Tsanangudzo Yakadzama Yezvakajairwa HDI PCB Stack-up Structures

Zvakajairwa Layering Zvimiro zveHDI PCB Mabhodhi

HDI (High-Density Interconnect) PCBs inoratidzira diki vias, yakanaka kuteedzera upamhi / nzvimbo, uye akaturikidzana akaturikidzana, achigonesa kupindirana kwekubatana uye compact dhizaini. Aya maitiro anoita kuti HDI PCBs ikwane kune yakakwirira-kuita, nzvimbo-inomanikidzirwa maapplication.

Zvakajairwa Layering Zvimiro zveHDI PCBs:

1. 2+N+2 Chimiro: 2 zvidimbu zvemukati, N zvinyorwa zvekunze (zvinoshandiswa kune 6-layer board).
2. 3+N+3 Chimiro: 3 zvidimbu zvemukati, N zvinyorwa zvekunze (zvinoshandiswa kune 8-layer board).
3. 4+N+4 Chimiro: 4 zvidimbu zvemukati, N zvidimbu zvekunze (zvinoshandiswa kune 10-layer uye mabhodhi epamusoro).
4. 5+N+5 Chimiro: 5 zvidimbu zvemukati, N zvidimbu zvekunze (zvinoshandiswa kune 12-layer uye mabhodhi epamusoro).

Ma-Blind Vias: Ma-Blind vias anobatanidza ma-inside layers ne-outer layers, zvichideredza ukobvu hwePCB.

MaVia Akavigwa: MaVia akavigwa anogadzira hukama pakati pezvikamu zvemukati, zvichiita kuti mashandisirwo ezvikamu zvinyatso shandiswa.

Kazhinji, mapofu uye akavigwa vias siyana kubva 0.075 kusvika 0.2 mm dhayamita uye anosikwa vachishandisa nzira dzakadai Laser drilling, plasma etching, uye photosensitive etching, pamwe Laser chibooresa vari vakawanda.

HDI PCBs, neayo epamusoro-density zvikamu uye zvinongedzo, zvakanakira dhizaini yakaoma se5G, IoT, uye mota application. Yavo stack-up dhizaini inogadziriswa zvichienderana nezvinodiwa chaizvo zvepurojekiti yega yega.

Nyore Yekutanga-Odha Yakadhindwa Yakadhindwa Circuit Board (Yekutanga-Odha Laminated 6-layer Board, Stacking Structure is (1+4+1))

Iyi mhando yeHDI PCB stackup, kunyanya yekutanga-yakarongeka laminated PCB, ndiyo yakapfava, iyo yemukati multilayer board haina maburi akavigwa uye inopedzwa nekutsikirira kamwe chete. Kunyangwe iri yekutanga-yakarongeka laminated 6-layer board, maitiro ayo ekugadzira akafanana neaya akajairwa multilayer PCB dhizaini iyo yakashongedzwa kamwe chete. Musiyano wakakosha ndewekuti zvinoda laser drilling yemapofu vias uye akawanda maitiro.

Sezvo iyi HDI PCB stackup chimiro isina maburi akavigwa, 2nd uye 3rd akaturikidzana anogona kuitwa akakosha PCB mukugadzirwa, uye 4th uye 5th akaturikidzana anoshandiswa seimwe musimboti board. Iyo yekunze yekunze inowedzerwa ne dielectric layer uye foil yemhangura, uye yepakati inowedzerwa ne dielectric layer uye yobva yadzvanywa kamwe chete, iyo iri nyore kwazvo uye ine mutengo wakaderera kana uchienzaniswa neyakajairwa yekutanga-kuraira laminated board.

Conventional First-order Laminated HDI Printed Circuit Board (Yekutanga-oda Laminated HDI 6-layer Board, Stacked Structure is (1+4+1))

Mamiriro emhando iyi yeHDI PCB stackup ndeye (1+N+1), (N≥2, N kunyange). Chimiro ichi ndicho dhizaini huru yeindasitiri yekutanga-odha laminated board parizvino. Iyo yemukati multilayer board yakaviga vias uye inoda kudzvanywa kaviri kuti ipedze. Pamusoro pemakomba mapofu, iyi mhando ye-single-layer laminated board zvakare yakaviga maburi.

Kana mugadziri achikwanisa kushandura iyi mhando yeHDI PCB kuita yataurwa pamusoro-yekutanga mhando yeyakapfava yekutanga-odha laminated PCB, zvichave zvinobatsira kune ese ari maviri ekupa uye kudiwa mativi. Mushure mezano redu, vazhinji vevatengi vedu vakasarudza kushandura stacking maitiro ezvakajairwa ekutanga-odha laminated HDI mabhodhi kune yakapfava yekutanga-yakarongeka laminated board yakafanana neyokutanga mhando.

Conventional Second-order Laminated HDI Printed Circuit Board (Chechipiri-odha Laminated HDI 8-layer Board, Stacking Structure is (1+1+4+1+1))

Mamiriro emhando iyi yeHDI PCB stackup ndeye (1+1+N+1+1), (N≥2, N iri even). Chimiro ichi ndicho dhizaini huru yeindasitiri yechipiri-odha laminated HDI mabhodhi parizvino. Iyo yemukati multilayer board yakaviga vias uye inoda kudzvanywa katatu kuti ipedze. Chikonzero chikuru cheizvi kushaikwa kwedhizaini yegomba, zvichiita kuti kuoma kwekugadzira kuve pakati.

Zvisinei, sezvataurwa pamusoro apa, kana vias yakavigwa yezvikamu (3-6) yakagadziridzwa kune yakavigwa vias yezvikamu (2-7), imwe kudzvanya inogona kuderedzwa. Iyi nzira yekugadzirisa inogona kutungamira mukuderedzwa kwemutengo uchichengetedza kuvimbika kweiyo HDI PCB. Mhando iyi yakafanana nemuenzaniso uri pasi apa.

Imwe Yechinyakare Chechipiri-Odha Laminated HDI Yakadhindwa Circuit Board (Yechipiri-odha Laminated HDI 8-layer Board, Stacking Structure is (1+1+4+1+1))

Mamiriro emhando iyi yeHDI PCB stackup ndeye (1+1+N+1+1), (N≥2, N iri even). Kunyange zvazvo iri yechipiri-kurongeka laminated HDI bhodhi chimiro, sezvo nzvimbo yakavigwa vias isiri pakati (3-6) akaturikidzana asi pakati (2-7) akaturikidzana, dhizaini yakadaro inogonawo kuderedza nhamba yokutsikirira nomumwe, zvichiita yechipiri-kurongeka laminated HDI PCB, izvo zvinowanzoda 3-kudzvanya muitiro, optimized kuti 2-kudzvanya muitiro.

Nekudaro, iyi mhando yebhodhi inopa rimwe dambudziko mukugadzira HDI PCB. Pane mapofu vias ari (1-3) akaturikidzana, izvo zvakakamurwa kuva (1-2) uye (2-3) layer bofu vias kuti kugadzira. Izvo zvinodikanwa kushandisa kuburikidza nekuzadza kuita iyo yemukati mapofu vias eiyo (2-3) akaturikidzana. Ndiko kuti, yemukati bofu vias of kaviri-layer lamination anogadzirwa kuburikidza kuburikidza nokuzadza. Kazhinji, maHDI PCB ane kuburikidza nekuzadza anodhura zvakanyanya uye kuoma kwekugadzira kwakakurawo zvakanyanya.

Naizvozvo, nokuda kwakajairika rechipiri-kurongeka laminated HDI mapuranga, zvinokurudzirwa kuti stacking magadzirirwo vanofanira kudzivisa kushandiswa akaturikidzana makomba uye edza kushandura (1-3) bofu vias kupinda akadzedzereka (1-2) bofu vias uye (2-3) akavigwa (bofu) vias. Vane ruzivo HDI PCB vagadziri vanogona kutora rudzi urwu rwekunzvenga uye kurerutsa dhizaini kana optimization kudzikisa mutengo wekugadzira wezvigadzirwa zvavo.

Imwe Isingawirirani Yechipiri-Odha Laminated HDI Yakadhindwa Circuit Board (Yechipiri-odha Laminated HDI 6-layer Board, Stacking Structure is (1+1+2+1+1))

Mamiriro emhando iyi yeHDI PCB stackup ndeye (1+1+N+1+1), (N≥2, N iri even). Kunyangwe iri yechipiri-yekurongeka laminated board chimiro, kune zvakare machinjiro-mapofu maburi, uye kudzika kwekugona kwemaburi mapofu kunowedzera zvakanyanya. Kudzika kwe (1-3) maburi mapofu anopetwa kaviri kana achienzaniswa neakajairika (1-2) maburi mapofu. Vatengi vane dhizaini iyi vane zvavanoda zvakasiyana uye havabvumiri (1-3) maburi e-cross-layer blind maburi kuti aitwe makomba akaturikidzana (1-2) (2-3) mapofu.

Mukuwedzera kune kuoma kwekuchera laser, iyo inotevera kunyura mhangura (PTH) uye electroplating yakaoma zvakare. Kazhinji, vagadziri vePCB vasina imwe nhanho yehunyanzvi hwedanho vanowana zvakaoma kugadzira mabhodhi akadaro. Kuomerwa kwekugadzira kwakakwira zvakanyanya kupfuura kweyakajairika yechipiri-order laminated board. Iyi dhizaini haina kukurudzirwa kunze kwekunge pane zvakakosha zvinodiwa.

Yechipiri-yakarongeka Laminated HDI ine Blind Hole Stacking Dizaini, Makomba Akavigwa (2-7) Matanho Pamusoro Pemakomba Akaturikidzana Mapofu. (Chechipiri-odha Laminated HDI 8-layer Board, Stacking Structure is (1+1+4+1+1))

Mamiriro emhando iyi yeHDI PCB stackup ndeye (1+1+N+1+1), (N≥2, N iri even). Ichi chimiro parizvino chinoshandiswa mune mamwe echipiri-odha laminated mabhodhi muindasitiri. Iyo yemukati multilayer board yakaviga maburi uye inoda kudzvanywa kaviri kuti ipedze. Chikonzero chikuru ndechekuti kune dhizaini yakaturikidzana yegomba, inotsiva iyo yataurwa pamusoro 5th point yemuchinjiko-layer bofu dhizaini.

Chinhu chikuru chekugadzirwa uku ndechekuti maburi mapofu anoda kuiswa pamusoro pe (2-7) makomba akavigwa, izvo zvinowedzera kuoma kwekugadzira. Iyo yakavigwa gomba dhizaini mu (2-7) layer inogona kuderedza imwe lamination, optimize maitiro, uye kuwana mhedzisiro yekudzikisa mutengo.

Chechipiri-oda Laminated HDI ine Cross-layer Bofu Hole Dhizaini (yechipiri-odha Laminated HDI 8-layer Board, Stacking Structure is (1+1+4+1+1))

Mamiriro emhando iyi yeHDI PCB stackup ndeye (1+1+N+1+1), (N≥2, N iri even). Ichi chimiro parizvino chechipiri-kuraira laminated board ine imwe dhigirii yekuomerwa mukugadzira muindasitiri. Nemagadzirirwo akadai, iyo yemukati multilayer board yakaviga maburi mumitsetse (3-6) uye inoda kudzvanywa katatu kuti ipedze. Chikonzero chikuru ndechekuti kune dhizaini ye-cross-layer blind hole dhizaini, iyo ine yakanyanya kuoma kugadzira.

Zvakaoma kune vagadziri veHDI PCB vasina humwe hunyanzvi hwekugadzira mabhodhi echipiri-odha laminated. Kana ichi chinjikira bofu gomba (1-3) akaturikidzana optimized uye kupatsanurwa kuva (1-2) uye (2-3) mapofu makomba, nzira iyi kupatsanura mapofu makomba haisi stacking nzira anotaurwa muna 4 uye 6 pamusoro pfungwa. Pane kudaro, inzira yakadzedzereka yegomba rekutsemura, iyo inoderedza zvakanyanya mutengo wekugadzira uye kukwidziridza maitiro ekugadzira.

Kukwidziridzwa kweZvimwe Zvimiro Zvimiro zveHDI Mabhodhi

Simio optimization misimboti inogona kuiswa kune yechitatu-odha lamination uye yepamusoro HDI PCB stackup zvimiro kudzivirira zvisina kufanira lamination cycle. Shifting vias kubvisa vias akaturikidzana kunoderedza nhanho dzekugadzira uye kunatsiridza goho muHDI PCB kugadzira maitiro.

Izvo zvakakosha kuti uzive kuti nepo HDI PCB stackups ichipa akawanda mabhenefiti, ivo zvakare vanoda nyanzvi HDI PCB dhizaini dhizaini uye hunyanzvi hwekugadzira. Vagadziri vanofanirwa kutarisisa zvinhu zvakaita sechiratidzo chekuvimbika, manejimendi ekupisa, uye kugadzirwa kwekushandisa zvizere mabhenefiti eHDI tekinoroji.

Pamusoro pezvo, kushanda pamwe chete nevagadziri vePCB vane ruzivo uye masevhisi ekugadzira maPCB eHDI akavimbika kwakakosha kuti kuve nechokwadi chekuti kugadzirwa kwePCB yeHDI kunobudirira.

Iyo yakajairika HDI inorongedza seinotevera

Kunzwisisa akasiyana HDI PCB stackup zvimiro zvinopa vagadziri kuchinjika kwakawanda maererano nekugovaniswa kwe layer, sarudzo dzenzira, uye chikamu chekuisa. Izvi zvinobvumira kushandiswa kwakanaka kwenzvimbo iripo uye optimization yePCB marongero.

Sei Sarudza Highleap Electronic yeHDI PCB Kugadzira

Highleap Electronic inomira seyekutanga sarudzo yeHDI PCB kugadzirwa nekuda kwehunyanzvi hwayo hwekugadzira uye hunyanzvi hwakakura muhunyanzvi hwekubatanidza tekinoroji. Nzvimbo dzedu dzemazuva ano dzakashongedzerwa nemichina yazvino yekudhirowa kwelaser, plasma etching, uye hunyanzvi hwekuona mafoto, kuve nechokwadi chekuti HDI PCB yega yega inosangana nemhando yepamusoro yemhando uye kuita.

Tinoshandisa timu yemainjiniya vane hunyanzvi hwakanyanya avo vane hunyanzvi mukugadzirisa magadzirirwo ekubatanidza masaini kuti vawedzere kunaka kwemasaini, kutumirwa kwemagetsi, uye manejimendi yekupisa, vachiva nechokwadi chekuti maPCB ako eHDI akavimbika uye anoshanda zvakanaka.

Pamusoro pezvo, Highleap Electronic yakazvipira kupa yakasarudzika yevatengi sevhisi uye rutsigiro mukati mese maitiro ekugadzira. Kubva pakatanga kubvunzana dhizaini kusvika kumagumo ekugadzirwa kwechigadzirwa, tinoshanda padhuze nevatengi vedu kuti tinzwisise zvavanoda chaizvo uye nekupa mhinduro dzakagadziridzwa dzinosangana nezvinodiwa zvavo zvakasiyana.

Kuzvipira kwedu pakuvandudza nekuvandudza zvinhu zvitsva nguva dzose kunoita kuti tirambe tiri pamberi pemafambisirwo eindasitiri nekufambira mberi kwetekinoroji, zvichikupai mhinduro dzeHDI PCB dzepamusoro dzinofambisa mapurojekiti enyu nechivimbo nekubudirira.

HDI PCB Stackup Professional FAQ

1. Ndedzipi pfungwa dzakakosha dzekugadzirisa kuvimbika kwechiratidzo muHDI PCB stackups?

Kuti uwedzere kutendeseka kwechiratidzo muHDI PCB stackups, vagadziri vanofanirwa kutarisisa kudzikisa crosstalk, kubata trace impedance, uye kuona kwakaringana chiratidzo chekufambisa. Kushandisa inodzorwa impedance nzira, kusiyanisa vaviri nzira, uye kudzivirira zvisina basa kuburikidza neshanduko kunogona kuvandudza zvakanyanya kunaka kwechiratidzo.

2. Kusarudzwa kwezvinhu kunokanganisa sei kushanda kweHDI PCBs?

Sarudzo yemidziyo yeHDI PCBs, kusanganisira rudzi rwe dielectric nemhangura foil, inobata zvakananga mashandiro emagetsi ebhodhi, kutonga kwemafuta, uye kugadzikana kwemuchina. Yepamusoro-mhando, yakaderera-kurasikirwa dielectric zvinhu zvinogona kuwedzera kukurumidza kwechiratidzo uye kuderedza kurasikirwa kwesimba, nepo yakakwirira-conductivity mhangura inovimbisa kushanda kwemagetsi.

3. Ndezvipi zvakanakira kushandisa microvias muHDI PCB magadzirirwo?

Microvias muHDI PCB dhizaini inobvumira kukwirira kwechikamu uye kuvandudza kushanda kwemagetsi nekugonesa mapfupi masaini nzira uye kuderedza parasitic inductance. Ivo zvakare vanofambisa akawanda-layer kubatanidzwa, kuwedzera kuvimbika kwebhodhi uye kutendeseka kwechiratidzo.

4. Vagadziri vanogona sei kugadzirisa zvinobudirira nyaya dzekupisa muHDI PCBs?

Kubudirira kwekutonga kwekupisa muHDI PCBs kunogona kuwanikwa kuburikidza nekushandiswa kwemafuta ekupisa, masingi ekupisa, uye magadzirirwo akakodzera akaturikidzana. Kubatanidza zvinhu zvine high thermal conductivity uye kuve nechokwadi chekufambisa kwemhepo kwakakwana muchigadzirwa chekupedzisira kunogonawo kubatsira kubvisa kupisa uye kuchengetedza zvakakwana tembiricha yekushanda.

5. Ndeapi matambudziko akajairika mukugadzira HDI PCB, uye anogona kugadziriswa sei?

Matambudziko akajairika mukugadzira HDI PCBs anosanganisira kuve nechokwadi chekuchera mamicrovias, kuchengetedza dhizaini yekumisikidza, uye kuwana inopindirana lamination mhando. Aya matambudziko anogona kugadziriswa nekushandisa advanced laser drilling matekiniki, akaomesesa emhando yekudzora matanho, uye kushanda nevagadziri vePCB vane ruzivo vane hunyanzvi muHDI tekinoroji.