Ceramic PCB Material Kuenzanisa: Alumina, AlN, Si₃N₄, SiC, BeO

ziviso

Ceramic substrates yave yakakosha mumagetsi emazuva ano uko kutonga kwemafuta, kugadzikana kwedimensional, uye kuvimbika kwakakosha. Mune epamusoro-simba ma LED masisitimu, mota inverters, aerospace avionics, uye RF amplifiers, echinyakare FR-4 mabhodhi haakwanise kubvisa zvakakwana kupisa kana kuchengetedza kushanda pasi pemamiriro akanyanya.

Kuenzanisa uku kwePCB yeceramic kunoongorora zvinhu zvishanu zvikuru: aluminium oxide (Al₂O₃), aluminium nitride (AlN), silicon nitride (Si₃N₄), silicon carbide (SiC), uye beryllium oxide (BeO). Chinhu chimwe nechimwe chine zvakanakira zvakasiyana mukupisa, coefficient of thermal expansion (CTE), simba remakanika, uye mutengo.

Kunyangwe kukosha kwako kuri kuwana yakanyanya kupisa kupisa, kuenzanisa silicon mudziyo CTE weflip-chip maassemblies, kana kuenzanisa kuita uchipesana nezvinetso zvebhajeti, gwara iri rinopa ruzivo rwehunyanzvi uye ruzivo rwemashandisirwo kuzivisa sarudzo yako yezvinhu.

Kurumidza Kutarisisa: Pamusoro 5 Ceramic PCB Zvishandiso pakungotarisa

Tafura inotevera inopfupisa akakosha maitiro ega ega ceramic PCB zvinhu kufambisa nekukurumidza kuenzanisa:

Iyi ceramic PCB yekuenzanisa tafura inoratidza kuti hapana chinhu chimwe chete chinotonga pamativi ese. Aluminium oxide inoshanda seyekutanga kwehupfumi, nepo aluminium nitride uye beryllium oxide inopa kushanda kwepamusoro kwekupisa pamitengo yakakwira.

Yakadzama Ongororo Yeimwe Ceramic PCB Material

1. Aluminium Oxide (Al₂O₃): The Industry Standard

Material Overview uye Key Properties

Aluminium oxide inomiririra yakanyanya kugamuchirwa ceramic substrate zvinhu nekuda kwekunaka kwayo kwekuita, kugadzira, uye mutengo. Nekupisa kwekushisa kunobva pa20 kusvika pa30 W/m·K, Al₂O₃ substrates inonyatso bvisa kupisa muzvishandiso zvine mwero-simba uko silicon kana FR-4 yaizotadza.

Izvo zvinhu zvinoratidzira zvakanakisa kuvharwa kwemagetsi zvine simba re dielectric rinopfuura 10 kV/mm uye vhoriyamu resistivity pamusoro pe10¹⁴ Ω·cm. Iyo coefficient yekuwedzera kwekupisa (inenge 6.5-7.5 ppm/K) zvine musoro inoenderana neyakajairwa semiconductor zvinhu, kuderedza kushushikana kwekupisa mumajoini ekutengesa panguva yekutenderera bhasikoro.

Manufacturing and Processing Characteristics

Kugadzira aluminium oxide PCBs kunosanganisira nzira dzakanyatsogadziriswa dzinosanganisira kukanda tepi, kudhindwa kwechidzitiro chemetalization paste, uye kufambisa-pfuti patembiricha yakatenderedza 1600 ° C. Flexural simba rinowanzosvika 300-400 MPa, ichipa yakaringana mechani kusimba kune akajairwa magungano maitiro.

Iyo yakakura yekugovera cheni uye yakatwasuka kugadzirisa inobatsira kune yayo mutengo mukana. Mashandisirwo akajairika anosanganisira akajairwa mwenje we LED arrays, yakaderera-kusvika-yepakati magetsi ekushandura, uye mahybrid microelectronic maseketi uko kunyanyisa kupisa kusingade.

Performance Limitations

Iyo yekutanga kudzikisira yeAl₂O₃ mune iyi ceramic PCB kuenzanisa kwezvinhu ndeye yakadzikama yekupisa conductivity, iyo inova isingakwani kune dense-yakazara-yakazara-simba masimba kana maapplication anopfuura 5-10 W/cm² simba density.

2. Aluminium Nitride (AlN): High Thermal Conductivity Champion

Superior Thermal uye Electrical Performance

Aluminium nitride yabuda sechinhu chinosarudzika chekushandisa chinoda zvese zvakanakisa zvekupisa conductivity uye magetsi ekudzivirira. Nekupisa kwekupisa kunotangira pa170 kusvika pa230 W/m·K, ma substrates eAlN anopa hurongwa hwehukuru huri nani hwekubvisa kupisa pane aruminiyamu oxide uku ichichengetedza epamusoro dielectric zvivakwa.

The material coefficient of thermal expansion (inenge 4.5 ppm/K) inonyatsoenderana nesilicon (2.6 ppm/K), zvichiita kuti AlN inyanyokodzera flip-chip assemblies, direct die attach applications, uye high-reliability power modules uko CTE mismatch inogona kutungamira mukutadza nguva isati yakwana.

Electrical Characteristics uye RF Applications

Kuiswa kwemagetsi kunoramba kwakanaka, ine dielectric inogara yakatenderedza 8.8 uye kurasikirwa tangent pazasi 0.001 paRF frequency. Musanganiswa uyu unogonesa aluminium nitride kuti ibudirire mune ese emagetsi emagetsi uye yakakwirira-frequency application.

Kufunga Kwekugadzira

Kugadzira aruminiyamu nitride kunoda kunyatso kudzora mamiriro ekunze uye tembiricha (kazhinji 1700-1900 ° C) kuti uwane yakakwana yekupisa conductivity. Izvo zvinhu zvinonzwa nekunyorova panguva yekupfura, uye maitiro esimbi anofanirwa kuenderana nemakemikari ayo.

Kunyangwe izvi zvakaoma zvekugadzira, AlN yave kuita zvekutengesa kugadzirwa kweakakwira-simba LED mapakeji, RF magetsi amplifiers, laser diode submounts, uye mota magetsi emagetsi. Izvo zvinonyanya kutariswa ndezvayo zvine mwero mutengo premium pamusoro peAl₂O₃ uye zvishoma kuderera kwesimba remagetsi zvichienzaniswa nesilicon nitride.

3. Silicon Nitride (Si₃N₄): Superior Mechanical Kuvimbika

Yakasarudzika Simba uye Thermal Shock Resistance

Silicon nitride inozvisiyanisa pachayo kuburikidza neakasarudzika mechanicha simba uye kupisa kwekuvhunduka kuramba, zvichiita kuti ive yakanakira maapplication ari pasi pekupisa kupisa bhasikoro kana kushushikana kwemagetsi. Izvo zvinyorwa zvinowana flexural simba rinopfuura 700-900 MPa, inenge yakapetwa kaviri iyo yealuminium oxide, ichichengetedza kupisa kwekushisa mu70-90 W / m · K renji.

Iyo coefficient yekuwedzera kwekupisa kweSi₃N₄ (inenge 3.2 ppm/K) inopa kuenderana kwakanyanya nesilicon zvishandiso, kuderedza kushushikana pakufa kubatanidza nzvimbo. Iyi CTE inofananidzwa, yakasanganiswa nekuomarara kwekutsemuka kwepamusoro, inoita kuti silicon nitride substrates irarame inodzokororwa mafambiro ekupisa kubva -40 ° C kusvika +150 ° C kana kupfuura pasina kutsemuka.

Manufacturing Process uye Design Benefits

Kugadzira silicon nitride PCBs kazhinji inoshandisa kupisa kupisa kana gasi kudzvanywa sintering kuti uwane dense microstructures ine optimal zvivakwa. Simba repamusoro rezvinhu rinobvumira yakaonda substrate dhizaini, ichidzikisa kupisa kwekudzivirira uku ichichengetedza kutendeseka kwechimiro.

Metallization maitiro akanyatso kusimbiswa, achishandisa tungsten kana molybdenum-based masisitimu anogona kumirisana neyakaomarara yekupisa. Mune iyi ceramic PCB kuenzanisa kwezvinhu, silicon nitride inoshanda seyakavimbika-yakatarisana sarudzo yemotokari traction inverters, maindasitiri mota madhiraivha, uye avionics simba masisitimu.

4. Silicon Carbide (SiC): High Temperature Nyanzvi

Unique Properties uye Dzinogumira Zvinokosha

Silicon carbide inopa yakasarudzika thermal conductivity (120–200 W/m·K) uye inokwanisa kushanda patembiricha inopfuura 600°C, asi inopa muganhu wakakomba: iyo pachayo inobata magetsi pane insulating. Ichi chimiro chinosiyanisa zvakanyanya SiC kubva kune zvimwe zvinhu mune ino ceramic PCB kuenzanisa kwezvinhu.

Kuti ishande sePCB substrate, silicon carbide inoda mamwe dielectric akaturikidzana kana zvimiro zvehunyanzvi kupa kuparadzaniswa kwemagetsi pakati pematanho edunhu. Nzira dzakajairika dzinosanganisira kuisa silicon dioxide kana aluminium nitride insulation layers paSiC base, kugadzira chimiro chakaumbwa.

Mamiriro ekushandisa uye Kugadzirisa Kuoma

Iyo yemhando yepamusoro yekupisa conductivity, yakaderera kupisa kwekuwedzera (inenge 4.0 ppm/K), uye yakanyanya kudzikama tembiricha inoita kuti itaridzike kune yakakosha maapplication akadai seyepamusoro-tembiricha sensors, magetsi emagetsi ekuedza zvigadziriso, uye mamwe masisitimu emuchadenga uko tembiricha inoshanda inodarika miganhu yeyakajairwa ceramic zvinhu.

Nekudaro, iyo yakawedzera kuomarara kwekusungirirwa kwekubatanidza layer, yakasanganiswa neSiC's inherent material cost, inomisa kushandiswa kwayo kune niche application. Kufunga kwekugadzira kunosanganisira kungwarira interface engineering pakati peSiC uye insulation layer, yakasarudzika simbi inoenderana neyakaumbwa chimiro, uye yakasimba yemhando yekudzora kuti ive nechokwadi chedielectric kutendeseka.

5. Beryllium Oxide (BeO): Ultimate Performance ine Critical Constraints

Yakanakisa Thermal Performance

Beryllium oxide inomiririra iyo yepamusoro yekupisa kwekupisa pakati peceramic PCB zvinhu, kuwana kukosha kubva pa250 kusvika 300 W/m·K uku ichichengetedza yakanakisa magetsi ekudzivirira. Uku kusanganiswa kwezvivakwa hakuna kufananidzwa nechero imwe ceramic substrate zvinhu mune ino ceramic PCB zvinhu kuenzanisa.

Iyo CTE yezvinhu (ingangoita 7.5 ppm/K) yakafanana nealuminium oxide asi ine hukuru hwepamusoro hwekupisa kupisa kugona. Mumaapplication anoda kunyanyisa kupisa kwekuita, BeO inogona kugonesa dhizaini yemagetsi uye magadzirirwo ekupisa zvisingagoneke neimwe nzira.

Yakakosha Toxicity uye Safety Concerts

Nekudaro, beryllium oxide inotakura huturu hwekunetsekana hunodzora zvakanyanya kushandiswa kwayo. Beryllium huruva inogadzirwa panguva yekugadzira, kubata, kana kuputsika kwe substrate kunoisa njodzi dzakakomba dzehutano, kusanganisira chirwere chisingaperi cheberyllium, chirwere chemapapu chinogona kuuraya.

Mitemo yakasimba yekuchengetedza basa inotonga kugadzira nekubata kweBeO, inoda zvivakwa zvehunyanzvi, midziyo yekudzivirira, uye nzira dzekurasa. Nekuda kweidzi chengetedzo uye zvipingaidzo zvekudzora, beryllium oxide substrates inonyanya kugumira kumauto, aerospace, uye mamwe epamusoro-inoshanda masisitimu ekutaurirana.

Dzimwe Nzira Dzinoshanda

Mumashandisirwo mazhinji ekutengesa mukati meiyi ceramic PCB yekuenzanisa, aluminium nitride yakanyanya kutamisa beryllium oxide, ichipa 70-80% yeBeO's thermal performance pasina kunetsekana kwehupfu, zvichiita kuti AlN ive sarudzo inosarudzika kune yakakwira-thermal-conductivity zvinodiwa.

Performance Kuenzanisa: Thermal Conductivity Analysis

1. Thermal Conductivity Hierarchy

Thermal conductivity inomiririra yakanyanya kusiyanisa musiyano mune ino ceramic PCB kuenzanisa kwezvinhu, sezvo ichitarisa zvakananga kupisa kwekupisa kugona uye yakanyanya kusimba simba density. The performance hierarchy inoteera kurongeka uku:

• Beryllium oxide - 250–300 W/m·K inoburitsa kupisa kwakanyanya asi nekurambidzwa kwehupfu
• Aluminium nitride - 170–230 W/m·K inopa kuita kwakanakisa kwekupisa pasina kunetseka nezvekuchengetedza
• Silicon carbide – 120–200 W/m·K inopa yakakwira conductivity asi inoda matinji
• Silicon nitride - 70–90 W/m·K inoyera kushanda kwemafuta nesimba repamusoro remuchina
• Aluminium oxide - 20–30 W/m·K inoshanda sehwaro hwehupfumi hwemashandisirwo emagetsi ari pakati nepakati

2. Power Density Application Guidelines

Pamaapplications anoda simba remagetsi riri pamusoro pe15 W/cm², aluminum nitride kana beryllium oxide inova yakakosha kuchengetedza tembiricha yepakati mukati memiganhu inogamuchirwa. Silicon nitride inoshandisa zvikumbiro mu5-15 W/cm² renji uko kuvimbika kwayo kwepamusoro kwemuchina kunowedzera kukosha kupfuura kwakachena kupisa kwekuita.

Aluminium oxide inoramba yakaringana kusimba kwemagetsi pazasi pe5 W/cm² kana uko nzvimbo yemudziyo inobvumira kupararira kwekupisa. Izvi zvikumbaridzo zvinopa hutungamiri hunoshanda hwekusarudzwa kwezvinhu zvichienderana nezvinodiwa zvekupisa.

3. Coefficient of Thermal Expansion Matching

Beyond absolute thermal conductivity, CTE inofananidzwa nesilicon zvishandiso zvinokanganisa zvakanyanya kuvimbika kwenguva refu. Aluminium nitride (4.5 ppm/K) uye silicon nitride (3.2 ppm/K) inopa yepamusoro CTE inoenderana nesilicon (2.6 ppm/K) zvichienzaniswa nealuminium oxide (6.5–7.5 ppm/K) kana beryllium oxide (7.5 ppm/K).

Iyi yepedyo mechi inoderedza kushushikana kweiyo thermomechanical panguva yekushisa bhasikoro, kutarisisa kwakakosha kwemotokari uye maindasitiri ekushandisa ne50,000 kana anopfuura ekupisa kutenderera kwehupenyu hwechigadzirwa. Silicon nitride's yakasarudzika mechanicha simba uye kupisa kwekutya kupikisa kunoenderana neayo ari pakati nepakati ekupisa conductivity, ichigonesa kushanda kwakavimbika kuburikidza neyakaomesesa kupisa.

Mutengo, Kuwanikwa, uye Kufunga Kwekugadzira

1. Material Cost Structure

Mutengo wezvinhu uye kuomarara kwekugadzira kunosiyana zvakanyanya pane zvese sarudzo mune ino ceramic PCB yekuenzanisa zvinhu. Aluminium oxide inomiririra sarudzo inodhura zvakanyanya, ine macheni ekupa akamiswa, vatengesi vakawanda vanokwanisa, uye nzira dzakatwasuka dzekugadzira dzinogonesa kugadzirwa kwemhando yepamusoro pamitengo yemakwikwi.

Aluminium nitride uye silicon nitride inogara pakati-yepamusoro mutengo wemhando, kazhinji mutengo wakapetwa kaviri kana kana mutengo weakaenzana aluminium oxide substrates. Iyi premium inoratidza zvimwe zvinonetsa sintering process, tighter process control zvinodiwa, uye mamwe mashoma mabhesi evapi.

2. Specialized Materials uye Supply Chain

Silicon carbide substrates ine yakabatanidzwa insulation layers inoraira mitengo yeprimiyamu nekuda kwemitengo yezvinhu uye iyo yekuwedzera kugadzirisa inodiwa kune dielectric layer deposition uye interface engineering. Kuwanikwa kwemupi kwakaganhurirwa kunowedzera kumanikidza kupa, zvichiita kuti SiC ive yakakodzera kunyanya kune hunyanzvi maapplication.

Beryllium oxide inotarisana nemutengo wakakomba uye zvipingaidzo zvekuwanikwa. Kupfuura mutengo wezvakasikwa, zvivakwa zvekugadzira zvine hunyanzvi, maprotocol akasimba ekuchengetedza, uye shoma yevashambadziri inokonzeresa nguva dzekutungamira dzakayerwa mumwedzi nemitengo inogona kudarika zvakapetwa kagumi mutengo wealuminium oxide.

3. Kugadzira Goho Impact

Kufunga nezvekugadzira goho kunokanganisawo mutengo unoshanda. Aluminium oxide inowana goho repamusoro nekuda kwemaitiro akakura, nepo aluminium nitride uye silicon nitride inoda kungwarira maitiro ekutonga. Silicon carbide composite zvimiro uye beryllium oxide kugadzirisa zvinopa matambudziko makuru egoho, zvichipa mubhadharo wavo.

Chengetedzo, Yezvakatipoteredza, uye Regulatory Kufunga

1. Beryllium Oxide Toxicity Concerns

Zvakatipoteredza nekuchengetedza zvinhu zvinomiririra maitiro akakosha esarudzo mune ino ceramic PCB yekuenzanisa zvinhu, kunyanya yeberyllium oxide. Kuchetura kweberyllium komisheni kunogadzira njodzi dzakakura dzehutano hwepabasa panguva yekugadzira, kugadzira, uye kubata kweBeO substrates.

Kufema guruva reberyllium kunogona kukonzera acute pneumonitis uye chirwere chisingaperi cheberyllium, zvichiita kuti mapapu awedzere kuderera. Nekuda kweizvozvo, masimba mazhinji anoisa mirau yakasimba pakushandiswa kweBeO, inoda masisitimu ekufemesa mhepo, zvekuzvidzivirira nazvo, zvirongwa zvekuongorora zvekurapa, uye nzira dzakadzorwa dzekurasa.

2. Alternative Material Safety Profile

Izvi zvinodikanwa zvekuchengetedza zvinogadzira zvinonetsa uye mashandiro akaomarara ayo akafambisa akawanda ekushambadzira maapplication akananga kune aruminiyamu nitride seimwe yakachengeteka imwe ine inofananidzwa nemafuta kuita. Masangano anofunga nezve beryllium oxide anofanirwa kunyatso ongorora kana kuwedzera kwekupisa kunoenderana nemutoro wekutonga.

Zvishandiso zvasara muiyi ceramic PCB zvinhu kuenzanisa zvinopa hutano hudiki kana kushushikana kwezvakatipoteredza kupfuura yakajairwa ceramic kubata matanho. Aluminium oxide, aluminium nitride, silicon nitride, uye silicon carbide hazviratidze nyaya dzakakosha dzehupfu, kunyangwe matanho ekudzora guruva panguva yekugadzira anoramba akakodzera.

3. Environmental Impact uye Kurasa

Yese ceramic substrates inoda yakakwirira-tembiricha sintering maitiro ekudya simba rakawanda, kutariswa kwemasangano ane zvinangwa zvekusimudzira kwezvakatipoteredza. Kupera-kwe-hupenyu sarudzo dzekurasa dzinosiyana nezvinhu.

Aluminium oxide substrates inogona kazhinji kushandiswazve kana kuraswa kuburikidza neyakajairwa marara maindasitiri hova. Aluminium nitride, silicon nitride, uye silicon carbide zvingada kuraswa kwakasarudzika nekuda kwehunhu hwadzo hwekuramba asi hazviratidze zvinonetsa marara. Beryllium oxide inoda kuraswa kwemarara ine ngozi inodzorwa, ichiwedzera kumitengo yehupenyu.

Mamiriro Ekushandisa Recommendations

1. High-Power LED Lighting Systems

Kune zvakajairika zvekutengesa mwenje we LED uko mutengo unoshanda zvakanaka, aluminium oxide substrates inopa yakakwana yekupisa kuita pamutengo wakakwana. Zvishandiso zvinoda mwenje wepamusoro wekubuda densities zvinobatsira kubva kune zvakasiyana zvinhu.

Mwenje weMotokari, mwenje wenhandare, uye zvigadziriso zvemaindasitiri zvakakwirira zvinobatsirwa nealuminium nitride's superior thermal conductivity, ichigonesa madiki mafomu zvinhu uye yakawedzerwa hupenyu hweLED kuburikidza nematembiricha epazasi. Sarudzo yemidziyo inobata zvakananga kuita uye mutengo wakakwana wevaridzi.

2. Power Electronics uye Motor Drives

Mota traction inverters uye maindasitiri emota anotyaira anoda zvinhu zvinopona makumi ezviuru zvemafuta ekutenderera mukati mehupamhi hwetembiricha. Silicon nitride musanganiswa wepakati nepakati kupisa conductivity (70–90 W/m · K) uye yakasarudzika simba remuchina inoita kuti ive sarudzo inosarudzika mune ino ceramic PCB kuenzanisa kwezvinhu.

Kune akaderera-simba DC-DC anoshandura uye akajairwa magetsi ekushandisa, aruminiyamu oxide inopa kuita kwakakwana pamutengo wakaderera. Kusiyanisa kwakakosha kuri mukuoma kwenzvimbo yekushanda uye hupenyu hunodiwa.

3. RF uye Microwave Amplifiers

Radio frequency magetsi amplifiers anoshanda pamafrequency ari pamusoro pe1 GHz anobatsirwa kubva kualuminium nitride musanganiswa wepamusoro kupisa conductivity, yakaderera dielectric kurasikirwa, uye yakanaka yekuwedzera yekupisa inoenderana negallium nitride kana gallium arsenide zvishandiso.

Izvo zvinhu zvinogonesa kubviswa kupisa kwakanaka kubva kune densely packed RF transistors uchichengetedza chiratidzo chekuvimbika. Kune yakaderera-simba RF zvikumbiro, aluminium oxide inoramba ichishanda uye inodhura-inoshanda.

4. Aerospace uye Defense Systems

Mauto uye zvemuchadenga zvikumbiro zvinowanzo tsanangura zvinhu kubva kune iyi ceramic PCB kuenzanisa kwezvinhu zvinoenderana nepamusoro pekuita zvinodiwa kwete kukwirisa mutengo. Aluminium nitride inoshanda zvakanyanya-yakavimbika avionics uye masisitimu ekutaurirana zvinobudirira.

Beryllium oxide inoramba yakatsanangurwa kune mamwe mauto enhaka masisitimu uye yakanyanya kupisa yekupisa manejimendi uko njodzi dzehupfu dzinogona kudzorwa kuburikidza nekudzora kugadzira uye kubata mapuroteni. Nekudaro, magadzirirwo matsva anowedzera kufarira aluminium nitride kudzivirira matambudziko eBeO.

Madhizaini neKugadzira Mazano

1. Thermal Path Kugadzira Kufunga

Mainjiniya anosarudza zvinhu kubva pane iyi ceramic PCB kuenzanisa kwezvinhu zvinofanirwa kufunga akati wandei dhizaini zvinhu zvinopfuura zvekutanga zvekupisa uye zvemagetsi zvakatemwa. Thermal nzira dhizaini inofanirwa kuverengera iyo substrate's thermal conductivity, inobatanidza nzvimbo dzakakwana dzekuparadzira mhangura uye kuburikidza nezvimiro zvekuitisa kupisa kubva kumidziyo kuenda kunonyura.

Ukobvu hwesubstrate hunofanirwa kuenzanisa kusimba kwemechanicha, kupisa kwekupisa, uye zvipingaidzo zvekugadzira, kazhinji kubva pa0.25 mm kusvika 1.5 mm zvichienderana nehukuru hwebhodhi uye mashandisirwo. Thinner substrates inoderedza kupisa kwekudzivirira asi inoda kungwarira kubata panguva yekuungana.

2. Metallization Selection uye Processing

Metallization kusarudzwa kunokanganisa zvese kuita uye kuvimbika. Izvi zvinotevera zvinopa zvinodiwa zvakasiyana:

• Gobvu-firimu metallization - Tungsten, molybdenum, kana copper paste inopa mhinduro dzinodhura nehupamhi hwepakati kubva pagumi kusvika pamakumi maviri neshanu mamicrons kune akawanda eceramic substrates.
• Direct bonded mhangura (DBC) -Maapplication anoda kushomeka kwemagetsi kuramba anoshandisa maitiro eDBC, kuwana mhangura yemhangura ukobvu hwe200-400 microns nekunamira kwakanaka.
• Active metal brazing (AMB) -Alternative high-conductivity metallization nzira inopa kuita kwakafanana kuDBC ine akasiyana maitiro maitiro

3. Gungano Rekugadzirisa Maitiro

Soldering uye magungano maitiro anofanirwa kugarisa ceramic substrates 'yepamusoro yehuremu yekupisa kana ichienzaniswa nemabhodhi eorganic. Reflow profiles inogona kuda yakawedzera preheat nzvimbo uye yakakwira zvishoma tembiricha yepamusoro kuti ive nechokwadi chekunyungudika kwakaringana nekunyorova.

Simba repamusoro reSilicon nitride rinogonesa kubata zvine hukasha, nepo aluminium oxide uye aluminium nitride inoda kuchenjerera kugadzirisa dhizaini kudzivirira kucheka mupendero panguva yekusangana. Kuvandudzwa kwemaitiro kunofanirwa kuverengera kune zvinhu-zvakananga maitiro.

4. Special Material Kubata Zvinodiwa

Kune silicon carbide substrates ine insulation layer, vagadziri vanofanirwa kuonesa dielectric kutendeseka kuburikidza neakakwira-voltage kuyedzwa uye kuve nechokwadi chekuti metallization mapatani anochengetedza akaringana creepage uye madaro ekubvisa. Iyo inoumbwa chimiro inoda kumwe kusimbiswa kupfuura yakajairwa ceramic substrates.

Beryllium oxide substrates inoda hunyanzvi hwekubata maitiro, yakatsaurirwa nzvimbo dzekugadzira, uye yakazara yevashandi kuchengetedza mapuroteni anofanirwa kugadzwa pamberi pekusarudzwa kwezvinhu. Iko kuomarara kwekushanda kunowanzopfuura iyo yekupisa kuita mabhenefiti kune akawanda ekutengesa maapplication.

Ceramic PCB Material Sarudzo Summary

Iyi ceramic PCB kuenzanisa kwezvinhu zvinoratidza kuti kusarudzwa kwezvinhu kwakaringana kunoenderana nekushandiswa-chaicho zvinonyanya kukosha kwete hukuru hwepasirese. Iyo inotevera sarudzo sarudzo inopa nhungamiro inoshanda:

• Aluminium oxide -Sarudza zvekushandisa-zvinodhura zvine mwero simba density pazasi 5 W/cm² uko kuvimbika kwakaratidza kunonyanya kukosha kupfuura kwekupedzisira kupisa kwemafuta.
• Aluminium nitride -Taridza apo kupisa kwekushisa kuri pamusoro pe150 W/m·K kuchidikanwa, kunyanya kune maLED-ane simba, maRF amplifiers, kana maapplication anoda CTE inoenderana nesilicon zvishandiso.
• Silicon nitride -Sarudza zvemotokari uye maindasitiri ekushandisa uko simba remuchina, kupisa kwekutya kusagadzikana, uye kuvimbika kwenguva refu kuburikidza neyakaomarara bhasikoro inoruramisa mutengo wepakati-wepamusoro.
• Silicon carbide -Fungidzira chete kune akasarudzika epamusoro-tembiricha maapplication anopfuura 300 ° C ekushanda tembiricha uko kuomarara kweiyo yakabatanidzwa yekuvharisa maseru uye mutengo wepamusoro unogamuchirwa.
• Beryllium oxide - Dzivisa kunze kwekunge pasina chimwe chinhu chinosangana nezvinodiwa zvekupisa uye kugona kwesangano kuripo kugadzirisa muchetura, kutevedzera mutemo, uye hunyanzvi hwekubata mapuroteni.

Kazhinji, aruminiyamu nitride inopa yakakwana yekupisa kushanda pasina kuchengetedzwa kweberyllium oxide uye mutoro wekutonga, zvichiita kuti ive sarudzo inoshanda kune yakakwirira-thermal-conductivity zvinodiwa.

Kudyidzana neHighleap Electronics yeCeramic PCB Manufacturing

KuHighleap Electronics, tine hunyanzvi mukugadzira maPCB eceramic akavimbika zvakanyanya kuburikidza nealuminium oxide, aluminium nitride, uye silicon nitride substrates. Chikwata chedu cheinjiniya chinopa nhungamiro yekusarudza zvinhu, thermal simulation, uye rutsigiro rwekugadzira kuti magadzirirwo ePCB ako eceramic abudirire, akavimbika, uye mutengo.

Bata isu kuti tikurukure yako chaiyo yekudziya manejimendi zvinodiwa uye ugamuchire kurudziro yenyanzvi zvichienderana neiyi ceramic PCB yekuenzanisa yekuongorora. Isu tinoendesa chaiyo ceramic substrates inosangana nezvinodiwa zvinodiwa zvemagetsi emagetsi, RF masisitimu, uye yakakwirira-kuvimbika maapplication.

Mibvunzo Inonyanya Kubvunzwa

1. Ndeipi ceramic PCB zvinhu inopa yepamusoro yekupisa conductivity?

Beryllium oxide inopa yakanyanya kupisa conductivity pa250–300 W/m·K pakati peceramic PCB zvinhu. Nekudaro, huturu hwayo uye zvirambidzo zvekudzora zvinomisa kushandiswa kunoshanda. Aluminium nitride inomiririra iyo yakasarudzika yepamusoro-thermal-conductivity sarudzo pa170–230 W/m·K isina chepfu zvinonetsa, zvichiita kuti ive yakakodzera kune zvekutengesa zvikumbiro zvinoda kupisa kwakanyanya.

2. Ndeipi inonyanya kudhura-inoshanda zvedongo PCB zvinhu?

Aluminium oxide (Al₂O₃) inopa yakanakisa mutengo-kuita reshiyo yezvishandiso zvakajairika, ine thermal conductivity ye20–30 W/m·K inokwana kune simba density iri pasi pe5 W/cm². Maitiro ayo ekugadzira akakura uye akamisikidzwa ekutengesa anogonesa kukwikwidza mitengo yekugadzirwa kwevhoriyamu, zvichiita kuti ive sarudzo yekutanga kana zvinodikanwa zvemafuta zviri pakati nepakati.

3. Ndechipi chinyorwa chinonyatsokodzera mota magetsi emagetsi?

Silicon nitride (Si₃N₄) inopa kushanda kwakaringana kwemotokari kunyorera kuburikidza neayo akasarudzika emakanika simba uye kupisa kwekushomeka kuramba. Izvo zvinhu zvinorarama nekuvimbika kune yakanyanya kupisa bhasikoro inogara munzvimbo dzemotokari uku ichipa yakakwana yekupisa conductivity ye70-90 W/m·K. Iyi musanganiswa inogadzirisa zvese zvinopisa manejimendi uye kwenguva yakareba kuvimbika zvinodiwa zve traction inverters uye mota madhiraivha.

4. Ko silicon carbide inogona kushandiswa zvakananga sePCB substrate?

Silicon carbide inoita zvemagetsi uye haigone kushanda senge insulating substrate isina mamwe dielectric layers. Zvishandiso zvinoshandisa SiC zvinoda kuisirwa zvidzitiro zvekudzivirira zvakaita sesilicon dioxide kana aluminium nitride paSiC base, kugadzira chimiro chakaumbwa chinokwirisa SiC's thermal properties uku ichipa inodiwa magetsi ega ega pakati pematanho edunhu.

5. Aluminium nitride inofananidzwa sei nealuminium oxide?

Mune iyi ceramic PCB zvinhu kuenzanisa, aruminiyamu nitride inopa katanhatu kusvika kasere yakakwirira yekupisa conductivity (170-230 W/m·K maringe ne20–30 W/m · K) uye zvirinani CTE inoenderana nesilicon zvishandiso (4.5 ppm/K maringe ne6.5–7.5 ppm/K). Nekudaro, AlN inodhura kaviri kana mana kupfuura Al₂O₃. Iyo premium inotenderwa kune yakakwirira-simba-density application inodarika 10 W/cm² uko kupisa kwepamusoro kunokanganisa zvakananga kuita uye kuvimbika.