Maitiro Ekugadzira Chip-on-Board PCB Assembly uye Kuvimbika

Kunzwisisa Chip PaBhodhi Technology

Chii Chip Pabhodhi

Chip pabhodhi inomiririra nzira yekurongedza apo isina semiconductor inofa inoiswa zvakananga pamabhodhi edunhu akadhindwa pane kuchengetwa mumapakeji echinyakare. Iyo difa inonamatira kuPCB substrate kuburikidza nekunamira kana solder, ine magetsi ekubatanidza anotangwa kuburikidza newaya bonding kana flip-chip matekiniki. Iyi nzira yekubatanidza yakananga inobvisa nhanho yepakati yekurongedza, kugadzira gungano rakawanda uye rinoshanda.

Evolution kubva Traditional Packaging

Kuchinja kubva pakushandisa nzira dzechinyakare dzekurongedza dzakadai seQFP neBGA kuenda kuhunyanzvi hwechip onboard kwakabva pakuda kwetsoka dzemidziyo midiki uye kushanda kwekupisa kwakawedzera. Mapakeji echinyakare anowedzera kureba, huremu, uye kuramba kupisa pakati pedhi nePCB. Tekinoroji yeCOB inotarisa izvi nekubvisa chinopindirana nepakeji, zvichiita kuti nzira pfupi dzekubatanidza dzishande uye kupisa kupararire zvakananga kuburikidza nepasi pebhodhi.

Basa reCOB muPCB Manufacturing

Mukati mePCB gungano mashandiro, chip pabhodhi kubatanidzwa inoda hunyanzvi hunyanzvi kupfuura yakajairwa pamusoro pekukwira tekinoroji. Maitiro acho anoda chaiyo kufa yekuisa michina, waya yekubatanidza michina, uye encapsulation masisitimu. Vagadziri vePCB vanofanirwa kurongedza substrate kugadzirira, kupedzisa kwepamusoro, uye dhizaini yebhodhi kuti igare isina kufa yakasungirirwa uye kuve nechokwadi chekuvimbika mukati mekufamba kwegungano.

Chip On Board Assembly Process

Substrate Kugadzirira

Iyo PCB substrate inorapwa zvine hungwaru pamusoro isati yafa yakanamatira. Kuchenesa kunobvisa zvinosvibisa zvinogona kukanganisa kunamatira, nepo kusarudzwa kwepamusoro pekupedzisira-kazhinji gobvu goridhe plating kana ENIG-inovimbisa yakavimbika waya bonding. Adhesive application kana solder deposition inoitika panzvimbo dzakatarwa kufa, nekurongeka chaikoiko kwakakosha kune anotevera bonding mashandiro.

Die Attachment Methods

Bare anofa anokwira kubhodhi kuburikidza neanobata kana asiri-conductive adhesives, zvichienderana nekupisa uye magetsi zvinodiwa. Conductive epoxies inopa nzira dzekumisa magetsi, nepo zvinonamira zvinopisa zvinogonesa kutamisa kupisa. Nzvimbo yekuisa masisitimu inofa ine micron-level chaiyo, inoteverwa nekurapa matenderedzwa anomisikidza mechaniki zvisungo pakati pesilicon ne substrate.

Interconnection Techniques

Wire bonding inoramba iri iyo yakanyanya chip pabhodhi yekubatanidza nzira, uchishandisa goridhe rakatsetseka kana waya dzealuminium kubatanidza die pads kune PCB traces. Ultrasonic kana thermosonic bonding inogadzira majoini emetallurgical kumigumo yese yewaya imwe neimwe. Flip-chip inoswedera kutendeutsa difa, ichibatanidza kuburikidza nemapundu emasolder kana mbiru dzemhangura kune yakakwirira density application inoda hurefu hupfupi hwekubatanidza.

Encapsulation uye Dziviriro

Mushure mekubatana, glob-yepamusoro epoxy kana maumbirwo ekuumbwa anovhara iyo inofa uye waya zvisungo. Iyi inodzivirira layer inodzivirira kubva mukunyorova, mechanical stress, uye zvakatipoteredza zvinosvibisa. Kusarudzwa kwezvinhu kunoenzanisa kupisa kwekuwedzera coefficients pakati pesilicon, adhesive, uye PCB substrate kuderedza kushushikana panguva yekushisa bhasikoro.

Kuedzwa uye Kusimbiswa

Kuyedzwa kwemagetsi kunosimbisa kushanda kusati kwavharwa kwekupedzisira pazvinogoneka, kunyangwe imwe chip pabhodhi maassembly inoedza chete mushure mekuvhara kwakazara. Kuvimbika kuisirwa kunosanganisira tembiricha bhasikoro, humidity kuratidzwa, uye mechanic stress yekuyedza kuona kuti gungano rinosangana nezvinodiwa zvehupenyu hwese pane ese ekushanda tembiricha.

Zvakanakira zveChip Pabhodhi Kubatanidzwa

Kukura uye Kuderedza Mutengo

Chip pabhodhi tekinoroji inobvisa mutengo wepakeji uye inoderedza yakazara musangano tsoka. Pasina mapakeji miviri inodya nzvimbo yebhodhi, vagadziri vanowana yakakwirira chikamu density. Uku kushanda zvakanaka kwenzvimbo kunoratidza kukosha zvakanyanya muzvigadzirwa zve miniaturized uko kune imwe neimwe square millimeter inokosha.

Kuwedzerwa Kwemagetsi Kushanda

Mapfupi ekubatanidza nzira mu chip pamabhodhi magungano anoderedza parasitic inductance uye capacitance. Kutendeseka kwechiratidzo kunovandudza kuburikidza nekudzikisira kureba kwekutevera pakati pekufa pads uye PCB maseketi. Iyi bhenefiti inobatsira yakakwira-frequency application uko package lead inductance yaizodzikamisa kumhanya kwekushanda.

Yakavandudzwa Thermal Management

Yakananga kufa yakanamatira kuPCB substrates inogadzira nzira dzinodziya dzekupisa dzekubvisa kupisa. Thermal resistance inodzikira kana ichienzaniswa nemidziyo yakarongedzerwa uko muviri wepasuru unotadzisa kupisa kuyerera. Hunhu uhu hunoita kuti chip pabhodhi ive yakakodzera magetsi emagetsi uye epamusoro-kuita processors. Aluminium substrates inowedzera kuwedzera kupisa conductivity kana zvichidikanwa.

Key COB Benefits

Iyo chip pabhodhi nzira inopa mabhenefiti akasiyana pane akawanda maitiro ekuita:

• Yakaderedzwa tsoka -Kubviswa kwemapaketi miviri kunogonesa 40-60% nzvimbo yekuchengetedza zvichienzaniswa neakaenzana akaiswa mukati
• Lower thermal resistance - Yakananga kufa-kune-bhodhi yekubata inopa jena-kune-ambient nzira dzekudziya dzakaderera se1-3 ° C / W.
• Kubudirira kwemutengo -Kudzikiswa kwemutengo we20-30% kunowanikwa kuburikidza nekubviswa kwepakeji mukugadzirwa kwepamusoro-vhoriyamu
• Chiratidzo chekuvimbika -Kubatanidza kureba pasi pe3mm kuderedza parasitic mhedzisiro mune yakakwirira-frequency application

Pamwe chete, mabhenefiti aya anoita kuti chip-on-board tekinoroji ive mhinduro inoyevedza kune mainjiniya ari kutsvaga compact, thermally inoshanda, uye inodhura-inoshanda zvemagetsi magungano.

Zvipingamupinyi uye Zvinetso muChip Pabhodhi Kugadzira

Process Complexity

Chip pabhodhi musangano inoda inodzorwa nzvimbo dzakachena dzemukamuri uye midziyo yakasarudzika. Kubata kufa kunoda kurongeka kudzivirira kukuvara kana kusvibiswa. Wire bonding consistency inokanganisa goho, nechisungo chega chega chinoda optimal parameters. Izvi zvinodikanwa zvemaitiro zvinowedzera kuoma kwekugadzira zvichienzaniswa neyakajairwa pamusoro pegomo gungano.

Yakaganhurirwa Rework Kugona

Kana yangovharwa, chip pabhodhi magungano anove akanyanya kusingaperi. Akakundikana anofa haagoni kubviswa uye kutsiviwa pasina kuparadza PCB nzvimbo. Vagadziri vanofanirwa kuwana yakakwira yekutanga-pass goho, sezvo zvakaraswa mutengo unosanganisira zvese zviri zviviri kufa uye PCB substrate.

Dhizaini uye Kuvimbika Zvipingamupinyi

Yakakwira I/O yekuverenga michina inogona kusangana newaya bonding zvisingakwanisi nekuda kwepad pitch uye waya routing yakaoma. Yakareba waya mabhondi inounza inductance iyo inogona kukanganisa chiratidzo chekutendeseka pane yakakwirira frequencies. Coefficient yemafuta ekuwedzera kusawirirana pakati pesilicon, adhesive, encapsulant, uye PCB inogadzira kushushikana kwemagetsi panguva yekutenderera bhasikoro.

PCB Dhizaini Mazano eChip Pabhodhi

Surface Pedzisa Zvinodiwa

Wire bonding kuvimbika kunoenderana nepamusoro pekupedzisira kunaka uye ukobvu. Electroless nickel kunyudzwa goridhe (ENIG) inopa rakati sandara, rinosungirirwa nzvimbo ine hupenyu hwesherufu hwakanakisa. Hard goridhe plating inopa yepamusoro yekubatanidza simba asi inowedzera mutengo. Iyo yekupedzisira inofanirwa kunge isina kusvibiswa uye oxidation panguva yekubatanidza.

Peji rino rinotaura nezve nzira dzekubatanidza chip-on-board, kwete zvemagetsi zvedrone zvakajairika. Kuti uwane sarudzo yezvikamu zvedrone uye mamiriro ekushandisa, ona gwara rekushandisa chip yedrone ; kuti uwane rutsigiro rwekugadzira, Highleap inoongorora basa reCOB kuburikidza nekugona kwayo kugadzira PCB.

Via Management Strategy

Tsvaga vias kunze kwefa footprint uye encapsulant muganhu kudzivirira epoxy wicking kuburikidza nemakomba. Kana vias inofanira kuvapo mukati mematunhu aya, tsanangura plugging yakazara nemhangura kana isiri-conductive kuzadza, ichiteverwa ne planarization. Vias isina kuvharwa inogadzira nzvimbo dzisina simba uko encapsulant adhesion inotadza uye mwando unogona kupinda.

Fiducial uye Bond Pad Layout

Automated die placement uye waya yekubatanidza michina inoda chaiyo chinzvimbo mareferensi. Isa ma-crosshair-style fiducial marks pane kuita denderedzwa mapatani ekunyatso zivikanwa nemuchina. Dhizaina bond pad marongero ekudzikisa uye kuenzana urefu hwewaya mhiri kwefa periphery kudzivirira kusaenzana kwazvino uye michina yekushushikana kusiyanisa.

Critical Design Parameters

Kubudirira chip pakuitwa kwebhodhi kunoenderana nekuomerera kune yakatarwa dhizaini maitiro:

• Goridhe kupera ukobvu - Yakaderera 0.05μm flash goridhe kana 0.75-1.25μm goridhe rakaomarara yeakavimbika waya yekubatanidza
• Bond pad spacing -Chengetedza 150-200μm yakaderera pitch kudzivirira kupfupika kwewaya panguva yekubatanidza mashandiro
• Wire loop urefu - Govera 200-400μm yemvumo pamusoro pekufa kwenzvimbo yekuvhara encapsulant
• Thermal kuburikidza ne density -Position thermal vias mukati me 1mm yefa perimeter yekunyatso kupisa kupararira

Thermal Design Integration

Bare kufa kuiswa kunokanganisa zvakananga kuita kwekupisa. Chinzvimbo chepamusoro-simba chinofa padyo neairi inopisa kana nzvimbo dzine ukobvu hwemhangura hwakawedzerwa. Funga kupisa kuparadzira mapatani muPCB layer. Pakuremerwa nekupisa kwakanyanya, aluminium substrates kana mari dzemhangura dzakamisikidzwa dzinopa nzira dzepamusoro dzekupisa kupisa kubva pajunction yekufa kuenda kumadhishi ekunze ekupisa.

Kugadzira Kufunga kweChip Pabhodhi PCB

Board Material Selection

Mapurojekiti echipboard anoda maPCB ane hunhu hwakakodzera hwekupisa uye kupedzisa pamusoro. FR-4 inoshanda zvakanyanya, nepo mabhodhi ane aruminiyamu achienderana nezvinodiwa nesimba rakawanda. MaPCB esimbi anopa kupararira kwakanyanya kwekupisa kune zvinoshandiswa zvakanyanya kupisa.

Manufacturing Infrastructure Zvinodiwa

Zvishandiso zvinobata chip pabhodhi zvinoda kufa ma bonder, waya bonding masisitimu, midziyo yekuparadzira yekunamira uye encapsulants, uye mahovhoni ekurapa. Equipment calibration nekugadzirisa zvinokanganisa goho. Nzvimbo dzekugadzira dzakachena dzinodzivirira kusvibiswa kwechikamu panguva yekubatanidza kufa uye kubatana.

Mutengi Kukurukurirana Protocol

Kudyidzana kwekutanga pakati pevagadziri vePCB nevatengi kunoratidza kwakakosha kune chip pabhodhi kubudirira. Kufa kwakatemwa, madhayagiramu ekubatanidza, encapsulant marudzi, uye zvinodikanwa zvekupisa zvinofanirwa kutsanangurwa zvakajeka. Vatengesi vanofanirwa kupa akadzama maitiro ezvinyorwa uye, pazvinenge zvakakodzera, kugadzira mavhidhiyo anoratidza kugona.

Indasitiri Zvishandiso zveChip On Board Technology

LED Lighting Systems

Ma LED modules ane machipisi ari mubhodhi anonyanya kushandiswa mukushandisa magetsi anopenya zvakanyanya. Ma LED akawanda anoiswa paaluminium substrates, zvichigadzira manyuko emwenje akafanana nekutarisira kupisa kwakanaka. Kugadziriswa uku kunowedzera kushanda zvakanaka kwemwenje ukuwo kuchideredza mitengo yemapakeji emagetsi emotokari, mwenje yekutengeserana, uye kuvhenekesa kwakakosha.

Zvinopfekeka uye IoT Zvishandiso

Miniaturization inoda dhiraivha chip pabhodhi kugamuchirwa mune zvinopfekwa zvemagetsi uye maIoT sensors. Smartwachi, matracker ekugwinya, uye zvinoyamura zvekunzwa zvinosimudzira tekinoroji yeCOB kuwana slim form factor. Kubviswa kwehurefu hwepakeji kunogonesa dhizaini yechigadzirwa sezvo michina yakabatana ichiramba ichiwanda.

Emerging Market Mikana

Kufambira mberi kwe5G zvivakwa uye millimeter-wave application zvinogadzira mikana yechip pabhodhi muRF modules uko kushoma interconnect parasitics zvine basa. Magetsi emagetsi anowedzera kutora COB yemadhiraivha emota uye shanduko yemagetsi, nepo mota dzemagetsi dzichimbundira tekinoroji yenzvimbo-inomanikidzwa kutonga modules.

Zvishandiso Zvakanakira neSector

Maindasitiri akasiyana anowedzera chip pane bhodhi tekinoroji kune chaiyo kuita zvinodiwa:

• LED chiedza -Kunatsiridza kwekushisa kwe25-35% kuburikidza neyakagadzika aluminium substrate
• Wearables -Kudzikisira kwechishandiso kunogonesa fomu zvinhu pasi pe5mm yakazara gungano kureba
• RF modules -Kurasikirwa kwechiratidzo kuderedzwa pamwe nekubatanidza parasitics yakaderedzwa ne50-70% kupesana nedzimwe nzira dzakaputirwa.
• Simba remagetsi -Kudzikisira tembiricha yeJunction ye15-20°C kuburikidza nekunatsiridza kupisa kwakabatana
• Automotive -Kuvimbika kwekusimudzira musangano AEC-Q100 Giredhi 1 zvinodiwa zve -40°C kusvika 150°C kushanda

Aya mabhenefiti akanangana nechikamu anoratidza kuti chip-on-board tekinoroji inogonesa sei kushanda kwepamusoro, kuvimbika kukuru, uye mamwe madhizaini akaumbwa pamagetsi akasiyana siyana.

mhedziso

Chip pabhodhi tekinoroji inopa zvinogombedzera zvakanakira zvikumbiro zvinoda compact saizi, mutengo wakanaka, uye kukwidziridzwa kuita. Iyo yakananga kufa-kune-bhodhi nzira inobvisa yechinyakare kurongedza pamusoro uku uchivandudza kupisa uye magetsi maitiro. Nekudaro, kuita kwakabudirira kunoda hunyanzvi hwekugadzira hunyanzvi, kunyatsotarisisa dhizaini, uye kwakasimba kudzora kwemhando.

Kune masangano anoongorora chip pabhodhi mhinduro, kusarudza vane ruzivo vanogadzira vanobatana kunoratidza kunetsa. Ongorora kugona kwemupi kuburikidza nenzvimbo yekuongorora, maitiro ekuongorora zvinyorwa, uye sampuli yekuongorora. Kumbira maitiro ekugadzira mavhidhiyo anoratidza kufa kuiswa kwechokwadi, kubatana kwekubatana, uye encapsulation mhando.

KuHighleap Electronics, kugona kwedu kugadzira nekugadzira maPCB kunosanganisira matekinoroji echip onboard ane ISO 9001, ISO 13485, uye IATF 16949 certifications. Tinotsigira vatengi kubva mukubvunzana nezvekugadzira kuburikidza nekugadzira huwandu, tichipa hunyanzvi hwehunyanzvi uye zvivakwa zvekugadzira zvakakosha kuti COB ibudirire kubatanidzwa. Bata timu yedu yeinjiniya kuti ukurukure zvinodiwa nechip onboard yako.