BT Resin PCB: Zvimiro, Mashandisirwo, uye Kudzora Kugadzira

Bismaleimide Triazine (BT) resin ilaminate inoshanda zvakanyanya inokosheswa uko FR-4 yakajairika inopererwa nekupisa uye magetsi - inonyanya kuzivikanwa se substrate iri mukati meBGA uye chip-scale IC packages. Inopa tembiricha yepamusoro yekuchinja kwegirazi, kurasikirwa kwakaderera kwe dielectric, uye kugadzikana kwakanaka kwehukuru. Gwaro iri rinotsanangura kuti BT resin chii, kuti inoenzaniswa sei neFR-4 nedzimwe laminates dzinoshanda zvakanyanya, kwainoshandiswa, uye kuti Highleap Electronics inogadzira sei mabhodhi ne substrates zvakagadzirwa neBT zvichienderana nespec.

1. Chii chinonzi BT resin uye nei ichishandiswa muPCBs?

BT resin ipurasitiki inogadziriswa nekupisa yakagadzirwa neBismaleimide Triazine, inoshandiswa mumaPCB uko kunodzivirira kupisa kwakanyanya, kurasikirwa nechiratidzo kwakaderera, uye kugadzikana kwakasimba kunodiwa kupfuura zvinopihwa neFR-4. Hunhu hwayo hunoratidza kupisa kwakanyanya kwegirazi, izvo zvinoita kuti bhodhi rirambe rakabatirira hunhu hwaro hwemakanika nemagetsi pakupisa kwakakwira pane kupfavisa sezvinoita epoxy laminates.

Chinhu ichi chakatanga kushandiswa seIC-package substrate — bhodhi diki, rakakora riri mukati meBGA kana chip-scale package rinoburitsa kubatana kwediyi nebhodhi riri pazasi. Ikoko, kugadzikana kweBT pasi pekupisa kwe die-attach ne reflow, uye kurasikirwa kwayo kushoma pa high frequency, zvinoita kuti ive yakakodzera kurongedza kwakasimba. Iri mumhuri imwecheteyo inoshanda zvakanyanya semamwe ma laminates epamusoro akafukidzwa muongororo iyi yezvinhu zvePCB board , uye kuisarudza isarudzo yezvinhu zve circuit-board zvinotungamirwa nezvinodiwa nekupisa nemagetsi.

2. Hunhu hweBT resin: Tg, Dr, uye CTE zvinokosha

Zvinhu zvitatu zveBT resin zvinotungamira kusarudzwa kwayo itembiricha yepamusoro yekuchinja kwegirazi (Tg), kushanduka kwe dielectric kwakaderera, kwakagadzikana uye kurasikirwa, uye kushanduka kwekupisa (CTE). Pamwe chete izvi zvinopa bhodhi rinoramba rakasimba uye rakarurama pamativi aro richimhanya richipisa uye richitakura masaini anokurumidza. Zvinorehwa nechinhu chimwe nechimwe mukushanda:

Nzvimbo yakaderera yeCTE inonyanya kukosha pakurongedza: kana substrate ikakura pamwero wakafanana nesilicon ne solder joints, inoderedza kushushikana kwe thermal-cycling kunopwanya connections dzakapfava. Rutivi rwemagetsi runobatanidza zvakananga ne dielectric constant uye loss tangent - ma parameter anosarudza kana masaini anokurumidza asvika akachena. Gara uchigadzira zvinoenderana nehukuru chaihwo mu datasheet chaiyo yeBT laminate.

3. BT resin vs FR-4 vs polyimide: ndeipi laminate yekusarudza

Sarudza BT resin yekushandisa mabhodhi emhando yepamusoro eTg, ane low-loss substrate, FR-4 yekushandisa mabhodhi emhando yepamusoro asingadhuri, uye polyimide inoshandiswa zvakanyanya pakupisa kwakanyanya uye kuchinjika. Laminate yega yega ine mwero wekupisa, mashandiro emagetsi, uye mutengo, saka yakakodzera zvinoenderana nezvinodiwa nebhodhi:

• FR-4 ndiyo sarudzo yakajairika uye isingadhuri yemabhodhi mazhinji, ine Tg iri pakati nepakati uye kurasikirwa kunogamuchirika — zvakanaka kusvika zvinodiwa nekupisa kana kuti mafrequency akakwira zvapfuura.
• BT resin inokwidza Tg, inoderedza kurasikirwa, uye inowedzera kugadzikana kwezvikamu, zvichiita kuti ikwane neIC substrates, high-frequency, uye high-reliability boards uko FR-4 isingakwani.
• Polyimide inotsungirira tembiricha dzakanyanya kusimba uye ndiyo hwaro hwemasekete akawanda anochinjika, anoshandiswa apo kupisa kwakanyanya kana kuchinjika kunodzivisa ma epoxy laminates akaomarara.

Madhizaini mazhinji anofunga nezveBT anoremawo magiredhi epamusoro eFR-4 uye zvinhu zveRF zvakananga, saka sarudzo yacho inofanira kunge iri mukutengeserana kwakakura kwezvinhu kwete kwega. Kana chinhu chikuru chiri kushanda kwechiratidzo, kuenzanisa kunosvika kune zvinhu zvakaita sezviri muhurukuro iyi yeFR-4 zvichienzaniswa neyakakosha yekurasikirwa nepasi ; apo iri huwandu hwekurongedza, BT inokwikwidzana nezvikamu zviri pazasi.

4. Panoshandiswa maPCB eBT resin (BGA substrates nezvimwe zvakadaro)

Resin yeBT inoshandiswa zvakanyanya muzvikamu zveIC-package — zvikamu zviri mukati meBGA, chip-scale, uye zvakafanana — uye zvakare mumamodules ane frequency yakakwira, mabhodhi akavimbika zvakanyanya, uye mashandisirwo ane thermal stress yakakura. Nyaya yakajairika ndeyekuti zvese izvi zvinoranga laminate isina kusimba, kungave nekupisa kana magetsi, saka kugadzikana kweBT kunobhadhara:

• Zvigadziko zveIC-package. Chikamu chakakora chiri mukati meBGA kana chip-scale package, uko kugadzikana kweBT uye kuramba kupisa kunotsigira fan-out yakanaka, yakavimbika — zvine hukama hwakasimba ne Zvigadziko zveBGA uye MaPCB eIC-substrate.
• Mamodule epamusoro-soro. Magadzirirwo eRF uye ekumhanya kwepamusoro-soro anobatsirwa nekurasikirwa kushoma kweBT, uko kuvimbika kwemasaini kuri kukuru.
• Mabhodhi akavimbika zvikuru. Zvigadzirwa zvinogara kwenguva refu zvichipisa uye zvichishandisa simba rakawanda zvinoshandisa BT's stability kudzivirira kuneta.

Nekuti mashandisirwo akawanda eBT ane chekuita nekurongedza, zvinhu izvi zviri muchimiro chezvigadzirwa zvepamusoro, zvakanaka kwete mabhodhi akareruka - ndosaka zvichibatanidzwa nekugadzirwa kwakawanda uye kubatanidzwa kwakanyatsonaka.

5. Kugadzira mabhodhi eBT resin: zvekudzora

Kugadzira mabhodhi eBT resin kunoda kudzora maitiro ekuboorera uye ekuchera zvinhu kuti zviome uye Tg yakakwira, kugadzirisa maficha akanaka ehuwandu hwe substrate, uye kufananidza plating uye surface finish nedhizaini. BT inoita zvakasiyana neFR-4 iri kugadziriswa, saka mugadziri wezvinhu anoona nezvazvo akakosha kuti awane mhedzisiro yakavimbika. Zvinhu zvakakosha zvinodzora:

• Lamination. Kukwira kweTg kweBT kunoreva kutenderera kwakasiyana kwekudzvanya pane FR-4, uye kuita nemazvo ndiko kunoita kuti zvinhu zvigadzikane.
• Kuchera. Resin yakaoma uye zvinhu zvakapfava zvinoda kuti pave nematanho akakodzera ekuboorera kuti pave nemakomba akachena uye akavimbika.
• Kugona kushanda zvakanaka. Basa repasi pevhu rinoda upamhi hwemitsara yakasimba uye nzvimbo yakakura, inova nzvimbo ine vanhu vakawanda.
• Kuisa jira uye kupedzisa. Maburi akavimbika akavharwa nepurasitiki uye kupedzisa kwakakodzera kushandiswa kunodzivirira kushanda zvakanaka uye kugona kwekubatanidza.

Aya ndiwo mamwe maitiro anodzora chero laminate yepamusoro, uye ndizvo chaizvo zvinosimbiswa neongororo yekugadzira isati yagadzirwa usati waisa zvinhu - zvichiratidza kuti stackup, maficha, uye maburi zvinogoneka muBT.

6. Magadzirirwo anoitwa mabhodhi eHighleap akavakirwa paBT

Highleap inogadzira mabhodhi eBT resin nema laminate anoshanda zvakanaka ne lamination, drilling, uye fine-feature inodzora zvinodiwa nezvinhu izvi, yozozvitsigira kuburikidza nekuunganidza. Kusarudzwa kwezvinhu kunoonekwa sesarudzo yeinjiniya: kana dhizaini ichida Tg yakakwira yeBT, kurasikirwa kwakaderera, uye kugadzikana, kuvakwa kwayo kunogadzirirwa; apo FR-4 kana imwe laminate inokwana zviri nani, izvo zvinokurudzirwa pachinzvimbo, uchishandisa huwandu hwese hwePCB laminate.

Nekuti BT inowanzoshandiswa mumagadzirirwo emhando yepamusoro, ine hunyanzvi hwakatsetseka uye ine giredhi rekurongedza, Highleap inobatanidza chigadzirwa ichi ne turnkey assembly inosanganisira fine-pitch uye BGA placement uye X-ray inspection, saka substrate nezvinhu zviri pairi zvese zvinosimbiswa. Paunokumbira mutengo, taura BT laminate chaiyo (kana Tg, Dk, uye loss targets), nhamba ye layer uye zvinhu zvakanakisisa, uye kana bhodhi iri rakagadzirwa ne substrate-grade kana standard build, saka maitiro acho anoenderana nemazvo.

7. Mibvunzo Inowanzo bvunzwa nezve BT resin PCB

Chii chinonzi BT muBT resin?

BT inomiririra Bismaleimide Triazine, makemikari maviri akasanganiswa kuti agadzire thermosetting resin. Zita racho rinoratidza kuumbwa kwayo, uye chinhu chacho chinowanzo sanganiswa ne epoxy mu BT laminates dzekutengesa.

Ko resin yeBT inodhura kupfuura FR-4 here?

Ehe — BT laminate inodhura kupfuura standard FR-4 nekuda kwekushanda kwayo kwepamusoro uye kugadziriswa kwayo kunoda nguva yakawanda. Inosarudzwa kana paine zvakanakira kupisa uye zvemagetsi, kwete sekutsiva mabhodhi akajairika.

Ko resin yeBT inogona kushandiswa neFR-4 yakajairika here mu hybrid stackup?

Kazhinji hongu — ma "hybrid stackups" anosanganisa laminate inoshanda zvakanyanya painodiwa neFR-4 kune dzimwe nzvimbo kuti mutengo nekushanda kwayo zvienzane. Kana yakakodzera zvinoenderana nedhizaini uye inofanira kusimbiswa nemugadziri wako.

Chii chinonzi Tg yakajairika yeBT resin?

Malaminate eBT anopa tembiricha yepamusoro yekuchinja kwegirazi kupfuura FR-4 yakajairwa, ndicho chikonzero chikuru chekuti ashandiswe. Nhamba chaiyo inosiyana zvichienderana negiredhi rechigadzirwa, saka gadzira zvinoenderana nedata relaminate pane kukosha kwakajairika.

Ko BT resin haina halogen here kana kuti inoenderana neRoHS?

Magiredhi mazhinji eBT laminate anowanikwa mumhando dzisina halogen uye dzinotevedzera RoHS, asi zvinoenderana nechigadzirwa chaicho. Kana kutevedzera mitemo kuchikosha kumusika wako, simbisa zvirevo zvegiredhi chairo usati wazvitaura.

Sei BT resin ichishandiswa pakugadzira zvinhu zveBGA package?

Kugadzikana kwayo kwakaderera kweCTE uye divi rayo rinochengetedza zvinhu zvakanaka zve substrate uye zvinoderedza kushushikana kwekupisa pamajoini epakeji, nepo kurasikirwa kwayo kushoma kuchitsigira masaini ekumhanya kukuru - zvese zvakakosha mukati mepakeji yakakora yeBGA.