Mabhodhi Esimbi Ane Mhangura (Copper-Clad Laminate): Chii Chaari, Mhando, uye Magadzirirwo Anoitwa PCB Nawo
Mufananidzo 1. Mufananidzo wemabhodhi akaputirwa nemhangura wekuongorora kugadzirwa kwePCB.
Bhodhi rakaputirwa nemhangura, kana kuti laminate yakaputirwa nemhangura (CCL), ndiro rakagadzirwa nePCB yese yakasimba: pepa rekudzivirira rakabatanidzwa nefoil yemhangura rakasungirirwa kune rimwe kana mativi ese. Bvisa mhangura isingadiwe uye chinosara ndicho dunhu rako. Kunzwisisa CCL — mamakisi ayo, huremu hwemhangura, uye kuti inova sei bhodhi rakapedzwa — ndiko kunzwisisa kuti PCB chii chaizvo. Gwaro iri rinotsanangura kuti laminate yakaputirwa nemhangura, marudzi ayo, kuti huremu hwemhangura hunotsanangurwa sei, uye kuti Highleap Electronics inoshandura sei CCL kuita mabhodhi akapedzwa.
1. Chii chinonzi bhodhi rakaputirwa nemhangura (CCL)?
Bhodhi rakaputirwa nemhangura ndiro chinhu chepakutanga chePCB: chinhu chinodzivirira kupisa - kazhinji epoxy yakasimbiswa negirazi - chine jira rakatetepa remhangura rakanamirwa kune imwe kana nzvimbo dzese dziri mbiri. Ndiyo nzvimbo yekutanga inogadzirwa circuit; mhangura ndiyo kondakita uye chinhu chinodzivirira kupisa ndicho chinochengetedza zvese panzvimbo. Pasati pava nezviratidzo, bhodhi rinongova jira rakafukidzwa nemhangura zvizere.
Iyo laminate inovakwa nekudzvanya foil yemhangura pa substrate yakacheneswa (kana kuti inogadzirisa) resin-uye-kusimbisa pasi pekupisa nekumanikidzwa, zvichizvibatanidza kuita jira rakaoma. Ukobvu hwemhangura, rudzi rwe substrate, uye ukobvu hwe substrate zvese zvinosarudzwa zvinoenderana nezvinodiwa nebhodhi. Iyi ndiyo yekutanga PCB laminate , uye mavakirwo ayo - foil, resin, reinforcement - inotsanangurwa zvakadzama mukutarisa uku kwePCB laminate.
2. Mhando dzesimbi dzakaputirwa nemhangura: FR-4, CEM, simbi-core, nezvimwewo
Ma laminate ane mhangura anouya mumhando dzakasiyana-siyana dzinotsanangurwa ne substrate yavo: FR-4 (epoxy yakasimbiswa negirazi, iyo standard), CEM grades (composite epoxy), high-frequency laminates (PTFE uye ceramic-filled), uye metal-core (copper foil pamusoro pealuminium kana copper base). Substrate inosarudza maitiro ebhodhi emagetsi, thermal, uye mechanical, saka mhando yeCCL inotevera kubva pakushandiswa:
| Rudzi rweCCL | Substrate | Chaizvoizvo kushandiswa |
|---|---|---|
| FR-4 | Epoxy yakasimbiswa negirazi | Mabhodhi akajairika, akaomarara zvakanyanya |
| Epoxy yepamusoro-Tg / yepamusoro | Epoxy yakawedzerwa | Kupisa kwakanyanya, kuvimbika |
| Yakakwira-frequency | PTFE / yakazadzwa neceramic | Mabhodhi eRF nema microwave |
| Muviri wesimbi | Hwaro hwearuminiyamu kana hwemhangura | Mabhodhi e LED neanopisa zvakanyanya |
FR-4 inovhara mabasa mazhinji, mamwe achisarudzwa kana zvakanakira — tembiricha yakakwira, kurasikirwa kwakaderera kweRF, kana kupisa kwakasimba — zvichidikanwa. CCL yesimbi, semuenzaniso, inotsigira mabhodhi e LED nemagetsi kuburikidza nearuminiyamu substrate PCBs , nepo magadzirirwo eRF achishandisa magiredhi epamusoro-soro. Pakati pawo pane sarudzo yezvinhu zvecircuit-board zvinoumba bhodhi rese.
3. Huremu hwemhangura muCCL: 1 oz, 2 oz, uye zvazvinoreva
Kurema kwemhangura kunotsanangura ukobvu hwepepa remhangura riri palaminate, rakatorwa mumaounces pa sikweya futi — 1 oz mhangura ine ukobvu hwema microns makumi matatu nemashanu, 2 oz inenge 70 microns. Iyi itsika yekare, asi pfungwa huru iri nyore: huremu hwemhangura hwakawanda hunoreva mhangura yakakora, iyo inotakura magetsi akawanda uye inobvisa kupisa kwakawanda, zvichikonzera kuoma kwekugadzira zvinhu zvakanaka. Zviyero zvakajairika:
- 0.5 oz (~17.5 µm) — inoshandiswa pazvikamu zvemukati uye pabasa remitsetse mitete.
- 1 oz (~35 µm) — chiyero chemachira ekunze akajairika.
- 2 oz (~70 µm) — yemabhodhi emagetsi ane simba rakawanda uye emagetsi.
- 3 oz zvichikwira (~105 µm+) — mhangura inorema yekugadzira magadzirirwo emagetsi ane simba guru uye kupisa.
Sarudzo yacho ndeyekuchinjana: mhangura inorema inotakura magetsi akawanda muhupamhi hwakapihwa asi zvakaoma kupinza muzvidimbu zvidiki, saka mabhodhi ane magetsi akawanda uye masaini anowanzo shandisa huremu hwakasiyana. Iyi ndiyo pfungwa imwechete yehuremu hwemhangura iyo inofambisa kugona kwemagetsi uye dhizaini yemhangura inorema, uye inotsanangurwa pamwe chete nerudzi rwe laminate. Kune mabhodhi anosunda magetsi akakwira, laminate inorema ndiyo hwaro hwekuvaka kunokwanisa kupisa.
4. Magadzirirwo ePCB kubva kupurasitiki yakaputirwa nemhangura
PCB inogadzirwa nesimbi yakaputirwa nemhangura nekufungidzira patani yedunhu iri pamhangura, ichibvisa mhangura isingadiwe kuti ibve pane zvisaririra, wobva wawedzera kuboora, kuisa mapurasitiki, chifukidzo chesolder, uye kupedzisa. CCL ndiyo kanivhasi, uye kugadzira inzira yekubvisa inoburitsa dunhu. Kutevedzana kwepakati:
- Mufananidzo wepatani. Chinodzivisa chinoiswa uye chinogadzirwa nemufananidzo (kazhinji nemifananidzo) kudzivirira mhangura inozova zvisaririra.
- Etch. Mhangura isina kudzivirirwa inobviswa nemakemikari, zvichisiya madonhwe emuchina wesimbi ari pasi pevhu.
- Boorera nendiro. Maburi anoboorwa uye anoputirwa kuti abatanidze zvikamu, zvichivaka kubatana.
- Pedza. Chifukidzo chesolder, silkscreen, uye pamusoro pechinhu zvinowedzerwa kuchengetedza mhangura uye kuigadzirira kuungana.
Pamabhodhi ane zvidimbu zvakawanda, macores akawanda akachekwa emhangura uye zvidimbu zve prepreg zvinonamirwa pamwe chete, zvichidzokorora musimboti uyu pane mamwe mativi. Huremu hwemhangura hwe laminate yekutanga uye substrate zvinoisa zvinogoneka pakunamirwa uye kushanda, ndosaka kusarudzwa kweCCL kuchiuya pekutanga - zvese mukugadzirwa kwePCB zvinovakwa pane izvo zvinhu zvepakutanga.
Mufananidzo 2. Ruzivo rwekugadzira mapuranga emhangura akafukidzwa nemhangura runofanira kuongororwa usati watenga zvinhu zvakati wandei uye wagadzira zvinhu izvi.
5. Maitiro ekusarudza laminate yakaputirwa nemhangura yakakodzera
Sarudza laminate yakaputirwa nemhangura nekubatanidza substrate nezvinodiwa nemagetsi, kupisa, uye kuvimbika uye huremu hwemhangura nezvinodiwa nemagetsi nekupisa — FR-4 ine mhangura ye 1 oz inofukidza mapuranga mazhinji, ine laminate dzakasarudzwa chete kana zvakanakira zvichidikanwa. Kusarudza zvinopfuura zvinodiwa nedhizaini kunowedzera mutengo; kusarudza njodzi shoma pakushanda kana kuvimbika. Zvinhu zvinosarudza:
- Zvinodiwa zvemagetsi. Zviratidzo zvinomhanya zvakanyanya kana kuti zvinomhanya zvakanyanya zvinoratidza kuti pane ma laminates asinganyanyi kurasikirwa; mashandiro edhijitari nee analog akanaka paFR-4.
- Zvinodiwa pakupisa. Kupisa kwakanyanya kana simba rakawanda zvinotsigira laminate ine Tg yakawanda kana simbi kuti igone kudzora tembiricha.
- Kurema kwemhangura. Ita kuti ienderane nemagetsi uye kupisa — inorema pakushandisa simba, yakajairika pakushandisa masaini — ichienzanisa nekucheka kwemavara akanaka.
- Mutengo uye kuwanikwa. Zviyero zveFR-4 zvakajairwa uye zvemhangura zvakajairika ndizvo zvakachipa uye zvinowanikwa nyore nyore, sezvakatsanangurwa mu kusarudza laminate yakanakisisa yakaputirwa nemhangura.
Nekuti laminate ndiyo inotsigira zvese, sarudzo iyi inosimbiswa zvakanaka nemugadziri wako, zvakanaka kana uchiongorora mashandiro ekugadzira, saka zvinhu zvacho, huremu hwemhangura, uye zvinhu zvakaunganidzwa zvinoenderana nedhizaini uye maitiro ekugadzira bhodhi risati ragadzirwa.
6. Mashandisiro anoita Highleap nekushandisa CCL yemabhodhi ako
Highleap inosarudza huremu hwesimbi yakaputirwa nemhangura uye hwemhangura kuti ienderane nezvinodiwa nemagetsi, kupisa, uye kuvimbika kwebhodhi rako, yobva yazvigadzirisa kuburikidza nemifananidzo, kutema, kuboora, kuputira, uye kupedzisa kuita bhodhi rakazara. Zvinhu zvinoonekwa sesarudzo yeinjiniya: standard FR-4 painokodzera, uye high-Tg, high-frequency, kana metal-core laminates apo dhizaini inoda chaizvo, ichishandisa zvinhu zvakasiyana-siyana zvesimbi.
Nekuti base laminate inogadzirisa zvinogona kuitwa nebhodhi rapera, ongororo yekugadzirwa kwayo inosimbisa kuti zvinhu, huremu hwemhangura, uye stackup zviri pamberi pekugadzirwa, zvichidzivirira kusawirirana kunowanikwa mushure mekunge bhodhi ragadzirwa. Highleap inovhara izvi mukati mePCB uye inotsigira bhodhi rakazadzwa nevanhu kuburikidza ne turnkey assembly . Paunokumbira mutengo, taura rudzi rwe laminate (kana zvinodiwa nemagetsi, thermal, uye Tg), huremu hwemhangura, uye huwandu hwe layer kuitira kuti base tool yakakodzera ishandiswe.
7. Mibvunzo Inowanzo bvunzwa pamusoro pebhodhi rakaputirwa nemhangura
Ndeupi musiyano uripo pakati pebhodhi rakaputirwa nemhangura nePCB?
Bhodhi rakaputirwa nemhangura ndiro laminate isina kubikwa, yakazara nemhangura isati yavapo; PCB ndiyo yaunowana mushure mekunge mhangura isingadiwe yabviswa uye kucherwa, kuputirwa, chifukidzo, uye kupedzwa zvawedzerwa. CCL ndiyo yekutanga PCB.
Chii chinonzi FR-4 copper-clothed laminate?
FR-4 CCL ndiyo yakajairika PCB base material: girazi-reinforced epoxy substrate ine copper foil yakabatana kune rimwe kana divi rese. Inofukidza ruzhinji rwemabhodhi akasimba nekuda kwekuenzanisa kwayo mutengo, simba, uye hunhu hwemagetsi.
Ko 1 oz mhangura inorevei pabhodhi rakaputirwa?
Inotsanangura ukobvu hwefoil yemhangura — inenge 35 microns (0.035 mm) — inotorwa sehuremu pa sikweya futi. 2 oz inenge 70 microns. Mhangura inorema inotakura magetsi akawanda asi yakaoma kupinza muzvidimbu zvidiki.
Unogona kugadzira PCB kumba uchishandisa bhodhi rakaputirwa nemhangura here?
Mabhodhi ari nyore, ane mativi maviri kana maviri, anogona kugadzirwa nelaminate yakagadzirwa nemhangura nekugadzira resist nekuicheka, asi mabhodhi ane mativi akawanda, magadzirirwo akanaka, maburi akaputirwa, uye magadzirirwo akavimbika zvinoda kugadzirwa nehunyanzvi. Kucheka pamba kunokodzera chete ma prototypes ekutanga.
Chii chinonzi bhodhi remhangura rine mativi maviri kana kuti rimwe chete?
CCL ine mativi maviri ine mhangura kumeso kumwe uye mativi maviri ine mhangura kumeso kwese. Mativi maviri anobvumira maburi ekupinda nepakati pamativi ese, zvichitsigira nzira dzakaoma kupfuura zvinhu zvine mativi maviri.
Ko laminate yakaputirwa nemhangura inokanganisa mashandiro echiratidzo here?
Ehe — hunhu hwe dielectric hwe substrate hunokanganisa impedance nekurasikirwa, ndosaka mabhodhi ane frequency yakakwira achishandisa ma laminates akasarudzika ane low-loss pane standard FR-4. Zvinhu zvepasi chinhu chakakosha mukuita kwemagetsi kwebhodhi.
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-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.
