilayer

Dhizaini inogona kufamba zvakanaka pabhodhi remachira masere pa110×85mm asi inofanira kukwana nzvimbo yakavharirwa ye85×65mm. HDI ine blind via fanout uye via-in-pad inodzoreredza nzvimbo yacho nekuderedza tsoka ye per-via pad uye kubvumira BGA escape routing zvakananga mu via pasi pepad, zvichibvisa nzira yekubuda zvachose. Bhodhi reHDI rinodhura zvakanyanya pa square centimeter asi mutengo wese we assembly ungave wakaderera kana bhodhi diki rikadzikisa mutengo we enclosure, huremu, kana kuoma kwe assembly. Uku kutengeserana kwe system-level kunoda kutevedzera mutengo kwakarurama, kwete kufungidzira kwe default.

Ma "blind vias" haasi iwo sarudzo isiriyo kana: BGA pitch iri ≥0.65mm ine nzvimbo yakakwana yebhodhi; ma signal frequency ari pasi pe5–10 Gbps uko stub resonance isingayereki; nzvimbo yebhodhi haina muganho; kana chigadzirwa chiri muchikamu chekutanga che prototype uko kunotarisirwa kugadziriswa kwedhizaini uye nguva yekutanga yeHDI (mazuva 8–21 zvichienzaniswa nemazuva 5–7 e "standard multilayer") zvichinonotsa kudzokorora.

Mitemo yeMagadzirirwo eMapofu: Kubatanidza Masheya, Saizi yePad, Chiyero cheAspect, uye Via-in-Pad

Kubatanidza Zvikamu: Chirambidzo Chisingakurukurwe Chemuviri

Kabhini kanopenya rakareba divi rimwe chete redhielectric. Laser inoputika nepakati pekunze kwekugadzira uye inomira padanda rekutanga remhangura rainosangana naro — kuti mhangura yemukati ndiyo nzvimbo yekumira chaiyo. Hazvigoneki kuti divi rimwe chete rebhandi ribatanidze L1 kuL3 muchivako chine mhangura yeL2 pakati pavo; mhangura yeL2 inogumisa laser isati yasvika kuL3.

Iyi ndiyo chikanganiso cheHDI chinodhura zvikuru, uye haina mhinduro inodhura. Dhizaini inoratidza L1→L3 blind vias muType I (1+N+1) build inoda kugadziriswa kwakazara kweHDI escape layers kana yabatwa paDFM review. Mutemo wacho uri nyore kutaura uye unowanzo tyorwa: muType I build, blind vias dzinobatanidza L1 kuL2 chete (uye dzinoratidzwa pasi seL(n)↔L(n-1)). Kubatana kwematanho maviri kunoda Type II build kana mavias maviri akasiyana — imwe L1→L2 uye imwe L2→L3 — ine intermediate capture pad paL2.

Kuti uwane ruzivo rwakakwana rwekuti sei nzira yekuyeresa lamination ichigadzira dambudziko iri, ona bhuku rekuti "blind" kuburikidza nePCB lamination process guide.

Saizi yeLand Pad: Chikanganiso chekunyoresa ndicho chirambidzo chekutonga

Laser pachayo inomira pa ±25–35µm accuracy. Dambudziko nderekuti inner layer target pad ingasave panotaurwa nedhizaini yacho. Lamination cycle yega yega inounza ±30–50µm yeXY registration error sezvo outer layers dzichinyoresa ku inner fiducials. MuType I build (two cycles), kusava nechokwadi kwese kwe via center kana tichienzanisa ne target pad yayo kunosvika ±65–100µm. Land pad yakakura ne laser accuracy chete - kuregeredza registration - ichaita kuti annular ring breakout ibude kakawanda.

Koramu diki inomiririra pasi rejometri riri pasi iro rinovimbiswa kubuda kwechinhu kana kunyoresa kwakajairika kuchichinja. Koramu yakachengeteka pakugadzira ndiyo chinangwa chakakodzera chemagadzirirwo akagadzirirwa goho rekugadzira rinopfuura 97%.

Chiyero Chekutaridzika: Chirambidzo Chekuvimbika, Kwete Kungoyera Kubudirira

Maererano neIPC-2226, chiyero chepamusoro chinokurudzirwa che "blind vias" i1:1 — kudzika kwakakamurwa nedhayamita hakufanirwe kudarika 1. Mukuita, data rekuvimbika rinoratidza kuti chirambidzo chakasimba. Kuyedzwa pakati pe "aspect ratio" dzakasiyana kunoratidza "0.7 aspect ratio microvias" dzinopona miedzo yehupenyu yakakurumidza, nepo "microvias" dzine "aspect ratio" ye1 dzichikundikana mukati menguva shoma dzekupisa. "Failure mode" ndeye "copper fatigue" pabvi re "via" — kuchinja pakati pemadziro ebharero nepazasi pedhi — uko CTE mismatch stress inonangana panguva yekupisa. "The via" inopfuura bvunzo yekutanga yemagetsi patembiricha yekamuri uye inokundikana mumunda.

Kusarudzwa kweprepreg kunodzora chiyero cheaspect zvakananga:

• Prepreg yemhando ye1080 ine huwandu hweresin hwe65–70% inoporesa kusvika 60–70µm — ine chiyero che 0.10mm, chiyero = 0.65:1 ✓
• Prepreg yemhando ye2116 ine huwandu hwe52–58% hwe resin inoporesa kusvika 110–130µm — ine 0.10mm kuburikidza, chiyero cheaspect = 1.1–1.3:1 ✗
• Inoporesa 7628-type prepreg kusvika 170–200µm — usashandise se outer buildup dielectric kune chero chinhu chakaboorwa nelaser kuburikidza

Taura nezve 1080 kana 106-type prepreg ye HDI outer buildup layers dzese. Kuchinja uku kwechinhu chimwe chete chekugadzira kunoita kuti kukanganiswa kweaspect ratio kuite sekunge hapana shanduko ye routing uye pasina muripo wemari. Zvakakoshawo kuti pave nemhando yepamusoro yemadziro: resin-content prepregs yakaderera ine fiberglass yakawanda, iyo inodzima zvisina kufanana pasi pe CO₂ laser, ichigadzira rough nemadziro anowedzera zvinodiwa zve desmear uye inoderedza kunamira kweplating.

Via-in-Pad: Kana Ichifanira Kushandiswa uye Maitiro Ekuitsanangura Zvakakodzera

Via-in-pad inoisa blind zvakananga mukati meBGA kana QFN land pad pane pedyo nayo. Inodiwa kana BGA pitch iri 0.40mm kana pasi paine I/O yakawanda - nzvimbo yepad haina kukwana kuti upinde nea via padivi pepad uku uchichengetedza nzvimbo shoma kusvika kumapedhi ari pedyo, zvichiita kuti kuiswa kwepadhedhi kuve mhinduro yega yekuchinjana kwemagetsi.

Chinhu chisina kuzadzwa chinobata solder panguva yekudzoreredza simba. Solder inopinda mubharero, haidzokeri, uye mhedzisiro yacho inhengo isina solder ine conductivity yakakwana yekuongorora kuenderera mberi asi simba remuchina harina kukwana rekupisa kana kudedera. Iyi nzira yekukundikana inopfuura kuongororwa kwese kwefekitori - inoonekwa mukudzoka kwemunda.

Zvinyorwa zvekugadzira zve via-in-pad zvinofanira kutsanangura zvinhu zvina zvese:

• Nzira yekuzadza: Kuzadzwa kwemhangura nemagetsi - kwete epoxy kana resin fill, iyo inoderera panguva yekugadzirwa uye inosiya gomba riri pamusoro pepad rinokanganisa vhoriyamu ye paste uye maumbirwo emajoini.
• Kuronga: CMP (kuronga kwemakemikari-mechanical) kusvika ku ≤15µm kubuda pamusoro pemhangura yakakomberedza ye 0.40mm pitch; ≤25µm inogamuchirwa ye 0.50mm pitch
• Chinyorwa chisina basa: ≤10% nzvimbo isina chinhu paIPC-6012; tsanangura ≤8% yezvishandiso zvinoda ma thermal cycles anopfuura 500
• Kuderedzwa kwekuvhurika kwestencil: Deredza kuvhurika kwestencil panzvimbo dzinoshandiswa pakuisa stencil kusvika pa80–90% yenzvimbo yepedhi kuti uvhare kubuda kwepedhi; izvi zvinofanirwa kuziviswa kune mainjiniya wekugadzira zvakasiyana - hazvitamire otomatiki kubva papepa rekugadzira.

Sarudzo yeHDI Build Type: Ndeipi Inodiwa Nedhizaini Yako

Rudzi rwekuvaka kweHDI runofanira kusarudzwa usati watanga kuronga. Izvi zvinosarudza kuti ndeapi ma layer pairs anotsigira blind vias, kuti bhodhi rinoda lamination cycles ngani, uye kuti rinodhura zvakadii. Kuwana kusawirirana kwerudzi rwekuvaka pakuongorora kweDFM — mushure mekunge routing yapera — kunoda kuti pave ne routing yega yega HDI escape layer yakakanganiswa.

Selection Logic

Tanga nepaipi ine zvikamu zvishoma, sarudza rudzi rudiki rwekushandisa runoburitsa fanaut, uye simbisa kuti ma "signal-critical layer pairs" ese anogona kubatanidzwa ne "blind" inowanikwa kuburikidza ne "pairs" murudzi irworwo rwekuvaka. Usasarudze Type II kana III nenzira yekufungidzira - imwe neimwe yekuwedzera lamination cycle inokonzeresa njodzi uye inowedzera nguva yekutungamira isingadzvanyiriri.

Kana dhizaini yako iine 0.50mm pitch BGA inoda L1→L2 blind vias chete kuti ibude, uye nzira yekupinda mukati ikaguma pa standard core, Type I yakakwana uye sarudzo yakakodzera yehupfumi. Kana dhizaini imwecheteyo iine 0.40mm pitch BGA apo via-in-pad inofanirwa uye chiratidzo chimwe chakakosha chinofanira kupfuudzwa kubva pamusoro kuenda kuL3 zvakananga, Type II inodiwa - uye kuwana izvi panguva yekupedzisa dhizaini pane isati yatanga ndiko kukanganisa.

Microvias dzakaiswa muStacked vs. Staggered: Kuchinjana kweData neDhizaini yeKuvimbika

Kana nzira yechiratidzo ichifanira kufamba nepakati pezvikamu zviviri zve dielectric — semuenzaniso, kubva kuL1 kuenda kuL3 muType II build — ma vias maviri anobatanidza L1→L2 naL2→L3 anogona kurongwa kana kurongwa.

Yakakamurwa: Ma "vias" maviri aya akatambanudzwa ne ≥0.20mm pakati nepakati. Imwe neimwe inomira pa "capture pad" yayo. "Intermediate (L2) pad" inofanira kunge yakakura kuti ikwane yepamusoro ne "annular ring" uye "routing trace" inobatanidza ne "low via". Hapana copper fill inodiwa. Iyi ndiyo sarudzo yekutanga - mutengo wakaderera, kuvimbika kwakanyanya, kugadzirwa kuri nyore.

Yakarongwa: Ma-vias ese ari maviri ane ma-coordinate akafanana eX/Y. Iyo via yepasi (L2→L3) inofanira kunge yakazadzwa nemhangura uye yakarongwa neCMP isati yaiswa laminated, nekuti iyo via yepamusoro (L1→L2) inoboorwa zvakananga pamusoro pe planarized fill surface. Inodiwa chete pasi peBGA escape arrays yakamanikana zvikuru apo 0.20mm horizontal offset isingawanikwe.

Data raunganidzwa kusvika pari zvino rinoratidza kuti ma microvia akaunganidzwa ane ma microvia matatu kana kupfuura ane mukana mukuru wekukundikana kupfuura akarongwa kuburikidza nema structures. Kune ma microvia akarongwa ane nhanho mbiri, kuvimbika kunoenderana zvakanyanya nehunhu hwekuzadza:

Maitiro e "void specification" akakosha nekuti "voids" dzinoisa simba rekupisa pa "void boundary" panguva ye "cycling". "Stacked via" ine "20% void cross-sectional area" ichakundikana pachikamu chidiki che "cycles" ye "stagged structure" yakafanana - uye "failure" inopfuura bvunzo yekutanga yemagetsi. Gara uchisimbisa nemugadziri kuti vanoshandisa "bottom-up pulse-plating chemistry" (kwete "standard conformal electroplating") ye "via fill". "Standard conformal plating" inovhara "via opening" isati yazadza pakati, zvichiita kuti "voids" ive 20-40% nguva dzose. "Bottom-up chemistry" inozadza kubva pa "stop pad" ichikwira, ichiwana ≤8%.

Usati wazvipira kuma "stacked vias", tanga waronga dhizaini nema "stagged vias". Madhizaini mazhinji anofungidzirwa kuti anoda "stacked configuration" anogona kuwana "stagged configuration" ine nzvimbo yekuwedzera ye5–8%. Mutengo, kuvimbika, uye musiyano wengozi yekugadzira wakakura.

Mutengo weBofu kuburikidza nePCB: Vatyairi, Vanowedzera, uye Zvinogona Kudzorwa neVagadziri

Chikonzero nei Mutengo wePremium Wakakura Kupfuura Zvinorehwa neLayer Count

Mutengo wepamusoro we "blind" kuburikidza nePCB unokonzerwa nekuoma kwemaitiro uye njodzi yekuwedzera goho, kwete nemutengo wezvinhu. Kutenderera kwega kwega kwe "lamination" kunowedzera maawa 8-12 enguva isingadzvanyiriri - kudzvanya kutenderera, kugara zvakanaka, uye kutonhora kunodzorwa - pamwe nekuongorora pakati pe "cycle", kuongororwa kwekunyoresa, uye mukana wekubvisa panel chero nguva. Chivakwa cheType III chine "lamination cycles" ina hachibhadhari 4 × bhodhi re "single-cycle" rakajairika; chinodhura zvakanyanya nekuti kutenderera kwega kwega kune mukana we1-3% wekukundikana kwemaitiro, uye mikana iyoyo inowedzera: mumatanho mana, mukana wekuti kanenge kamwechete kakakundikana kwe "cycle-level" kanosvika 4-12%.

Mari nhatu dzekugadzirisa dzinoita 50–65% yemutengo weyuniti yese:

• Lamination cycles: Nguva isingadzvanyiriri pasi penguva imwe neimwe inguva yemaawa 8-12. Chivako chemhando yechitatu chine madenderedzwa mana chine maawa angangoita 32-48 ekuita lamination nguva isati yasvika yekuboorwa, kuputirwa, kana kutorwa mifananidzo. Apa ndipo panobva nguva yekutungamira uye mari.
• Kuboorera neLaser: Mari yekuisa panel imwe neimwe inosvika $80–250 pasinei nekuverengwa kwayo, pamwe chete ne $0.008–0.025/via yeCO₂ kana $0.015–0.040/via yeUV laser. Papanel ine 600 blind vias, kubhoorwa chete kunowedzera $35–75/panel.
• Kuzadzwa kwemhangura uye kurongwa kweCMP: Zvinodiwa pama "stacked vias" uye "via-in-pad". Kuzadza kunowedzera $0.05–0.15/via; CMP planarization inowedzera $1.50–5.00/paneru. Kune dhizaini ye600-via uchishandisa "stacked vias" uchienzaniswa ne "stagged", musiyano uyu wega unogona kusvika $30–95/bhodhi.

Sarudzo Ina Dzekugadzira Dzinoderedza Mutengo Pasina Kukanganisa Kushanda

• Shandisa mhando yakaderera yeHDI iyo inozadzisa routing yako. Rudzi rwekutanga kubva kurudzi rwechitatu (Type I kusvika kurudzi rwechitatu) inzira yekuwedzera mitengo kubva pa2-3× paHDI premium, tisingaverenge kubhoborwa nekuisa zvinhu nelaser. Kana BGA fanout yese ikabudirira mukubatanidza kweL1→L2, Rudzi rwekutanga rwakakwana.
• Taura ma microvia akapatsanurwa chero kwaunobvumidza routing. Staggered inobvisa kutenderera kwekuzadza mhangura neCMP zvachose. Pama 600 vias papaneru, uyu mutsauko wemadhora makumi matatu kusvika makumi mapfumbamwe nemashanu pamutengo wekugadzirisa pabhodhi, uye kuvimbika kuri nani.
• Shandisa 0.15mm vias pachinzvimbo che0.10mm kana pitch ichibvumira. Pa 0.50mm BGA pitch, 0.15mm vias dzinoshanda zvakanaka uye dzinodhura 40% pasi pe via imwe neimwe pakuboorera, goho riri pamusoro pe 99% zvichienzaniswa ne 97–98% ye 0.10mm, uye dzine aspect ratios dziri nani. Hapana kuchinjana kwemagetsi.
• Taura 1080 prepreg muHDI buildup layers. 1080 pa 65–70µm ukobvu hwakacheneswa hunoderedza chiyero cheaspect kubva pa 1.1–1.3:1 (2116 prepreg) kusvika pa 0.65:1 — kuvandudza goho rekutanga, kuderedza mutengo wekuboorera, uye kuvandudza kuvimbika kwemunda. Mutengo wezvinhu wakaenzana.

Kuongorora Bofu Kuburikidza nePCB Mugadziri: Mibvunzo Inoratidza Kugona

Mibvunzo Yekugona Kwekuita

Kuona HDI kuburikidza nekugadzira kunoda michina yakasarudzika uye kurongeka kwemaitiro izvo vagadziri vazhinji vePCB vasina. Mibvunzo iyi inosiyanisa zvitoro zvine kugona chaiko kubva kune izvo zvinotambura nehukuru:

• "Ndedzipi mhando dzeHDI dzamunogadzira mumba, uye huwandu hwelamination cycle hunosvika papi pane imwe neimwe?" Mugadziri ane hunyanzvi anotaura Type I, II, III, uye anylayer ine huwandu hwema cycle anoenderana. Mhinduro isina kujeka — “tinoita HDI” kana “tinotsigira blind vias” — pasina ma process specifics anoratidza kuti vangangove vari kupa mabasa kune dzimwe nzvimbo kana kuti vane ruzivo rushoma nekushandisa zvinhu zvinopfuura Type I.
• "Chii chaunonyanya kushandisa paCO₂ neUV laser?" 0.10mm CO₂ ndiyo inokwanisa kugadzirwa. 0.075mm UV laser inoratidza michina yepamusoro-soro. Chero chipi zvacho chinotaurwa pasi pe0.075mm chinofanira kusimbiswa nedata rezvikamu zvakasiyana, sezvo iri inyanzvi iyo zvitoro zvishoma zvinokwanisa kugadzira.
• "Ndeipi nzira yako chaiyo yekunyoresa kubva pane imwe kuenda kune imwe mushure mekutenderera kwechipiri kwe lamination?" Nhamba yekufananidza nayo: ±35–50µm isimba rakajairika. ±25–30µm yakagadzirwa. Mugadziri asingakwanise kupindura izvi nenhamba haana mukana wekutarisa mashandiro ekubata ma land pads e0.30mm pa 0.10mm blind vias mukugadzirwa.
• "Chii chikamu chekushaya chaunobata pama "vias" akaunganidzwa azere nemhangura, uye unoshandisa kemikari ipi yekuzadza?" Mhinduro chaiyo: ≤10% void pa IPC-6012, ichitarisa ≤8%, uchishandisa makemikari ekubvisa mapuroteni kubva pasi kuenda kumusoro. Kambani inoshandisa electroplating yakajairwa yekuzadza ichaburitsa voids ye20–40% — inoenderana nemaumbirwo nekutarisa kusingatarisirwi, isina kuvimbika mukutenderera kwekupisa.
• "Munogadzirisa sei kutyorwa kwemitemo yekuona kuburikidza ne "layer-pair" muongororo yeDFM?" Chitoro chakasimba chinoratidza zvakananga kuburikidza nemapeya ane macoordinates, chinoona rudzi rwechivakwa chinodiwa kugadzirisa kutyorwa kwemutemo, uye chinodzosera izvi kumugadziri mukati memaawa makumi maviri nemana. Chitoro chinopa magadzirirwo asingagoneke kuburikidza nemapeya kune kugadzirwa - kana kugadzirisa kutyorwa kwemutemo nekutsiva rudzi rwechivakwa pasina chiziviso - chinoita kuti pave nekukundikana mumunda.

Zvinodiwa pakunyora magwaro ezvirongwa zvekugadzira

Kune chero chinhu chipi zvacho chinopfuura huwandu hweprototypes kuburikidza nePCB, zvinoda izvi sezvinodiwa:

• Zvinyorwa zvekuongorora pakati pemasekonzi: Kuyerwa kwekunyoreswa kweX-ray uye kuyera ukobvu hwepaneru pakati pese panowanikwa lamination — kwete zvichienderana nesampuli, asi zvichienderana ne100% yemapaneru
• Mishumo yeTDR impedance coupon: huwandu hwakasiyana hwe impedance hwakayerwa hune marekodhi e waveform, kwete magwaro e process-average
• Chikamu chekutanga: chikamu chidiki che microscopic che blind vias chinoratidza ukobvu hwe copper plating pabvi (IPC-6012 Class 3 minimum: 12µm), void percentage, uye capture pad registration
• Kutevedzana kwenzvimbo yezvinhu: prepreg lot, copper foil lot, uye laminate core lot zvakabatana neproduction traveler kuti zviongororwe kutadza kwebasa.

Highleap's Bofu Kuburikidza nePCB Kugona

Highleap Electronics inogadzira maPCB kubva kuType I kusvika kuType III uye anylayer HDI ine zviyero zvinotevera zvekugadzirwa zvakasimbiswa:

• Laser masisitimu: CO₂ (dhayamita ye 0.10mm yakapedzwa zvishoma, FR4 uye ma laminates akajairwa); UV (0.075mm zvishoma, laminate yakasarudzika ine kurasikirwa kwakaderera, PTFE, Megtron inoenderana ne6/7)
• Kuburikidza nekuzadza: Kemikari yekurova-kurova pasi kubva kumusoro; zvirevo zvisina chinhu ≤8%; CMP planarization kusvika ≤15µm surface protrusion
• Registration: ±35µm yakajairika kubva pane imwe kuenda kune imwe mushure mekutenderera kwechipiri kwe lamination; 100% X-ray registration check pane ese mapaneru ari pakati pemasekonzi
• DFM: Kuongororwa kwemaziso kuburikidza nekutarisa kwezvikamu zviviri uye kutarisa chiyero cheaspect ratio pane imwe neimwe HDI quote — zvikamu zviviri zvisingagoneke zvinodzoserwa negwara rekugadzirisa mukati memaawa makumi maviri nemana
• Zvinyorwa: Mishumo yemakuponi eTDR pachikamu chimwe nechimwe, zvinyorwa zvekuongorora pakati pemaseti ese, uye kurongeka kwenzvimbo yezvinhu sezvinodiwa pakutumira zvinhu
• Kugona kuvaka: Type I kusvika Type III; anylayer HDI inosvika mana buildup layers pachiso chimwe nechimwe; rigid-flex HDI hybrids

Kuti uwane maitiro ese ekutevera e lamination — kusanganisira ma press cycle parameters, inter-cycle inspection protocol, defect root causes, uye yield data by build type — ona blind kuburikidza nePCB lamination uye defect prevention guide.

Tora Bofu Rako Kuburikidza nePCB Yakataurwa